Articles de revues : « Wire-temperature »

1

OBARA, Haruki, Seiji ADACHI et Tsuyoshi OHSUMI. « An Attempt to Measure a Wire Temperature Distribution on Wire EDM. 2nd Report : Averaged Wire Temperature during EDM. » Journal of The Japan Society of Electrical Machining Engineers 31, n^o 68 (1997) : 18–25. http://dx.doi.org/10.2526/jseme.31.68_18.

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2

Yang, Leigang, Jisong Sun et Weiguo Wang. « Design and application of double stove wires high-temperature furnace in high-temperature creep rupture test ». Journal of Physics : Conference Series 2418, n^o 1 (1 février 2023) : 012059. http://dx.doi.org/10.1088/1742-6596/2418/1/012059.

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Abstract This paper presented a high-temperature furnace with double electric stove wires for the test of high-temperature creep rupture, adopted the 5 mm electric stove wire in diameter, and the wires are made up of the working stove wire and the alternate stove wire. When the tester system detects the working stove wire is fractured, it will automatically and quickly switch the power supply circuit from the working stove wire to the alternate stove wire. Then the alternate stove wire starts to heat to keep the high-temperature furnace working, reducing the loss caused by the interruption of the test on account of the fractured stove wire. Experimental result indicates that the high-temperature furnace with double electric stove wires can solve the problem that when the stove wire is fractured, the test is difficult to proceed for a long time and high-temperature creep rupture test with the classical high-temperature furnace. Besides, the 5 mm in diameter electric stove wire can also meet the temperature control on the ultra-high-temperature (such as 1200 °C) Creep test.

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3

El-Domiaty, Aly, et Sadek Z. Kassab. « Temperature rise in wire-drawing ». Journal of Materials Processing Technology 83, n^o 1-3 (novembre 1998) : 72–83. http://dx.doi.org/10.1016/s0924-0136(98)00045-4.

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Rodin, V. V., et I. I. Tolmacheva. « DETERMINATION OF TUNGSTEN WIRE TEMPERATURE ». Современные наукоемкие технологии (Modern High Technologies) 1, n^o 12 2022 (2022) : 52–56. http://dx.doi.org/10.17513/snt.39436.

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Yao, Chun Yan, Zong Hua Xu, Wei Zhang, Qiao Fang Zhang et Wei Peng. « Experimental Study on Temperature during Wire Saw Slicing ». Applied Mechanics and Materials 481 (décembre 2013) : 153–57. http://dx.doi.org/10.4028/www.scientific.net/amm.481.153.

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Heat generated during wire saw slicing can cause silicon temperature raise and make silicon wafer warpage, especially for larger silicon wafers. In order to study the wire saw effect on silicon temperature during slicing process, three kinds of wire saw, mainly semi-fixed abrasive wire saw and traditional wire saw, are applied for slicing silicon ingot. In this paper, the thermocouple is used to measure the temperature of the silicon during wire saw slicing. The experiment results show that the temperature of the silicon increases along with the wire saw working direction and reaches maximum value near the outlet position of silicon. The temperature of the silicon sliced by semi-fixed abrasive wire saw is lower than that sliced by traditional wire saw.

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6

Ni, Jun, et Hong Ming Gao. « Effect of the Wire Temperature on the Weld Formation in GMAW ». Advanced Materials Research 652-654 (janvier 2013) : 2289–92. http://dx.doi.org/10.4028/www.scientific.net/amr.652-654.2289.

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An arc-preheating wire GMAW process is proposed in this paper. The welding wire is preheated by a TIG arc to enhance the wire melting. As a result, the welding current is decrease. So the improved GMAW process is aimed at high efficiency welding with a low level heat input. In this paper, the welding system is designed. The wire temperature is measured by a pyrometer. The preheating current effect on the wire temperature is analyzed. In addition, the influence of the wire temperature on the weld current and weld formation are analyzed compared with conventional GMAW. The results show that the preheated wire can significantly enhance the wire melting. By increasing the temperature of the welding wire, the welding current decrease and the heat input of the base metal reduce accordingly. The shallow penetration and large reinforcement height are obtained at the arc-preheating wire GMAW process.

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Jo, H. H., S. K. Lee, M. A. Kim et B. M. Kim. « Pass schedule design system in the dry wire-drawing process of high carbon steel ». Proceedings of the Institution of Mechanical Engineers, Part B : Journal of Engineering Manufacture 216, n^o 3 (1 mars 2002) : 365–73. http://dx.doi.org/10.1243/0954405021520030.

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Recently, high-speed drawing has become very common because of the increase in customer demands and production rate in real industrial fields. In the high-carbon steel wire-drawing process, the wire temperature rises greatly according to the increase in the final drawing speed. The rapid temperature rise makes the wire more embrittled and finally leads to wire breakage. Therefore, in this paper, an approximate wire temperature estimation method is proposed to control the maximum temperature rise in the wire-drawing process. Using these results, it is possible to develop the isothermal pass schedule programme, to design the wire-drawing process. Also, the conventional pass schedule can be redesigned by considering the pass schedule constraints. As a result, the wire temperature was considerably reduced and the productivity of the final product could be improved by about 11 per cent.

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Lee, Sang Kon, Won Ho Hwang, Dae Cheol Ko, Byung Min Kim et Woo Sik Ko. « Pass Schedule of Wet-Wire Drawing Process with Ultra High Speed for Tire Steel Cord ». Key Engineering Materials 340-341 (juin 2007) : 683–88. http://dx.doi.org/10.4028/www.scientific.net/kem.340-341.683.

