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Articles de revues sur le sujet "TCAD ANALYSIS"
Wang, Ke, Haodong Jiang, Yiming Liao, Yue Xu, Feng Yan et Xiaoli Ji. « Degradation Prediction of GaN HEMTs under Hot-Electron Stress Based on ML-TCAD Approach ». Electronics 11, no 21 (2 novembre 2022) : 3582. http://dx.doi.org/10.3390/electronics11213582.
Texte intégralPan, Zijin, Cheng Li, Mengfu Di, Feilong Zhang et Albert Wang. « 3D TCAD Analysis Enabling ESD Layout Design Optimization ». IEEE Journal of the Electron Devices Society 8 (2020) : 1289–96. http://dx.doi.org/10.1109/jeds.2020.3027034.
Texte intégralGupta, Vaibhav. « Performance Analysis of TFET and VDSTFET for Low Power Application using the Work Function Engineering ». International Journal for Research in Applied Science and Engineering Technology 9, no VI (25 juin 2021) : 2722–27. http://dx.doi.org/10.22214/ijraset.2021.35534.
Texte intégralKim, Won-Young, Gee Young Suh, Jin Won Huh, Sung-Han Kim, Min-ju Kim, Yun Seong Kim, Hye-Ryoun Kim et al. « Triple-Combination Antiviral Drug for Pandemic H1N1 Influenza Virus Infection in Critically Ill Patients on Mechanical Ventilation ». Antimicrobial Agents and Chemotherapy 55, no 12 (3 octobre 2011) : 5703–9. http://dx.doi.org/10.1128/aac.05529-11.
Texte intégralPasseri, D., M. Baroncini, P. Ciampolini, G. M. Bilei, A. Santocchia, B. Checcucci et E. Fiandrini. « TCAD-based analysis of radiation-hardness in silicon detectors ». IEEE Transactions on Nuclear Science 45, no 3 (juin 1998) : 602–8. http://dx.doi.org/10.1109/23.682456.
Texte intégralScheinemann, Artur, et Andreas Schenk. « TCAD-based DLTS simulation for analysis of extended defects ». physica status solidi (a) 211, no 1 (janvier 2014) : 136–42. http://dx.doi.org/10.1002/pssa.201300233.
Texte intégralLi, Fuxing, Changchun Chai, Yuqian Liu, Yanxing Song, Lei Wang et Yintang Yang. « Study on ESD Protection Circuit by TCAD Simulation and TLP Experiment ». Micromachines 14, no 3 (4 mars 2023) : 600. http://dx.doi.org/10.3390/mi14030600.
Texte intégralHajj, Ibrahim N. « Extended Nodal Analysis ». IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 31, no 1 (janvier 2012) : 89–100. http://dx.doi.org/10.1109/tcad.2011.2167330.
Texte intégralJongyoon Jung et Taewhan Kim. « Variation-Aware False Path Analysis Based on Statistical Dynamic Timing Analysis ». IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 31, no 11 (novembre 2012) : 1684–97. http://dx.doi.org/10.1109/tcad.2012.2202392.
Texte intégralVytyaz, Igor, David C. Lee, Pavan Kumar Hanumolu, Un-Ku Moon et Kartikeya Mayaram. « Sensitivity Analysis for Oscillators ». IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 27, no 9 (septembre 2008) : 1521–34. http://dx.doi.org/10.1109/tcad.2008.927731.
Texte intégralThèses sur le sujet "TCAD ANALYSIS"
Bäcker, Alexandra. « A TCAD analysis of long-wavelength vertical-cavity surface-emitting lasers ». Konstanz Hartung-Gorre, 2009. http://d-nb.info/995591296/04.
Texte intégralBrunton, Jason A. « TCAD analysis of heating and maximum current density in carbon nanofiber interconnects ». Thesis, Monterey, California. Naval Postgraduate School, 2011. http://hdl.handle.net/10945/5495.
