Letteratura scientifica selezionata sul tema "Bonding"
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Articoli di riviste sul tema "Bonding"
Breugst, Martin, Daniel von der Heiden e Julie Schmauck. "Novel Noncovalent Interactions in Catalysis: A Focus on Halogen, Chalcogen, and Anion-π Bonding". Synthesis 49, n. 15 (23 maggio 2017): 3224–36. http://dx.doi.org/10.1055/s-0036-1588838.
Testo completoRiorini, Sri Vandayuli. "PENGARUH IKATAN HUBUNGAN TERHADAP KESETIAAN PELANGGAN". Media Riset Bisnis & Manajemen 9, n. 1 (8 aprile 2009): 65–90. http://dx.doi.org/10.25105/mrbm.v9i1.1074.
Testo completoBrožek, M. "Bonding of plywood". Research in Agricultural Engineering 62, No. 4 (28 novembre 2016): 198–204. http://dx.doi.org/10.17221/39/2015-rae.
Testo completoBrožek, M. "Bonding of wood". Research in Agricultural Engineering 61, No. 3 (2 giugno 2016): 134–39. http://dx.doi.org/10.17221/8/2014-rae.
Testo completoKim, Yeongjung, Byeong Jo Han e Jong-Hyun Lee. "Paste Containing 1.5 μm Ag Particles with Enhanced Surface Area: Ultrafast Thermo-Compression Sinter-Bonding and Annealing Effects". Korean Journal of Metals and Materials 60, n. 11 (5 novembre 2022): 827–36. http://dx.doi.org/10.3365/kjmm.2022.60.11.827.
Testo completoGhafouri, Reza, Fatemeh Ektefa e Mansour Zahedi. "Characterization of Hydrogen Bonds in the End-Functionalized Single-Wall Carbon Nanotubes: A DFT Study". Nano 10, n. 03 (aprile 2015): 1550036. http://dx.doi.org/10.1142/s1793292015500368.
Testo completoKumar Katta, Prashanth. "Composition of Bonding Agents". Indian Journal of Dental Education 13, n. 2 (1 aprile 2020): 75–77. http://dx.doi.org/10.21088/ijde.0974.6099.13220.5.
Testo completoYokura, Miyoshi, Kenichi Uehara, Guo Xiang, Kazuya Hanada, Yoshinobu Nakamura, Lakshmi Sanapa Reddy, Kazuhiro Endo e Tamio Endo. "Ultralong Lifetime of Active Surface of Oxygenated PET Films by Plasma-irradiation and Bonding Elements". MRS Proceedings 1454 (2012): 201–6. http://dx.doi.org/10.1557/opl.2012.1128.
Testo completoBrammer, Lee. "Halogen bonding, chalcogen bonding, pnictogen bonding, tetrel bonding: origins, current status and discussion". Faraday Discuss. 203 (2017): 485–507. http://dx.doi.org/10.1039/c7fd00199a.
Testo completoZHANG, YAN, CHANG-SHENG WANG e ZHONG-ZHI YANG. "ESTIMATION ON THE INTRAMOLECULAR 8- AND 12-MEMBERED RING N–H…O=C HYDROGEN BONDING ENERGIES IN β-PEPTIDES". Journal of Theoretical and Computational Chemistry 08, n. 02 (aprile 2009): 279–97. http://dx.doi.org/10.1142/s0219633609004708.
Testo completoTesi sul tema "Bonding"
Clarke, D. E. "Bonding in cokes". Thesis, University of Newcastle Upon Tyne, 1986. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.372550.
Testo completoHodgson, Michael John. "Bonding in semiconductors". Thesis, University of Cambridge, 1991. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.240971.
Testo completoXu, Hui. "Thermosonic ball bonding : a study of bonding mechanism and interfacial evolution". Thesis, Loughborough University, 2010. https://dspace.lboro.ac.uk/2134/6325.
Testo completoCornes, Stuart. "Halogen bonding, hydrogen bonding and Lewis acidic receptors for anion recognition". Thesis, University of Oxford, 2016. https://ora.ox.ac.uk/objects/uuid:0725f9c4-ff44-4158-b94e-9bcaf0fa3b4d.
Testo completoChen, Xi. "Designing Acrylic Block Copolymers with Multiple Hydrogen Bonding or Multiple Ionic Bonding". Thesis, Virginia Tech, 2018. http://hdl.handle.net/10919/84961.
Testo completoMaster of Science
Rix, Douglas. "Bond strengths and fluoride release of modified glass ionomer and resin adhesives". Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1999. http://www.collectionscanada.ca/obj/s4/f2/dsk2/ftp01/MQ39873.pdf.
