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1
Garcia, Alexandre. "Ligand Induced Electroless Plating of Polymers". Palaiseau, Ecole polytechnique, 2011. https://pastel.hal.science/docs/00/64/69/62/PDF/ThA_seAGARCIA.pdf.
Testo completoAbstract (sommario):
Ce projet de recherche avait pour objectif de répondre à un enjeu industriel: Développer un procédé " propre " de métallisation des polymères sans satinage à l'acide chromique (CrVI). Au cours de ce travail, un procédé alternatif s'appuyant sur une technologie innovante de revêtement de surface (la technologie Graftfast®) a été développé. Ce procédé utilisable dans l'eau et à température ambiante permet de greffer chimiquement des polymères vinyliques sur une large gamme de surfaces de natures différentes. Par cette méthode, une couche d'acide polyacrylique (PAA) a été greffée de manière covalente sur différents substrats polymériques (ABS, ABS-PC, PA, PET, PVC, PVDF. . . ). Les propriétés chélatantes des groupes introduits dans ces films minces de polymères ont été mises à contribution pour l'immobilisation de sels métalliques. Une fois réduites au sein de cette interphase, les particules métalliques ont permis la croissance de la couche métallique par immersion dans un bain Electroless en jouant le rôle de catalyseur. Les couches métalliques résultantes ont montré des propriétés électriques et mécaniques identiques à celles obtenues par les procédés industriels actuels. Combiné à des procédés lithographiques bas coûts et innovants, des motifs métalliques localisés sur substrats flexibles et transparents (PET and PVDF) ont été réalisés à l'échelle micrométrique. Afin de répondre encore plus fortement aux contraintes environnementales et économiques actuelles, le procédé de fonctionnalisation de surface par immersion (Graftfast®) a été remplacé par un procédé par impression jet d'encre photo-assisté. Des motifs métalliques sur substrats flexibles du type papier glacé (PVC) ou transparents (PET) avec une résolution micrométrique ont aussi été réalisés. Ces structures présentent également d'excellentes propriétés électriques et mécaniques et laisse envisager une utilisation de ce procédé pour des applications dans le domaine de la microélectroniqueThe main goal of this research project was to answer to an industrial issue: To develop a "green" process for the electroless plating of polymers without chromic acid (CrVI) etching. During this work, an alternative process based on an innovative surface coating technology (Graftfast® technology) has been developed. This technique which is working in aqueous solution and at room temperature allows to chemically graft vinylic polymers on various types of substrates. Based on this method, a poly(acrylic acid) (PAA) layer has been covalently grafted onto various polymer substrates (ABS, ABS-PC, PA, PET, PVC, PVDF. . . ). Ion exchange properties introduced in these polymer thin films were used to entrap metal salts. Once reduced into this interphase, copper particles act as catalysts of the metal layer growth by immersion into an electroless plating bath. The resulting metal layer owns mechanical and electrical properties competitive with the current industrial processes. Combined with cost-effective and innovative lithographic processes, metal patterns were obtained onto flexible and transparent substrates (PET, PVDF) at the micrometer scale. In order to answer more appropriately to the current environmental and economic constraints, this "wet" Graftfast® surface functionalization process has been replaced by an inkjet-printed and photo-assisted process. This new process also enables to produce metal patterns onto flexible substrates such as glossy papers (PVC) or transparent sheets (PET) with a micrometric resolution. These devices similarly own excellent electrical and mechanical properties and allow considering its use for applications in the microelectronic field
2
Noren, Martin. "Electroless Copper Plating to Achieve Solderless Connections". Thesis, Luleå tekniska universitet, Institutionen för system- och rymdteknik, 2021. http://urn.kb.se/resolve?urn=urn:nbn:se:ltu:diva-86533.
Testo completoAbstract (sommario):
As the world has woken up to the change in climate in recent years, people's environmental concerns are forcing companies to change and find ways to manufacture products without harming nature. One area of serious concern is the electronics industries where an ever-increasing number of products gets updated with sensors and microcomputers to be part of the internet of things. Wen more things are upgraded with electronics, it's important that the production process is as environmentally friendly as possible and that the techniques used introduces a minimum amount of disturbance to the circuits in them. To tackle this problem, this thesis presents a novel way of manufacturing PCBs without the need for soldering components, a method that increases performance and has substantial environmental benefits. When comparing conventional soldering to the electroless copper plating process presented in this thesis, electroless copper plating uses 67 times less metal and also reduces the parasitic capacitance in the PCB that comes from the solder joints. Utilizing the solder-free method means 67 times less metal needs to be mined, transported, and recycled. Moreover, since lead is a toxic heavy metal that is often part of the solder, decreasing its use in the industry is beneficial for human health and the environment. Nowadays, when the world steadily moves toward products that use technologies like 5G, technologies where higher frequencies are required, their sensitivity to capacitive disturbances from parasitics increases. In this thesis, when comparing the conventional solder method to the non-solder method to attach a capacitor, a significant reduction in phase shift of 0.9° is measured; this change is directly related to the removal of the solder and the parasitic capacitance that comes with it.
3
Sullivan, Anne M. "Autocatalytic electroless gold deposition at low pH". Diss., Georgia Institute of Technology, 1995. http://hdl.handle.net/1853/10079.
Testo completo
4
Krishnan, Vidya. "Electroless deposition of copper for microelectronic applications". Thesis, Georgia Institute of Technology, 2000. http://hdl.handle.net/1853/11752.
Testo completo
5
Shi, Zhongliang 1965. "Electroless deposited palladium membranes and nanowires". Thesis, McGill University, 2007. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=111872.
Testo completoAbstract (sommario):
Hydrogen is considered to be the fuel of the future as it is clean and abundant. Together with the rapidly developing fuel cell technology, it can sustain an environmentally sound and efficient energy supply system. Developing the technologies of palladium-based membrane for hydrogen separation and palladium nanostructured materials for hydrogen sensing and hydrogenation catalysts makes the "hydrogen economy" possible. This is because these technologies will allow for commercially viable production of comparatively cheap and high-quality hydrogen, and safety of its application. Based on the market requirements and interest in the development of a hydrogen economy, the purposes of this thesis are to develop thin palladium membrane for hydrogen separation and to explore an economic method for the synthesis of palladium nanowires in potential engineering applications. The original contributions of this thesis are outlined below:The investigation of deposition progress of a palladium membrane on porous stainless steel substrate illustrates that palladium deposits will form a network structure on pore areas of the substrate surface in the initial stages. A bridge model is presented to describe the formation of a membrane. This model is confirmed from the cross-section of the deposited membranes. Based on the bridge model and the experimental measurements of palladium membranes deposited on the pore area of the substrates, the thickness of a palladium membrane deposited on 0.2 mum grade porous stainless steel substrate can be effectively controlled around 1.5∼2 mum, and the thickness of a palladium membrane deposited on 2 mum grade porous Inconel substrate can be effectively controlled around 7.5∼8 mum. Comparing the thickness and quality of palladium membranes deposited on the same substrates with the data in the literature, the thicknesses of the membranes prepared in this program are lower. The obtained result will be beneficial in the design and manufacture of suitable membranes using the electroless deposition process.
In the initial deposition stages, palladium nanoparticles cannot be deposited at the surface of the SiO2 inclusions that appear at the substrate surface. With the extension of deposition time, however, palladium nanoparticles gradually cover the SiO2 inclusions layer by layer due to the advance deposited palladium nanoparticles on the steel substrate surrounding them. The effect of the SiO2 inclusions on palladium deposits cannot be neglected when an ultra-thin membrane having the thickness similar to the size of inclusions is to be built.
The chemical reaction between phosphorus (or phosphate) and palladium at high temperature can take place. This reaction causes surface damage of the membranes. If palladium membranes are built on the porous substrates that contain phosphorus or phosphate used in the inorganic binders, they cannot be used over 550°C. This result also implies that palladium membranes cannot be employed on the work environment of phosphorus or phosphates.
Palladium nanowires are well arranged by nanoparticles at the rough stainless steel surface. The formation procedures consist of 3 stages. In the initial stage, palladium nanoparticles are aligned in ore direction, then the nanowire is assembled continuously using follow-up palladium deposits, and finally the nanowire is built smoothly and homogeneously. It is also found that palladium nanoparticles generated from the autocatalytic reaction are not wetting with the steel substrate and they are not solid and easily deformed due to the interfacial tension when they connect to each other.
