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1

Kwon, Kibaek, Chankyu Bae, Myunsik Kim, Jiwon Son, Hein Kim, Heuikwan Yang et Joongho Choi. « Analog Front-End IC Design for Vehicle Ultrasonic Sensor ». Journal of the Institute of Electronics and Information Engineers 58, no 9 (30 septembre 2021) : 13–19. http://dx.doi.org/10.5573/ieie.2021.58.9.13.

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Li, Zhong Yi, Xiao Dong Chen, Yun Xia Hao et Dao Yin Yu. « Excitation and Receiving Circuit Design for the Multi-Element Medical Ultrasonic Endoscope Probe ». Key Engineering Materials 552 (mai 2013) : 491–96. http://dx.doi.org/10.4028/www.scientific.net/kem.552.491.

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Multi-element ultrasonic probe applied in vivo, compared with the traditional probe applied in vitro or single-element probe, has its own specialty in working environment and structure. This paper designed an analog circuit applied in vivo including excitation and reception amplification for multi-element ultrasonic probe. The circuit provides an excitation and receiving front-end for the self-developed multi-element ultrasound endoscope imaging system. This ultrasound analog circuit can be used for d / 2 ultrasonic scanning along with the 16 element ultrasound transducer.
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Zamora, Iván, Eyglis Ledesma, Arantxa Uranga et Núria Barniol. « Miniaturized 0.13-μm CMOS Front-End Analog for AlN PMUT Arrays ». Sensors 20, no 4 (22 février 2020) : 1205. http://dx.doi.org/10.3390/s20041205.

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This paper presents an analog front-end transceiver for an ultrasound imaging system based on a high-voltage (HV) transmitter, a low-noise front-end amplifier (RX), and a complementary-metal-oxide-semiconductor, aluminum nitride, piezoelectric micromachined ultrasonic transducer (CMOS-AlN-PMUT). The system was designed using the 0.13-μm Silterra CMOS process and the MEMS-on-CMOS platform, which allowed for the implementation of an AlN PMUT on top of the CMOS-integrated circuit. The HV transmitter drives a column of six 80-μm-square PMUTs excited with 32 V in order to generate enough acoustic pressure at a 2.1-mm axial distance. On the reception side, another six 80-μm-square PMUT columns convert the received echo into an electric charge that is amplified by the receiver front-end amplifier. A comparative analysis between a voltage front-end amplifier (VA) based on capacitive integration and a charge-sensitive front-end amplifier (CSA) is presented. Electrical and acoustic experiments successfully demonstrated the functionality of the designed low-power analog front-end circuitry, which outperformed a state-of-the art front-end application-specific integrated circuit (ASIC) in terms of power consumption, noise performance, and area.
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Govindan, Pramod, Vidya Vasudevan, Thomas Gonnot et Jafar Saniie. « Reconfigurable Ultrasonic Testing System Development Using Programmable Analog Front-End and Reconfigurable System-on-Chip Hardware ». Circuits and Systems 06, no 07 (2015) : 161–71. http://dx.doi.org/10.4236/cs.2015.67017.

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Chen, Dongdong, Xinhui Cui, Qidong Zhang, Di Li, Wenyang Cheng, Chunlong Fei et Yintang Yang. « A Survey on Analog-to-Digital Converter Integrated Circuits for Miniaturized High Resolution Ultrasonic Imaging System ». Micromachines 13, no 1 (11 janvier 2022) : 114. http://dx.doi.org/10.3390/mi13010114.

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As traditional ultrasonic imaging systems (UIS) are expensive, bulky, and power-consuming, miniaturized and portable UIS have been developed and widely utilized in the biomedical field. The performance of integrated circuits (ICs) in portable UIS obviously affects the effectiveness and quality of ultrasonic imaging. In the ICs for UIS, the analog-to-digital converter (ADC) is used to complete the conversion of the analog echo signal received by the analog front end into digital for further processing by a digital signal processing (DSP) or microcontroller unit (MCU). The accuracy and speed of the ADC determine the precision and efficiency of UIS. Therefore, it is necessary to systematically review and summarize the characteristics of different types of ADCs for UIS, which can provide valuable guidance to design and fabricate high-performance ADC for miniaturized high resolution UIS. In this paper, the architecture and performance of ADC for UIS, including successive approximation register (SAR) ADC, sigma-delta (Σ-∆) ADC, pipelined ADC, and hybrid ADC, have been systematically introduced. In addition, comparisons and discussions of different types of ADCs are presented. Finally, this paper is summarized, and presents the challenges and prospects of ADC ICs for miniaturized high resolution UIS.
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Cheng, Teng-Chuan, et Tsung-Heng Tsai. « CMOS Ultrasonic Receiver With On-Chip Analog-to-Digital Front End for High-Resolution Ultrasound Imaging Systems ». IEEE Sensors Journal 16, no 20 (octobre 2016) : 7454–63. http://dx.doi.org/10.1109/jsen.2016.2599580.

