Littérature scientifique sur le sujet « Reliability characterization »
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Articles de revues sur le sujet "Reliability characterization"
Amirabdollahian, Mahsa, et Bithin Datta. « Reliability Evaluation of Groundwater Contamination Source Characterization under Uncertain Flow Field ». International Journal of Environmental Science and Development 6, no 7 (2015) : 512–18. http://dx.doi.org/10.7763/ijesd.2015.v6.647.
Texte intégralTsuchiya, Toshiyuki. « Reliability Characterization of MEMS Materials ». IEEJ Transactions on Sensors and Micromachines 125, no 7 (2005) : 289–93. http://dx.doi.org/10.1541/ieejsmas.125.289.
Texte intégralSong, William, Saibal Mukhopadhyay et Sudhakar Yalamanchili. « Architectural Reliability : Lifetime Reliability Characterization and Management ofMany-Core Processors ». IEEE Computer Architecture Letters 14, no 2 (1 juillet 2015) : 103–6. http://dx.doi.org/10.1109/lca.2014.2340873.
Texte intégralYang, Q. J., H. L. J. Pang, Z. P. Wang, G. H. Lim, F. F. Yap et R. M. Lin. « Vibration reliability characterization of PBGA assemblies ». Microelectronics Reliability 40, no 7 (juillet 2000) : 1097–107. http://dx.doi.org/10.1016/s0026-2714(00)00036-6.
Texte intégralEkwueme, Chukwuma G., et Gary C. Hart. « Structural reliability characterization of precast concrete ». Structural Design of Tall Buildings 3, no 1 (mars 1994) : 13–35. http://dx.doi.org/10.1002/tal.4320030103.
Texte intégralLee, J. C., Chen Ih-Chin et Hu Chenming. « Modeling and characterization of gate oxide reliability ». IEEE Transactions on Electron Devices 35, no 12 (1988) : 2268–78. http://dx.doi.org/10.1109/16.8802.
Texte intégralCheng, Bowen, Dirk De Bruyker, Chris Chua, Kunal Sahasrabuddhe, Ivan Shubin, John E. Cunningham, Ying Luo, Karl F. Bohringer, Ashok V. Krishnamoorthy et Eugene M. Chow. « Microspring Characterization and Flip-Chip Assembly Reliability ». IEEE Transactions on Components, Packaging and Manufacturing Technology 3, no 2 (février 2013) : 187–96. http://dx.doi.org/10.1109/tcpmt.2012.2213250.
Texte intégralClaeys, C., E. Simoen, J. M. Rafi, Marcelo A. Pavanello et Joao A. Martino. « Physical Characterization and Reliability Aspects of MuGFETs ». ECS Transactions 9, no 1 (19 décembre 2019) : 281–94. http://dx.doi.org/10.1149/1.2766899.
Texte intégralSheikh, A. « A reliability model for fatigue life characterization ». International Journal of Fatigue 17, no 2 (février 1995) : 121–28. http://dx.doi.org/10.1016/0142-1123(95)95891-j.
Texte intégralShaddock, David, et Liang Yin. « Reliability of High Temperature Laminates ». Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, HiTEN (1 janvier 2015) : 000100–000110. http://dx.doi.org/10.4071/hiten-session3b-paper3b_1.
Texte intégralThèses sur le sujet "Reliability characterization"
Nam, David. « Characterization, Reliability and Packaging for 300 °C MOSFET ». Thesis, Virginia Tech, 2020. http://hdl.handle.net/10919/104896.
Texte intégralM.S.
Electrical devices that are rated for high temperature applications demand a use of a material that is stable and reliable at the elevated temperatures. Silicon carbide (SiC) is such a material. Devices made from SiC are able to switch faster, have a superior efficiency, and are capable of operating at extreme temperatures much better than the currently widely used silicon (Si) devices. There are limitations on SiC certain structures of SiC devices, such as the metal oxide semiconductor field effect transistor (MOSFET), have inherent reliability issues related to the fabrication of the device. These reliability issues can get worse over higher temperature ranges. Therefore, studies must be made to determine the feasibility of SiC MOSFETs in high temperature applications. To do so, industry standard tests are conducted on newer generation SiC MOSFETs to ascertain their use for said conditions.
Ali, Richard A. « Reliability and characterization of high voltage power capacitors ». Thesis, Monterey, California : Naval Postgraduate School, 2014. http://hdl.handle.net/10945/41346.
Texte intégralAlternative energy products are an increasingly common sight on military bases in the United States. Energy product reliability affects the sustainability and cost-effectiveness of these systems, which must be tested by outside entities to ensure quality. The purpose of this thesis is to perform component level reliability testing on a high voltage power capacitor used in an electrical vehicle solar charging system. A component level characterization was performed to better understand the physical attributes of these capacitors. This investigation identified the expected component lifetime and conditions in which this component will become less reliable. Results are compared to those published by the manufacturer.
Tallarico, Andrea Natale <1988>. « Characterization and Modeling of Semiconductor Power Devices Reliability ». Doctoral thesis, Alma Mater Studiorum - Università di Bologna, 2017. http://amsdottorato.unibo.it/7990/1/Tallarico_PhD_Thesis.pdf.