Various palladium nanowire arrays possessing the morphologies of single wires, parallel and curved wires, intersections and network structures are illustrated. The results demonstrate that palladium nanowires can be built in a self-assembled manner by palladium nanoparticles in the initial deposition stages. Such self-assembled nanowires may attract engineering applications because electroless deposition process and preparation of a substrate are simple and inexpensive.
The diameter of palladium nanowires can be effectively controlled by the concentration of PdCl2 in the plating solution and deposition time. The size of palladium nanoparticles generated from the autocatalytic reaction is directly dependent on the concentration of PdCl2 in the plating solution. The higher the concentration of PdCl2 in the plating solution is, the smaller the deposited palladium nanoparticles are. The experimental results provide a controllable method for the fabrication of palladium nanowire arrays with potential engineering applications.
6
Shemesh, Ely 1962. "TERNARY COMPLEXES OF COPPER(I), CYANIDE, AND 2,9-DIMETHYL-1,10-PHENANTHROLINE". Thesis, The University of Arizona, 1986. http://hdl.handle.net/10150/291268.
Testo completo
7
Owen, S. A. "Corrosion resistance of electroless nickel deposits from aged and synthetic solutions". Thesis, University of Nottingham, 1999. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.311914.
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8
Sutch, Peter John F. "Consumption and loss of formaldehyde in electroless copper plating". Master's thesis, University of Central Florida, 1993. http://digital.library.ucf.edu/cdm/ref/collection/RTD/id/21775.
Testo completoAbstract (sommario):
University of Central Florida College of Engineering ThesisThe objectives of this research were to quantify formaldehyde consumption due to plating and parasitic reactions and determine the magnitude and distribution of formaldehyde losses from the electroless copper plating process. Plating and rinse bath samples obtained from three electroless copper plating operations were analyzed for formaldehyde and copper in order to develop a mass balance analysis about the plating bath for periods of active production and no production. Fugitive air and stack releases of formaldehyde were estimated using emission factors developed from air sampling at the three facilities. It was determined that approximately 90% of the formaldehyde added to the plating process was sonsumed by some type of chemical reaction. The remaining 10% of formaldehyde represents losses from the plating operation. For the facilities with a waste plating solution stream, atmospheric losses accounted for approximately 25% of the total losses. The mass of fugitive air formaldehyde measured approximately 2.8 times that escaping through the stack. Dragout accounted for approximately 2.3% of the losses with the remaining going to the waste stream. For the facility without a plating solution waste stream, formaldehyde losses were distributed 59% to atmospheric relases and 41% to the rinse tank. Fugitive and stack releases were approximately the same at 29% of the formaldehyde losses. Formaldehyde consumption due to parasitic reactions for periods of active plating and no plating were determined for two facilities. The rate of parasitic consumption during periods of production was found to be approximately 3 times greater than that for no production. The rate of parasitic consumption was observed to increase with increasing bath temperature.
M.S.;
Civil and Environmental Engineering;
Engineering;
Environmental Engineering;
206 p.
xii, 206 leaves, bound : ill. ; 28 cm.
9
Zeszut, Ronald Anthony Jr. "Effects of Transport and Additives on Electroless Copper Plating". Case Western Reserve University School of Graduate Studies / OhioLINK, 2017. http://rave.ohiolink.edu/etdc/view?acc_num=case1497271315649528.
Testo completo
10
Hayden, Harley T. "Enhanced Adhesion Between Electroless Copper and Advanced Substrates". Diss., Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/22615.
Testo completoAbstract (sommario):
In this work, adhesion between electrolessly deposited copper and dielectric materials for use in microelectronic devices is investigated. The microelectronics industry requires continuous advances due to ever-evolving technology and the corresponding need for higher density substrates with smaller features. At the same time, adhesion must be maintained in order to preserve package reliability and mechanical performance. In order to meet these requirements two approaches were taken: smoothing the surface of traditional epoxy dielectric materials while maintaining adhesion, and increasing adhesion on advanced dielectric materials through chemical bonding and mechanical anchoring.
It was found that NH3 plasma treatments can be effective for increasing both catalyst adsorption and adhesion across a range of materials. This adhesion is achieved through increased nitrogen content on the polymer surface, specifically N=C. This nitrogen interacts with the palladium catalyst particles to form chemical anchors between the polymer surface and the electroless copper layer without the need for roughness. Chemical bonding alone, however, did not enable sufficient adhesion but needed to be supplemented with mechanical anchoring. Traditional epoxy materials were treated with a swell and etch process to roughen the surface and create mechanical anchoring. This same process was found to be ineffective when used on advanced dielectric materials. In order to create controlled roughness on these surfaces a novel method was developed that utilized blends of traditional epoxy with the advanced materials. Finally, combined treatments of surface roughening followed by plasma treatments were utilized to create optimum interfaces between traditional or advanced dielectric materials and electroless copper. In these systems adhesion was measured over 0.5 N/mm with root-mean-square surface roughness as low as 15 nm. In addition, the individual contributions of chemical bonding and mechanical anchoring were identified.
The plasma treatment conditions used in these experiments contributed up to 0.25 N/mm to adhesion through purely chemical bonding with minimal roughness generation. Mechanical anchoring accounted for the remainder of adhesion, 0.2-0.8 N/mm depending on the level of roughness created on the surface. Thus, optimized surfaces with very low surface roughness and adequate adhesion were achieved by sequential combination of roughness formation and chemical modifications.
11
Tian, Bo. "Modified electroless plating technique for preparation of palladium composite membranes". Thesis, Link to the online version, 2005. http://hdl.handle.net/10019/1243.
Testo completo
12
Bird, Elliott J. "Investigation of Additives for Use in Electroless Plating Solutions for Fabrication of Nanowires". BYU ScholarsArchive, 2009. https://scholarsarchive.byu.edu/etd/2125.
Testo completoAbstract (sommario):
This study focused on improvement of electroless plating methods by use of particular bath additives. The techniques developed here can enable us to plate very thin layers selectively on a nonconductive substrate and thus create metallized features on a nanoscale. Through the development of such bottom-up techniques this work contributes a key technology to achieving self-assembled nanocircuits. The use of additives in an electroless plating environment can modify the barriers to nucleation (or seeding) and growth. Two additives, namely 3-mercapto-1-propanesulfonic Acid (MPS) and 1,3-propanedisulfonic acid (PDS), notably increased the selectivity of electroless metallization on chemically modified surfaces, which can be used to create patterned structures. More specifically, the additives increased the growth rate of metal on an aminosilane-coated surface relative to an uncoated surface. This work includes an examination of metal layer thickness and conductivity in addition to selectivity. The layer thickness was determined through the use of atomic force microscopy on surfaces that exhibited conductivity. The conductivity of the surface metal was determined through a measurement on a four-point probe measurement. In this series of experiments, the disulfonate-containing additive PDS provided the highest nucleation density, highest conductivity and the best selectivity ratio. The palladium metal deposit on the PDS-treated surface was nearly uniform in height and its conductivity approached the bulk conductivity of palladium with a metal height of less than 30 nm. MPS-treated surfaces also provided increased nucleation density when used during the seeding step, but the resulting conductivity was less than that of the PDS treated samples. We recommend the use of PDS as an effective electroless plating additive for use in palladium electroless plating processes.
13
Song, Li. "Application of electroless plating for fabrication of flexible and integrated piezoelectric ultrasonic sensors". Thesis, McGill University, 2008. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=21961.