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High speed multi pass wet wire drawing has become very common for production of high carbon steel cord because of the increase in customer demand and production rates in real industrial fields. Although the wet wire drawing is preformed at a high speed usually above 1000 m/min, greater speed is required to improve productivity. However, in the high carbon steel wire drawing, the wire temperature rises greatly as the drawing speed increase. The excessive temperature rise makes the wire more brittle and finally leads to wire breaks. In this study, the variations in wire temperature during wet wire drawing process were investigated. A multi pass wet wire drawing process with 21 passes, which was used to produce steel cord, was redesigned by considering the increase in temperature. Through a wet wire drawing experiment, it was possible to increase the maximum final speed from 1000 m/min to 2000 m/min.

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9

Takahashi, Hidemi, Mitsuru Kurita, Hidetoshi Iijima et Seigo Koga. « Simplified Calibration Method for Constant-Temperature Hot-Wire Anemometry ». Applied Sciences 10, n^o 24 (18 décembre 2020) : 9058. http://dx.doi.org/10.3390/app10249058.

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This study proposes a unique approach to convert a voltage signal obtained from a hot-wire anemometry to flow velocity data by making a slight modification to existing temperature-correction methods. The approach was a simplified calibration method for the constant-temperature mode of hot-wire anemometry without knowing exact wire temperature. The necessary data are the freestream temperature and a set of known velocity data which gives reference velocities in addition to the hot-wire signal. The proposed method was applied to various boundary layer velocity profiles with large temperature variations while the wire temperature was unknown. The target flow velocity was ranged between 20 and 80 m/s. By using a best-fit approach between the velocities in the boundary layer obtained by hot-wire anemometry and by the pitot-tube measurement, which provides reference data, the unknown wire temperature was sought. Results showed that the proposed simplified calibration approach was applicable to a velocity range between 20 and 80 m/s and with temperature variations up to 15 °C with an uncertainty level of 2.6% at most for the current datasets.

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10

Hwang, Joong-Ki, et Young-Chul Chang. « Effects of Contact Conditions at Wire–Die Interface on Temperature Distribution during Wire Drawing ». Processes 11, n^o 2 (8 février 2023) : 513. http://dx.doi.org/10.3390/pr11020513.

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The effects of contact conditions at the wire–die interface on the temperature distribution of the specimen and die are investigated to understand the wire drawing process. Finite element analysis and experiments are performed to analyze the temperature distribution of a drawn wire and die based on different contact conditions using a low-carbon steel wire. The maximum temperature (Tmax) of the die decreases as the contact heat transfer coefficient at the wire–die interface increases, whereas that of the wire increases with the contact heat transfer coefficient. The Tmax of the die and wire decreases with the thermal conductivity of the die. As the thermal conductivity of the die increases, the heat generated by friction is rapidly absorbed into the die, and the Tmax of the die decreases, thus resulting in a decrease in the surface temperature of the wire. The Tmax of both the die and wire linearly increases with the friction factor. In particular, the Tmax of the die more sensitively changes with the friction factor compared with that of the wire. The Tmax of the die linearly increases with the drawing velocity, whereas that of the wire parabolically increases with the drawing velocity. The influence of bearing length on the temperature increase in both the wire and die is insignificant.

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11

WU, Yun-xin, Zhi-li LONG, Lei HAN et Jue ZHONG. « Temperature effect in thermosonic wire bonding ». Transactions of Nonferrous Metals Society of China 16, n^o 3 (juin 2006) : 618–22. http://dx.doi.org/10.1016/s1003-6326(06)60109-x.

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12

Miller, I. S., D. A. Shah et R. A. Antonia. « A constant temperature hot-wire anemometer ». Journal of Physics E : Scientific Instruments 20, n^o 3 (mars 1987) : 311–14. http://dx.doi.org/10.1088/0022-3735/20/3/016.

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13

Kovalev, S. A., et S. V. Usatikov. « Temperature domains on a wire heater ». High Temperature 38, n^o 2 (mars 2000) : 243–48. http://dx.doi.org/10.1007/bf02755952.

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14

Chen, Chao, Cui Jiao Ding, De Gang Ouyang, Sheng Chen et Zhong Hua Song. « Numerical Simulation on Temperature History during Cooling Process of Wire Rod ». Advanced Materials Research 337 (septembre 2011) : 188–91. http://dx.doi.org/10.4028/www.scientific.net/amr.337.188.

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A one-dimensional mathematical model of wire rod during cooling was developed. This model considered the heat of phase transformation during the cooling process. Based on the energy-balance method the equations were calculated, and the temperature history during cooling process of wire rod was obtained. The comparison of the calculated results with the measured results showed that the model worked well for simulating the temperature history of wire rod during cooling process. The effects of roller speed, diameter of wire and fan delivery on temperature history of wire were analyzed. With this developed model, the optimizing of cooling processes of wire rod can be investigated in the future.

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15

Wang, Luyan, Yueguang Yu, Peng Zhang et Jiancan Yang. « Influence of Lanthanum-Doped Tungsten Wire Drawing Process on Microstructure and Properties ». Materials 15, n^o 14 (18 juillet 2022) : 4979. http://dx.doi.org/10.3390/ma15144979.

