Articoli di riviste sul tema "Electronic board design"
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Kolesnyk, Kostiantyn, Andrzej Łukaszewicz, Volodymyr Dutka, Dmytro Zahoruiko e Bohdan Vasylyshyn. "Automated design of printed circuit boards made by electronic computer –aided design (CAD) with the next using in CNC- machine". Computer Design Systems. Theory and Practice 4, n. 1 (2022): 9–16. http://dx.doi.org/10.23939/cds2022.01.009.
Testo completoLiu, Yang, Yun Feng Zhang e Ya Kui Xing. "The Optimized Design of the Electronic Bus Stop Board". Applied Mechanics and Materials 97-98 (settembre 2011): 1195–200. http://dx.doi.org/10.4028/www.scientific.net/amm.97-98.1195.
Testo completoAkash R., Maya Srinivas, Venugopal Rao S, Sanjan Kashyap, Adithya T.G., Pavithra G., Sindhu Sree M. e T.C.Manjunath. "Wireless notice board design using bluetooth technologies". international journal of engineering technology and management sciences 6, n. 6 (28 novembre 2022): 230–33. http://dx.doi.org/10.46647/ijetms.2022.v06i06.035.
Testo completoGOROSHKO, Andrii, Igor KOVTUN e Maryna ZEMBYTSKA. "IMPROVING THE ACCURACY OF THE VIBRATION ANALYSIS OF ON-BOARD ELECTRONICS PRINTED BOARDS". Herald of Khmelnytskyi National University. Technical sciences 313, n. 5 (27 ottobre 2022): 301–6. http://dx.doi.org/10.31891/2307-5732-2022-313-5-301-306.
Testo completoYang, Yan Fei, Jian Wang, Xue Jian Liu, Xiao Juan Yang e Ya Hu. "Design of Electronic Seal Terminal for Tank Vehicles". Applied Mechanics and Materials 620 (agosto 2014): 133–36. http://dx.doi.org/10.4028/www.scientific.net/amm.620.133.
Testo completoSuriano, Domenico. "Design and Development of an Electronic Board for Supporting the Operation of Electrochemical Gas Sensors". Hardware 2, n. 2 (14 giugno 2024): 173–89. http://dx.doi.org/10.3390/hardware2020009.
Testo completoUSLU-OZKUCUK, Gonca. "TRIAC Based Isolated AC Load Drive Equivalent Circuit Design of Solid-State Relay". Eurasia Proceedings of Science Technology Engineering and Mathematics 26 (30 dicembre 2023): 183–89. http://dx.doi.org/10.55549/epstem.1409469.
Testo completoPandey e Vora. "Open Electronics for Medical Devices: State-of-Art and Unique Advantages". Electronics 8, n. 11 (1 novembre 2019): 1256. http://dx.doi.org/10.3390/electronics8111256.
Testo completoZhang, Cai Rong, Guo Liang Liu e Bin Wei. "Design and Implementation of Electronic Bus Stop Boards System Based on Wireless Communication Module". Applied Mechanics and Materials 651-653 (settembre 2014): 2441–44. http://dx.doi.org/10.4028/www.scientific.net/amm.651-653.2441.
Testo completoBucolo, Maide, Arturo Buscarino, Luigi Fortuna, Carlo Famoso, Mattia Frasca, Antonino Cucuccio, Gaetano Rasconà e Giovanni Vinci. "A Comparative Analysis of Computer-Aided Design Tools for Complex Power Electronics Systems". Energies 14, n. 22 (18 novembre 2021): 7729. http://dx.doi.org/10.3390/en14227729.
Testo completoLiao, Wei. "Electronic Circuit Board Design and Production Project Design and Teaching Innovation". Creativity and Innovation 6, n. 3 (2022): 226–30. http://dx.doi.org/10.47297/wspciwsp2516-252745.20220603.
Testo completoSimon, Erik P., Moritz Fröhlich, Ch Kallmayer e K. D. Lang. "Design and Optimization of an Injection-Moldable Force-Fit Interconnection Module for Smart Textile Applications". Advances in Science and Technology 80 (settembre 2012): 96–101. http://dx.doi.org/10.4028/www.scientific.net/ast.80.96.