Testo completoAbstract (sommario):
Integrated (IUTs) and flexible ultrasonic transducers (FUTs) have been found to be of great interest for structural health monitoring (SHM) of graphite/epoxy (Gr/Ep) composite parts and structures. Because certain Gr/Ep composites do not have sufficient electrical conductivity, bottom electrodes are required for the IUT fabrication. Also FUTs using insulating polyimide (PI) membrane which offers high flexibility, bottom electrode is required as well. One main objective is to develop the electroless plating technique to deposit nickel (Ni) or silver (Ag) onto Gr/Ep composites and PI for IUT or FUT fabrication. The pre-treatments (cleaning, etching, sensibilization, activation and reduction) and reaction conditions (bath chemistry, temperature, time, agitation, etc.) have been investigated. Recipes of electroless nickel (EN) plating at room temperature (RT) and 90°C and RT electroless Ag plating have been developed. The interfacial adhesion of the Ni or Ag/substrate was also tested. The conductivity of the fabricated bottom electrodes was tested by ohmmeter. A 50~60µm piezoelectric film was fabricated by sol-gel spray technique. IUTs and FUTs consisting of these EN bottom electrodes, piezoelectric film and Ag paste top electrode perform well for SHM purposes.Les capteurs ultrasonores flexible (CUF) et intégré (CUI) sont très intéressants pour le suivi de la santé structurelle (SSS) des pièces de structures et de composites, composées à partir de carbone/époxyde (C/Ep). Parce que le C/Ep n'a pas suffisamment de conductivité électrique, une électrode de base est nécessaire pour la fabrication de CUIs. De plus, pour le CUF utilisant du polyimide (PI) comme membrane isolante nécessite aussi l'utilisation d'une électrode de base. Un des principaux objectifs de ce mémoire est de remédier à ce problème par le développement d'une technique de placage au tampon. Cette dernière déposera du nickel (Ni) ou de l'argent (Ag) sur le C/Ep et le PI pour obtenir des CUIs ou des CUFs. Les prétraitements (nettoyage, attaque chimique, sensibilisation, activation et réduction) et les conditions de réaction (bain chimique, température, temps, agitation, etc.) ont été étudiés. Les procédures pour le placage au tampon du nickel (PTN) à la température de la pièce (TP) et à 90C ainsi que pour l'Ag à TP furent développées. Les adhésions de surface du Ni ou de l'Ag avec le substrat furent testées. Les conductivités électriques des électrodes de base furent testées avec un ohmmètre. Un film piézo-électrique de 50~60 μm fut fabriqué par une technique sol-gel. Les CUI et CUF fabriqués avec l'électrode de base faite à partir du PTN, du film piézo-électrique et une pâte d'Ag comme électrode de surface, excelle bien pour les besoins en SSS.
14
Lin, Ting-yu, e 林廷育. "Electrolysis recovery of nickel from spent electroless nickel plating solution". Thesis, 2011. http://ndltd.ncl.edu.tw/handle/17399091443936885802.
Testo completoAbstract (sommario):
碩士朝陽科技大學
環境工程與管理系碩士班
99
Nickel is a really rare and expensive metal, and it can cause cancer. Nickel''s price is getting higher recently and the production cost is increasing, and therefore it is really important to take care of spent electroless nickel plating solution. If the spent solution is treated improperly, it would not only cause heavy metal contamination, but also resource wasting. The focus of this study is on the adoption of electrolysis method to recover nickel from spent electroless nickel plating solution. Unlike traditional chemical precipitation method which causes large amount of nickel sludge and expensive solidified treatment cost sequentially. At first, simulated spent nickel solution was used in this study. Anodes are two types of dimensionally stable anodes (DSA) including RuO2/Ti mesh and IrO2/Ti mesh, respectively. Cathodes are stainless steel and nickel foam, respectively. The electrolysis process parameters including electrolysis time, solution pH, space between anode and cathode and solution temperature. Spent nickel solution generation from electroless nickel plating factory was used in electrolysis process sequentially. The temporal varieties of electrolytic efficiencies are studied throughout each process parameter. The results showed RuO2/Ti is better than IrO2/Ti. The electrolytic efficiencies decrease as solution pH increase within the range from 7 to 11. The best space between anode and cathode is 3cm within the range from 1 to 5cm. The best solution temperature is 80℃ within the range from 50 to 90cm. Nickel''s removal ratio can be as high as 94% using nickel foam as cathode. The recovered nickel foils can be easily peeled using stainless steel as cathode.
15
Chen, Jenn Ray, e 陳振瑞. "Electroless Nickel Plating on Silicon". Thesis, 1995. http://ndltd.ncl.edu.tw/handle/58524198318750932265.
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16
Chen, Shu Hui, e 陳淑惠. "Electroless Nickel Bumps and Electroless Copper Plating of Nickel powders". Thesis, 1993. http://ndltd.ncl.edu.tw/handle/64913003417166320744.
Testo completo
17
Chen, Hung-Sheng, e 陳宏生. "Study of Electroless Nickel Plating on Copper". Thesis, 1996. http://ndltd.ncl.edu.tw/handle/94583332216719405604.
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18
Hsien, Wang Hsiao, e 王孝賢. "Research for electroless copper plating on POM". Thesis, 1999. http://ndltd.ncl.edu.tw/handle/26099699012480466603.
Testo completoAbstract (sommario):
碩士淡江大學
機械工程學系
87
This research aims to improve the platability and adhesive strength of electroless plating copper on POM by modifying the surface morphology using sulfuric acid or hydrogen chloride solution and various conditions. It is found: High concentration of etching solution has an increasing rate on weight loss per unit area of POM in etching process. It means that the reaction rate increases with etchant concentration, and the reaction rate as well as concentration adapt to the following equation: Ln (rate) = n Ln (concentration) + constant Where n is the concentration index. To the relation of concentration index and temperature, the concentration index increases with temperature and expresses an S-shaped curve. The lowest concentration index happens at temperature 20C. And, the concentration index increases rapidly with raising temperature. Up to temperature 70C, the increasing rate of concentration index gets slowly and approaches to a saturation-like situation. On the other side, the reaction rate corresponds to Arrhenius equation in etching process. The activation energy of sodium acid and sulfuric acid are 385 and 650 kcal/mole respectively. In surface morphology, the surface roughness (Ra, Rt) of POM increases with etchant concentration and raising temperature, the surface pits significantly increase as well. As etchant concentration or temperature continuous increasing, the surface pits enlarge and connect to form network tunnels. It also means that higher etchant concentration and raising temperature on POM surface contributes more mechanical locking positions for plating deposit. To form plating deposit and mechanical properties, only a larger surface pit density of POM can generate a continuous deposit layer in electroless plating. The adhesive strength of deposit increases with the number of network tunnels on POM surface. However, the adhesive strength does not increase or decrease when the pit size keeps growing.
19
She, Te-Chin, e 佘德勤. "Synthesis Ni-P Nanoarrays with Electroless Plating". Thesis, 2009. http://ndltd.ncl.edu.tw/handle/44564053869031672898.
Testo completoAbstract (sommario):
碩士國立臺灣大學
材料科學與工程學研究所
97
Nanoarrays of nickel-phosphorous is developed by electroless plating into anodic aluminum oxide(AAO) template. Unlike traditional template electroless plating, which needs to sensitize and activate inside of the pores in anodic aluminum oxide template, we sensitized and activated the substrate then stock one side of anodic aluminum oxide template on the substrate and started electroless plating. Nckel is self-activated, so that there is no need to sensitize and activate inside the pores in anodic aluminum oxide template. Deposited nickel will be the new catalytic layer, so nanoarrays can be developed. And, this method can avoid that nickel may deposited too fast and stuck the pores of anodic aluminum oxide template. We used different substrates to develop nanoarrays, such as glass, polystyrene film, polystyrene nanoparticles and polyaniline-coated-polystyrene nanoparticles. Only polystyrene nanoparticles and polyaniline-coated-polystyrene nanoparticles could develop nanoarrays. Nanoarrays made by polystyrenes were nanorods with the same length. But, nanoarrays made by core-shell particles were nanotubes with bad structure. The difference between these two methods was because their growth mechanisms were different. And, properties of nanoarrys from these two different substrates were not the same. Besides, nanoarrays made of two methods both maintain their magnetism. Nanoarrays were analyzed by SEM, EDS, XRD and SQUID.
20
Chen, Yan-Bin, e 陳彥彬. "Development of Interconnects by Electroless Nickel Plating". Thesis, 2015. http://ndltd.ncl.edu.tw/handle/26720310789069034050.
