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McCauley, James W., et Volker Weiss, dir. Materials Characterization for Systems Performance and Reliability. Boston, MA : Springer US, 1986. http://dx.doi.org/10.1007/978-1-4613-2119-4.
Texte intégralMaterial Characterization for Systems Performance and Reliability (Conference) (1984 Lake Luzerne, N.Y.). Materials characterization for systems performance and reliability. New York : Plenum, 1986.
Trouver le texte intégralSagamore Army Materials Research Conference (31st 1984 Lake Luzerne, N.Y.). Materials characterization for systems performance and reliability. New York : Plenum Press, 1986.
Trouver le texte intégralMcCauley, James W. Materials Characterization for Systems Performance and Reliability. Boston, MA : Springer US, 1986.
Trouver le texte intégralRajeshuni, Ramesham, Society of Photo-optical Instrumentation Engineers. et Semiconductor Equipment and Materials International., dir. Reliability, testing, and characterization of MEMS/MOEMS : 22-24 October 2001, San Francisco, USA. Bellingham, Wash : SPIE, 2001.
Trouver le texte intégralD, Todd M., U.S. Nuclear Regulatory Commission. Office of Nuclear Regulatory Research. Division of Engineering. et Oak Ridge National Laboratory, dir. A characterization of check valve degradation and failure experience in the nuclear power industry. Washington, DC : Division of Engineering, Office of Nuclear Regulatory Research, U.S. Nuclear Regulatory Commission, 1993.
Trouver le texte intégralL, Veteran Janice, dir. Silicon materials--processing, characterization and reliability : Symposium held April 1-5, 2002, San Francisco, California, U.S.A. Warrendale, PA : Materials Research Society, 2002.
Trouver le texte intégral1952-, Tanner Danelle Mary, Ramesham Rajeshuni et Society of Photo-optical Instrumentation Engineers., dir. Reliability, testing, and characterization of MEMS/MOEMS III : 26-28 January, 2004, San Jose, California, USA. Bellingham, Wash : SPIE, 2004.
Trouver le texte intégralHartzell, Allyson L. Reliability, packaging, testing, and characterization of MEMS/MOEMS VII : 21-22 January 2008, San Jose, California, USA. Bellingham, Wash : SPIE, 2008.
Trouver le texte intégral1952-, Tanner Danelle Mary, Ramesham Rajeshuni, Society of Photo-optical Instrumentation Engineers., Semiconductor Equipment and Materials International., Solid State Technology (Organization) et Sandia National Laboratories, dir. Reliability, packaging, testing, and characterization of MEMS/MOEMS IV : 24-25 January 2005, San Jose, California, USA. Bellingham, Wash : SPIE, 2005.
Trouver le texte intégralHacke, P. Characterization of multicrystalline silicon modules with system bias voltage applied in damp heat. Golden, CO] : National Renewable Energy Laboratory, 2011.
Trouver le texte intégralWorkshop on Model Uncertainty, Its Characterization and Quantification (1993 Annapolis, Maryland). Proceedings of Workshop on Model Uncertainty, Its Characterization and Quantification : Annapolis, Maryland, USA, October 20-22, 1993. College Park, MD, U.S.A : University Printing Services, University of Maryland, 1995.
Trouver le texte intégralname, No. Reliability, testing, and characterization of MEMS/MOEMS II : 27-29 January 2003, San Jose, California, USA. Bellingham, WA : SPIE, 2003.
Trouver le texte intégralGarcia-Blanco, Sonia. Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices X : 24-25 January 2011, San Francisco, California, United States. Sous la direction de SPIE (Society), Institut national d'optique (Canada), DALSA Corporation (Canada) et Smart Equipment Technology (France). Bellingham, Wash : SPIE, 2011.
Trouver le texte intégralKullberg, Richard C., et Rajeshuni Ramesham. Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices IX : 25-26 January 2010, San Francisco, California, United States. Sous la direction de SPIE (Society). Bellingham, Wash : SPIE, 2010.
Trouver le texte intégralGarcia-Blanco, Sonia, et Rajeshuni Ramesham. Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices XI : 23-24 January 2012, San Francisco, California, United States. Sous la direction de SPIE (Society), Dyoptyka (Firm), Vuzix Corporation et Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Bellingham, Wash : SPIE, 2012.