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A reasonable preparation processing of Lanthanum-doped tungsten wire plays a decisive role in the final properties of the wire. This paper gives the optimum drawing process parameters of lanthanum-doped tungsten wire with φ1.00 mm–φ0.50 mm and explains the phenomenon of coarsening of fiber-like grains in the preparation processing of tungsten wire. The final optimum process parameters of lanthanum-doped tungsten wire are given: the temperature is 950 °C (the first pass temperature is 950 °C, and the temperature decreases by about 20 °C for each pass), the compression ratio is 15%, mold temperature is 550 °C, because of the limitation of equipment conditions, the wire drawing speed is fixed at 0.19 m/s. It is found that the fiber-like grains of the tungsten wire coarsen when the temperature is too high, and it is prone to breakage when the temperature is too low during the drawing process. When the compression ratio is too high (for example, 22%), there is a negative impact on the surface quality and the straightness of the tungsten wire. When the compression ratio is too low, the processing die time is increased, and the production cost is increased.

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16

Naksuk, Nirut, Jiradech Nakngoenthong, Waravut Printrakoon et Rattanapon Yuttawiriya. « Real-Time Temperature Measurement Using Infrared Thermography Camera and Effects on Tensile Strength and Microhardness of Hot Wire Plasma Arc Welding ». Metals 10, n^o 8 (3 août 2020) : 1046. http://dx.doi.org/10.3390/met10081046.

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The hot wire plasma arc welding process, a hybrid process between the plasma arc welding (PAW) process and hot wire process, is used to weld 316 stainless steel sheets, in which the temperature generated during welding is recorded in real time with a high-speed infrared thermography camera. Therefore, this research studies the factors in the hot wire process, of which there are two: (1) wire feed rate and (2) wire current; this study investigated the tensile strength, microhardness, and relationship of cooling rate per tensile strength and microhardness. The study found that the hot wire current plays an important role in cooling rates and tensile strength. The temperature results from high-speed infrared thermography camera show that the maximum welding temperature is around 1300 °C. The weld pool has a temperature between 900 and 1300 °C and the temperature profile of the weld pool will look like an “M” shaped, which is caused by the hot wire process. Finally, the appropriate hot wire parameters are 1.5 m/min for wire feed rate and 40A for wire current, which will give the workpiece cooling rate of 800–500 °C as 13.42 °C/s, tensile strength of 610.95 MPa, and the average Vickers microhardness of 195 HV.

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17

Hwang, Joong-Ki. « Comparison of Temperature Distribution between TWIP and Plain Carbon Steels during Wire Drawing ». Materials 15, n^o 23 (6 décembre 2022) : 8696. http://dx.doi.org/10.3390/ma15238696.

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The effect of the thermal properties of steels on wire drawing behavior has been investigated to understand and improve the wire drawing process. Finite element analysis and experimental tests were conducted to analyze the temperature distribution of the deformed specimens with different thermal properties. The thermal properties of twinning-induced plasticity (TWIP) steel were measured and compared with those of plain carbon steel. Based on the measurement of thermal properties, wire drawing behaviors were systematically compared with thermal conductivity of the specimen (k) using plain low-carbon steel with high k and TWIP steel with low k. The results revealed that the k of TWIP steel was approximately one third of that of low-carbon steel, and the thermal expansion coefficient of the TWIP steel was approximately 50% higher than that of low-carbon steel in the temperature range of 26–400 °C. The temperature distributions in the wire strongly depended on the k of the wire during wire drawing. TWIP steel exhibited higher maximum temperature, and took a longer time to attain the equilibrium temperature than low-carbon steel during wire drawing owing to the low k. The maximum temperature of the die increased with decreasing k of the wire, indicating that die wear can increase with decreasing k of the wire. Therefore, reducing the drawing speed is suggested for a wire with low k, such as high-alloyed metals, especially for TWIP steels.

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18

Anderson, Scott Richard, Serkan Inceoglu et Montri D. Wongworawat. « Temperature Rise in Kirschner Wires Inserted Using Two Drilling Methods : Forward and Oscillation ». HAND 13, n^o 4 (16 mai 2017) : 423–27. http://dx.doi.org/10.1177/1558944717708052.

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Background: Kirschner wires (K-wires) are commonly used in orthopedic surgery. However, the loosening of the pins can lead to delayed or improper healing or infection. Wire loosening can occur by thermal necrosis that occurs due to heat produced during wire insertion. Although the parameters that affect temperature rise in cortical bone during wire insertion and drilling have been studied, the effect of drilling mode (oscillation versus forward) is unknown. The purpose of this study was to compare the temperature changes occurring in cortical bone during wire insertions by oscillating and forward drills. Our hypothesis is that oscillation drilling would produce less heat compared with forward drilling in K-wire insertion with 2 commonly used wire diameters. Methods: We drilled K-wires in a pig metacarpal model and measured the temperature rise between forward and oscillation drilling modes using diamond-tipped 0.062- and 0.045-inch-diameter K-wires. There were 20 holes drilled for each group (n = 20). Results: The average temperature rise using the 0.062-inch K-wire under forward and oscillation insertion was 14.0 ± 5.5°C and 8.8 ± 2.6°C, respectively. For the 0.045-inch K-wire, under forward and oscillation insertion, the average temperature rise was 11.4 ± 2.6°C and 7.1 ± 1.9°C, respectively. The effects of the drilling mode and wire diameter on temperature rise were significant ( P < .05). Conclusions: In conclusion, the oscillation of K-wires during insertion causes a lower temperature rise when compared with forward drilling.