Testo completoAbstract (sommario):
碩士國立臺灣大學
材料科學與工程學研究所
104
As the progress of the electronic packaging, the critical dimension continues to reduce in size. At the scale of micro bump, solder joints would encounter some issues affecting its reliability. A low temperature process of interconnection technology of chips without using solder was researched in this paper. Because of selective plating and uniformity in thickness, electroless nickel plating was applied to pillar interconnection in flip chip bonding. Copper pillars were interconnected by electroless nickel plating at 74 ℃ and the plating time was decided by the distance between two pillars. The samples were inspected and analyzed by optical microscope (OM) and scanning electron microscope (SEM). Different methods were tested to optimize the electroless nickel bonding, including Triton X-100 addition, sample rotation and dome-shaped pillar. The results of electroless nickel plating of aligned chips without any additive showed that nickel only plated on the surface near the entrances of the gap. By adding Triton X-100 to the plating bath, the pillar array located at the central of chip could be plated by nickel, however, the cross-sectional images showed some irregular voids trapped and seams in the nickel plating layer. To increase the mass transfer of reactants in the gap, rotation was applied to the sample while electroless nickel plating. A void with disk-like shape could be observed in the plated nickel layer of the sample been rotated. Not only flat-topped pillar but also dome-shaped pillar were tested in this experiment. According to the results of electroless nickel plating using dome-shaped pillars with sample rotation, the plated nickel layer showed three different cases of bonding, first, a seam across the whole pillar existed in the nickel layer, second, some discontinuous seams remained in the nickel layer, third, a seam-less bonding.
21
Huang, Kuan-Ning, e 黃冠寧. "Study of Electroless Cu Plating on Graphene". Thesis, 2014. http://ndltd.ncl.edu.tw/handle/rm3fvg.
Testo completoAbstract (sommario):
碩士國立虎尾科技大學
材料科學與綠色能源工程研究所
102
Graphene owns high specific surface area, large surface to volume ratio and high stability and is a suitable catalyst support. Electroless plating is a low cost and easy method to deposit nano-metals on substrate. In this study, Graphene（reduced graphene oxide, rGO）was fabricated by using Sodium borohydride to reduce Graphene oxide（GO）which was prepared from natural graphite by using modified Hummers method, and then went through electroless Copper plating to form nano-composite material. The effect of electroless Copper parameters on graphene were investigated. The optimum conditions of electroless Copper plating to form semiconductor Cu2O nanoparticles on graphene and its hydrogen generation effect were studied. Electroless Copper parameters contain plating temperature, plating time, concentration of reductant, pH value and using ice water to inhibit reaction. The XRD results show clusters of Cu and Cu2O crystals deposited on rGO after electroless Copper plating at pH 13, and the intensity of Cu2O（111）increases with increasing temperature, but Cu（111）decreases. Half concentration of reductant and ice water were used to inhibit electroless Copper reaction, to deposit fine and uniform Cu and Cu2O particles on rGO. The SEM and TEM morphology of Cu2O particles are different and depend on the growth rate of preferred orientation, but SEM and TEM morphology of Cu particles are lot of ball shape or long shape. The optimum conditions to deposit Cu2O semiconductor on substrate including commercial graphene, rGO and Si sheet by using electroless Copper plating are pH 13, 0.5mL/L methanol reductant, 30℃, plating for 30seconds, and using ice water to stop reaction. Among them, square Cu2O semiconductor of 20 nm size could be uniformly deposited on rGO, and which perform the best Hydrogen generation, there is 98 ml hydrogen product at 5 minutes, if using commercial graphene as substrate, there is 33 ml hydrogen product at 5 minutes .
22
Kutnahorsky, Marika Renée. "Electroless Copper Deposition: A Sustainable Approach". Thesis, 2009. http://hdl.handle.net/1807/30125.
Testo completoAbstract (sommario):
A sustainable electroless copper coating process was developed for plating automotive fasteners shaped from AISI 9255 low carbon, high silicon steel. The objective was to minimize the ionic and organic species present in each step of the plating process. A sulfuric acid solution inhibited with quinine was defined to clean the steel prior to plating. The corrosivity of the solution was examined through electrochemical and weight loss measurements to evaluate the efficiency of the cleaning process at high temperatures and high acid concentrations. An electroless copper coating process was then developed using a simple copper sulfate chemistry inhibited with quinine to extend the possible operating window. Finally, benzotriazole was evaluated as a possible anti-oxidant coating. Accelerated thioacetamide corrosion tests were used to evaluate the corrosion inhibition of benzotriazole on copper coatings.
23
"A study on the chemical and physical properties of electroless nickel on carbon-steel". 2000. http://library.cuhk.edu.hk/record=b5890502.
Testo completoAbstract (sommario):
by Lam Ka.Thesis (M.Phil.)--Chinese University of Hong Kong, 2000.
Includes bibliographical references (leaves 54-60).
Abstracts in English and Chinese.
ABSTRACT --- p.i
ACKNOWLEDGEMENT --- p.ii
TABLE OF CONTENT --- p.iii
LIST OF TABLES --- p.v
LIST OF FIGURES --- p.vii
Chapter CHAPTER ONE: --- INTRODUCTION --- p.1
Chapter 1.1 --- Metal deposition --- p.1
Chapter 1.2 --- Electroless Nickel Plating --- p.3
Chapter 1.2.1 --- Historical Review and Applications --- p.3
Chapter 1.2.2 --- General Chemical Principles --- p.5
Chapter 1.2.3 --- Previous Studies --- p.7
Chapter 1.3 --- Scope of Work --- p.12
Chapter CHAPTER TWO: --- EXPERIMENTAL --- p.13
Chapter 2.1 --- Bath Composition --- p.13
Chapter 2.1.1 --- Theoretical Description --- p.13
Chapter 2.2.2 --- Materials --- p.15
Chapter 2.2 --- Procedure and Experimental Conditions --- p.17
Chapter 2.3 --- Characterization of EN Coatings --- p.18
Chapter 2.3.1 --- Theory --- p.18
Chapter 2.3.1.1 --- Energy Dispersive X-ray Detection of Scanning Electron Microscopy --- p.18
Chapter 2.3.1.2 --- Polycrystalline X-ray Diffraction --- p.18
Chapter 2.3.1.3 --- X-ray Photoelectron Spectroscopy --- p.20
Chapter 2.3.1.4 --- Microhardness --- p.22
Chapter 2.3.1.5 --- Corrosion resistance --- p.23
Chapter 2.3.1.6 --- Thickness Measurement --- p.23
Chapter 2.4 --- Application --- p.24
Chapter CHAPTER THREE: --- RESULTS AND DISCUSSION --- p.26
Chapter 3.1 --- Appearance --- p.28
Chapter 3.2 --- Microstructure --- p.30
Chapter 3.2.1 --- Effect of Phosphorus Content --- p.30
Chapter 3.2.2 --- Effect of heat treatment --- p.32
Chapter 3.3 --- Corrosion Resistance --- p.37
Chapter 3.3.1 --- Effect of Phosphorus Content --- p.37
Chapter 3.3.2 --- Effect of Heat Treatment --- p.45
Chapter 3.3.2.1 --- Temperature --- p.45
Chapter 3.3.2.2 --- Cooling Rate --- p.47
Chapter 3.4 --- Microhardness --- p.49
Chapter 3.4.1 --- Effect of Phosphorus Content --- p.49
Chapter 3.4.2 --- Effect of Heat Treatment --- p.49
Chapter CHAPTER FOUR: --- CONCLUSION --- p.52
REFERENCES --- p.54
24
Wu, Chih–Hsiang, e 吳致翔. "Reproduce the Moth-Eye Structure by Electroless Plating". Thesis, 2015. http://ndltd.ncl.edu.tw/handle/16173160691654522728.
Testo completoAbstract (sommario):
碩士國立雲林科技大學
材料科技研究所
103
This thesis replicated a nano mold with moth-eye structure. Firstly polydimethylsiloxane (PDMS) was used to replicate a negative mold. The catalytic seeds needed in electroless nickel plating were adsorbed on the negative mold by sensitization and activation of the mold, then nickel alloy positive nano mold was obtained through electroless nickel plating. The thickness of the nickel layer was increased by plating. Finally, the PDMS negative mold could be separated from the nickel positive mold successfully. The bath composition, time of deposition, temperature, pH value of the bath and time of sensitization and activation were investigated systematically. The grain morphology and structure were observed by optical microscope. SEM analysis showed that the nickel layer surface was all periodic structure. AFM analysis further showed that the nano-columnar structure was copied successfully.