Testo completoKhan, Noor Mohmmed, Shubhangi Patil, Tushar Diggewadi e Anand Gudnavar. "Cinch and Sterling Analog Circuits for Laboratory". International Journal of Advanced Research in Electrical, Electronics and Instrumentation Engineering 6, n. 01 (25 giugno 2017): 51–58. http://dx.doi.org/10.15662/ijareeie.2017.0601007.
Testo completoNazirkulov, N., e N. Burambaeva. "A systematic approach to in-circuit diagnostics and design of printed circuit boards for locomotives". BULLETIN of the L.N. Gumilyov Eurasian National University. PHYSICS. ASTRONOMY Series 141, n. 4 (30 dicembre 2022): 29–40. http://dx.doi.org/10.32523/2616-6836-2022-141-4-29-40.
Testo completoCole, Reena, Tara Dalton, Jeff Punch, Mark R. Davies e Ronan Grimes. "Forced Convection Board Level Thermal Design Methodology for Electronic Systems". Journal of Electronic Packaging 123, n. 2 (21 luglio 2000): 120–26. http://dx.doi.org/10.1115/1.1339822.
Testo completoKim, Ernest M., e Thomas F. Schubert. "A low-cost design experience for junior-level electronics circuits laboratories through emulation of industry-printed circuit board design practice". International Journal of Electrical Engineering & Education 54, n. 3 (3 novembre 2016): 208–22. http://dx.doi.org/10.1177/0020720916673650.
Testo completoOberloier, Shane, e Joshua Pearce. "Belt-Driven Open Source Circuit Mill Using Low-Cost 3-D Printer Components". Inventions 3, n. 3 (5 settembre 2018): 64. http://dx.doi.org/10.3390/inventions3030064.
Testo completoHan, Ye, Xiang Dong You, Xu Zhang, Hui Yang Wang e Cong Deng. "A Novel Design of the CNG Dispenser Electronic Control System". Applied Mechanics and Materials 448-453 (ottobre 2013): 3119–22. http://dx.doi.org/10.4028/www.scientific.net/amm.448-453.3119.
Testo completoYang, Jun, e Jing Liu. "Direct printing and assembly of FM radio at the user end via liquid metal printer". Circuit World 40, n. 4 (28 ottobre 2014): 134–40. http://dx.doi.org/10.1108/cw-07-2014-0029.
Testo completoLi, Hong, e Si Qing Zhang. "Design for Robot Control Board Based on AVR Single Chip Microcomputer". Applied Mechanics and Materials 484-485 (gennaio 2014): 570–73. http://dx.doi.org/10.4028/www.scientific.net/amm.484-485.570.
Testo completoShonhe, Liah, e Balulwami Grand. "Implementation of electronic records management systems". Records Management Journal 30, n. 1 (11 settembre 2019): 43–62. http://dx.doi.org/10.1108/rmj-03-2019-0013.
Testo completoTaylor, Christine, Budy Notohardjono, Suraush Khambati e Shawn Canfield. "Designing Electronic Card Packages Against Shipping Shock". Journal of the IEST 64, n. 1 (1 dicembre 2021): 42–49. http://dx.doi.org/10.17764/1557-2196-64.1.42.
Testo completoRojas-Molina, Adriana, Gilberto Herrera-Ruiz, Rodrigo Castañeda-Miranda, Antonio Terrazas-Lara, Javier Hissarlik Flores-Chaparro, Benjamín Barón-Rodríguez e Ricardo Chaparro-Sánchez. "Diseño de tarjeta electrónica genérica para el control de motores trifásicos". Ingeniería, investigación y tecnología 13, n. 1 (1 gennaio 2012): 21–31. http://dx.doi.org/10.22201/fi.25940732e.2012.13n1.003.
Testo completoKannan Megalingam, Rajesh, Shree Rajesh Raagul Vadivel, Sreekumar S, Swathi Sekhar, Thejus R Nair e Midhun RR. "Design and Implementation of CNC Milling Bot for Milled Circuit Board Fabrication". International Journal of Engineering & Technology 7, n. 3.12 (20 luglio 2018): 1205. http://dx.doi.org/10.14419/ijet.v7i3.12.17838.
Testo completoYunardi, Riky Tri, Moh Zakky Zulfiar, Rr Wanda Auruma Putri e Deny Arifianto. "Design and Implementation of Solder Paste Dispenser Based on Linear Drive System". JEEE-U (Journal of Electrical and Electronic Engineering-UMSIDA) 3, n. 2 (13 novembre 2019): 338. http://dx.doi.org/10.21070/jeee-u.v3i2.2637.
