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Letteratura scientifica selezionata sul tema "In-Mold Electronics"

Autore: Grafiati

Pubblicato: 21 dicembre 2024

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Articoli di riviste sul tema "In-Mold Electronics"

Beltrão, Mariana, Fernando M. Duarte, Júlio C. Viana e Vitor Paulo. "A review on in‐mold electronics technology". Polymer Engineering & Science 62, n. 4 (11 febbraio 2022): 967–90. http://dx.doi.org/10.1002/pen.25918.

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Madadnia, Behnam, Jan Vanfleteren e Frederick Bossuyt. "Methods to Improve Accuracy of Electronic Component Positioning in Thermoformed Electronics". Micromachines 14, n. 12 (16 dicembre 2023): 2248. http://dx.doi.org/10.3390/mi14122248.

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Three new methods for accurate electronic component positioning for thermoformed electronics are presented in this paper. To maintain the mechanical and electrical properties of printed-ink tracks, prevent deformation and stretching during thermoforming, and ensure reproducibility, the component positioning principle for all three proposed methods is based on keeping the temperature of some regions in the thermoplastic substrate less than the glass transition temperature of the thermoplastic carrier, to keep those regions resistant to plastic deformation. We have verified the accuracy of the different approaches by implementing these methods in a semi-sphere mold for positioning seven LEDs and one printed capacitive touch sensor. We compared the result of our fabrication processes with the typical fabrication process of in-mold electronics (direct printing on a thermoplastic foil and followed by a thermoforming step) and noticed that the sample produced by the typical process had tracks that were randomly stretched, tracks were not in a straight path after thermoforming and they were not electrically conductive. Furthermore, the final 3D position of the components was not reproducible sample by sample. However, with our proposed fabrication methods, the tracks and pads do not deform or expand during thermoforming and are electrically conductive after. Moreover, the round shape of the touch sensor remains the same as in the 2D design. Based on the results of the experiments, it appears that the proposed methods are capable of positioning electronic components with high precision in thermoformed electronics.

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Srinivasan, KP, e T. Muthuramalingam. "In-depth scrutinization of In- Mold Electronics for Automotive applications". Journal of Physics: Conference Series 1969, n. 1 (1 luglio 2021): 012064. http://dx.doi.org/10.1088/1742-6596/1969/1/012064.

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Holdford, Becky, e Roger Stierman. "What “Green” Means: Challenges for Failure Analysis". EDFA Technical Articles 8, n. 4 (1 novembre 2006): 12–14. http://dx.doi.org/10.31399/asm.edfa.2006-4.p012.

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Abstract With the July 2006 implementation of RoHS (the restriction of the use of certain hazardous substances in electrical and electronic equipment), the electronics reliability industry has seen a changeover to lead-free solders and “green” mold compounds that have no bromine- or antimony-based flame retardants. This article addresses some of the challenges caused by implementation of the new requirements.

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Morishige, Koichi. "Special Issue on Dies and Molds". International Journal of Automation Technology 2, n. 6 (5 novembre 2008): 417. http://dx.doi.org/10.20965/ijat.2008.p0417.

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Mass-produced items such as cars, consumer electronics, electronic parts, precision instruments, office supplies, daily necessities, toys, etc., are invariably connected to dies and molds, basic manufacturing technology whose quality determines product quality. Die and mold production is difficult due to the complexity of structures and the requirement for high precision. Advances in both processing and elemental technology such as machine tool and CAD/CAM software determine the results of die and mold acceptability and the level of productive techniques in the country of manufacture. This special issue focuses on die and mold manufacturing technology. Among the many interesting papers are those on rapid prototyping, end mill machining, electric discharge machining, machine tools, press working, and CAD/CAM. We are certain that you will find this issue both interesting and informative. We thank the authors for their generous cooperation and the editing staff for their many contributions.

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Rusyana, Mohammad Purwa, e Rizky Maulana. "PENGARUH REKONDISI MOLD TYPE-2186 TERHADAP PENINGKATAN PRODUKTIVITAS DAN KUALITAS HASIL PRODUKSI". Jurnal Permadi: Perancangan, Manufaktur, Material dan Energi 3, n. 1 (29 gennaio 2021): 54–62. http://dx.doi.org/10.52005/permadi.v3i1.47.