Texte intégralAs devices shrink, the current density through interconnects increases proportionally making new materials a necessity for industry growth. Carbon nanofiber (CNF) and carbon nanotube's (CNT) potential for high current density make them a possible replacement for metal contacts. Learning the limitations of CNFs and CNTs is important if they are to be used in next-generation electronics. As current density increases, heat is generated throughout the CNF structure. This heating eventually leads to breakdown as the temperature reaches the bonding energy of the Carbon-Carbon (C-C) bond, the bond between two carbon atoms. The resultant reaction is the vaporization of the carbon, eliminating electromigration problems common with metal interconnects. The physics of breakdown of CNFs is poorly understood. The CNF interconnects' heating under a voltage sweep between two electrodes is modeled in this thesis. A working model was created with Silvaco ATLAS using experimental data provided by Santa Clara University (SCU). An analytical solution was found for the heat generation occurring within the device. The simulation does not show the breakdown occurring; instead, it accurately predicts the temperature and electrical characteristics of the device. This model will aid in the analysis of CNFs' reliability and potential future integration into the next generation electronics.
Mazzoli, Andrea. « TCAD analysis of hot-carrier-stress degradation in p-channel LDMOS power devices ». Master's thesis, Alma Mater Studiorum - Università di Bologna, 2021.
Trouver le texte intégralCouso, Fontanillo Carlos. « Analysis of impact of nanoscale defects on variability in mos structures ». Doctoral thesis, Universitat Autònoma de Barcelona, 2018. http://hdl.handle.net/10803/650408.
Texte intégralOver the last years, the information and its analysis have become in the corner stone of growth of our society allowing the sharing economy, globalization of products and knowledge, block-chain technology etc. Huge companies such as: Amazon, Facebook, Google... which were aware of the potential of these resources, are developing vast infrastructures in order to extract as much information as possible about our environment (Internet of Things) or ourselves (social media, smart-phones...), process this information (Big Data Centers) and transmit it quickly all over the world. However, this challenge requires electronic devices with higher performance and low power consumption, which cannot be developed using the conventional scaling techniques because the dimensions of devices have reached the atomic range. In this range of dimensions, the impact of the discrete of matter and charge increases inevitably the variability of devices. Among different variability sources, Interface traps (IT), Random Dopant Distributions (RDD), Line Edge Roughness (LER) and Poly Gate Granularity (PGG) have been identified as the most prominent ones. Consequently, the scientific community is exploring new solutions such as, alternative device materials and/or structures, in order to overcome the different issues owing to the scaling. In this context, this thesis, which is structure in 7 chapters, will try to contribute to solve this problem, analyzing the impact of interface traps and defects on device variability. In order to introduce to the reader, in chapter 1 the charge transport theory through a semiconductor and metal junction (Schottky contact) and the Metal-Oxide-Semiconductor Field Effect Transistor (MOSFET) device are explained. Besides, the concept of variability and different sources of variability are also presented. In the second chapter, advanced characterization techniques, such as, Conductive Atomic Force Microscopy (CAFM) and Kelvin Prove Force Microscopy (KPFM) used to obtain nanoscale information are described in detail. After that, the TCAD device simulator called ATLAS is explained. Here, the models and their limitations to simulate the electronic devices are discussed. Third chapter is devoted to describe the impact of threading dislocation (TD) defects on the conduction through a schottky contact formed by a III-V semiconductor material (InGaAs) and a metal. Here, different conduction mechanisms, Poole Frenkel (PF) and Thermionic Emission (TE), have been associated to the conduction through areas with TD and without TD, respectively, proving that III-V materials with high density of TD showing higher leakage current. In chapter four, the development of a simulator called (NAnoscale MAp Simulator (NAMAS)) to generate automatically topography and density charge maps from inputs obtained from CAFM measurements (topography and current maps) of a given sample is explained. From the generated maps, the impact of the oxide thickness and the charge density fluctuations on MOSFET variability is studied. In chapter five, the impact of interface traps in the gate oxide on device variability is analyzed. Firstly, the impact of interface discrete fixed charges on 65 nm technology MOSFET devices with different dimensions is studied (time-zero variability), where a deviation of Pelgrom's law is proved by experimental and TCAD simulation data. Next, the dynamic behavior of traps is analyzed by TCAD transient simulation in order to estimate their physical parameters of traps from empiric parameters. Chapter six is devoted to study the performance and power consumption trade-off in Ultra-thin Body and Buried Oxide Fully Depleted Silicon on Insulator (UTBB FDSOI) MOSFET when it is operated in near-threshold voltage. Besides, the impact of traps in gate oxide / channel and in buried oxide / channel interfaces on the performance and power consumption of device is also analyzed. Finally, the more relevant conclusions are highlighted.