Testo completoCole, Reena, Mark Davies e Jeff Punch. "A Board Level Study of an Array of Ball Grid Components—Aerodynamic and Thermal Measurements". Journal of Electronic Packaging 125, n. 4 (1 dicembre 2003): 480–89. http://dx.doi.org/10.1115/1.1604811.
Testo completoStęplewski, Wojciech, Mateusz Mroczkowski, Radoslav Darakchiev, Konrad Futera e Grażyna Kozioł. "New technologies of multi-layered printed circuit boards, intended of rapid-design electronic modules". Circuit World 41, n. 3 (3 agosto 2015): 121–24. http://dx.doi.org/10.1108/cw-03-2015-0008.
Testo completoRodgers, Peter, Vale´rie Eveloy e M. S. J. Hashmi. "An Investigation Into the Potential of Low-Reynolds Number Eddy Viscosity Turbulent Flow Models to Predict Electronic Component Operational Temperature". Journal of Electronic Packaging 127, n. 1 (1 marzo 2005): 67–75. http://dx.doi.org/10.1115/1.1849234.
Testo completoMao, Weiwei, Teng Pang, Xiaoyu Jin, Yang Li e Hongbao Bai. "Overall Scheme Design of Fault Diagnosis for Complex Electronic Systems". Journal of Physics: Conference Series 2731, n. 1 (1 marzo 2024): 012031. http://dx.doi.org/10.1088/1742-6596/2731/1/012031.
Testo completoPennathur, Priyadarshini R., Ann M. Bisantz, Rollin J. Fairbanks, Shawna J. Perry, Frank Zwemer e Robert L. Wears. "Assessing the Impact of Computerization on Work Practice: Information Technology in Emergency Departments". Proceedings of the Human Factors and Ergonomics Society Annual Meeting 51, n. 4 (ottobre 2007): 377–81. http://dx.doi.org/10.1177/154193120705100448.
Testo completoFomin, D. G., N. V. Dudarev, S. N. Darovskikh, M. G. Vakhitov e D. S. Klygach. "Specific Features of Volume-modular Technology Application in the Design of Microwave Electronic Devices". Ural Radio Engineering Journal 5, n. 2 (2021): 91–103. http://dx.doi.org/10.15826/urej.2021.5.2.001.
Testo completoChong, Peng Lean, Silvia Ganesan, Poh Kiat Ng e Feng Yuan Kong. "A TRIZ-Adopted Development of a Compact Experimental Board for the Teaching and Learning of Operational Amplifier with Multiple Circuit Configurations". Sustainability 14, n. 21 (29 ottobre 2022): 14115. http://dx.doi.org/10.3390/su142114115.
Testo completoPang, Teng, Weiwei Mao, Hongliang Liu, Yuan Li e Chao Hou. "Design of Fault Diagnosis Method Based on Circuit Frequency Domain Characteristics Fault Dictionary Method". Journal of Physics: Conference Series 2731, n. 1 (1 marzo 2024): 012009. http://dx.doi.org/10.1088/1742-6596/2731/1/012009.
Testo completoEt al., Andy Wahyu H. "Developing Learning Media Based Project Board in Electronic Materials to Improve the Analysis Capability and Skills for the Cadets of PIP Semarang". Turkish Journal of Computer and Mathematics Education (TURCOMAT) 12, n. 6 (5 aprile 2021): 2686–94. http://dx.doi.org/10.17762/turcomat.v12i6.5769.
Testo completoEvdulov, O. V., e A. M. Khaibulaev. "Experimental studies of the electronic board cooling system". Herald of Dagestan State Technical University. Technical Sciences 49, n. 1 (19 maggio 2022): 6–13. http://dx.doi.org/10.21822/2073-6185-2022-49-1-6-13.
Testo completoChung, B. T. F., e H. H. Li. "Forced Convective Cooling Enhancement Through a Double Layer Design". Journal of Electronic Packaging 117, n. 1 (1 marzo 1995): 69–74. http://dx.doi.org/10.1115/1.2792069.