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PT. STAR COMGISTIC INDONESIA is a company engaged in household electronics production field that makes 3 types of electronic products namely cooking utensils, electric iron and coffee pot. In the production process must pay attention to the quality at each stage in order to get the best production results optimal. Internship practice shows that the process of making a product that used in the production process must be done carefully and activities according to the existing standard operating procedures (SOP), so that the results of production can be of good quality or the results of production get good results optimal. The internship that was carried out at PT STAR COMGISTIC INDONESIA was on repair molding field. (molding) basically consists of two parts, namely the stationary part of the mold (stationary platen) in which the molten polymer is deposited, and the movable platen on the cover side or ejector side of a injection molding parts.Repair molding is a work in which repairing mold or mold that is damaged or needs maintenance, repair mold is done so that the mold can work properly. After done repair, when the molding is damaged before being repaired then the result production becomes defective or imperfect, for results from before being repaired and after fixing there is already an image in the testing section, for this case it is hoped that the mold can work as before it was damaged so that the product produced from the mold to produce an optimal product.

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Anzai, Masahiro. "Special Issue on Die and Mold Technology". International Journal of Automation Technology 4, n. 5 (5 settembre 2010): 414. http://dx.doi.org/10.20965/ijat.2010.p0414.

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Mass-produced items such as cars, consumer electronics, electronic parts, precision instruments, office supplies, and daily necessities are invariably connected to dies and molds – basic manufacturing technology whose quality determines product quality. Die and mold production is difficult due to product complexity and high-precision requirement. Advances in processing and elemental technology such as machine tools and CAD/CAM software determine whether die and mold products are acceptability and the level of production techniques in the country of manufacture. This special issue focuses on advanced die and mold manufacturing technology. Among the many interesting papers are those on machining and measurement of texture, fabrication of parts using welding, high-speed servo press, CAM system for metal forming, surface inspection system, development of liner motor machining centers, and machine tools. We are certain that you will find this issue both interesting and informative. We thank the authors for their generous cooperation and the editing staff for their many helpful suggestions.

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Chen, Feng Jun, Shao Hui Yin, Jian Wu Yu, Ke Jun Zhu e Yu Wang. "Ultra-Precision Fabrication of Small-Size Aspherical Glass Lens Mold". Key Engineering Materials 487 (luglio 2011): 29–33. http://dx.doi.org/10.4028/www.scientific.net/kem.487.29.

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With the rapid development of opto-electronics communications, optics, aerospace and other industries, ultra-precision aspheric glass lenses are widely used in middle/high-grade optical opponent because of its high resolution and imaging quality. To achieve ultra-precision molding pressing of micro-lens, ultra-precision mold must be fabricated firstly. In this paper, some key new technologies were proposed for fabricating ultra-precision mold of small-size aspheric optical lens. A method of finite element simulation was employed to predict mould pressing process of the glass lens for correcting molds and improving the formation efficiency. An ultra-precision inclined-axis grinding and error compensation technology was also used to improve form accuracy of micro lens mold.

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Zhang, Sam, Xianting Zeng, Zhenggui Tang e Ming Jen Tan. "EXPLORING THE ANTISTICKING PROPERTIES OF SOLID LUBRICANT THIN FILMS IN TRANSFER MOLDING". International Journal of Modern Physics B 16, n. 06n07 (20 marzo 2002): 1080–85. http://dx.doi.org/10.1142/s0217979202010890.