Trouver le texte intégralKostas, Amberiadis, European Optical Society, Society of Photo-optical Instrumentation Engineers., European Commission. Directorate-General XII, Science, Research, and Development., Scottish Enterprise, Sira Technology Centre (U.K.) et Institution of Electrical Engineers, dir. In-line characterization, yield reliability, and failure analysis in microelectronics manufacturing : 19-21 May, 1999, Edinburgh, Scotland. Bellingham, Wash., USA : SPIE, 1999.
Trouver le texte intégralT, Kundu, Qu Jianmin, American Society of Mechanical Engineers. Applied Mechanics Division., American Society of Mechanical Engineers. NDE Engineering Division. et International Mechanical Engineering Congress and Exposition (2000 : Orlando, Fla.), dir. Nondestructive evaluation and characterization of engineering materials for reliability and durability predictions : Presented at the 2000 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida. New York, N.Y : American Society of Mechanical Engineers, 2000.
Trouver le texte intégralUeda, Osamu. Materials and Reliability Handbook for Semiconductor Optical and Electron Devices. New York, NY : Springer New York, 2013.
Trouver le texte intégralGudrun, Kissinger, Weiland Larg H, Society of Photo-optical Instrumentation Engineers., Scottish Enterprise, European Optical Society et Institution of Electrical Engineers, dir. In-line characterization, yield, reliability, and failure analysis in microelectronic manufacturing II : 31 May-1 June 2001, Edinburgh, UK. Bellingham, Washington : SPIE, 2001.
Trouver le texte intégralA, Mosleh, U.S. Nuclear Regulatory Commission, EG & G Idaho, University of Maryland at College Park et U.S. Nuclear Regulatory Commission. Division of Safety Issue Resolution, dir. Proceedings of Workshop I in Advanced Topics in Risk and Reliability Analysis : Model uncertainty, its characterization and quantification : held at Governor Calvert House and Conference Center, Annapolis, Maryland, October 20-22, 1993. Washington, DC : Division of Safety Issue Resolution, Office of Nuclear Regulatory Research, U.S. Nuclear Regulatory Commission, 1994.
Trouver le texte intégralBorys, Michael. Fundamentals of Mass Determination. Berlin, Heidelberg : Springer Berlin Heidelberg, 2012.
Trouver le texte intégralservice), SpringerLink (Online, dir. Handbook of Technical Diagnostics : Fundamentals and Application to Structures and Systems. Berlin, Heidelberg : Springer Berlin Heidelberg, 2013.
Trouver le texte intégralSabbagh, Harold A. Computational Electromagnetics and Model-Based Inversion : A Modern Paradigm for Eddy-Current Nondestructive Evaluation. New York, NY : Springer New York, 2013.
Trouver le texte intégralHo, Paul S., Janice L. Veteran, David L. O'Meara et Veena Misra. Silicon Materials : Processing, Characterization and Reliability. University of Cambridge ESOL Examinations, 2014.
Trouver le texte intégralMcCauley, James W., et Volker Weiss. Materials Characterization for Systems Performance and Reliability. Springer, 2013.
Trouver le texte intégralAltenbach, Holm, et Andreas Öchsner. Properties and Characterization of Modern Materials. Ingramcontent, 2016.
Trouver le texte intégralAltenbach, Holm, et Andreas Öchsner. Properties and Characterization of Modern Materials. Springer, 2018.
Trouver le texte intégralAliofkhazraei, Mahmood. Handbook of Functional Nanomaterials Vol. 2 : Characterization and Reliability. Nova Science Publishers, Incorporated, 2013.
Trouver le texte intégralEl-Kareh, Badih, et Lou N. Hutter. Silicon Analog Components : Device Design, Process Integration, Characterization, and Reliability. Springer, 2020.
Trouver le texte intégralStovl Fighter Propulsion Reliability Maintainability and Supportability Characterization/Ada 224221. Natl Technical Information, 1990.
Trouver le texte intégralEl-Kareh, Badih, et Lou N. Hutter. Silicon Analog Components : Device Design, Process Integration, Characterization, and Reliability. Springer, 2015.