Testo completoOzerkin, D. V., e V. O. Bondarenko. "Using Microthermostatting to Increase Thermal Stability of On-Board Electronics". Herald of the Bauman Moscow State Technical University. Series Instrument Engineering, n. 3 (132) (settembre 2020): 18–36. http://dx.doi.org/10.18698/0236-3933-2020-3-18-36.
Testo completoMonier-Vinard, Eric, Najib Laraqi, Cheikh Dia, Minh-Nhat Nguyen e Valentin Bissuel. "Analytical modeling of multi-layered printed circuit board using multi-stacked via clusters as component heat spreader". Thermal Science 20, n. 5 (2016): 1633–47. http://dx.doi.org/10.2298/tsci140403143m.
Testo completoZhang, Xiaoyan, Bo Lan, Yadongyang Zhu e Lugang Zhang. "Application of EDA Technology in Electronic Engineering Design". Learning & Education 10, n. 7 (7 giugno 2022): 175. http://dx.doi.org/10.18282/l-e.v10i7.2998.
Testo completoZhou, Shuyu. "Design of Novel Optical Fiber Communication Electronic System and Big Data Prediction Method of Its Loss". Journal of Nanoelectronics and Optoelectronics 16, n. 8 (1 agosto 2021): 1308–16. http://dx.doi.org/10.1166/jno.2021.3082.
Testo completoSandera, Josef. "Connection of electronic and microelectronic modules". Microelectronics International 31, n. 2 (29 aprile 2014): 86–89. http://dx.doi.org/10.1108/mi-10-2013-0053.
Testo completoR., Prabhu, e Divija T. "Design of Temperature Based Automatic Fan Speed Controller Using Arudino". International Journal of Innovative Research in Advanced Engineering 10, n. 07 (31 luglio 2023): 537–42. http://dx.doi.org/10.26562/ijirae.2023.v1007.17.
Testo completoLei, Lei, Jia Jing Zhuo, He Chen, Xian Feng Luo e Wei Peng. "Design and Realization of One Circuit Board General Test System Based on USB". Applied Mechanics and Materials 121-126 (ottobre 2011): 1977–81. http://dx.doi.org/10.4028/www.scientific.net/amm.121-126.1977.
Testo completoHasegawa, Kiyohisa, Yasuki Torigoshi e Daisuke Oshima. "Board Design Environments and Simulation Technologies". Journal of The Japan Institute of Electronics Packaging 25, n. 5 (1 agosto 2022): 488–98. http://dx.doi.org/10.5104/jiep.25.488.
Testo completoKUBODERA, Tadashi. "Printed Circuit Board Design for EMC". Journal of Japan Institute of Electronics Packaging 5, n. 4 (2002): 405–11. http://dx.doi.org/10.5104/jiep.5.405.
Testo completoSinotin, A. M., O. M. Tsymbal, T. A. Kolesnikova e S. V. Sotnik. "Algorithm for multi-board radio-electronic devices synthesis on maximal accepted overheat". Radiotekhnika, n. 190 (16 ottobre 2017): 89–96. http://dx.doi.org/10.30837/rt.2017.3.190.13.
Testo completoZwal, Yahaya Ibrahim, Madiu Ismail Opeyemi e Ibrahim Muhammad Warji. "Design and Construction of a Modified SMS-Based Electronic Notice Board". Path of Science 9, n. 4 (30 aprile 2023): 2001–6. http://dx.doi.org/10.22178/pos.91-7.
Testo completoPape, Alioune Dia, e Ndiaye Ababacar. "Design of a low-cost electronic board for monitoring photovoltaic systems". International Journal of Physical Sciences 18, n. 1 (31 gennaio 2023): 1–11. http://dx.doi.org/10.5897/ijps2022.4999.
Testo completoBURDUCEA, Sorin, e Miron ZAPCIU. "SIMULATION TECHNOLOGIES USED IN HIGH-SPEED PRINTED CIRCUIT BOARD DESIGN". ANNALS OF THE ACADEMY OF ROMANIAN SCIENTISTS Series on ENGINEERING SCIENCES 13, n. 2 (2021): 46–62. http://dx.doi.org/10.56082/annalsarscieng.2021.2.46.
Testo completoACITO, Bill. "“A Cross-Domain, System Planning Methodology”". International Symposium on Microelectronics 2018, n. 1 (1 ottobre 2018): 000005–12. http://dx.doi.org/10.4071/2380-4505-2018.1.000005.
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