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In the plastic molding industry, plastic parts like pager and handphone cases, plastic containers, etc. are formed in a mold by applying temperature and pressure. The transfer molding is the standard workhorse for the electronics industry. Although the transfer molding is widely used, it is far from being optimized. Mold sticking is a serious practical problem in this industry. A solution to the problem is to apply mold-releasing agents on the mold to act as a lubricant layer between the plastic and the mold. This easily results in stains and degraded surface finish. This paper investigates the effectiveness of solid thin films on reducing the adhesion between polymer and mold steel of different surface roughness. WS2, MoS2, and DLC coatings are deposited on test surfaces via unbalanced magnetron sputtering before polymer blocks are molded on and pulled apart using an Instron Machine. The force required to separate the plastic part and the mold steel is used as an indication of the stickiness. After the separation, the coating surface is also examined under microscope for stains and polymer residues. The coatings are characterized using Raman spectroscopy and contact angle measurements. Generally, the stickiness increases with initial surface roughness for all coatings. Initial test indicates that the DLC coating has the highest contact angle with water (100°) and the best anti-sticking properties among the samples tested, and could reduce the stickiness by 80% as compared to bare steel.

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Hwang, Chul Jin, Y. B. Ko, Hyung Pil Park, S. T. Chung e Byung Ohk Rhee. "Development of Dental Scaler Tip Mold with Powder Injection Molding Process". Materials Science Forum 534-536 (gennaio 2007): 345–48. http://dx.doi.org/10.4028/www.scientific.net/msf.534-536.345.

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With the capability of net shaping for complex 3D geometry, powder injection molding (PIM) is widely used for automotive parts, electronics and medical industry. In this study, an ultrasonic dental scaler tip produced by machining process was redesigned for the PIM process. An injection mold was designed and machined to produce the dental scaler tip by the PIM process. The mold design was aided by CAE analysis. A PIM feedstock was made of SUS316L powder and a wax based binder. The filling balance in the mold was checked by a short shot test with LDPE and the PIM feedstock. Production capability of the PIM process for the dental scaler tip was examined with the mold. Although there were minor problems such as a discoloration around the gate and a flashing at the air vent, the PIM process turned out to be an excellent substitute for machining process to manufacture the ultrasonic dental scaler tip.

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Più fonti

Tesi sul tema "In-Mold Electronics"

Guérin, Thomas. "Développement d'encres fonctionnelles pour l'In-Mold Electronics". Electronic Thesis or Diss., Lyon, INSA, 2024. http://www.theses.fr/2024ISAL0089.

