Littérature scientifique sur le sujet « ULTRASONIC ASSISTED CMT »
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Articles de revues sur le sujet "ULTRASONIC ASSISTED CMT"
NOMURA, Mitsuyoshi, Yutaka MATSUSHIMA, Yongbo WU, Masakazu FUJIMOTO et Zhou LIBO. « 2207 Effects of Ultrasonic Vibration on Abrasive Pellet Working Life for Si Wafer using Ultrasonic Assisted Fixed Abrasive Chemical Mechanical Polishing(UF-CMP) ». Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21 2015.8 (2015) : _2207–1_—_2207–4_. http://dx.doi.org/10.1299/jsmelem.2015.8._2207-1_.
Texte intégralTeyeb, Ahmed, João Silva, Jamil Kanfoud, Phil Carr, Tat-Hean Gan et Wamadeva Balachandran. « Improvements in the Microstructure and Mechanical Properties of Aluminium Alloys Using Ultrasonic-Assisted Laser Welding ». Metals 12, no 6 (17 juin 2022) : 1041. http://dx.doi.org/10.3390/met12061041.
Texte intégralMing, Ping Mei, Di Zhu, Yang Yang Hu et Yong Bin Zeng. « Experimental Research on Microelectroforming with Ultrasonic Agitation ». Key Engineering Materials 375-376 (mars 2008) : 253–57. http://dx.doi.org/10.4028/www.scientific.net/kem.375-376.253.
Texte intégralLi, Zhe, Daoguo Yang, Weidong Hao, Song Wu, Yan Ye, Zhidan Chen et Xiaoping Li. « Ultrasonic vibration-assisted micro-hole forming on skull ». Proceedings of the Institution of Mechanical Engineers, Part B : Journal of Engineering Manufacture 231, no 14 (24 octobre 2015) : 2447–57. http://dx.doi.org/10.1177/0954405415611363.
Texte intégralCruz-Garibaldi, Bianka Y., Alma D. Alarcon-Rojo, Mariana Huerta-Jimenez, Ivan A. Garcia-Galicia et Luis M. Carrillo-Lopez. « Efficacy of Ultrasonic-Assisted Curing Is Dependent on Muscle Size and Ultrasonication System ». Processes 8, no 9 (20 août 2020) : 1015. http://dx.doi.org/10.3390/pr8091015.
Texte intégralHao, Changchun, Hongjin Qu, Shi Chen, Wenjing Han et Runguang Sun. « Ultrasound-assisted Extraction of Polysaccharide from Radix Bupleuri using Response Surface Methodology and Antioxidant Research of the Polysaccharide ». Natural Product Communications 13, no 4 (avril 2018) : 1934578X1801300. http://dx.doi.org/10.1177/1934578x1801300420.
Texte intégralChen, Xiwen, Xiaoqian Li, Weihua Gui et Luca Landi. « Simulation and Experiment of New Ultrasonic Vibration Network ». Shock and Vibration 2020 (27 septembre 2020) : 1–12. http://dx.doi.org/10.1155/2020/4913286.
Texte intégralKida, Małgorzata, Sabina Ziembowicz et Piotr Koszelnik. « The Use of an Ultrasonic Field in Support of Classical Methods of Oxidising Component Leached from Microplastics in Bottom Sediments ». Materials 14, no 11 (2 juin 2021) : 3029. http://dx.doi.org/10.3390/ma14113029.
Texte intégralAbedini, Reza, et Mahmoud Mousavi. « Effect of different parameters on sonochemical synthesized nanocrystalline TiO2 particles ». Chemical Industry and Chemical Engineering Quarterly 18, no 2 (2012) : 171–78. http://dx.doi.org/10.2298/ciceq110826059a.
Texte intégralSilva, Liliana J. G., André M. P. T. Pereira, Angelina Pena et Celeste M. Lino. « Citrinin in Foods and Supplements : A Review of Occurrence and Analytical Methodologies ». Foods 10, no 1 (23 décembre 2020) : 14. http://dx.doi.org/10.3390/foods10010014.
Texte intégralThèses sur le sujet "ULTRASONIC ASSISTED CMT"
Yang, Wei-Zheng, et 楊緯政. « Ultrasonic Vibration and Water-Jet Assisted Diamond Disk Dressing Characteristic of CMP Polishing Pad ». Thesis, 2011. http://ndltd.ncl.edu.tw/handle/66594057681439110536.
Texte intégral國立勤益科技大學
機械工程系
99
This study introduces an ultrasonic, vibration-assisted, chemical mechanical polishing (UV-CMP) method to improve the fabrication process and machining efficiency and an ultrasonic, vibration-assisted, diamond disk (UV-DD) method to enhance the diamond work number, then extension diamond disk life. The removal rate of the copper substrate in CMP and UV-CMP are compared. The pad cut rate, friction force, and pad surface profiles of TDD and UV-DD are also investigated in experiments. In addition an experimental investigation of the dressing characteristics of a porous polishing pad using a combination process of high-pressure water jet conditioning (HPWJC) and diamond disk conditioning (DDC) is also investigated. The HPWJC and DDC dressing mechanisms were integrated to improve the dressing efficiency. Experimental results reveal that UV-DD can produce twice the pad cut rate and reduce torque force compared to TDD. Consequently, a dressing time reduction by half is expected, and hence, the diamond life is extended. The removal rate of the copper substrate polished by UV-CMP is higher than that of traditional CMP because in UV-CMP, a passive layer on the copper surface, formed by the chemical action of the slurry, will be removed not only by the mechanical action of CMP but also by ultrasonic action. In addition, the surface roughness improves and the torque force reduces dramatically. It is found that although the HPWJC can clean the slurry residue from the pad surface and consumes less pad material, it cannot remove the glazed area layer formed as a result of plastic deformation. DDC can eliminate the pads glaze layer and restore the pad asperities, but some residual chips still remain the sides of the pores or inside the pores. HPWJC + DDC can not only remove the embedded slurry particulates and glazed layer, but also clean the slurry residue accumulated on the pad surface, and regenerate the pad asperities. In addition, the chip roughness in the pores, created by the diamond grit, are completely removed by the HPWJC + DDC conditioning process, which helps achieve the highest material removal rate. In summary, UV-CMP, HPWJC and UV-DD technology has the potential to be effectively used as a wafer polishing and pad conditioning method.
Actes de conférences sur le sujet "ULTRASONIC ASSISTED CMT"
Hwangbo, C. K., M. R. Jacobson et H. A. Macleod. « Ultrasound-assisted evaporation of optical thin films ». Dans OSA Annual Meeting. Washington, D.C. : Optica Publishing Group, 1986. http://dx.doi.org/10.1364/oam.1986.mq3.
Texte intégralNagayama, Gyoko, Ryuji Ando, Kei Muramatsu et Takaharu Tsuruta. « Fabrication of Macroporous on No-Mask Silicon Substrate for Application to Microsystems ». Dans 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems. ASMEDC, 2008. http://dx.doi.org/10.1115/micronano2008-70323.
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