25
Lin, Kuen-Hsing, e 林坤興. "A Study on Electroless Copper Plating for VLSI". Thesis, 1999. http://ndltd.ncl.edu.tw/handle/53906994765703038252.
Testo completo
26
Chen, Yen-Wen, e 陳彥文. "Electroless plating and its application to Bio-Chips". Thesis, 2005. http://ndltd.ncl.edu.tw/handle/65578341825230021288.
Testo completoAbstract (sommario):
碩士國立屏東科技大學
材料工程研究所
93
Traditional microchip are performed using optical detection, utilizing either absorbance or laser–induced-fluorescence. However, these optical detection methods have some drawbacks. During the past few years, contactless conductivity detection has been presented as a valuable extension to optical detection technology. The current study reports a simple and reliable method of micro fabrication technology, electroplating, and electroless technology to fabricate an integrated capacitive detection microfluidic bio-chip. This bio-chip have become a firmly accepted separation analysis technique suitable for complex mixtures owing to its ability to provide extremely high separation efficiencies in relatively short time with small sample volume in low concentration. A simple and low-cost electrical detection method using contactless electrode pair is developed. Electroless plating and electroplating copper film electrode used as the three dimension(3D) detection electrodes, that placed on the end of micro channel . This detection scheme measures the electrical properties of the sample plugs as they pass-by the detection area. The contactless electrode can avoid the reaction between electrode and samples. Improve the result of detection. The 3D electrode which fabricate by electroless and electroplating technology to increase the detection area .and Improve of the sensitive of detection
27
Liu, Chen-Lang, e 劉貞郎. "Preparation the Polymer microspheres of Electroless nickel plating". Thesis, 2000. http://ndltd.ncl.edu.tw/handle/bbnbw3.
Testo completoAbstract (sommario):
碩士中正理工學院
應用化學研究所
88
The polystyrene micro-spheres in the micron diameter range were made by polymerizations. The magnetic fine particles were prepared by electroless nickel-plating after sensitization and activation. The concentration of monomer and initiator, the amount of surfactant used, and polymerization temperature will affect the particle size and disparity of microspheres. The amount of nickel deposited on microspheres is strongly dependent on the pH value of plating bath and bath composition. The experimental results have shown that the magnetic fine particles can be made under the suitable temperature of 70℃, stirring rate in 300~400rpm and the pH value is 7 of plating bath. The nickel-plating thin layer on the spherical particles might have the ability of electromagnetic absorbent. We hope that the electromagnetic absorbent polymeric powders can be made through an appropriate processing.
28
Wu, Tzu-Yu, e 吳梓渝. "Preparation of Core-Shell Nanocomposites by Electroless Plating". Thesis, 2010. http://ndltd.ncl.edu.tw/handle/77673556551153454338.
Testo completoAbstract (sommario):
碩士國立高雄大學
應用物理學系碩士班
99
The controlled organization of metal nanosized particles into ordered structures has the unique optical, electrical, magnetic, and catalytic properties, which were important for various fields. For the core-shell nanocomposites synthesis technology in current literatures, most of disadvantages are too loose on metal shell structure and are complicated synthetic steps, resulting in affecting its nature and application.In this study, we present an electroless method for the fabrication of core-shell silica-silver nanocomposite spheres. The technique for electroless metal plating is based on the use of a chemical reducing reaction that permits the reduction of the metal silver ions from solution on the surface of the core silica. For this process, the surface does not need electronically conducting, while the kinetics of electron transfer should be slow enough to avoid the reduction of the metal ions and nucleation in solution. The surface is ensured that reduction only takes place on the surface, so that the metal remains attached. Then, we can search influence parameter on coating thickness of silver shell via experiment. Further, we can obtain the optimum result from various parameters.
29
Chen, Chin-Te, e 陳金德. "Study of Electroless Nickel Plating with Auxiliary Electric-Field". Thesis, 2005. http://ndltd.ncl.edu.tw/handle/18402639989106638246.
Testo completoAbstract (sommario):
碩士逢甲大學
材料與製造工程所
93
Low-carbon steel substrate was deposited with Ni-P by electroless plating method assisted with pulse direct current of different duty cycles. Microstructures of Ni-P coatings were analyzed by ICP-AES, EPMA, XRD, SEM. The corrosion behaviors in 3.5%NaCl aqueous solution of Ni-P deposit were studied by electrochemical analysis and dipping test. Plating rate in acidic plating bath is faster at pH 4.8 than that at pH 4.4. The percentage of phosphorus in coating layer is lowered as plating rate is increased. Plating rate is increased as duty cycle of applied pulse current increases. The phosphorus content in coating is lowered when plating rate is increased at pH4.4. However, variation of P % is not obvious for plating bath at pH4.8. A broad diffraction peak was shown for XRD analysis of Ni-P coating deposited in acidic plating bath with auxiliarly pulse electric current (0.5A/dm2). The corrosion resistance capability of Ni-P coating in 3.5% NaCl aqueous solution is closely related to the P%. As phosphorus percentage increases, better anti-corrosion behavior is observed. For satisfactory corrosion resistance, it is suggested that duty cycle ≦ 50% for plating at pH 4.4, and duty cycle ＞ 20% for plating at pH 4.8. For coatings with multilayer, if active layer with lower P% is on the top of passive layer, the corrosion resistance is enhanced. The sacrificial anodic effect is evidenced by the cross-sectional morphology of SEM micrographs.
30
HWANG, CHIEN-YAO, e 黃建堯. "Analysis on surface properties of electroless plating copper catalyst". Thesis, 1996. http://ndltd.ncl.edu.tw/handle/59986897635436891447.
Testo completo
31
Wu, Shao-Ling, e 吳少鈴. "Metallization by Ink-Jet Printing Based on Electroless Plating". Thesis, 2006. http://ndltd.ncl.edu.tw/handle/71978078241659594409.
Testo completoAbstract (sommario):
碩士國立臺灣大學
化學工程學研究所
94
Ink-jet printing, as a derivative of direct-write technology, offers the additional advantages of low cost, high material efficiency, elimination of photolithography, low temperature deposition, friendly environment and non-contact processing. Therefore, it has great potentials for applications on electronics fabrication processes, especially on plane and flexible substrate in recent years. In this study, ink-jet printing is combined with electroless plating which has been fully developed and direct writes cooper and silver lines at low temperature. First, the mixed-potential theory is applied to investigate the effects of reagents concentrations in both electroless copper and silver plating systems. In the electroless copper plating system, the change in copper concentrations has more effects on the deposition current density than formaldehyde. As compared with the silver system, the mixed potential is more negative, which means the occurrence of copper deposition is not as easy as silver. The reduction rate of silver ion is very fast and silver deposits almost immediately when the silver ion solution meets the reduction agent solution, hence it is suitable for applying to the ink-jet printing system. The thickness of ink-jet silver lines in this study is about 100 nm and the resistivity is 4.4 μΩ-cm. In the electroless copper plating system, copper can deposit very fast on a catalyzed surface by adding 1.0M KOH in the solution to adjust it to a high-pH condition. The reaction completes within about 12 seconds by the prediction of the mathematical model established in this study. The thickness of ink-jet copper lines is about 25 nm and the resistivity is 11 μΩ-cm. Hydrogen is a by-product in the reduction reaction of copper and it comes in a large amount when the copper reduction rate increases. The large amount of hydrogen would cause the discontinuity of surface of copper lines and hence affect the conductivity. Furthermore, the printing head would easily get corrosion in a strong-base environment and hence end its life. Metallization by ink-jet printing based on electroless plating, different from traditional electroless plating bath which calls for the stability of plating bath, needs high reduction rate of metals. The thickness of metal deposited has no relations with reaction time and temperature, but it can be controlled by adjusting the reagents concentration in ink solutions or by jetting multi-layers of metal to form a thicker conductive lines.
32
Hu, Guo-Ren, e 胡國仁. "Electroless Plating Pd Induced Crystallization of Amorphous Thin Films". Thesis, 2001. http://ndltd.ncl.edu.tw/handle/30616060323048690383.