Ramirez-garcia, Eloy. « Analyse expérimentale et modélisation du bruit haute fréquence des transistors bipolaires à hétérojonctions SiGe et InGaAs/InP pour les applications très hautes fréquences ». Thesis, Paris 11, 2011. http://www.theses.fr/2011PA112082/document.
Texte intégralIn order to fulfil the roadmap for the development of telecommunication and information technologies (TIC), low noise level and very fast semiconductor devices are required. Heterojunction bipolar transistor has demonstrated excellent high frequency performances and becomes a candidate to address TIC roadmap. This work deals with experimental analysis and high frequency noise modelling of Si/SiGe:C HBT (STMicroelectronics tech.) and InP/InGaAs HBT (III-V Lab Alcatel-Thales).Chapter I introduces the basic concepts of HBTs operation and the characterization at high-frequency. This chapter summarizes the high frequency performances of many state-of-the-art HBT technologies. The first part of chapter II describes the two HBT sets, with paying attention on the impact of the base composition (SiGe:C) or the lateral reduction of the device (InGaAs) on static and dynamic performances. Based on TCAD modelling, the second part shows that a 15-25% germanium composition profile in the base is able to reach highest dynamic performances. Chapter III summarizes the static and dynamic results at low temperature, giving a separation of the intrinsic transit times and charging times involved into the performance limitation. Chapter IV presents noise measurements and the derivation of high frequency noise analytical models. These models highlight the impact of the current crowding and the self-heating effects, and the influence of the base-emitter heterojunction on the high frequency noise. According to these models the high frequency noise performances are estimated at low temperature for both HBT technologies
El, Boubkari Kamal. « Impact de la modélisation physique bidimensionnelle multicellulaire du composant semi-conducteur de puissance sur l'évaluation de la fiabilité des assemblages appliqués au véhicule propre ». Phd thesis, Université Sciences et Technologies - Bordeaux I, 2013. http://tel.archives-ouvertes.fr/tel-00856596.
Texte intégralBaccar, El Boubkari Fedia. « Évaluation des mécanismes de défaillance et de la fiabilité d’une nouvelle terminaison haute tension : approche expérimentale et modélisation associée ». Thesis, Bordeaux, 2015. http://www.theses.fr/2015BORD0266/document.
Texte intégralThis work is a part of the research project SUPERSWITCH in which alternatives solutions to the IGBT, are investigated. This solution was used IGBT in power converters in the 600-1200 V breakdown voltage range. The new MOSFET structures based on the super-junction, such as the DT-SJMOSFET and its "Deep Trench Termination", is proposed as an alternative to IGBT. In this context, this thesis focuses on the robustness characterization of the DT2 termination adapted to a planar diode. After a state of the art on unidirectional voltage power components, the power components termination, and power modules reliability, a test vehicle has been designed in order to carry out different accelerated ageing tests and electrical monitoring. The reliability of DT2 termination was evaluated by experimental tests and numerical simulations. An innovative modeling methodology has been proposed. Finally, new structures have been proposed to limit the delamination failure mechanisms and interface charges problems highlighted in this thesis
Tang, Jun. « Causal models for analysis of TCAS-induced collisions ». Doctoral thesis, Universitat Autònoma de Barcelona, 2015. http://hdl.handle.net/10803/309134.