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Park, Song B., Jaeyoung Kwak et Kwyro Lee. « An ASIC Design for Versatile Receive Front-End Electronics of an Ultrasonic Medical Imaging System — 16 Channel Analog Inputs and 4 Dynamically Focused Beam Outputs ». Ultrasonic Imaging 25, no 2 (avril 2003) : 85–108. http://dx.doi.org/10.1177/016173460302500202.

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An ultra large-scale ASIC is designed for the receive front-end electronics of an ultrasonic medical imaging system. The chip receives 16 channel analog rf signals and outputs 4 sets of sample-point-wise dynamically focused partial beam data. Four complete beam data sets are obtained in parallel by simply cascading as many chips as needed in an array system. High resolution of the focusing delay is obtained by nonuniformly selecting each channel data from a quadruply-interpolated rf data stream. The proposed ASIC can be applied to most practical array transducers in the frequency range of 2 to 10 MHz. The digital part of the designed ASIC can be implemented on a chip area of 17.9 μm2 with 0.18 mm CMOS technology, leaving sufficient room for 16 ADCs of 8 bits, 50 MHz on the 5.7 mm × 5.7 mm chip with a 208 pin package.
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Xu, Jie, Ninghao Wang, Tianxiang Chu, Bingqian Yang, Xiaohua Jian et Yaoyao Cui. « A High-Frequency Mechanical Scanning Ultrasound Imaging System ». Biosensors 13, no 1 (27 décembre 2022) : 32. http://dx.doi.org/10.3390/bios13010032.

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High-frequency ultrasound has developed rapidly in clinical fields such as cardiovascular, ophthalmology, and skin with its high imaging resolution. However, the development of multi-elements high-frequency ultrasonic transducers and multi-channel high-frequency ultrasound imaging systems is extremely challenging. Here, a high-frequency ultrasound imaging system based on mechanical scanning was proposed in this paper. It adopts the method of reciprocating feed mechanism, which can achieve reciprocating scanning in the 14 mm range at 168 mm/s with a small 60 MHz transducer. A single-channel high-frequency ultrasonic imaging system consisting of the transmitting module, analog front end, acquisition module, and FPGA control module was developed. To overcome the non-uniformity of mechanical scanning, the ultrasound images are compensated according to the motion trajectory. The wire target and ex vivo tissue experiments have shown that the system can obtain an imaging resolution of 51 μm, imaging depth of 8 mm, and imaging speed of 12 fps. This high-frequency mechanical scanning ultrasound imaging system has the characteristics of simple structure, high-frequency, real-time, and good imaging performance, which can meet the clinical needs of high-resolution ultrasound images.
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Kou, Zhengchang, et Michael L. Oelze. « Implementation of real-time high-speed ultrasound communications through tissue ». Journal of the Acoustical Society of America 151, no 4 (avril 2022) : A245. http://dx.doi.org/10.1121/10.0011208.

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In this work, we propose a novel implementation of both a transmitter and receiver with field programmable gate arrays (FPGAs) to achieve real-time continuous high-definition (HD) video transmission through tissue, which can enable HD and higher frame rate wireless capsule endoscopy. We used a Texas Instruments AFE58JD48EVM 16 channel analog front end (AFE) evaluation board as the receiver connected to a Xilinx ZCU106 Zynq Ultrascale MPSoC development board in which we implemented a digital down converter (DDC), OFDM demodulator, maximum ratio combiner and low-density parity-check (LDPC) decoder. For the transmitter, we used an Analog Devices EVAL-AD9166 vector signal generator evaluation board, which has a built-in 4.3 dBm output power amplifier as a transmitter connected to another ZCU106 development board in which we implemented a LDPC encoder, OFDM modulator and digital up converter (DUC). The modulated signal was transmitted through a tissue-mimicking abdominal phantom using a 2-mm microcrystal transducer and received with a Sonic Concepts IP103 64 channel phased array at a center frequency of 3.2 MHz. We achieved the continuous transmission of up to over[OML1] 6 Mbps error free payload data rate after LDPC decoder which is used to carry HD video streams through ultrasound.
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Musayev, Javid, et Antonio Liscidini. « A Quantized Analog RF Front End ». IEEE Journal of Solid-State Circuits 54, no 7 (juillet 2019) : 1929–40. http://dx.doi.org/10.1109/jssc.2019.2914576.