Testo completoAbstract (sommario):
碩士國立交通大學
材料科學與工程系
89
In this thesis, metal-induced crystallization (MIC) / metal-induced lateral crystallization (MILC) processes using metal seed layer by electroless Pd plating method was proposed. The Pd clusters formed by electroless plating method uniformly distributed on the surface of amorphous silicon (a-Si) films. Needle-liked polycrystalline silicon (poly-Si) films were obtained when the a-Si films with electroless plating Pd were annealed at 550 ℃ for 1 hr. For the pre-patterned a-Si films, Pd clusters were preferred to deposit on the sidewalls of the silicon island. After the samples were annealed, long needle-liked poly-Si grains were observed. Most of the grains were lying in the same direction with an angle of ~55° from the sidewalls of the silicon island. Based on this finding, a new TFT structure was proposed. The electron characteristics of the new TFT structure are better than that of the conventional TFT structure. This attributes that the orientation of needle-liked grain parallel the moving direction of carrier. The characteristics of TFT are improved by NH3 plasma treatment.
33
TSAI, YUAN-YUAN, e 蔡淵源. "Study of Electroless Nickel Plating Technology and Bath Management". Thesis, 2017. http://ndltd.ncl.edu.tw/handle/04020426897527135254.
Testo completoAbstract (sommario):
碩士南臺科技大學
高階主管企管碩士班
105
The advantage of electroless nickel plating had on corrosion resistance, uniformity, high hardness and good non-magnetic capability. It was widely used in Machinery, petroleum, chemicals, textiles, electronics, aerospace, military and many other fields. Two key points of plating rate and phosphorus content are major control conditions during the electroless plating process. The trend of the two characteristic was contradictory. The effects of complexing agent, pH values and temperature on plating rate and phosphorus content were investigated. The stronger complexing agent, low pH values and low temperature leaded to low plating rate and high phosphorus content. Increasing of plating rate leaded to decreasing of phosphorus content. Therefore, the phosphorus content were decreased with increasing of plating rate. Our study focused on the effects of bath composition, complexing agents, pH values and temperature base on literature and experience. The investigation was carries on the optimization with the continuous orthogonal testing method. The optimal condition of electroless nickel plating was obtained：Lactic acid 21 g/L, Succinic acid 6.1 g/L, pH 4.8, temperature 87℃.The plating rate attain 10.98 μm/h. The phosphorus content of the coating film under this condition was about 11.04 %. The corrosion resistance reached 48 hours due to salt spray test. The microcrystalline structure of specimen showed an amorphous phase. The composition and concentration of complexing agents, the conditions of operation, pH values, temperature, pretreatment and post-treatment almost leaded to significant changes on plating rate, phosphorus content and properties of the coating. Electroless nickel plating is a very sensitive technology, therefore should be very serious, especially the manner and careful of the operator is very important.
34
Gafin, Anthony Harold. "Electrochemical studies with the quartz crystal microbalance". Thesis, 1994. https://hdl.handle.net/10539/24912.
Testo completoAbstract (sommario):
A thesis submitted to the Faculty of Science,
University of the Witwatersrand, Johannesburg,
in fulfilment of the requirements for the degree of
Doctor of Philosophy.A quartz microbalance electrode (QME) was constructed for the investigation of the electrochemistry of electroless plating baths. To this end, the electronic oscillator circuitry required for the microbalance was developed from literature examples, and the techniques of forming electrodes and mounting the crystal in an appropriate holder were established. The device thus developed was compact, allowing for in situ frequency and electrochemical measurements to be made in a commercially available 100 mL Metrohm cell. The precision .and accuracy obtained with the home-built device were shown to be adequate for electrochemical research, and the sensitivity was found to be consistent with the value expected from the Sauerbrey equation.(Abbreviation abstract)
Andrew Chakane 2018
35
鄭仲甫. "Nanoporous gyroid Platinum with High Catalytic Activity from Block Copolymer Template via Electroless Plating". Thesis, 2014. http://ndltd.ncl.edu.tw/handle/87784829695143766968.
Testo completoAbstract (sommario):
碩士國立清華大學
材料科學工程學系
102
Block copolymers (BCPs) that consist of chemically different components can self-assemble into various ordered nanostructures due to the incompatibility of constituted blocks. In recent decades, BCPs have been extensively investigated because of their ability to self-assemble into various ordered nanostructures, such as sphere, cylinder, lamellae, and gyroid. Among all of the nanostructures resulting from BCPs self-assembly, gyroid is one of the most appealing morphologies for practical applications because of its unique texture with a matrix and two continuous networks in 3D space. Here, we report the nanoporous platinum (Pt) with gyroid nanostructure fabricated by using a nanoporous polymer with gyroid nanochannels as a template. The nanoporous polymer template was obtained from the self-assembly of degradable block copolymer, polystyrene-b-poly(L-lactide) (PS-PLLA), followed by the hydrolysis of PLLA blocks. Templated electroless plating can be conducted at ambient conditions to create precisely controlled Pt gyroid nanostructure with high crystallinity in a PS matrix. After removal of the PS matrix, well-interconnected nanoporous gyroid Pt can be successfully fabricated. In comparison with commercial available catalysts, the nanoporous Pt possesses superior macroscopic stability and peak specific activity, benefiting from the well-defined network structure with robust texture and the growth of the low-index crystalline facets of Pt.
36
Yang, ShangRay, e 楊尚叡. "The Study of Electroless Nickel Plating on the Silicon Wafer". Thesis, 2001. http://ndltd.ncl.edu.tw/handle/09468540294882463931.
Testo completoAbstract (sommario):
碩士國立臺灣大學
材料科學與工程學研究所
89
This research is to investigate the direct electroless Ni-P plating on the n-type (100) silicon wafer. We also study the pretreatment process for the silicon substrate, and the relationship between the composition of the plating solution and the threshold plating temperature, the plating rate, and the phosphorous content and the crystallinity of the as-plated layer. For the pretreatment of the silicon wafer, the simple ethanol process is more convenient and better than the traditional roughening, sensitizing, and activation processes. When the original load of the plating solution is 5cm2/dm3, if we add 40g/L NiSO4, 40g/LNaH2PO2, 60g/L Na3C6H5O7, 8g/L saccharin, 1.5ppm Pb(CH3COO)2, 1.5ppm C12H25O4SNa, and 20ml/L NH4OH, we can produce electroless Ni-P layer at 80℃with phosphorous content above 7 wt%. The plating rate is about 15.1μm/hr. The results of X-ray diffraction show the amorphous tendency. Furthermore, the influence of the reducing agent concentration on the phosphorous content of the plated layer is not obvious. If the plating solution is not composed of NaF, we can decrease the threshold plating temperature from 78℃to 72℃ by adding Na2WO4.If we further add 6g/L NaF, the threshold plating temperature drops to 65℃.If the concentration of NaF increases to 12g/L, the threshold plating temperature continuously drops to 60℃, but the plating solution becomes unstable. Although there is indeed no W in the plated layer, the other result about reducing threshold plating temperature does not agree well with K. Chen’s study, in which the substrate is low-carbon steel. Without adding saccharin in the plating solution, the plated layer chaps easily. From the surface SEM micrograph, we can conclude that the plated layer is under tensile stress. If we add 8g/L saccharin in the plating solution, the plated layer will no longer chap . From the results of the adhesion test, the adhesion strength of Si/Ni-P is 9.8~14.7 MPa. By observing the surface and cross-section SEM morphology of the plated layer, we indeed find that there are both large and small particles deposited on the substrate.This observation is in accordance with Takano’s third reaction mechanism without the reducing agent. But in our experiment there is no plating reaction occurred without the reducing agent, so we cannot confirm the reaction mechanism supposed by Takano.
37
Chu, Rong-Shian, e 朱容賢. "Hermetically Copper-Coated Optical Fibers Prepared by Electroless Plating Method". Thesis, 2004. http://ndltd.ncl.edu.tw/handle/20690002757965960535.