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Kung, Huang Kuang, et Bo Wun Huang. « On the Wire Sweep Experiments and Predictions of Gold Wire for Semiconductor Wirebonding Technology ». Materials Science Forum 505-507 (janvier 2006) : 319–24. http://dx.doi.org/10.4028/www.scientific.net/msf.505-507.319.

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This paper studies the elevated-temperature sweep characteristics of wire bond during transfer molding process for semiconductor package. A set of sweep experiments is also conducted to acquire the sweep stiffness of wire bond for several bond spans and bond heights. The results show the increase of the sweep deflections is more delicate to bond span than bond height. The main objectives of this research are to obtain elevated-temperature material properties of gold wire experimentally and to predict the wire sweep of various bond spans and bond heights subjected to drag force in the compound flow during transfer molding. Based on the analysis results of ANSYS, the effects of bond span and bond height on wire sweep in the elevated-temperature environment can be obtained. Then, the elevated-temperature deflections of wire sweep can be predicted.

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Wan Yusoff, Wan Yusmawati, Azman Jalar, Norinsan Kamil Othman et Irman Abdul Rahman. « Nanoindentation Study on Heat Treated Gold Wire Bonding ». Materials Science Forum 857 (mai 2016) : 31–35. http://dx.doi.org/10.4028/www.scientific.net/msf.857.31.

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The effect of high temperature storage of gold ball bonds towards micromechanical properties has been investigated. Gold wire from thermosonic wire bonding exposed to high temperature storage at 150 °C for 10, 100 and 1000 hours. The nanoindentation test was used in order to evaluate the high temperature storage effect on wire bonding in more details and localized. Prior to nanoindentation test, the specimens were cross-sectioned diagonally. The constant load nanoindentation was performed at the center of gold ball bond to investigate the hardness and reduced modulus. The load-depth curve of nanoindentation for the high temperature storage gold wire has apparent the discontinuity during loading compared to as-received gold wire. The hardness value increased after subjected to high temperature storage. However, the hardness decreased when the storage period is extended. The decreasing in the hardness value may due to the grain size of Au metal which recrystallized after subjected to high temperature storage. The results obtained from nanoindentation is important in assessing the high temperature storage of wire bonding.

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Cao, Jun, Junchao Zhang, Baoan Wu, Huiyi Tang, Changchun Lv, Kexing Song, Guannan Yang, Chengqiang Cui et Yangguang Gao. « Study on Manufacturing Technology of Ag-8.5Au-3.5Pd Fine Alloy Wire ». Micromachines 12, n^o 8 (9 août 2021) : 938. http://dx.doi.org/10.3390/mi12080938.

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The performance of Ag-8.5Au-3.5Pd alloy wire after cold deformation and annealing were analyzed by SEM (scanning electron microscope), strength tester and resistivity tester. The processing process and performance change characteristics of Ag-8.5Au-3.5Pd alloy wire were studied. The results show that alloy wire grains gradually form a fibrous structure along with the increase in deformation. The strength of the wire increases with the increase in deformation rate, but the increase trend becomes flat once the deformation rate is higher than 92.78%; the resistivity of Ag-8.5Au-3.5Pd alloy wire decreases with the increase in annealing temperature, reaching minimum (2.395 × 10−8 Ω·m) when the annealing temperature is 500 °C; the strength of Ag-8.5Au-3.5Pd alloy wire decreases with the increase in annealing temperature. When the annealing temperature is 500 °C, the strength and elongation of the φ0.2070 mm Ag-8.5Au-3.5Pd alloy wire are 287 MPa and 25.7%, respectively; the fracture force and elongation of φ0.020 mm Ag-8.5Au-3.5Pd alloy wire are 0.0876 N and 14.8%, respectively. When the annealing temperature is 550 °C, the metal grains begin to grow and the mechanical performance decrease; the φ0.020 mm Ag-8.5Au-3.5Pd alloy wire have good surface quality when the tension range is 2.5–3.0 g.

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Ismail, Norliza, Maria Abu Bakar et Saiful Bahari Bakarudin. « Effect of Temperature on Strain-Induced Hardness of Lead-Free Solder Wire using Nanoindentation Approach ». Sains Malaysiana 49, n^o 12 (31 décembre 2020) : 3019–26. http://dx.doi.org/10.17576/jsm-2020-4912-14.

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Hardness properties of SAC305 solder wire under tensile test at varied temperature was investigated. Continuous multi-cycle (CMC) nanoindentation technique with ten cycle of indentation for each sample was performed to evaluate the hardness behaviour of SAC305 solder wire at different depth of indentation. As a result, all investigated SAC305 solder wire under constant strain rate of tensile test and at different temperature revealed the occurrence of indentation size effect (ISE). At initial cycle of indentation, SAC305 solder wire at room temperature (25 °C) have higher hardness value compared to the others sample which exposed to the varied temperature during tensile test. Besides, higher temperature causes the higher strain or elongation to the SAC305 solder wire. Applied of strain during the tensile test had generated the pre-dislocation activity in the SAC305 solder wire. Therefore, higher hardness values of SAC305 at room temperature is due to the existence of high dislocation density induced by the applied strain. Nevertheless, the existence of heat at 60, 90, 120 and 180 °C during the tensile test prompt the rearrangement of dislocation and reduce the dislocation activities, thus, allowing higher elongation of solder wire.