Texte intégralUna serie de colisiones en el aire que ocurrieron durante un período de unos 30 años (1956-1986) fueron uno de los principales motivos por los que la Administración Federal de Aviación (FAA) tomó la decisión de desarrollar e implementar un sistema de prevención de colisiones eficaz que actuara como último recurso, cuando se produjese un fallo del servicio de separación de aeronaves por parte del controlador de tránsito aéreo (ATC). El Sistema de Alerta de Tráfico y Anticolisión (TCAS) fue desarrollado para este objetivo a partir de un análisis completo de datos de vuelo. Como resultado La influencia de TCAS en la seguridad del vuelo ha sido eficaz, beneficiosa y significativa en la reducción de la probabilidad de colisiones. Los proyectos Single European Sky ATM Research (SESAR) y Next Generation Air Transportation System (NextGen) pretenden mejorar la eficiencia en la gestión del tráfico aéreo (ATM) al mismo tiempo que se pretende reducir la actual capacidad latente en el lado aire mediante la incorporación de nuevas tecnologías y procedimientos,. En consecuencia, va a ser necesario investigar el impacto en seguridad al aumentar la capacidad del espacio aéreo mediante un análisis exhaustivo y una evaluación efectiva del vuelo. En esta tesis, se proponen varios modelos causales de encuentro entre aeronaves para mejorar el rendimiento del TCAS teniendo en cuenta el potencial efecto sobre el tráfico colindante, considerando escenarios futuros con un número elevado de trayectorias. Los diferentes modelos han sido especificados como sistemas a eventos discretos mediante el formalismo de Redes de Petri Coloreadas. Mediante el análisis del espacio de estado de un volumen de espacio aéreo con varias aeronaves, los modelos desarrollados evalúan los efectos de los distintos RAs generados por TCAS sobre el tráfico colindante. Los modelos han sido validados utilizando InCAS y ofrecen una perspectiva global de las dinámicas que se generan, y una mejor comprensión de las potenciales colisiones inducidas para una mejor valoración del riesgo de colisión. Como resultado, los escenarios con tráfico colindante que podrían iniciar colisiones inducidas han sido identificados y caracterizados. El análisis cuantitativo del factor de riesgo de colisiones inducidas por TCAS ha sido realizado para evaluar el impacto de la demora del piloto para responder a los avisos TCAS durante el vuelo en escenarios de alta densidad. Mediante el uso de modelos estocásticos para representar la respuesta del piloto se han analizado los diferentes estados alcanzables con el objetivo de generar resoluciones cooperativas. En consecuencia, el rendimiento de TCAS se podría mejorar de forma innovadora sin necesidad de introducir cambios relevantes en la lógica. Los modelos de encuentros causales propuestos pueden ser utilizados como herramientas auxiliares en el análisis de escenarios de tráfico denso, y aumentar la capacidad del espacio aéreo, gestionando de manera eficiente y segura un mayor número de vuelos. El presente trabajo contribuye a continuar las investigaciones en el análisis de la seguridad de los conceptos ATM actuales y avanzados, incluyendo las futuras extensiones de TCAS.
Billingsley, Thomas B. (Thomas Boyd). « Safety analysis of TCAS on Global Hawk using airspace encounter models ». Thesis, Massachusetts Institute of Technology, 2006. http://hdl.handle.net/1721.1/35294.
Texte intégralThis electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections.
Includes bibliographical references (p. 66).
The U.S. Air Force's RQ-4 Global Hawk unmanned aerial vehicle (UAV) is a high altitude, long endurance aircraft used for surveillance and reconnaissance. Because of the potential for close proximity to manned aircraft in civil airspace, collision avoidance is a major concern, and the Air Force is seeking to equip Global Hawk with the Traffic Alert and Collision Avoidance System (TCAS) to reduce the probability of mid-air collision. Currently, Global Hawk is equipped with a Mode S transponder and uses chase aircraft, ground observers and/or ground radar contact to comply with the collision avoidance requirement. In order to evaluate TCAS effectiveness, a fast-time simulation tool has been developed at MIT Lincoln Laboratory that computes the mean probability of a near mid-air collision for a large number of close encounters between two aircraft. Airspace encounter models enable sets of encounters to be simulated that are statistically representative of the aircraft encounters that actually occur in the airspace. The TCAS logic is implemented in the simulation tool and the aircraft responses during the encounters, with and without TCAS, are simulated in parallel.