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Gattani, A., D. W. Cline, P. J. Hurst et P. M. Mosinskis. « A CMOS HDSL2 analog front-end ». IEEE Journal of Solid-State Circuits 35, no 12 (décembre 2000) : 1964–75. http://dx.doi.org/10.1109/4.890311.

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Kim, Hyeong-Kyu, Bum-Sik Chung, Kang-Il Cho, Ho-Jin Kim et Gil-Cho Ahn. « Analog Front-end for EMG Acquisition System ». JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE 18, no 6 (31 décembre 2018) : 667–76. http://dx.doi.org/10.5573/jsts.2018.18.6.667.

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Ye, Mao, Yumei Zhou, Bin Wu et Jianhua Jiang. « An optimized analog to digital converter for WLAN analog front end ». Journal of Semiconductors 33, no 4 (avril 2012) : 045008. http://dx.doi.org/10.1088/1674-4926/33/4/045008.

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Richelli, Anna. « EMI Susceptibility Issue in Analog Front-End for Sensor Applications ». Journal of Sensors 2016 (2016) : 1–9. http://dx.doi.org/10.1155/2016/1082454.

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The susceptibility to electromagnetic interferences of the analog circuits used in the sensor readout front-end is discussed. Analog circuits still play indeed a crucial role in sensor signal acquisition due to the analog nature of sensory signals. The effect of electromagnetic interferences has been simulated and measured in many commercial and integrated analog circuits; the main cause of the electromagnetic susceptibility is investigated and the guidelines to design high EMI immunity circuits are provided.
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15

Song, Haryong, Yunjong Park, Hyungseup Kim et Hyoungho Ko. « Fully Integrated Biopotential Acquisition Analog Front-End IC ». Sensors 15, no 10 (30 septembre 2015) : 25139–56. http://dx.doi.org/10.3390/s151025139.

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Kim, Hyuntae, et Bertan Bakkaloglu. « CMOS Analog Front-End IC for Gas Sensors ». Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, DPC (1 janvier 2011) : 001761–96. http://dx.doi.org/10.4071/2011dpc-wp25.

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An electrochemical sensor readout analog front-end (AFE) IC for recording long term chemical and gas exposure is presented. The AFE readout circuit enables the detection of exhaust fumes in hazardous diesel and gasoline equipment, which helps correlate atmospheric pollutants with severe illnesses. The AFE reads out the output of eight conductometric sensor arrays and eight amperometric sensor arrays. The IC consists of a low noise potentiostat and associated 9 bits current-steering DAC for sensor stimulus, followed by the first order nested chopped ΣΔ ADC. The conductometric sensor uses a current driven approach for extracting resistance change of the sensor depending on gas concentration. The amperometric sensor uses a potentiostat to apply constant voltage for measuring current out of the sensor after a chemical reaction. The core area for the AFE is 2.65x0.95 mm2. The IC is fabricated in 0.18μm CMOS process and achieves 91dB SNR with 1.32mW power consumption per channel from a 1.8 V supply. With digital offset storage and nested chopping, the readout IC achieves 500 μV input referred offset. In order to use the system with AFE as part of a compact badge with battery, the entire gas detection system has been designed in 3D layers with a bio sensor mounted layer, an AFE layer, power management layer, a micro controller layer, and battery.
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Huang, Ping-Chen, et Jan M. Rabaey. « A Bio-Inspired Analog Gas Sensing Front End ». IEEE Transactions on Circuits and Systems I : Regular Papers 64, no 9 (septembre 2017) : 2611–23. http://dx.doi.org/10.1109/tcsi.2017.2697945.