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OBARA, Haruki, Yasushi IWATA, Tsuyoshi OHSUMI et Osamu YASUDA. « An Attempt to Measure a Temperature Distribution of Wire on WIRE EDM. » Journal of The Japan Society of Electrical Machining Engineers 28, n^o 57 (1994) : 21–31. http://dx.doi.org/10.2526/jseme.28.21.

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Koyano, Tomohiro, Taishi Takahashi, Seiya Tsurutani, Akira Hosokawa, Tatsuaki Furumoto et Yohei Hashimoto. « Temperature Measurement of Wire Electrode in Wire EDM by Two-color Pyrometer ». Procedia CIRP 68 (2018) : 96–99. http://dx.doi.org/10.1016/j.procir.2017.12.029.

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Shan, Jianqiang, Henan Wang, Wei Liu, Linxing Song, Xuanxiang Chen et Yang Jiang. « Subchannel Analysis of Wire Wrapped SCWR Assembly ». Science and Technology of Nuclear Installations 2014 (2014) : 1–8. http://dx.doi.org/10.1155/2014/301052.

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Application of wire wrap spacers in SCWR can reduce pressure drop and obtain better mixing capability. As a consequence, the required coolant pumping power is decreased and the coolant temperature profile inside the fuel bundle is flattened which will obviously decrease the peak cladding temperature. The distributed resistance model for wire wrap was developed and implemented in ATHAS subchannel analysis code. The HPLWR wire wrapped assembly was analyzed. The results show that: (1) the assembly with wire wrap can obtain a more uniform coolant temperature profile than the grid spaced assembly, which will result in a lower peak cladding temperature; (2) the pressure drop in a wire wrapped assembly is less than that in a grid spaced assembly, which can reduce the operating power of pump effectively; (3) the wire wrap pitch has significant effect on the flow in the assembly. SmallerHwire/Drodwill result in stronger cross flow a more uniform coolant temperature profile, and also a higher pressure drop.

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Yan, Chun Yan, Xin Zhao, Song Ya Tian, Sheng Xun Xu, Bai Qing Ma et Hai Yang Jiang. « Effect of Welding Parameters on Temperature Field during Twin-Wire Submerged Arc Welding of X80 Pipeline Steel ». Advanced Materials Research 652-654 (janvier 2013) : 2347–51. http://dx.doi.org/10.4028/www.scientific.net/amr.652-654.2347.

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The welding temperature field of twin-wire submerged arc welding (SAW) in an X80 pipeline steel welded joint was analyzed using a three-dimensional (3D) finite element (FE) model. Taking into account nonlinear relationships between temperature and mechanical properties, a coupled thermo-mechanical FE solution was used to obtain the temperature distribution for varying set of welding conditions. Effect of welding speed, inter wire spacing on welding temperature field were studied and presented. It is found that welding speed and inter wire spacing play a significant role in deciding the temperature distribution of twin-wire submerged arc welding. Simulation results were well consistent with theoretical analysis.

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Jalar, Azman, Saidatul Azura Radzi et Muhammad Azmi Abd Hamid. « Effect of Ca Content on Mechanical Properties of 4N Gold Wire for Quad Flat Nolead (QFN) Stacked Die Package ». Advanced Materials Research 97-101 (mars 2010) : 36–39. http://dx.doi.org/10.4028/www.scientific.net/amr.97-101.36.

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This paper discusses the effect of two similar gold wire (wire A and wire B) used mainly as a wire bonding material for Quad Flat Nolead (QFN) package. Both wires with diameter of 25.4 μm were bonded using automatic wire bonder by maintaining the temperature at 200°C. The effect of trace elements on the mechanical properties of 4N gold wire has not been widely investigated for some years despite the important of wire-bonding and the move towards fine pitch applications. Due to the element analysis, atomic percentage of Ca in wire B is higher than wire A. Pull strength increase with the increasing of the trace element. The higher pull strength of wire B could improve the yield strength, elastic modulus and recrytallization temperature.

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Ni, Jun, et Hong Ming Gao. « Influence of Preheated Wire on GMAW Process ». Advanced Materials Research 668 (mars 2013) : 538–42. http://dx.doi.org/10.4028/www.scientific.net/amr.668.538.

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An hot-wire GMAW process is proposed in which the wire is preheated by a TIG arc to enhance the wire melting, and the process is aimed at high efficiency welding with a low level heat input. The welding system is designed, the wire temperature is monitored and the metal transfer and arc behavior is observed. The preheating effect on the wire temperature is analyzed, and the influence of the hot wire on the metal transfer, arc behavior, and the weld formation are analyzed, compared with conventional GMAW. The results show that the preheated wire can significantly enhance the wire melting, and thus several beneficial effects on the GMAW process.

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Yuan, Chengwei, Shujun Chen, Fan Jiang, Bin Xu et Shanwen Dong. « Mechanism of Continuous Melting and Secondary Contact Melting in Resistance Heating Metal Wire Additive Manufacturing ». Materials 13, n^o 5 (28 février 2020) : 1069. http://dx.doi.org/10.3390/ma13051069.