Trouver le texte intégralAliofkhazraei, Mahmood. Comprehensive Guide for Nanocoatings Technology, Volume 2 : Characterization and Reliability. Nova Science Publishers, Incorporated, 2015.
Trouver le texte intégralEl-Kareh, Badih, et Lou N. Hutter. Silicon Analog Components : Device Design, Process Integration, Characterization, and Reliability. Springer New York, 2016.
Trouver le texte intégralEl-Kareh, Badih, et Lou N. Hutter. Silicon Analog Components : Device Design, Process Integration, Characterization, and Reliability. Springer, 2019.
Trouver le texte intégralEl-Kareh, Badih, et Lou N. Hutter. Silicon Analog Components : Device Design, Process Integration, Characterization, and Reliability. Springer, 2015.
Trouver le texte intégral(Editor), Volker Weiss, dir. Materials Characterization for Systems Performance and Reliability (Sagamore Army Materials Research Conference//Proceedings). Springer, 1986.
Trouver le texte intégralKim, Young Hee, et Jack C. Lee. Hf-Based High-K Dielectrics : Process Development, Performance Characterization, and Reliability. Springer International Publishing AG, 2007.
Trouver le texte intégralKim, Young Hee, et Jack C. Lee. Hf-Based High-K Dielectrics : Process Development, Performance Characterization, and Reliability. Morgan & Claypool Publishers, 2006.
Trouver le texte intégralVeteran, Janice L. Silicon Materials--Processing, Characterization and Reliability (Materials Research Society Symposia Proceedings, 716.). Materials Research Society, 2002.
Trouver le texte intégral(Editor), Danelle M. Tanner, et Rajeshuni Ramesham (Editor), dir. Reliability, Packaging, Testing and Characterization of Mems / Moems 5 (Proceedings of Spie). SPIE-International Society for Optical Engine, 2006.
Trouver le texte intégralRamesham, Rajeshuni, et Herbert R. Shea. Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS, Nanodevices, and Nanomaterials XIII. SPIE, 2014.
Trouver le texte intégralSmolyansky, Dmitry A. Enhanced accuracy time domain reflection and transmission measurements for IC interconnect characterization. 1994.
Trouver le texte intégralReliability, testing, and characterization of MEMS/MOEMS III : 24-28 January 2004, San Jose, California, USA. Bellingham, WA : SPIE, 2004.
Trouver le texte intégralRajeshuni, Ramesham, Tanner Danelle Mary 1952-, Society of Photo-optical Instrumentation Engineers., Semiconductor Equipment and Materials International., Solid State Technology (Organization) et Sandia National Laboratories, dir. Reliability, testing, and characterization of MEMS/MOEMS II : 27-29 January 2003, San Jose, California, USA. Bellingham, Wash., USA : SPIE, 2003.
Trouver le texte intégralSPIE. Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices VIII : 28-29 January 2009, San Jose, California, United States. SPIE, 2009.
Trouver le texte intégralAmerican Society of Mechanical Engineers. Applied Mechanics Division (Corporate Author), American Society of Mechanical Engineers Nde Engineering Division (Corporate Author), Jianmin Qu (Editor), American Society of Mechanical Engineers (Editor) et T. Kundu (Editor), dir. Nondestructive Evaluation & Characterization of Energy Materials for Reliability & Durability Predictions : Presented at the 2000 Asme International Mechanical ... Orlando, Florida (Amd (Series), Vol. 240.). American Society of Mechanical Engineers, 1998.
Trouver le texte intégralReliability, packaging, testing, and characterization of MEMS/MOEMS VI : 23-24 January, 2007, San Jose, California, USA. Bellingham, Wash : SPIE, 2007.
Trouver le texte intégralPearton, Stephen J., et Osamu Ueda. Materials and Reliability Handbook for Semiconductor Optical and Electron Devices. Springer, 2014.
Trouver le texte intégralKim Young-Hee and Jack C. Lee. Hf-Based High-k Dielectrics : Process Development, Performance Characterization, and Reliability (Synthesis Lectures on Solid State Materials and Devices). Morgan & Claypool Publishers, 2005.
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