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Cette thèse explore le domaine émergent de la plastronique 3D, qui fusionne l’électronique et la plasturgie pour intégrer des circuits électroniques sur des substrats 3D en polymère. Le travail se concentre sur le développement d’encres conductrices pour le procédé In-Mold Electronics (IME), une technique prometteuse pour la production en grand volume de dispositifs plastroniques, en particulier pour les interfaces homme-machine (IHM). Le processus IME comprend plusieurs étapes : l’impression de pistes conductrices sur un film mince de polycarbonate à l’aide d’encre conductrice, le transfert des composants électroniques sur le film et leur connexion au circuit par collage, le thermoformage du film en 3D et le surmoulage 3D par injection de thermoplastique. Après une revue de la littérature sur la plastronique et l’IME, la thèse propose l’étude de différentes formulations d’encres conductrices, en se concentrant sur celles composées d’une matrice polymérique organique contenant des charges d’argent micrométriques. Une méthodologie a été mise en place pour caractériser les encres à chaque étape du processus, en termes de résistivité électrique, d’adhésion, d’étirement et de cisaillement sous contraintes lors des étapes d’impression, de thermoformage et de surmoulage. Le polycarbonate a été utilisé comme matériau de référence pour le film et la matière de surmoulage. Plusieurs encres conductrices ont été élaborées à partir de matériaux organiques issus de la pétrochimie ou de matériaux biosourcés. À partir de matériaux pétrosourcés, nous avons obtenu des encres peu résistives (26 µΩ.cm) et avec une grande capacité de déformation par thermoformage. À partir de matériaux biosourcés, de nouvelles matrices organiques ont été formulées pour obtenir des encres plus responsables. Les encres -bio- se distinguent par leur respect de l’environnement grâce à un liant biodégradable, un solvant vert biosourcé et l’argent recyclable. Les performances atteignent une faible résistivité de 20 µΩ.cm et avec une grande capacité de déformation par thermoformage. Une encre -bio- a été surmoulée avec du polycarbonate, et un démonstrateur IME a été réalisé. Cependant, certaines difficultés persistent et limitent le potentiel d’application de ces formulations. Parmi elles, des cas critiques de délamination et de rupture des pistes conductrices lors du thermoformage. Également, de possible délavage des encres et le détachement des composants électroniques lors de l’étape d’injection peuvent survenir. Ces limitations sont liées aux contraintes géométriques engendrées par le 3D et ont été étudiées. Cependant, par contrainte de temps, toutes les encres n’ont pas pu être testées jusqu’à la réalisation d’un démonstrateur
This thesis explores the emerging field of 3D plastronics, which merges electronics and plastics engineering to integrate electronic circuits on 3D polymer substrates. The work focuses on the development of conductive inks for the In-Mold Electronics (IME) process, a promising technique for the high-volume production of plastronic devices, particularly for human-machine interfaces (HMIs). The IME process involves several steps: printing conductive tracks on a thin polycarbonate film using conductive ink, transferring the electronic components onto the film and connecting them to the circuit by bonding, thermoforming the film in 3D, and 3D overmolding by injection of thermoplastic. After a literature review on plastronics and IME, the thesis proposes the study of different formulations of conductive inks, focusing on those composed of an organic polymer matrix containing micrometric silver fillers. A methodology was set up to characterize the inks at each stage of the process, in terms of electrical resistivity, adhesion, stretching and shear under stress during the printing, thermoforming and overmolding stages. Polycarbonate was used as a reference material for the film and the overmolding material. Several conductive inks were developed from organic materials derived from petrochemicals or bio-based materials. From petro-based materials, we obtained low-resistivity inks (26 µΩ.cm) and with a high deformation capacity by thermoforming. From bio-based materials, new organic matrices were formulated to obtain more responsible inks. The -bio- inks are distinguished by their respect for the environment thanks to a biodegradable binder, a bio-based green solvent and recyclable silver. The performances reach a low resistivity of 20 µΩ.cm and with a high deformation capacity by thermoforming. A -bio- ink was overmolded with polycarbonate, and an IME demonstrator was produced. However, some difficulties persist and limit the application potential of these formulations. Among them, critical cases of delamination and rupture of the conductive tracks during thermoforming. Also, possible washing out of the inks and the detachment of the electronic components during the injection step can occur. These limitations are linked to the geometric constraints generated by 3D and have been studied. However, due to time constraints, not all the inks could be tested until the production of a demonstrator

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Wang, Enhai. "Metal-mold reactions in CMSX-4 single crystal superalloy castings". abstract and full text PDF (UNR users only), 2009. http://0-gateway.proquest.com.innopac.library.unr.edu/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqdiss&rft_dat=xri:pqdiss:1464425.

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Libri sul tema "In-Mold Electronics"

Nihon Bōeki Shinkōkai. Ho Chi Minh Office. The excellent Vietnamese companies in southern Vietnam: Mold, plastic/metal processing, precision parts, mechanical, electronics, plating, textile, etc. = Betonamu yūryō kigyō (minami betonamu hen) : Kanagata, kinzoku purasutikku kakō, seimitsu buhin, kikai, denshi denki buhin, mekki, boseki, hoka. 2^a ed. Ho Chi Minh]: JETRO Ho Chi Minh Office, 2009.

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Nihon Bōeki Shinkōkai. Hanoi Representative Office. The excellent Vietnamese companies in northern and central Vietnam: Mold, plastic/metal processing, precision parts, mechanical, electronics, plating, etc = [Betonamu yūryō kigyō (kita, chubu betonamu hen) : kanagata, purasutikku kakō, kinzoku kakō, seimitsu buhin, kikai, denshi denki buhin, mekki, hoka]. Hanoi]: JETRO Hanoi Representative Office, 2009.

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Capitoli di libri sul tema "In-Mold Electronics"

Yusro, Muhammad. "Emerging Potential on Laser Engraving Method in Fabricating Mold for Microfluidic Technology". In Proceedings of the 2nd International Conference on Electronics, Biomedical Engineering, and Health Informatics, 203–14. Singapore: Springer Nature Singapore, 2022. http://dx.doi.org/10.1007/978-981-19-1804-9_16.