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Resistance heating metal wire materials additive manufacturing technology is of great significance for space environment maintenance and manufacturing. However, the continuous deposition process has a problem in which the metal melt is disconnected from the base metal. In order to study the difference between the second contact melting of the disconnected metal melt and the continuous melting of the metal wire as well as eliminate the problem of the uneven heat dissipation of the base metal deposition on the melting process of the metal wire, the physical test of melting the metal wire clamped by the equal diameter conductive nozzle was carried out from the aspects of temperature distribution, temperature change, melting time, dynamic resistance change, and the microstructure. The current, wire length, and diameter of the metal wire are used as variables. It was found that the dynamic resistance change of the wire can be matched with the melting state. During the solid-state temperature rise, due to the presence of the contact interface, the continuous melting and secondary contact melting of metal wires differ in dynamic resistance and the melting process. The continuous melting of the metal wire was caused by the overall resistance of the wire to generate heat and melt, and the temperature distribution is “bow-shaped”. In the second contact melting, the heat generated by the contact interface resistance was transferred to both ends of the metal wire to melt, and the temperature distribution is “inverted V”. The microstructure of the metal wire continuous melting and secondary contact melting solidification is similar. The continuous melting length of the metal wire is greater than the melting length of the secondary contact.

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Cheema, Taqi Ahmad, Haider Ali, Kyung Won Kim, Choon Young Lee, Moon Kyu Kwak et Cheol Woo Park. « Numerical Investigation on the Effects of Sample Wire Motion in a Tube Furnace ». Applied Mechanics and Materials 300-301 (février 2013) : 771–74. http://dx.doi.org/10.4028/www.scientific.net/amm.300-301.771.

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A tube furnace is a heat treatment device in which a specimen is heated in the presence of an inert gas using electric heating coils embedded in a thermally insulating matrix. Heat flux and temperature gradients of sample during heat treatment in a tube furnace depend on the gas and wire velocities. These parameters were used in this paper for a 2-D axisymmetric numerical study to determine an optimized relationship between the temperature and the sample wire motion. The results show that wire velocity considerably affected the wire temperature distribution and increased the gas temperature to some extent. The phenomenon resulted in the shifting of the heating zone on the wire surface and occurrence of an inner convection heat transfer.

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Wang, Yong Jun, Zhen Qing Wang, Hong Qing Lv et Yu Long Wang. « Experiment Study on the Mechanical Properties of Shape Memory Alloy ». Advanced Materials Research 148-149 (octobre 2010) : 1360–63. http://dx.doi.org/10.4028/www.scientific.net/amr.148-149.1360.

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In order to investigate the performance of shape memory alloy wire, two types of alloy wire were studied. The results showed that the phase transition temperature of the superelastic wire were: Ms and Mf were 21.18 °C and 7.08 °C; As and Af were 12.32 °C and 25.13 °C. The phase transition temperature of memory effect alloy wire were that Ms =- 11.85 °C, Mf =- 29.37 °C, As = 36.77 °C, Af = 43.35 °C. By the tensile test of the SMA wire, the stress - strain curves of the two kinds of alloy wire were obtained.

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Shu, Zhongjun, Wei Shen, Qiang Li, Minghao Fan et Jiaqing Zhang. « Calculation of temperature field of coiled wire using EFM ». E3S Web of Conferences 72 (2018) : 03002. http://dx.doi.org/10.1051/e3sconf/20187203002.

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Provided a heat transfer model of coiled wire method. Based on the method, a software of EFM (ANSYS) was used to calculate the temperature field of coiled wire. Comparisons between the experimental of RVS coiled wire and numerical results indicated the effectiveness of the method utilized. The simulation method based on EFM proved to be useful for the fire risk assessment of coiled wire.

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Tagawa, M., K. Kato et Y. Ohta. « Response compensation of fine-wire temperature sensors ». Review of Scientific Instruments 76, n^o 9 (septembre 2005) : 094904. http://dx.doi.org/10.1063/1.2044567.

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Ligęza, P. « Constant-bandwidth constant-temperature hot-wire anemometer ». Review of Scientific Instruments 78, n^o 7 (juillet 2007) : 075104. http://dx.doi.org/10.1063/1.2752604.

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Harrison, R. G., et M. A. Pedder. « Fine wire thermometer for air temperature measurement ». Review of Scientific Instruments 72, n^o 2 (2001) : 1539. http://dx.doi.org/10.1063/1.1336819.

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TAGAWA, Masato, Kenji KATO et Yasuhiko OHTA. « Response Compensation of Fine-Wire Temperature Sensors ». Transactions of the Japan Society of Mechanical Engineers Series B 71, n^o 706 (2005) : 1663–70. http://dx.doi.org/10.1299/kikaib.71.1663.

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Abdel-Rahman, A., C. Tropea, P. Slawson et A. Strong. « On temperature compensation in hot-wire anemometry ». Journal of Physics E : Scientific Instruments 20, n^o 3 (mars 1987) : 315–19. http://dx.doi.org/10.1088/0022-3735/20/3/017.

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Hubert, B. N., R. Zhou, T. G. Holesinger, W. L. Hults, A. Lacerda, A. S. Murray, R. D. Ray et al. « Silver alloys for high-temperature superconducting wire ». Journal of Electronic Materials 24, n^o 12 (décembre 1995) : 1869–72. http://dx.doi.org/10.1007/bf02653000.

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Han, Fuzhu, Gang Cheng, Zhijing Feng et Isago Soichiro. « Measurement of wire electrode temperature in WEDM ». International Journal of Advanced Manufacturing Technology 41, n^o 9-10 (30 juillet 2008) : 871–79. http://dx.doi.org/10.1007/s00170-008-1546-x.