(cont.) By observing measured vertical miss distance at the closest point of approach between the two aircraft, it is possible to quantify the reduction in collision risk provided by TCAS, termed the risk ratio. Global Hawk's flight characteristics differ from a conventional aircraft. Its mission profile through civil airspace includes slow, steep climbs and descents, and shallower turns than a conventional aircraft. Its vertical acceleration and climb rate limits can hinder its response to a TCAS resolution advisory (RA). Communication latency also may occur. For this thesis, encounter models were developed that reflect Global Hawk's flight characteristics. The new encounter models were then implemented in the simulation tool, and millions of encounters between Global Hawk and a conventional aircraft were simulated. These encounters were compared against encounters between two conventional aircraft to observe how Global Hawk's flight characteristics changed the effectiveness of TCAS. Assuming a standard pilot response to TCAS RAs, TCAS provided a significant safety improvement to Global Hawk over a Mode S transponder alone, yielding risk ratios in the range of 0.003 to 0.079.
(cont.) Global Hawk's flight characteristics generally caused a decrease in TCAS effectiveness from the original encounter models. Encounters were also simulated where Global Hawk's response to TCAS RAs was delayed by increasing amounts to simulate communication latency. A delay of approximately 15 seconds was tolerable before TCAS provided less safety than a Mode S transponder alone.
by Thomas B. Billingsley.
S.M.
Williams, Thomas C. R. « Metabolic Flux Analysis of the TCA Cycle in Arabidopsis ». Thesis, University of Oxford, 2009. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.515020.
Texte intégralLivres sur le sujet "TCAD ANALYSIS"
Bäcker, Alexandra. A TCAD analysis of long-wavelength vertical-cavity surface-emitting lasers. Konstanz : Hartung-Gorre, 2009.
Trouver le texte intégralG, Rojas R., Burnside Walter Dennis 1942- et United States. National Aeronautics and Space Administration., dir. Modelling and performance analysis of four and eight element TCAS. Columbus, Ohio : Ohio State University, Electroscience Laboratory, 1990.
Trouver le texte intégralMassa, Solekaye, dir. Dictionnaire démé (Tchad) : Precédé de notes grammaticales. Louvain : Peeters, 2006.
Trouver le texte intégralDictionnaire démé (Tchad) : Précédé de notes grammaticales. Louvain : Peeters, 2006.
Trouver le texte intégralLitvin, F. L. Topology of modified helical gears and tooth contact analysis (TCA) program. Cleveland, Ohio : Lewis Research Center, 1989.
Trouver le texte intégralLitvin, F. L. Topology of modified helical gear and tooth contact analysis (TCA) program. [Washington, DC] : National Aeronautics and Space Administration, Office of Management, Scientific and Technical Information Division, 1989.
Trouver le texte intégralLitvin, F. L. Spur gears : Optimal geometry, methods for generation and tooth contact analysis (TCA) program. [Washington, DC] : National Aeronautics and Space Administration, Scientific and Technical Information Division, 1988.
Trouver le texte intégralLaFleur, Lawrence E. NCASI procedures for the preparation and isomer specific analysis of pulp and paper industry samples for 2,3,7,8-TCDD and 2,3,7,8-TCDF. New York, N.Y : National Council of the Paper Industry for Air and Stream Improvement, 1989.
Trouver le texte intégralEnvironmental Monitoring Systems Laboratory (Research Triangle Park, N.C.), dir. National dioxin study : Analytical procedures and quality assurance plan for the analysis of 2,3,7,8-TCDD in tier 3-7 samples of the U.S. Environmental Protection Agency national dioxin strategy. Research Triangle Park, NC : Environmental Monitoring Systems Laboratory, U.S. Environmental Protection Agency, 1986.
Trouver le texte intégralNational Aeronautics and Space Administration (NASA) Staff. Modelling and Performance Analysis of Four and Eight Element Tcas. Independently Published, 2018.