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Kmon, P., L. A. Kadlubowski et P. Kaczmarczyk. « Design of analog pixels front-end active feedback ». Journal of Instrumentation 13, no 01 (22 janvier 2018) : P01018. http://dx.doi.org/10.1088/1748-0221/13/01/p01018.

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Arunthathi, J. M., et R. Prabhakar. « Implantable Devices with Reconfigurable Biosensing Analog Front End ». IOP Conference Series : Materials Science and Engineering 561 (12 novembre 2019) : 012095. http://dx.doi.org/10.1088/1757-899x/561/1/012095.

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Khalil, W., Tsung-Yuan Chang, Xuewen Jiang, S. R. Naqvi, B. Nikjou et J. Tseng. « A highly integrated analog front-end for 3g ». IEEE Journal of Solid-State Circuits 38, no 5 (mai 2003) : 774–81. http://dx.doi.org/10.1109/jssc.2003.810059.

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Hurst, P. J., T. J. Glad, J. J. Illgner et G. F. Landsburg. « An analog front end for v.22bis modems ». IEEE Journal of Solid-State Circuits 23, no 4 (août 1988) : 978–86. http://dx.doi.org/10.1109/4.349.

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Abba, A., A. Manenti, F. Caponio et A. Geraci. « High Performance Analog Front-End for Digital Spectroscopy ». IEEE Transactions on Nuclear Science 57, no 4 (août 2010) : 2173–77. http://dx.doi.org/10.1109/tns.2010.2049658.

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Kim, Insoo, Yusuf A. Bhagat, Johnny Homer et Ryan Lobo. « Multimodal Analog Front End for Wearable Bio-Sensors ». IEEE Sensors Journal 16, no 24 (15 décembre 2016) : 8784–91. http://dx.doi.org/10.1109/jsen.2016.2564942.

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Heijhoff, K., K. Akiba, R. Ballabriga, M. van Beuzekom, M. Campbell, A. P. Colijn, M. Fransen, R. Geertsema, V. Gromov et X. Llopart Cudie. « Timing performance of the Timepix4 front-end ». Journal of Instrumentation 17, no 07 (1 juillet 2022) : P07006. http://dx.doi.org/10.1088/1748-0221/17/07/p07006.

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Abstract A characterisation of the Timepix4 pixel front-end with a strong focus on timing performance is presented. Externally generated test pulses were used to probe the per-pixel time-to-digital converter (TDC) and measure the time-bin sizes by precisely controlling the test-pulse arrival time in steps of 10 ps. The results indicate that the TDC can achieve a time resolution of 60 ps, provided that a calibration is performed to compensate for frequency variation in the voltage controlled oscillators of the pixel TDCs. The internal clock distribution system of Timepix4 was used to control the arrival time of internally generated analog test pulses in steps of about 20 ps. The analog test pulse mechanism injects a controlled amount of charge directly into the analog front-end (AFE) of the pixel, and was used to measure the time resolution as a function of signal charge, independently of the TDC. It was shown that for the default configuration, the AFE time resolution in the hole-collecting mode is limited to 105 ps. However, this can be improved up to about 60 ps by increasing the preamplifier bias-current at the cost of increased power dissipation. For the electron-collecting mode, an AFE time resolution of 47 ps was measured for a bare Timepix4 device at a signal charge of 21 ke. It was observed that additional input capacitance from a bonded sensor reduces this figure to 62 ps.
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Wang, Ying Zhi, Jia Yang et Tai Lin Han. « Design of a Pulse Oximeter Based on STM32 Microcontroller ». Applied Mechanics and Materials 713-715 (janvier 2015) : 1261–64. http://dx.doi.org/10.4028/www.scientific.net/amm.713-715.1261.

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It uses STM32F103C8T6 microcontroller as the core processor and AFE4400 integrated analog front-end as the signal conditioning section.OLED12864 displays the measurement results. Dedicated pulse oximeter analog front-end chip simplifies the system and improves the measurement accuracy.
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Bocharov, Y. I., et V. A. Butuzov. « Multichannel analog front-end and analog-to-digital converter ICs for silicon photomultipliers ». IOP Conference Series : Materials Science and Engineering 151 (octobre 2016) : 012006. http://dx.doi.org/10.1088/1757-899x/151/1/012006.