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Heuck, Nicolas, F. Baars, Andrey Bakin et A. Waag. « Development of a Wire-Bond Technology for SiC High Temperature Applications ». Materials Science Forum 645-648 (avril 2010) : 749–52. http://dx.doi.org/10.4028/www.scientific.net/msf.645-648.749.

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In this paper a wire-bond technology for high temperatures (up to 500°C) based on silver-wire is presented. The mechanical properties of silver thick-wire wedge bonds are analyzed and compared to previously presented silver-stripes fastened onto the chip with the Low Temperature Joining Technique (LTJT) and to common aluminum thick-wire.

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Unger, Andreas, Matthias Hunstig, Michael Brökelmann, Dirk Siepe et Hans J. Hesse. « Cell Interconnections in Battery Packs Using Laser-assisted Ultrasonic Wire Bonding ». International Symposium on Microelectronics 2020, n^o 1 (1 septembre 2020) : 000217–21. http://dx.doi.org/10.4071/2380-4505-2020.1.000217.

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Abstract This paper presents the results of a series of bonding tests using a laser-assisted ultrasonic wire bonding process. Aluminium and copper wire, both 500 μm (20 mil) thick, were bonded to nickel-coated steel caps of type 21700 battery cells. Mechanical bond strength tests prove that laser-assisted wire bonding has significant advantages over room temperature wire bonding. For example, it can be used to reduce the process time with aluminium wire or to increase the bondability of copper wire on nickel-coated steel. The results show a direct relation between tool tip temperature and measured bond strength. The quality of the joints was effectively improved by heating the tool tip up to 430 °C. These advantages are the same as in classic thermosonic wire bonding, but without the major disadvantage of having to heat to whole package. The cell temperature was shown to remain safely below the critical 60 °C in any application.

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Fann, Kuang-Jau, Chia Feng Yu et Chun Hao Chang. « Analysis of Dieless Drawing to Form the End of Metal Wires under Proportional Shape Evolution with Slab Method ». Materials Science Forum 920 (avril 2018) : 155–60. http://dx.doi.org/10.4028/www.scientific.net/msf.920.155.

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This study is to set a goal to create a model solving the temperature distribution and its evolution for the process of dieless drawing metal wire parts by using slab method and postulating that the wire end suffers a proportional deformation. The results from using a SUS304 stainless wire in 5 mm diameter dielessly drawn show that the highest temperature locates on the symmetry plane at the process beginning, so that the necking takes place there and an end will be formed securely. As a result, the method proposed by this study is feasible. In addition, for a given final shape of the metal wire end, there are many possibilities to get different temperature distribution and its evolution by setting different temperature boundary condition. The higher the boundary temperature set, the higher the temperature distribution, but the lower the drawing force needed.

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Min, Sung-Yong, Yeongjun Lee, Se Hyun Kim, Cheolmin Park et Tae-Woo Lee. « Room-Temperature-Processable Wire-Templated Nanoelectrodes for Flexible and Transparent All-Wire Electronics ». ACS Nano 11, n^o 4 (27 mars 2017) : 3681–89. http://dx.doi.org/10.1021/acsnano.6b08172.

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Maiti, Tapan Kumar. « A Novel Lead-Wire-Resistance Compensation Technique Using Two-Wire Resistance Temperature Detector ». IEEE Sensors Journal 6, n^o 6 (décembre 2006) : 1454–58. http://dx.doi.org/10.1109/jsen.2006.883903.

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Pedullà, Eugenio, Francesco Saverio Canova, Giusy Rita Maria La Rosa, Alfred Naaman, Franck Diemer, Luigi Generali et Walid Nehme. « Influence of NiTi Wire Diameter on Cyclic and Torsional Fatigue Resistance of Different Heat-Treated Endodontic Instruments ». Materials 15, n^o 19 (22 septembre 2022) : 6568. http://dx.doi.org/10.3390/ma15196568.

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We compared the mechanical properties of 2Shape mini TS2 (Micro-Mega, Besançon, France) obtained from 1.0 diameter nickel-titanium (NiTi) wires and 2Shape TS2 from 1.2 diameter nickel-titanium (NiTi) wires differently thermally treated at room and body temperature. We used 120 NiTi TS2 1.0 and TS2 1.2 files made from controlled memory (CM) wire and T-wire (n = 10). Cyclic fatigue resistance was tested by recording the number of cycles to fracture (NCF) at room and body temperatures using a customized testing device. Maximum torque and angle of rotation at failure were recorded, according to ISO 3630-1. Data were analyzed by a two-way ANOVA (p < 0.05). The CM-wire files had significantly higher NCFs at both temperatures, independent of wire dimensions. Testing at body temperature negatively affected cyclic fatigue of all files. The 1.0-mm diameter T-wire instruments showed higher NCF than the 1.2-mm diameter, whereas no significant differences emerged between the two CM wires at either temperature. The maximum torque was not significantly different across files. The TS2 CM-wire files showed significantly higher angular rotation to fracture than T-wire files. The TS2 CM-wire prototypes showed higher cyclic fatigue resistance than T-wire prototypes, regardless of wire size, exhibiting suitable torsional properties. Torsional behavior appears to not be affected by NiTi wire size.

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Du, Qing Fu. « Temperature Measurement with High Accuracy ». Advanced Materials Research 301-303 (juillet 2011) : 1333–38. http://dx.doi.org/10.4028/www.scientific.net/amr.301-303.1333.