Testo completoJohnsen, Bernt Brønmo. "Adhesive bonding of aluminium". Doctoral thesis, Norwegian University of Science and Technology, Faculty of Engineering Science and Technology, 2004. http://urn.kb.se/resolve?urn=urn:nbn:no:ntnu:diva-515.
Testo completoIn order to get approval of adhesive bonding as a reliable joining method in the automotive industry, a better understanding of the interfacial interactions between aluminium surfaces and adhesives is important. It is also important to get a better understanding of the degradation mechanisms of the bonded systems in humid environments, as humidity is known to have a detrimental effect. This work has been focused on an aluminium alloy and a one-component epoxy adhesive that are of particular interest to the automotive industry.
Pretreatment of the aluminium substrates before adhesive bonding is essential. However, the most successful pretreatment processes involve the use of hexavalent chromium, which will be banned from use within few years due to environmental considerations. Alternative pretreatments need to be developed. A literature study identified silanisation with GPS as a pretreatment method with the potential to obtain good durability. On the basis of research performed by SINTEF Materials Technology, AC anodising in hot phosphoric and sulphuric acid solutions were also identified as interesting pretreatment methods.
A modified version of the Boeing wedge test was used to determine the durability of adhesively bonded joints tested in hydrothermal environments. The joints were made of AA6060-T6 aluminium alloy and Betamate XD4600 epoxy adhesive. Both silane films and anodic oxides were investigated using reflection-absorption FT-IR spectroscopy. Other techniques of surface analysis were also used (SEM, TEM, WLI, XPS, ToF-SIMS and contact angle measurements).
The environmental durability of pretreated AA6060-T6 substrates was significantly improved after silanisation with GPS. The grit-blasting + GPS pretreatment process resulted in considerable higher durability then the chromic-sulphuric acid FPL-etch. The general understanding is that silanisation improves the durability through the formation of strong, covalent bonds between the aluminium surface and the adhesive. FT-IR spectroscopy strongly indicated that a chemical reaction took place between GPS films and amine curing agents. Particularly interesting was the reaction with dicyandiamide, which is a common curing agent in one-component epoxy adhesives. The amines also catalysed the condensation of SiOH groups, resulting in higher degree of SiOSi crosslink density in the siloxane films. However, chemical reaction is not necessary for improved durability. The hydrophobicity of the bonded surface is also an important factor. This effect has not been studies extensively earlier.
Exposure of GPS films to degrading environments showed that the silane desorbed from the surface in acidic solutions, but it was stable in alkaline solutions. The durability of adhesive joints was also reduced in acidic environments. The two models for the degradation of the silanised aluminium surface in acidic environments were proposed: hydrolysis of the siloxane network and corrosion of the underlying aluminium surface.
The environmental durability of substrates that were AC anodised in hot phosphoric and sulphuric acid solutions was good, almost as good as the well-established FPL + PAA pretreatment. DC anodising in sulphuric acid gave inferior durability. FT-IR spectroscopy showed that the anodic films formed in sulphuric acid contained significant amounts of sulphate. This can have a significant negative effect on the long-term properties of bonded joints. The anodic films released water during curing of the adhesive. The observations suggested that a transformation from the hydroxide to the oxide state took place.
Adhesive bonding in wet environment of substrates that were anodised in sulphuric acid had a negative effect on durability. The effect was more pronounced for DC anodised, than for AC anodised substrates. Bonding in wet environment also resulted in changed adhesive properties close to the oxide surface. Very little thixotropic agent was present in a ~200 nm wide region in the adhesive. This was explained by desorption of water from the oxide during curing of the adhesive.
Papers II, V and VI are reprinted with kind permission of Elsevier, sciencedirect.com.
Joshua, Nilmini Sureka, University of Western Sydney e Faculty of Science and Technology. "Novel phosphate bonding composites". THESIS_FST_XXX_Joshua_N.xml, 1997. http://handle.uws.edu.au:8081/1959.7/282.
Testo completoDoctor of Philosophy (PhD)
Joshua, Nilmini Sureka. "Novel phosphate bonding composites /". View thesis, 1997. http://library.uws.edu.au/adt-NUWS/public/adt-NUWS20030828.115030/index.html.
Testo completoWang, Xiaowei. "Adhesive bonding of polypropylene". Thesis, University of Bristol, 2002. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.247559.
Testo completoLibri sul tema "Bonding"
Chemical bonding. Oxford: Oxford University Press, 1994.
Cerca il testo completoDamico, DJ, TL Wilkinson e SLF Niks, a cura di. Composites Bonding. 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959: ASTM International, 1994. http://dx.doi.org/10.1520/stp1227-eb.