Trouver le texte intégralChapitres de livres sur le sujet "TCAD ANALYSIS"
Shigyo, Naoyuki. « Statistical Analysis of VLSI Using TCAD ». Dans Simulation of Semiconductor Processes and Devices 2001, 202–9. Vienna : Springer Vienna, 2001. http://dx.doi.org/10.1007/978-3-7091-6244-6_44.
Texte intégralCatoggio, E., S. Donati Guerrieri et F. Bonani. « Multibias TCAD Analysis of Trap Dynamics in GaN HEMTs ». Dans Lecture Notes in Electrical Engineering, 102–9. Cham : Springer Nature Switzerland, 2023. http://dx.doi.org/10.1007/978-3-031-48711-8_12.
Texte intégralKhiangte, Lalthanpuii, Kuleen Kumar et Rudra Sankar Dhar. « TCAD Modeling and Analysis of sub-30nm Strained Channel MOSFET ». Dans International Conference on Intelligent Computing and Smart Communication 2019, 1383–88. Singapore : Springer Singapore, 2019. http://dx.doi.org/10.1007/978-981-15-0633-8_135.
Texte intégralGehring, A., C. Heitzinger, T. Grasser et S. Selberherr. « TCAD Analysis of Gain Cell Retention Time for SRAM Applications ». Dans Simulation of Semiconductor Processes and Devices 2001, 416–19. Vienna : Springer Vienna, 2001. http://dx.doi.org/10.1007/978-3-7091-6244-6_96.
Texte intégralBiswas, Kalyan, Rachita Ghoshhajra et Angsuman Sarkar. « High Electron Mobility Transistor : Physics-Based TCAD Simulation and Performance Analysis ». Dans HEMT Technology and Applications, 155–79. Singapore : Springer Nature Singapore, 2022. http://dx.doi.org/10.1007/978-981-19-2165-0_12.
Texte intégralKumashiro, S., H. Kawaguchi, K. Imai et H. Matsumoto. « Analysis of the asymmetric breakdown characteristics of trench isolation structure by using TCAD ». Dans Simulation of Semiconductor Processes and Devices 1998, 259–62. Vienna : Springer Vienna, 1998. http://dx.doi.org/10.1007/978-3-7091-6827-1_65.
Texte intégralGrace, Jessy, Sphoorthy Bhushan, Chinnam S. V. Maruthi Rao et Ameet Chavan. « 16 nm FinFET Based Radiation Hardened Standard Cell Library Analysis Using Visual TCAD Tool ». Dans Advances in Robotics, Automation and Data Analytics, 206–13. Cham : Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-70917-4_20.
Texte intégralYadav, Nisha, Sunil Jadav et Gaurav Saini. « Simulation and Analysis of Gate Stack DG MOSFET with Application of High-k Dielectric Using Visual TCAD ». Dans High-k Materials in Multi-Gate FET Devices, 105–30. Boca Raton : CRC Press, 2021. http://dx.doi.org/10.1201/9781003121589-7.
Texte intégralMalavena, Gerardo. « Modeling of GIDL–Assisted Erase in 3–D NAND Flash Memory Arrays and Its Employment in NOR Flash–Based Spiking Neural Networks ». Dans Special Topics in Information Technology, 43–53. Cham : Springer International Publishing, 2022. http://dx.doi.org/10.1007/978-3-030-85918-3_4.
Texte intégralSrivastava, Ajay Kumar. « Analysis and TCAD Simulation for C/V, and G/V Electrical Characteristics of Gated Controlled Diodes for the AGIPD of the EuXFEL ». Dans Si Detectors and Characterization for HEP and Photon Science Experiment, 135–48. Cham : Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-19531-1_10.
Texte intégralActes de conférences sur le sujet "TCAD ANALYSIS"
Ceric, H., R. L. de Orio, J. Cervenka et S. Selberherr. « TCAD solutions for submicron copper interconnect ». Dans 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IEEE, 2008. http://dx.doi.org/10.1109/ipfa.2008.4588158.