Testo completoAbstract (sommario):
碩士逢甲大學
材料科學所
92
In this work, the hermetically copper-coated optical fibers were prepared by electroless plating method. The bath composition of electroless copper includes copper sulfate, formaldehyde, sodium hydroxide, ethylene diamine tetraacetic acid, potassium ferrocyanide and 2,2’-bipyridine. The experimental process includes: changing the concentration of formaldehyde and controlling the plating time. The surface appearance that film thickness and surface roughness of copper coatings were investigated using the optical microscope (OM), scanning electron microscope (SEM) and atomic force microscope (AFM), respectively. The OM observation shows that if the concentration of formaldehyde is 15 mL/L, the initial pH value is 12.4 and the plating temperature is 70°C, the hermetically copper-coated optical fiber has the best smooth surface. Using the above experimental conditions, the copper coatings in a variety of thickness were uniformly deposited on the glass fiber surface by controlling the plating time, and the coating thicknesses of 41, 62, 89, 127, 154, 165, 206 and 251 nm were obtained. The AFM measurement revealed that the copper film thickness of 89 nm has the lowest surface roughness (Ra at 2.78 nm). The copper-coated optical fibers resulted in a maximum tensile strength (372 MPa) as the thickness of Cu-deposits at 89 nm. Optical microscope was used to examine the thermal stress induced voids on the surface of copper coatings after the copper-coated optical fibers immersed in the liquid nitrogen for one day. A minimum number of stress voids was induced on the surface for the copper coatings at 62 nm.
38
凃亭婷. "The effects of additive on polyimide for electroless copper plating". Thesis, 2009. http://ndltd.ncl.edu.tw/handle/18366453952392427264.
Testo completoAbstract (sommario):
碩士明新科技大學
化學工程研究所
97
In this research,conductive polyimide films were prepared by used the potassium hydroxide microetching,followed by electroless copper plating. The discussion polyvinyl alcohol(PVA) and potassium iodide two kinds of additives analyze to the electroless copper plating influence on the plating rate,surface morphology,crystal and resistivity of copper deposition. The surface of these films was treated with additives which exhibited low resistivity and excellent conductivity. These films were investigated by the X-ray, to analysis crystallization change,by using EPMA to analysis surface texture,by using four-point probe to analysis electric properties. These results show that the surface morphology of copper deposition was smooth and dense with addition of the polyvinyl alcohol(PVA) and potassium iodide. The other purpose of this research, carries on the film test of the electromagnetic interference (EMI), the test result discovered the shielding effectiveness(SE) of interference of the films can be above 60dB. That two kinds of additives PVA and KI were added to the plating bath together,increasing EMI shielding effect from 60dB to the best SE of 85dB. At this level, 99.999999％ extraneous radiation is either reflected or absorbed by these treated films,and have the excellent shielding effectiveness of electromagnetic interference.
39
Hsueh, Han-Yu, e 薛涵宇. "Synthesis with Electroless Plating and Characterization of Metal Inverse Opals". Thesis, 2007. http://ndltd.ncl.edu.tw/handle/06888907550138465697.
Testo completoAbstract (sommario):
碩士國立臺灣大學
材料科學與工程學研究所
95
Construct dielectric materials with different refractive indexes to stack and to form two - dimensional or three - dimensional of periodic nanostructures. Such unique structures have characteristic photonic band gaps, and can control and manipulate the flow of light. We call the structures be photonic crystal. Consequently, photonic crystals are of great interest in applied research and lead to broad applications, like tunable optical filters, photonic crystal fiber, light emitting diode, sensor, etc. The research of photonic crystal is really an important science. One of the most researched structures in the laboratories is opals and inverse opals. The purpose of this article is to emphasize the synthesis in nickel inverse opals. According to references up to the present, electronic deposition and sintering are the methods used principally. However, the method of electronic deposition needs complicated equipment and takes longer time. The method of sintering would destroy the structures. We found a new method to fill nickel nanoparticles into interspace between polystyrene spheres. Experimental steps of fabricating the macroporous structure are described as follow: At first, make the glass template sensitized and activated, and palladium particles would cover the glass template to form catalytic sites. By evaporation, polystyrene spheres would align on the glass template to form three-dimensionally ordered opals. The diameter of polystyrene spheres is 550 nm. Put this template with polystyrene into the plating solution. At adequate temperature, nickel reduces from the surface of palladium and grows up to the top of colloidal crystal. Finally, use THF to take off polystyrene spheres, and we could get the structure of inverse opals. In different period of time, we could get nickel inverse opals with different thickness. By this method, we can synthesis metal inverse opals having large and unbroken areas without any expensive equipment. It’s really a convenient technology. SEM is carried out to observe the structure of Ni inverse opals. X-ray is used to confirm the lattice ,and ultraviolet ray is used to measure the band gap. Measure electronic conductivity with digital panel meter and 4 Point Probe .
40
Chan, Wei-hsiang, e 詹惟翔. "Surface Modification of Nanocrystalline Iron Oxide Powders by Electroless Plating". Thesis, 2006. http://ndltd.ncl.edu.tw/handle/00051956883652213455.
Testo completoAbstract (sommario):
碩士逢甲大學
材料科學所
94
In the present study, nanocrystalline iron oxide powders were prepared by an inert gas condensation technique under different oxygen partial pressure, i.e., 50, 100, and 150 mbar, respectively. Surface modification of nanocrystalline iron oxide powders and commercial available nanocrystalline iron powders was preformed by electroless nickel plating. The original and modified powders where characterized by X-ray diffraction, transmission electron microscopy, thermogravimetric analysis, and synchrotron X-ray absorption techniques. The experimental results showed that nanocrystalline iron oxide powders prepared by gas condensation technique exhibit a mixture of Fe and γ-Fe2O3 phase. TEM observation revealed that oxidation began from the surface of the gas-condensed iron powders. The amount of oxidation increased with increasing oxygen partial pressure and was confirmed by synchrotron X-ray absorption examination. Thermal analysis showed that Fe transformed intoγ-Fe2O3 at 100 oC, and further transformed into α-Fe2O3 at 400 oC. The iron oxide powders can be modified by electroless nickel plating in a solution with ph value ranged from 6 to 8. The coercivity of the nanocrystalline iron oxide powders as-prepared by gas-condensation technique was 458.63 Oe. After electroless nickel plating in a solution with ph=8, the saturated magnetization (Ms) was 74.51 emu/g.
41
Sher, Kun-Lin, e 佘坤霖. "Applications of Imprint and Electroless Silver Plating on TFT Processes". Thesis, 2005. http://ndltd.ncl.edu.tw/handle/02005771004558972582.
Testo completoAbstract (sommario):
碩士國立中山大學
機械與機電工程學系研究所
93
This study presents thin film transistor (TFT) electrode structures in flat panel displays by imprint and electroless silver plating techniques. Imprint technique is not limited to the physical properties of optical lithography. In the imprinting process, the glass mold designed for imprinting process is fabricated by semiconductor manufacturing technology to imprint photoresist (AZ-650). The material is evaluated for imprint process. In addition, at present, electrode materials used in TFT process are aluminum (Al), chromium (Cr) and so on. In other research, the thin film plating technique adopts sputtering process to manufacture TFT electrode structures. This study uses electroless silver plating process to fabricate TFT electrode structures. The experimental result shows that the silver film can be deposited on the glass wafer by electroless plating, The mechanical properties of the silver films such as hardness, coefficient of elasticity and Young’s module are measured by nanoindentation system,compared with the bulk materials.
42
Guo, I.-Ling, e 郭衣玲. "The Behavior of Electroless Copper Plating through Photosensitive Polymer Films". Thesis, 1996. http://ndltd.ncl.edu.tw/handle/59981711837465942278.
Testo completo
43
Chu, Chung-Ming, e 朱崇銘. "Application of pH-Sensitive Catalyst Ink on Electroless Copper Plating". Thesis, 2014. http://ndltd.ncl.edu.tw/handle/73586523938153974567.
Testo completoAbstract (sommario):
碩士國防大學理工學院
化學工程碩士班
102
In this study, a pH-responsive palladium catalyst for electroless copper deposition was prepared. The noble metal nanoparticles reduced and stabilized by styrene monomer and 2-(N,N-dimethylamino)-ethyl methacrylate(DMAEMA) monomer by free radical polymerization. Poly(St-co-DMAEMA) showed good dispersion and excellent stability in the aqueous solution without surfactant and reductant in the mixture. The properties of Poly(St-co-DMAEMA) and the nanocomposite catalyst Poly(St-co-DMAEMA)/Pd were characterized by Nuclear Magnetic Resonance Spectrometer(1H-NMR), Fourier transform infrared spectrometry (FTIR), gel permeation chromatography (GPC), Transmission electron microscopy (TEM), LU Misizer(LUM) and contant angle. It is known that the 2-(N,N-dimethylamino)-ethyl methacrylate(DMAEMA), is both a pH responsive cationic polyelectrolyte containing a tertiary amine group (pKa 7.0) and a thermosensitive polymer with phase transition temperature.It was found from our result that a copper film with dramatically enhanced adhesion is formed on PET surface without special pretreatment step,indicating that St-co-DMAEMA was used not only as the adsorption sites for palladium, but also as an adhesion-promoting layer for the electrolessly deposited copper on the PET surface. Finally, we used ink-jet printing technology to output the catalyst ink and controlled printing conditions and jet nozzle status of the printer, then we can made 500,300,and 150μm wide copper line of metallization track graphics. After 200 times of bending the copper wire on PET 180 degrees, still maintain a relatively high electrical conductivity.