Testo completoAlexe, Marin, e Ulrich Gösele, a cura di. Wafer Bonding. Berlin, Heidelberg: Springer Berlin Heidelberg, 2004. http://dx.doi.org/10.1007/978-3-662-10827-7.
Testo completoMetrangolo, P., e G. Resnati, a cura di. Halogen Bonding. Berlin, Heidelberg: Springer Berlin Heidelberg, 2008. http://dx.doi.org/10.1007/978-3-540-74330-9.
Testo completoLee, Lieng-Huang, a cura di. Adhesive Bonding. Boston, MA: Springer US, 1991. http://dx.doi.org/10.1007/978-1-4757-9006-1.
Testo completoHancock, David. Brick Bonding. London: Macmillan Education UK, 1990. http://dx.doi.org/10.1007/978-1-349-11431-3.
Testo completoAbbott, Stephen. Sole bonding. A cura di Carter Alan, Tame Roger, Larcombe Peter e SATRA Footwear Technology Centre. Kettering: SATRA, 1996.
Cerca il testo completoCentre, SATRA Technology. Sole bonding. [Kettering]: SATRA, 1999.
Cerca il testo completo1924-, Lee Lieng-Huang, a cura di. Adhesive bonding. New York: Plenum Press, 1991.
Cerca il testo completoEarthing & bonding. 9a ed. London: IET, 2012.
Cerca il testo completoCapitoli di libri sul tema "Bonding"
Kim, Tae Hyung. "Bonding". In CIRP Encyclopedia of Production Engineering, 1–4. Berlin, Heidelberg: Springer Berlin Heidelberg, 2018. http://dx.doi.org/10.1007/978-3-642-35950-7_6618-3.
Testo completoKim, Tae Hyung. "Bonding". In CIRP Encyclopedia of Production Engineering, 149–53. Berlin, Heidelberg: Springer Berlin Heidelberg, 2019. http://dx.doi.org/10.1007/978-3-662-53120-4_6618.
Testo completoBarnes, John R. "Bonding". In Robust Electronic Design Reference Book, 799–808. New York, NY: Springer US, 2004. http://dx.doi.org/10.1007/1-4020-7830-7_33.
Testo completoKim, Tae Hyung. "Bonding". In CIRP Encyclopedia of Production Engineering, 102–5. Berlin, Heidelberg: Springer Berlin Heidelberg, 2014. http://dx.doi.org/10.1007/978-3-642-20617-7_6618.
Testo completoWeik, Martin H. "bonding". In Computer Science and Communications Dictionary, 138. Boston, MA: Springer US, 2000. http://dx.doi.org/10.1007/1-4020-0613-6_1758.
Testo completoSymons, Douglas K. "Bonding". In Encyclopedia of Child Behavior and Development, 267–68. Boston, MA: Springer US, 2011. http://dx.doi.org/10.1007/978-0-387-79061-9_387.
Testo completoTres, Paul A. "Bonding". In Designing Plastic Parts for Assembly, 311–26. München: Carl Hanser Verlag GmbH & Co. KG, 2014. http://dx.doi.org/10.3139/9781569905562.009.
Testo completoTres, Paul A. "Bonding". In Designing Plastic Parts for Assembly, 319–34. München: Carl Hanser Verlag GmbH & Co. KG, 2017. http://dx.doi.org/10.3139/9781569906699.009.
Testo completoGooch, Jan W. "Bonding". In Encyclopedic Dictionary of Polymers, 89. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-6247-8_1486.
Testo completoKleiman, Karen. "Bonding". In Therapy and the Postpartum Woman, 211–17. New York: Routledge, 2022. http://dx.doi.org/10.4324/9781003248477-29.
Testo completoAtti di convegni sul tema "Bonding"
Ishida, Hiroyuki, Sumant Sood, Christopher Rosenthal e Stefan Lutter. "Temporary bonding/de-bonding and permanent wafer bonding solutions for 3D integration". In 2012 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan). IEEE, 2012. http://dx.doi.org/10.1109/icsj.2012.6523416.
Testo completoKutscha, Eileen, Kay Blohowiak, Vicki Wu e Marc Piehl. "Optically Enhanced Bonding Workstation for Robust Bonding". In SAMPE 2019 - Charlotte, NC. SAMPE, 2019. http://dx.doi.org/10.33599/nasampe/s.19.1398.
Testo completoMelanio, Rodan, Robert Altar e Regine Cervantes. "Copper bonding on thin top metal bonding pad". In 2014 IEEE 36th International Electronics Manufacturing Technology Conference (IEMT). IEEE, 2014. http://dx.doi.org/10.1109/iemt.2014.7123111.