Texte intégralCho, Jin, Frank Geelhaar, Uzma Rana, Laks Vanamurthy, Ryan Sporer et Francis Benistant. « TCAD analysis of SiGe channel FinFET devices ». Dans 2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD). IEEE, 2017. http://dx.doi.org/10.23919/sispad.2017.8085338.
Texte intégralPetrosyants, Konstantin. « INTRODUCTION INTO TCAD AND SPICE MODELING OF SEMICONDUCTOR DEVICES AND IC COMPONENTS. » Dans International Forum “Microelectronics – 2020”. Joung Scientists Scholarship “Microelectronics – 2020”. XIII International conference «Silicon – 2020». XII young scientists scholarship for silicon nanostructures and devices physics, material science, process and analysis. LLC MAKS Press, 2020. http://dx.doi.org/10.29003/m1550.silicon-2020/35-40.
Texte intégralSponton, Luca, Flavio Carbognani, Dipu Pramanik et Wolfgang Fichtner. « TCAD Analysis for VLSI-Application-Oriented Process Optimization ». Dans 2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings. IEEE, 2006. http://dx.doi.org/10.1109/icsict.2006.306143.
Texte intégralCai, W. Z., B. Gogoi, R. Davies, D. Lutz, D. Rice, G. H. Loechelt et G. Grivna. « TCAD Analysis of a Vertical RF Power Transistor ». Dans 2009 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD). IEEE, 2009. http://dx.doi.org/10.1109/sispad.2009.5290204.
Texte intégralDiaz Reigosa, Paula, Francesco Iannuzzo et Munaf Rahimo. « TCAD analysis of short-circuit oscillations in IGBTs ». Dans 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD). IEEE, 2017. http://dx.doi.org/10.23919/ispsd.2017.7988933.
Texte intégralLim, Shang Yi, Joydeep Ghosh et Aaron Thean. « Innovative use of TCAD Process Simulation for Device Failure Analysis ». Dans 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA). IEEE, 2021. http://dx.doi.org/10.1109/ipfa53173.2021.9617254.
Texte intégralNavarro, Carlos, Santiago Navarro, Carlos Marquez et F. Gamiz. « TCAD Analysis of III-V capacitor-less A2RAM cells ». Dans 2019 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS). IEEE, 2019. http://dx.doi.org/10.1109/eurosoi-ulis45800.2019.9041874.
Texte intégralKuang, Yawei, Yushen Liu, Yulong Ma, Jing Xu, Xifeng Yang et Jinfu Feng. « TCAD analysis of graphene silicon Schottky junction solar cell ». Dans International Symposium on Photonics and Optics, sous la direction de Zhiping Zhou. SPIE, 2015. http://dx.doi.org/10.1117/12.2197678.
Texte intégralAxelrad, Valery, Victor V. Boksha, Yuri Granik, Ognjen Milic, Juan C. Rey, D. Ward et Eduard I. Tochitsky. « Analysis of microlithography in an open-architecture TCAD system ». Dans SPIE's 1994 Symposium on Microlithography, sous la direction de Timothy A. Brunner. SPIE, 1994. http://dx.doi.org/10.1117/12.175459.
Texte intégralRapports d'organisations sur le sujet "TCAD ANALYSIS"
Yoshimura, A. S. Thermodynamic Cycle Analysis Program (TCAP). Office of Scientific and Technical Information (OSTI), janvier 1997. http://dx.doi.org/10.2172/481552.
Texte intégralStreso, Katy, et Francesco Lagona. Hidden Markov random field and FRAME modelling for TCA-image analysis. Rostock : Max Planck Institute for Demographic Research, octobre 2005. http://dx.doi.org/10.4054/mpidr-wp-2005-032.
Texte intégralFigueredo, Luisa, Liliana Martinez et Joao Paulo Almeida. Current role of Endoscopic Endonasal Approach for Craniopharyngiomas. A 10-year Systematic review and Meta-Analysis Comparison with the Open Transcranial Approach. INPLASY - International Platform of Registered Systematic Review and Meta-analysis Protocols, janvier 2023. http://dx.doi.org/10.37766/inplasy2023.1.0045.
Texte intégral