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Lim, Shin-Il. « Analog Front-End Circuit Design for Bio-Potential Measurement ». Journal of the Institute of Electronics Engineers of Korea 50, no 11 (25 novembre 2013) : 130–37. http://dx.doi.org/10.5573/ieek.2013.50.11.130.

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Bae, Seung Yong, Jong Do Lee, Eun Ju Choe et Gil Cho Ahn. « Low Distortion Analog Front-End for Digital Electret Microphone ». Applied Mechanics and Materials 475-476 (décembre 2013) : 1633–37. http://dx.doi.org/10.4028/www.scientific.net/amm.475-476.1633.

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This paper presents a low distortion analog front-end (AFE) circuit to process electret microphone output signal. A source follower is employed for the input buffer to interface electret microphone directly to the IC with level shifting. A single-ended to differential converter with output common-mode control is presented to compensate the common-mode variation resulted from gate to source voltage variation in the source follower. A replica stage is adopted to control the output bias voltage of the single-ended to differential converter. The prototype AFE circuit fabricated in a 0.35μm CMOS technology achieves 68.2dB peak SNDR and 79.9dB SFDR over an audio signal bandwidth of 20kHz with 2.5V supply while consuming 1.05mW.
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FUJIMORI, Tsukasa. « Low-power Analog-front-end Circuits for Sensor Networks ». Journal of The Institute of Electrical Engineers of Japan 133, no 4 (2013) : 218–21. http://dx.doi.org/10.1541/ieejjournal.133.218.

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López, Alberto, Francisco Ferrero, José Ramón Villar et Octavian Postolache. « High-Performance Analog Front-End (AFE) for EOG Systems ». Electronics 9, no 6 (11 juin 2020) : 970. http://dx.doi.org/10.3390/electronics9060970.

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Electrooculography is a technique for measuring the corneo-retinal standing potential of the human eye. The resulting signal is called the electrooculogram (EOG). The primary applications are in ophthalmological diagnosis and in recording eye movements to develop simple human–machine interfaces (HCI). The electronic circuits for EOG signal conditioning are well known in the field of electronic instrumentation; however, the specific characteristics of the EOG signal make a careful electronic design necessary. This work is devoted to presenting the most important issues related to the design of an EOG analog front-end (AFE). In this respect, it is essential to analyze the possible sources of noise, interference, and motion artifacts and how to minimize their effects. Considering these issues, the complete design of an AFE for EOG systems is reported in this work.
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Ohme, Bruce W., Mark R. Larson, Bhal Tulpule et Alireza Behbahani. « Characterization of Circuit Blocks for Configurable Analog-Front-End ». Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, HITEC (1 janvier 2014) : 000146–53. http://dx.doi.org/10.4071/hitec-wa13.

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Analog functions have been implemented in a Silicon-on-Insulator (SOI) process optimized for high-temperature (>225°C) operation. These include a linear regulator/reference block that supports input voltages up to 50V and provides multiple independent voltage outputs. Additional blocks provide configurable sensor excitation levels of up to 10V DC and/or 20V AC-differential, with current limiting and monitoring. A dual-channel Programmable-Gain-Instrumentation Amplifier (PGIA) and a high-level AC input block with programmable gain and offset serve signal conditioning, gain, and scaling needs. A multiplexer and analog buffer provide an output that is scaled and centered for down-stream A-to-D conversion. Limited component availability and high component counts deter development of sensing and control electronics for extreme temperature (>200°) applications. Systems require front-end power conditioning, sensor excitation and monitoring, response amplification, scaling, and multiplexing. Back-end Analog-to-Digital conversion and digital processing/control can be implemented using one or two integrated circuit chips, whereas the front-end functions require component counts in the dozens. The low level of integration in the available portfolio of SOI devices results in high component count when constructing signal conditioning interfaces for aerospace sensors. These include quasi-DC sensors such as thermo-couples, strain-gauges, bridge transducers as well as AC-coupled sensors and position transducers, such as Linear Variable Differential Transducers (LVDT's). Furthermore, a majority of sensor applications are best served by excitation/response voltage ranges that typically exceed the voltage range of digital electronics (either 5V or 3.3V in currently available digital IC's for use above 200°C). These constraints led Embedded Systems LLC to design a generic device which was implemented by Honeywell as an analog ASIC (Application Specific Integrated Circuit). This paper will describe the ASIC block-level capabilities in the context of the typical applications and present characterization data from wafer-level testing at the target temperature range (225C). This material is based upon work performed by Honeywell International under a subcontract from Embedded Systems LLC, funding for which was provided by the U.S. Air Force Small Business Innovative Research program.
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Huang, Wen Tzeng, Chao Nan Hung, Yao Ming Yu, Qing Han Wu et Chiu Ching Tuan. « Exquisite Design of a CCD Analog Front End Module ». Applied Mechanics and Materials 300-301 (février 2013) : 414–18. http://dx.doi.org/10.4028/www.scientific.net/amm.300-301.414.