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Rabhi, F., G. Cheng e T. Barriere. "Modeling of Viscoelasticity of Thermoplastic Polymers Employed in the Hot Embossing Process". In Lecture Notes in Mechanical Engineering, 251–60. Cham: Springer International Publishing, 2024. http://dx.doi.org/10.1007/978-3-031-58006-2_19.

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AbstractThe manufacturing of micro-scale components requires mastery of shaping processes ranging from micromechanics to electronic microfabrication. The hot embossing (HE) process is widely developed in various fields, since it allows to emboss complex structures at the micro/nanoscale such as optical sensors, diffractive lenses, microfluidic channels, and so on. The development of micro-structured parts via this process requires an in-depth analysis of the surface quality obtained and the mold filling rate. It is essential to analyze the influence of polymer properties to optimize the final mold filling to reduce cycle time and obtain defect-free replicated components. In this research, compression tests were carried out with poly(methyl methacrylate) (PMMA) and polycarbonate (PC), at different forming temperatures to determine their behavior law properties. Numerical simulation of the polymer forming processing was carried out by using Abaqus finite element software, taking into account the mechanical properties of both polymers and the characteristics of microchannels. The aim was to analyze the effect of the elastic–viscoplastic properties of the materials on the mold filling rate at different temperatures. Numerical simulation of the HE process with PMMA shows that the mold cavity is completely filled with elastic-viscoplastic behaviors, and the filling rate increases as a function of mold displacement. On the other hand, for PC, the embossed temperature has an influence on the filling ratio of the mold.

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Keränen, A., T. Wuori, J. Asikkala, E. Garcia Biosca e A. Benndorf. "Polypropylene films and injection-molding resins for In-Mold Structural Electronics (IMSE®)". In PIAE EUROPE 2021, 213–24. VDI Verlag, 2021. http://dx.doi.org/10.51202/9783181023853-213.

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Yuki, Kazuhisa. "Heat Transfer Enhancement Using Unidirectional Porous Media under High Heat Flux Conditions". In Porous Fluids - Advances in Fluid Flow and Transport Phenomena in Porous Media. IntechOpen, 2021. http://dx.doi.org/10.5772/intechopen.96594.

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In this chapter, new heat transfer enhancement technologies with unidirectional porous metal called “EVAPORON” and “Lotus’ Breathing” are introduced to remove and manage heat from high heat flux equipment. The unidirectional porous metals introduced here can be easily fabricated by unique techniques such as mold casting technique, explosive welding technique, and 3D printing technique. First of all, many kinds of porous media, which have been introduced by the author so far as a heat transfer promoter, are compared each other to clarify what kind of porous metal is more suitable for high heat flux removal and cooling by focusing on the permeability and the effective thermal conductivity. For the practical use of the unidirectional porous copper with high permeability and high thermal conductivity, at first, heat transfer performance of two-phase flow cooling using a heat removal device called “EVAPORON” is reviewed aiming at extremely high heat flux removal beyond 10 MW/m2. We have been proposing this device with the unidirectional porous copper fabricated by 3D printing technique as the heat sink of a nuclear fusion divertor and a continuous casting mold. Second, two-phase immersion cooling technique called “Lotus’ Breathing” utilizing “Breathing Phenomenon” is introduced targeting at thermal management of various electronics such as power electronics and high performance computers. The level of the heat flux is 0.1 MW/m2 to 5 MW/m2. In addition, as the other heat transfer enhancing technology with unidirectional porous metals, unidirectional porous copper pipes fabricated by explosive welding technique are also introduced for heat transfer enhancement of single-phase flow.

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Zhang, Xiujuan, e Gui Lin. "Poly(trimethylene terephthalate)". In Polymer Data Handbook, 1080–84. Oxford University PressNew York, NY, 2009. http://dx.doi.org/10.1093/oso/9780195181012.003.0188.