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Calibration of general temperature sensor, platinum resistor is done with measuring its zero resistance and dispersity of linear system and compensating. Accurate constant current source is used to provide platinum resistor sensor power and four-wire measuring method is designed for self-compensation of lead wire resistance. With amplifying the changing signal of platinum using amplifier of high precision and low temperature drift, and MCPU digital filtering, highly accurate temperature measurement result is got finally.

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Gok, A., K. Gok et M. B. Bilgin. « Three-dimensional finite element model of the drilling process used for fixation of Salter–Harris type-3 fractures by using a K-wire ». Mechanical Sciences 6, n^o 2 (20 août 2015) : 147–54. http://dx.doi.org/10.5194/ms-6-147-2015.

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Abstract. In this study, the drilling process was performed with Kirschner wire (K-wire) for stabilization after reduction of Salter–Harris (SH) type-3 epiphyseal fractures of distal femur. The study was investigated both experimentally and numerically. The numerical analyses were performed with finite element method (FEM), using DEFORM-3D software. Some conditions such as friction, material model and load and boundary must be identified exactly while using FEM. At the same time, an analytic model and software were developed, which calculate the process parameters such as drilling power and thrust power, heat transfer coefficients and friction coefficient between tool–chip interface in order to identify the temperature distributions occurring in the K-wire and bone model (Keklikoǧlu Plastik San.) material during the drilling process. Experimental results and analysis results have been found as consistent with each other. The main cutting force, thrust force, bone model temperature and K-wire temperature were measured as 80° N, 120° N, 69 °C and 61 °C for 400 rpm in experimental studies. The main cutting force, thrust force, bone model temperature and K-wire temperature were measured as 65° N, 87° N, 91 °C and 82 °C for 800 rpm in experimental studies. The main cutting force, thrust force, bone model temperature and K-wire temperature were measured as 85° N, 127° N, 72 °C and 67 °C for 400 rpm in analysis studies. The main cutting force, thrust force, bone model temperature and K-wire temperature were measured as 69° N, 98° N, 83 °C and 76 °C for 800 rpm in analysis studies. A good consistency was obtained between experimental results and finite element analysis (FEA) results. This proved the validity of the software and finite element model. Thus, this model can be used reliably in such drilling processes.

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Suliga, M. « Analysis of the Heating of Steel Wires During High Speed Multipass Drawing Process/ Analiza Nagrzewania Się Drutów Stalowych W Procesie Ciągnienia Wielostopniowego Z Dużymi Prędkosciami ». Archives of Metallurgy and Materials 59, n^o 4 (1 décembre 2014) : 1475–80. http://dx.doi.org/10.2478/amm-2014-0251.

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Abstract The analysis of the heating of the wire including theoretical studies showed that in the multistage drawing process a increase drawing speed causes intense heating of a thin surface layer of the wire to a temperature exceeding 1100°C, which should be explained by the accumulation of heat due to friction at the interface between wire and die. It has been shown that with increasing of drawing speed the heated surface layer thickness measured at the exit of the wire from the dies is reduced significantly and at drawing speed of 25 m/s is equal to about 68 μm. The decrease in the thickness of this layer can be explained by a shorter time of heat transfer to the wire, which causes additional heat accumulation in the surface layer. Thus fivefold increase in drawing speed caused an approximately 110% increase in the temperature in the surface layer of the wire. Experimental studies have shown that the increase of drawing speed of 5 to 25 m/s will increase the temperature of the wire after coiled on the spool more than 400%.

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Zhao, Sen, Hong Yang Jing, Yong Dian Han et Lian Yong Xu. « Electrochemical Behavior of Welded Joints with 308L Stainless Welding Wire and Low Temperature Transformation Welding Wire ». Advanced Materials Research 418-420 (décembre 2011) : 1392–95. http://dx.doi.org/10.4028/www.scientific.net/amr.418-420.1392.

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The electrochemical behavior of welded joints with 308L stainless solid welding wire and low temperature transformation welding wire using different welding processes was investigated at ambient temperature in 3.5% NaCl solution using potentiodynamic polarisation technique. Welded joints exhibited different corrosion potential due to the dilutions of alloy elements such as Cr, Ni, Ti, Nb and Mo. To reveal the corrosion resistance of welded joints using different welding processes, some significant characterization parameters such as Ecorr, Eb, △E and Icorr in polarisation curves were analyzed and compared. The result shows that the corrosion resistance of welded joints using low temperature transformation welding wire is better than that using 308L stainless solid welding wire.

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Todorov, Todor, Nikolay Nikolov, Georgi Todorov et Yanko Ralev. « Modelling and Investigation of a Hybrid Thermal Energy Harvester ». MATEC Web of Conferences 148 (2018) : 12002. http://dx.doi.org/10.1051/matecconf/201814812002.

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The presented paper deals with dynamical and experimental investigations of a hybrid energy harvester containing shape memory alloy (SMA) wire and elastic cantilever with piezoelectric layer. The SMA wire periodically changes its temperature under the influence of a heated plate that approaches and moves away from the SMA wire. The change of SMA wire length causes rotation of the hot plate. The plate is heated by a heater with constant temperature. The repeated SMA wire extensions and contractions bend the piezoelectric cantilever which generates electric charges. The shape memory effect is presented as a temperature approximation of the Young’s modulus. A dynamical model of the energy harvester is created and some analytical investigations are presented. With the help of an experimental setup the acceleration, the force, the temperature, and the output voltage have been measured. The theoretical results are validated experimentally. Some conclusions are made about the best performance of the energy harvester.

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