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One of the key technologies for high-resolution camera is the analog front end (AFE) design, which is between the lens and image system process (ISP). The 2 major evaluations of AFE are to evaluate the noise and the ratio between the RGB pixels. Hence, based on the charge coupled device (CCD) image sensor, we present our proposed AFE design to evaluate the CCD noise of the output image with a lower dark current. Our proposed AFE board design is to employee the 1080p (1920×1080) CCD image sensor and its corresponding timing controller with the digital-analog converter (ADC). Our results indicate that our design has the high performance among 6 different digital brands in the low noise applications. Moreover, the CCD sensors with the different resolutions can be installed within the same socket of our AFE board, which can also simultaneously support 3 types, Bayer, Truesense, and Black/White, color filter array.
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Gangopadhyay, Daibashish, Emily G. Allstot, Anna M. R. Dixon, Karthik Natarajan, Subhanshu Gupta et David J. Allstot. « Compressed Sensing Analog Front-End for Bio-Sensor Applications ». IEEE Journal of Solid-State Circuits 49, no 2 (février 2014) : 426–38. http://dx.doi.org/10.1109/jssc.2013.2284673.

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Sriskaran, V., J. Alozy, R. Ballabriga, M. Campbell, N. Egidos, J. M. Fernandez-Tenllado, E. Heijne et al. « New architecture for the analog front-end of Medipix4 ». Nuclear Instruments and Methods in Physics Research Section A : Accelerators, Spectrometers, Detectors and Associated Equipment 978 (octobre 2020) : 164412. http://dx.doi.org/10.1016/j.nima.2020.164412.

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Castello, R., L. Tomasini, S. Pernici, F. Salerno, M. Mazzucco et M. Ferro. « Analog front end of an ECBM transceiver for ISDN ». IEEE Journal of Solid-State Circuits 25, no 6 (1990) : 1575–85. http://dx.doi.org/10.1109/4.62194.

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Corsi, F., M. Foresta, C. Marzocca, G. Matarrese et A. Del Guerra. « CMOS analog front-end channel for silicon photo-multipliers ». Nuclear Instruments and Methods in Physics Research Section A : Accelerators, Spectrometers, Detectors and Associated Equipment 617, no 1-3 (mai 2010) : 319–20. http://dx.doi.org/10.1016/j.nima.2009.09.037.

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Ma, Cong, Lei Zhao, Yu-Xiang Guo, Jian-Feng Liu, Shu-Bin Liu et Qi An. « Analog front-end prototype electronics for the LHAASO WCDA ». Chinese Physics C 40, no 1 (janvier 2016) : 016101. http://dx.doi.org/10.1088/1674-1137/40/1/016101.

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Yuh-Shyan Hwang et Ho-Cheng Lin. « A New CMOS Analog Front End for RFID Tags ». IEEE Transactions on Industrial Electronics 56, no 7 (juillet 2009) : 2299–307. http://dx.doi.org/10.1109/tie.2008.2011348.

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Ansari, Mohd Samar. « Analog front-end design for biomedical signal acquisition systems ». CSI Transactions on ICT 7, no 3 (24 mai 2019) : 199–204. http://dx.doi.org/10.1007/s40012-019-00232-z.

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Spieler, Helmuth. « Analog front-end electronics for the SDC Silicon Tracker ». Nuclear Instruments and Methods in Physics Research Section A : Accelerators, Spectrometers, Detectors and Associated Equipment 342, no 1 (mars 1994) : 205–13. http://dx.doi.org/10.1016/0168-9002(94)91430-3.

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Anisimov, Aleksei A., Alexander V. Belov, Timofei V. Sergeev, Elizaveta E. Sannikova et Oleg A. Markelov. « Evolution of Bioamplifiers : From Vacuum Tubes to Highly Integrated Analog Front-Ends ». Electronics 11, no 15 (1 août 2022) : 2402. http://dx.doi.org/10.3390/electronics11152402.