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Abstract Major Applications PTT is expected to find industrial applications where PET and PBT are currently dominated such as in the electrical, electronics, automotive, furniture industry. It also has an important application in the textile industry and has been a promising engineering thermoplastic, which that can be spun into both fibers and yarns and has extensive applications in carpeting, textiles and apparel, engineering thermoplastics, nonwovens, films and mono-filament.(1) Properties of Special Interest PTT contains the property highlights of both PET and PBT. It has the physical properties of PET including strength, stiffness, toughness, and heat resistance, along with the good processing properties of PBT, such as low melt and mold temperatures and rapid crystallization, and good injection molding properties. Resilience, elastic recovery, superior dyeing ability.

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Ehrenfeld, David. "The Magic of the Internet". In Swimming Lessons. Oxford University Press, 2002. http://dx.doi.org/10.1093/oso/9780195148527.003.0008.

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I am the only person in my university building who wants no part of the university’s free e-mail and who does not surf the Internet, which makes me the last holdover from the days when conversations by voice, dusty books, and rectangular white envelopes with colored stamps in the upper right corner were our primary means of communication. Nevertheless, rumors of the new and wonderful electronic inventions reach me often—from my wife and children and especially from my students. Like the seven golden cities of Cibola, the Internet beckons; if I had the energy of Coronado, I would seek it out and master it. Being lazy, I sit in my office with nothing more modern than an automatic pencil, a telephone, and an aging Macintosh Centris equipped only with Microsoft Word 5.1,and think about what I am missing. I imagine the chat rooms, for instance, abuzz with scintillating conversations, the twenty-first century equivalent of the salon of Madame deStaël or that celebrated Oxford club where J. R. R. Tolkien and C. S. Lewis read to each other from their latest manuscripts. I know that chat rooms are not really rooms, but in my mind I can see one clearly: the lustrous walnut paneling, the floor-to-ceiling mullioned windows framed by the thick pleats of burgundy velvet drapes, the comfortable arm chair supholstered in rich mahogany leather, and next to one of the chairs—my chair—a small Louis Quatorze table holding a Waterford snifter with a generous dollop of Napoleonic brandy. Sometimes the rooms are contemporary in style, with walls consisting of giant liquid-crystal sur-faces that shimmer with ever-changing, abstract splashes of color o bold, functional patterns of steel-like beams intricately linked, endlessly dissolving and reconnecting. In place of chairs there are convivial arrangements of very large, “smart” cushions that rapidly mold them-selves to the contours of the body regardless of whether one wishes to sit or recline. And the conversations! Here must be the ultimate purpose for which language was invented, especially my language, English, with its unparalled wealth of words.

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Hassan, Dr Md Nurul. "RESEARCH: PLAYEING A GREAT ROLE IN THESIS / RESEARCH PAPER WRITING". In Futuristic Trends in Social Sciences Volume 3 Book 23, 1–4. Iterative International Publishers, Selfypage Developers Pvt Ltd, 2024. http://dx.doi.org/10.58532/v3bjso23ch1.

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Knowledge is the most pleasurable experience, as it offers constant satisfaction and appetite, unlike other pleasures that may lead to verdure and novelty. This makes it a unique pleasure source. Research is driven by human desire for knowledge, involving effort, application, and patience. It is achieved through written work and published to declare findings. Writing is a challenging and gradual process that requires clear presentation and correct format. be excused, but apathy or indifference is never forgiven.A thesis is a written work that contributes to a larger body of knowledge, aiming to add to the existing knowledge in a subject, thereby introducing new insights. The thesis's contribution is evaluated by a group of knowledgeable individuals, and a subjective tone is not allowed in the highly regulated field of research. Writing a thesis is a strenuous task requiring constant effort and concentration. Research scholars often question their intelligence and fit for the task, but this is unwarranted as research is not solely about intelligence. The educated mind struggles to slow down and reflect on their work, making it crucial for researchers to assess their patience and ability to undergo rigorous research writing is a slow, painful process requiring perseverance, patience, and industry. It involves careful revisions and achieving satisfaction, with good thoughts emerging only after passing through multiple drafts. Research novices often underestimate the societal expectations of admiration and friendships, leading to potential loss of close associates. It's crucial to be courageous and maintain equanimity during this challenging period.Research aids in learning through experience and dealing with complex problems. A thesis's material comes from various sources, requiring intelligence to weigh, select, reject, and mold it into a clear form, evaluating familiar topics.Research encourages critical reading of books, avoiding outdated, prejudiced, or lack of knowledge sources. Selection and acceptance should be impartial, avoiding subjective approaches. Writing a research thesis requires in-depth analysis, intelligent perspective, and objective treatment, unlike a report, which can be prepared using popular books and articles. A research paper is an exploration method, based on primary, secondary, or a combination of each primary research involves firsthand observation, analysis, and surveying, while secondary research examines other researchers' studies, such as books, articles, and electronic information. Secondary research is crucial for researchers and academic papers, as it involves investigating, reviewing, and utilizing information from other studies. Combining research and original ideas is essential, and research should not be merely a review of publications. The main purpose is to deepen understanding and delve deeper into the subject.