44
Lin, Chih-Hsien, e 林志憲. "Electroless Nickel Plating on the Surfaces of Different Polymer Nanoparticles". Thesis, 2008. http://ndltd.ncl.edu.tw/handle/89017471860467216221.
Testo completoAbstract (sommario):
碩士國立臺灣大學
材料科學與工程學研究所
96
Nickel-phosphorus alloys were electrolessly deposited on the surfaces of polystyrene nanoparticles and polyaniline-coated-polystyrene nanopar- ticles using sodium hypophosphite as reducing agent. In this work, the sensitization process was omitted, and the activation process was applied by adsorption of palladium ions on the surfaces of substrates. Products after electroless plating were analyzed by SEM, TEM, EDS and XRD. The efficacy of activation was influenced by the adsorption ability of palladium ions on the surfaces of polymer particles. The adsorption ability of palladium ions on the surfaces of these two different polymer nanopar- ticles was studied. During the process of electroless plating on the nanoparticles, we found that the composition of deposits and the deposition rate were different when depositing on different polymer nanoparticles. Before the deposition of nickel-phosphorus alloys started, there was an induction period, in which no alloys were deposited. The composition of nickel- phosphorus deposits, the length of induction time and the deposition rate when plating on these two different polymer nanoparticles were also studied.
45
Lin, Shih-Chieh, e 林士傑. "Applications of Electroless Plating and Electrophoretic to Glass Substrate Deposition". Thesis, 2006. http://ndltd.ncl.edu.tw/handle/22116022318788862252.
Testo completoAbstract (sommario):
碩士國立中山大學
機械與機電工程學系研究所
94
In this study we present the results of electroless deposition of silver (Ag) and electrophoretic deposition (EPD) of Al2O3 layers on glass for application in thin film transistor (TFT). Since Ag exhibits excellent resistivity, it is selected to be the material of conductive layer. Ag thin film electrical and physical parameters are studied as a function of the deposition time and working temperature. We study the thin-film electrical and mechanical properties using 4-point Probe, surface analyzer and nano indenter. The Ag film, thicker than 200 nm, exhibited a specific electrical sheet resistivity of about 500 mΩ/□. We also study the thin-film morphology and composition using SEM and FTIR, respectively. In this study, Mechanism and kinetics of the electrophoretic process in an Al2O3 cell are also studied. Al2O3 concentration levels are set from 1.25 to 7.5%, and deposition time from 5~20 seconds. Deposition time and Al2O3 particle concentration is experimentally discussed and characterized. The result shows that a linear relationship between the deposition rate and applied voltage is obtained. Besides, in this study, deposition of conductive layer silver and insulating layer Al2O3 for TFT are studied. A new process to deposit Ag layer and Al2O3 layer to be the conductivity layer and insulating layer of TFT is presented. First, the circuit pattern is defined by lithography process. Then, Ag is deposited with thickness of 200 nanometers. Second, the wafer is immersed in the stripper solution to remove the resist. After the deposition of the Ag on glass is finished, Al2O3 nano-scale particle concentration is prepared for electrophoretic deposition.
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Wang, Dong-Maw, e 王東茂. "Improved Electroless Ni-P Plating on TiN Sputtered Mild Steel". Thesis, 1996. http://ndltd.ncl.edu.tw/handle/35322519064156917744.
Testo completo
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WANG, XING-YUN, e 王興運. "Study of electroless nickel-boron plating on low-carbon steel". Thesis, 1987. http://ndltd.ncl.edu.tw/handle/83527620140331514147.
Testo completo
48
Yang, Chia-Hao, e 楊嘉豪. "Hermetically Nickel-Coated Optical Fibers Prepared by Electroless Plating Method". Thesis, 2003. http://ndltd.ncl.edu.tw/handle/957y48.
Testo completoAbstract (sommario):
碩士逢甲大學
材料科學所
91
Abstract In this experiment, hermetically nickel-coated optical fibers were prepared by electroless plating method. The experimental process includes changing the sodium hypophosphite concentration, initial pH value, plating time, and plating temperature. The surface appearance, film thickness and surface roughness of nickel coatings were investigated using the optical microscope (OM), scanning electron microscope (SEM) and atomic force microscope (AFM) , respectively. The OM observation shows that if the concentration of sodium hypophosphite is 20g/L, the plating temperature is 80℃, and the initial pH value is 4.0, the nickel-coated optical fiber has the best smooth surface. Using the above experimental conditions, the nickel coatings were uniformly deposited on the glass fiber surface by controlling the plating time, and the coating thicknesses of 35, 65, 119, 218, 308, 419 and 565 nm were obtained. The AFM measurement reveals that if the Ni film thickness is 65 nm, the surface roughness of nickel coating has the lowest value, and its surface roughness is 0.551 nm. After nickel-coated optical fibers immersed in the liquid nitrogen for one day, the stress induced voids on the surface of nickel coatings were observed using the optical microscope. It is found that if coating thicknesses are 65 nm, 119nm and 218 nm, minimum number of stress voids was induced in the nickel coatings. Finally, the tensile strengths of nickel-coated optical fibers were measured by tensile test. The result shows that if the thicknesses are 65 nm, 119 nm and 218 nm, nickel-coated optical fibers have maximum tensile strengths. Keywords: electroless plating method, hermetically coatings, optical fiber, nickel.
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YU, Mei-Feng, e 余美鳳. "Preparation of cuprous oxide thin film by Electroless Plating Process". Thesis, 2009. http://ndltd.ncl.edu.tw/handle/51808793216395111070.
Testo completoAbstract (sommario):
碩士國立高雄應用科技大學
化學工程與材料工程系
97
In this study, the electroless plating with different solutions is applied to fabricate the cuprous oxide film on ITO.The cupric oxide films would be formed while the solution consisting of copper(II) sulfate (CuSO4) and sodium thiosulfate (Na2S2O3) was used. The microstructure was retained after annealing. The cuprous oxide films would be formed by alternative dipping between A solution (CuSO4 and Na2S2O3) and B solution (NaOH ). The thickness of cuprous oxide films monotonically increased with dipping times, but the transmittance of the films would be decreased. The clip materials which were used to fix the sample would significantly influence the deposition rate of cuprous oxide films. The best dipping condition of cuprous oxide films on ITO substrates comes out when we use the solution consisting of CuSO4, NaKC4H4O6, and formaldehyde mixture above pH12.9 and 5 hours dipping time. The growth of cuprous oxide films could be monitored by quartz crystal microbalance as a function of growth time.
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Tsai, Cheng Ta, e 蔡承達. "Glucose biosensor with gold electrode produced by electroless plating method". Thesis, 2016. http://ndltd.ncl.edu.tw/handle/94879172909137068941.
Testo completoAbstract (sommario):
碩士國立中央大學
化學工程與材料工程學系
104
With the rapid development of technology, biosensors have been used extensively in medical detecting. Glucose biosensors, which have become the convenient and mature product, have great economic value because of huge consume in the world. In this study, in order to prepare lower cost gold electrode glucose biosensors, the screen printed substrate which contained palladium catalyst was prepared. The effects of contents of palladium on the performance of biosensor was investigated. A reactor for electroless plating was designed. Nickel, palladium and gold were deposited on the substrate in order to increase the conductivity of electron passed through the sample. The operating parameters such as temperature, time, hardness and thickness were changed to study their effects on the stability of product. The samples were then doped by the enzyme to check the performance of glucose biosensors. The samples were characterized by focused ion beam (FIB), scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS). The results illustrated that the better operating conditions of electroless reactors for nickel, palladium and gold was at the region of temperature and dipping time.