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The past century has seen the ongoing development of amplifiers for different electrophysiological signals to study the work of the heart. Since the vacuum tube era, engineers and designers of bioamplifiers for recording electrophysiological signals have been trying to achieve similar objectives: increasing the input impedance and common-mode rejection ratio, as well as reducing power consumption and the size of the bioamplifier. This review traces the evolution of bioamplifiers, starting from circuits on vacuum tubes and discrete transistors through circuits on operational and instrumental amplifiers, and to combined analog-digital solutions on analog front-end integrated circuits. Examples of circuits and their technical features are provided for each stage of the bioamplifier development. Special emphasis is placed on the review of modern analog front-end solutions for biopotential registration, including their generalized structural diagram and table of comparative characteristics. A detailed review of analog front-end circuit integration in various practical applications is provided, with examples of the latest achievements in the field of electrocardiogram, electroencephalogram, and electromyogram registration. The review concludes with key points and insights for the future development of the analog front-end concept applied to bioelectric signal registration.
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Baschirotto, A., F. Campi, R. Castello, G. Cesura, R. Guerrieri, L. Lavagno, A. Lodi, P. Malcovati et M. Toma. « Baseband analog front-end and digital back-end for reconfigurable multi-standard terminals ». IEEE Circuits and Systems Magazine 6, no 1 (2006) : 8–28. http://dx.doi.org/10.1109/mcas.2006.1607635.

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Dell'ova, F., B. Bonhoure et F. Paillardet. « Embeddable CMOS 3.3 V analog front end for CD applications ». IEEE Transactions on Consumer Electronics 41, no 3 (1995) : 821–26. http://dx.doi.org/10.1109/30.468078.

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Rao, Arun, Yueh-Ching Teng, Chris Schaef, Ethan K. Murphy, Saaid Arshad, Ryan J. Halter et Kofi Odame. « An Analog Front End ASIC for Cardiac Electrical Impedance Tomography ». IEEE Transactions on Biomedical Circuits and Systems 12, no 4 (août 2018) : 729–38. http://dx.doi.org/10.1109/tbcas.2018.2834412.

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Zheng, Jiawei, Wing-Hung Ki et Chi-Ying Tsui. « A Fully Integrated Analog Front End for Biopotential Signal Sensing ». IEEE Transactions on Circuits and Systems I : Regular Papers 65, no 11 (novembre 2018) : 3800–3809. http://dx.doi.org/10.1109/tcsi.2018.2854741.

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Kishishita, T., S. Sumomozawa, T. Kosaka, T. Igarashi, K. Sakashita, M. Shoji, M. M. Tanaka et al. « LTARS : analog readout front-end ASIC for versatile TPC-applications ». Journal of Instrumentation 15, no 09 (25 septembre 2020) : T09009. http://dx.doi.org/10.1088/1748-0221/15/09/t09009.

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Opris, I. E., et S. Watanabe. « A fast analog front-end processor for digital imaging systems ». IEEE Micro 21, no 2 (2001) : 48–54. http://dx.doi.org/10.1109/40.918002.

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Baschirotto, A., M. Cassis, P. Kirchlechner, F. Montecchi, G. Palmisano et D. Rossi. « An analog BiCMOS integrated circuit for front-end RDS decoder ». IEEE Transactions on Consumer Electronics 37, no 3 (1991) : 585–91. http://dx.doi.org/10.1109/30.85571.

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Fabiano, Ivan, Marco Sosio, Antonio Liscidini et Rinaldo Castello. « SAW-Less Analog Front-End Receivers for TDD and FDD ». IEEE Journal of Solid-State Circuits 48, no 12 (décembre 2013) : 3067–79. http://dx.doi.org/10.1109/jssc.2013.2271859.

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Deligoz, Ilker, Syed R. Naqvi, Tino Copani, Sayfe Kiaei, Bertan Bakkaloglu, Sang-Soo Je et Junseok Chae. « A MEMS-Based Power-Scalable Hearing Aid Analog Front End ». IEEE Transactions on Biomedical Circuits and Systems 5, no 3 (juin 2011) : 201–13. http://dx.doi.org/10.1109/tbcas.2010.2079329.

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