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Atti di convegni sul tema "In-Mold Electronics"

Fazlali, Zahra, David Schaubroeck, Maarten Cauwe, Sibel Ügdüler, Tine Van Laere, Dave Manhaeghe, Steven De Meester, Ludwig Cardon e Jan Vanfleteren. "Eco-Friendly In-Mold Electronics Using Polylactic Acid". In 2024 Electronics Goes Green 2024+ (EGG), 1–7. IEEE, 2024. http://dx.doi.org/10.23919/egg62010.2024.10631228.

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Lall, Pradeep, Fatahi Musa e Scott Miller. "Process Performance Interaction of In-Mold Electronics for Signal-Processing Applications". In 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 1–10. IEEE, 2024. http://dx.doi.org/10.1109/itherm55375.2024.10709472.

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Lall, Pradeep, Md Golam Sarwar e Scott Miller. "Reliability of Additively Printed In-Mold Electronics Using ECA in Sustained High-Temperature Operation". In 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 1–6. IEEE, 2024. http://dx.doi.org/10.1109/itherm55375.2024.10709441.

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Lall, Pradeep, Shriram Kulkarni e Scott Miller. "Screen-Printed Thermoformed Circuits Performance and Reliability under Sustained High Temperatures for In-Mold Electronics". In 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 1–12. IEEE, 2024. http://dx.doi.org/10.1109/itherm55375.2024.10709621.

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Homma, Soichi, Daichi Okada, Akihito Sawanobori, Susumu Yamamoto e Hiroshi Nishikawa. "Quantification of Adhesion Strength and Mechanism of Adhesion Degradation Between Sputtered SUS304 and Mold Resin in Electromagnetic Wave Shield Packages". In 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), 1–7. IEEE, 2024. http://dx.doi.org/10.1109/estc60143.2024.10712082.

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Lall, Pradeep, Ved Soni e Scott Miller. "Development and Performance Evaluation of Additively Printed In-Mold-Electronic Sensors". In 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 1–8. IEEE, 2024. http://dx.doi.org/10.1109/itherm55375.2024.10709447.

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Zhuang, Dawei, Yijun Wang, Guoqiang Dong e Zitao Qu. "Optimizing the wireless sensor network coverage algorithm of slime mold". In Ninth International Symposium on Advances in Electrical, Electronics, and Computer Engineering (ISAEECE 2024), a cura di Pierluigi Siano e Wenbing Zhao, 26. SPIE, 2024. http://dx.doi.org/10.1117/12.3033409.

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Lall, Pradeep, Hyesoo Jang e Scott Miller. "Development of In-Mold Integration of EDA Sensors Via Additive Printing". In 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 1–9. IEEE, 2024. http://dx.doi.org/10.1109/itherm55375.2024.10709533.

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Lall, Pradeep, Fatahi Musa e Scott Miller. "Impact of Thermal Cycling on In-Mold Flexible Substrates Fabricated via Direct-Write Printing". In 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 1–8. IEEE, 2024. http://dx.doi.org/10.1109/itherm55375.2024.10709453.

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Lall, Pradeep, Padmanava Choudhury, Ved Soni e Scott Miller. "Development and Performance Evolution of Thermoformed In-Mold Gravure Offset Band-Pass Filters due to Thermal Cycling". In 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 1–7. IEEE, 2024. http://dx.doi.org/10.1109/itherm55375.2024.10709460.

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