Testo completoRongzhi Gao, Lei Han e Jue Zhong. "Experimental studies on bonding pressure in wire bonding". In Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. IEEE, 2006. http://dx.doi.org/10.1109/hdp.2006.1707578.
Testo completoSuga, Tadatomo, e Fengwen Mu. "Surface Activated Bonding Method for Low Temperature Bonding". In 2018 7th Electronic System-Integration Technology Conference (ESTC). IEEE, 2018. http://dx.doi.org/10.1109/estc.2018.8546367.
Testo completoMu, Fengwen, Tadatomo Suga, Masahisa Fujino, Yoshikazu Takahashi, Haruo Nakazawa e Kenichi Iguchi. "SiC wafer bonding by modified suface activated bonding method". In 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). IEEE, 2014. http://dx.doi.org/10.1109/ltb-3d.2014.6886194.
Testo completoJi, Hongjun, Mingyu Li e Chunqing Wang. "Interfacial Characterization and Bonding Mechanism of Ultrasonic Wedge Bonding". In 2006 7th International Conference on Electronic Packaging Technology. IEEE, 2006. http://dx.doi.org/10.1109/icept.2006.359760.
Testo completoYang, Guohua, Guorong He, Wanhua Zheng e Lianghui Chen. "Direct wafer bonding technology employing vacuum-cavity pre-bonding". In Asia-Pacific Optical Communications, a cura di Yong Hee Lee, Fumio Koyama e Yi Luo. SPIE, 2006. http://dx.doi.org/10.1117/12.688864.
Testo completoFujino, Masahisa, Kenji Takahashi e Katsuya Kikuchi. "Wafer-level hybrid bonding for Cu/Interlayer-dielectric bonding". In 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). IEEE, 2019. http://dx.doi.org/10.23919/ltb-3d.2019.8735413.
Testo completoWang, Chenxi, Eiji Higurashi e Tadatomo Suga. "Silicon Wafer Bonding by Modified Surface Activated Bonding Methods". In 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Polytronic 2007. IEEE, 2007. http://dx.doi.org/10.1109/polytr.2007.4339133.
Testo completoRapporti di organizzazioni sul tema "Bonding"
Mishra, Umesh, e Gerald L. Witt. Wafer Cleaning and Pre-Bonding Module for Wafer Bonding. Fort Belvoir, VA: Defense Technical Information Center, dicembre 2007. http://dx.doi.org/10.21236/ada502259.
Testo completoLyon, R., C. Walkup e J. Matthews. Adhesive for composite bonding. Office of Scientific and Technical Information (OSTI), novembre 1989. http://dx.doi.org/10.2172/5211026.
Testo completoMakowiecki, D. M., e R. M. Bionta. Low temperature reactive bonding. Office of Scientific and Technical Information (OSTI), giugno 1995. http://dx.doi.org/10.2172/100316.
Testo completoMeer, Jonathan, e Harvey Rosen. Family Bonding with Universities. Cambridge, MA: National Bureau of Economic Research, novembre 2009. http://dx.doi.org/10.3386/w15493.
Testo completoBlumenberg, Aly, Samantha Davis, Ali Graham, Rachel Medina e Emily Rayder. Infant Massage and Bonding. University of Tennessee Health Science Center, maggio 2020. http://dx.doi.org/10.21007/chp.mot2.2020.0005.
Testo completoR. Q. Hwang, J. C. Hamilton e J. E. Houston. Smart interfacial bonding alloys. Office of Scientific and Technical Information (OSTI), aprile 1999. http://dx.doi.org/10.2172/751020.
Testo completoPacchioni, Gianfranco, Francesc Illas, Michael R. Philpott e Paul S. Bagus. Bonding Geometry and Bonding Character of Thiocyanate Adsorbed on A Ag(100). Fort Belvoir, VA: Defense Technical Information Center, marzo 1991. http://dx.doi.org/10.21236/ada233176.
Testo completoBaker, D. A. Local Bonding Arrangements in Amorphous Ge2Sb2Te5: The Importance of GE and TE Bonding. Fort Belvoir, VA: Defense Technical Information Center, dicembre 2006. http://dx.doi.org/10.21236/ada464396.
Testo completoDallimore, S. R. Ice Bonding and Excess Ice. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1991. http://dx.doi.org/10.4095/132231.
Testo completoLeymann, N., C. Heidemann, M. Zhang, B. Sarikaya e M. Cullen. Huawei's GRE Tunnel Bonding Protocol. RFC Editor, maggio 2017. http://dx.doi.org/10.17487/rfc8157.
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