Texte intégralXiao, Di. « On Modern IGBT Modules : Characterization, Reliability and Failure Mechanisms ». Thesis, Norwegian University of Science and Technology, Department of Electrical Power Engineering, 2010. http://urn.kb.se/resolve?urn=urn:nbn:no:ntnu:diva-10932.
Texte intégralThe increased demand of offshore power conversion systems is driven by newly initiated offshore projects for wind farms and oil production. Because of long distances to shore and inaccessibility of the equipment long repair times must be expected. At the same time the offshore environment is extremely harsh. Thus, high reliability is required for the converters and it is important to have good knowledge of the switching devices. This thesis investigates switching characteristics and losses of commercially available IGBT modules to be used for this application. It focuses on switching time and switching energy losses depending on gate resistance, current and voltage levels, operation temperatures, and show differences between several devices of the same type. Some test show how device characteristics and losses when the device has been exposed to stress over a certain period.
Zheng, Hanguang. « Die-Attachment on Copper by Nanosilver Sintering : Processing, Characterization and Reliability ». Diss., Virginia Tech, 2015. http://hdl.handle.net/10919/73312.
Texte intégralPh. D.
Luo, Wen. « Reliability characterization and prediction of high k dielectric thin film ». Texas A&M University, 2004. http://hdl.handle.net/1969.1/3225.
Texte intégralZAMBELLI, Cristian. « ELECTRICAL CHARACTERIZATION, PHYSICS, MODELING AND RELIABILITY OF INNOVATIVE NON-VOLATILE MEMORIES ». Doctoral thesis, Università degli studi di Ferrara, 2012. http://hdl.handle.net/11392/2389431.
Texte intégralRieske, Ralf. « Characterization of attenuation and reliability of PCB integrated optical waveguides ». Templin Detert, 2006. http://deposit.d-nb.de/cgi-bin/dokserv?id=3017300&prov=M&dok_var=1&dok_ext=htm.
Texte intégralLe, Huy X. P. « Characterization of hot-carrier reliability in analog sub-circuit design ». Thesis, Massachusetts Institute of Technology, 1996. http://hdl.handle.net/1721.1/41379.
Texte intégralIncludes bibliographical references (leaves 52-54).
by Huy X.P. Le.
M.Eng.
Engelbert, Carl Robert. « Statistical characterization of graphite fiber for prediction of composite structure reliability ». Thesis, Monterey, California : Naval Postgraduate School, 1990. http://handle.dtic.mil/100.2/ADA238020.
Texte intégralThesis Advisor(s): Wu, Edward M. "June 1990." Description based on signature page as viewed on October 21, 2009. DTIC Identifier(s): Graphite fiber strength testing, graphite fiber statistical evaluation. Author(s) subject terms: Graphite fiber strength testing, graphite fiber statistical evaluation, composite reliability predictions. Includes bibliographical references (p. 78-79). Also available in print.
Livres sur le sujet "Reliability characterization"
McCauley, James W., et Volker Weiss, dir. Materials Characterization for Systems Performance and Reliability. Boston, MA : Springer US, 1986. http://dx.doi.org/10.1007/978-1-4613-2119-4.
Texte intégralMaterial Characterization for Systems Performance and Reliability (Conference) (1984 Lake Luzerne, N.Y.). Materials characterization for systems performance and reliability. New York : Plenum, 1986.
Trouver le texte intégralSagamore Army Materials Research Conference (31st 1984 Lake Luzerne, N.Y.). Materials characterization for systems performance and reliability. New York : Plenum Press, 1986.
Trouver le texte intégralMcCauley, James W. Materials Characterization for Systems Performance and Reliability. Boston, MA : Springer US, 1986.
Trouver le texte intégralRajeshuni, Ramesham, Society of Photo-optical Instrumentation Engineers. et Semiconductor Equipment and Materials International., dir. Reliability, testing, and characterization of MEMS/MOEMS : 22-24 October 2001, San Francisco, USA. Bellingham, Wash : SPIE, 2001.
Trouver le texte intégralD, Todd M., U.S. Nuclear Regulatory Commission. Office of Nuclear Regulatory Research. Division of Engineering. et Oak Ridge National Laboratory, dir. A characterization of check valve degradation and failure experience in the nuclear power industry. Washington, DC : Division of Engineering, Office of Nuclear Regulatory Research, U.S. Nuclear Regulatory Commission, 1993.
Trouver le texte intégralL, Veteran Janice, dir. Silicon materials--processing, characterization and reliability : Symposium held April 1-5, 2002, San Francisco, California, U.S.A. Warrendale, PA : Materials Research Society, 2002.
Trouver le texte intégral1952-, Tanner Danelle Mary, Ramesham Rajeshuni et Society of Photo-optical Instrumentation Engineers., dir. Reliability, testing, and characterization of MEMS/MOEMS III : 26-28 January, 2004, San Jose, California, USA. Bellingham, Wash : SPIE, 2004.
Trouver le texte intégralHartzell, Allyson L. Reliability, packaging, testing, and characterization of MEMS/MOEMS VII : 21-22 January 2008, San Jose, California, USA. Bellingham, Wash : SPIE, 2008.
Trouver le texte intégral1952-, Tanner Danelle Mary, Ramesham Rajeshuni, Society of Photo-optical Instrumentation Engineers., Semiconductor Equipment and Materials International., Solid State Technology (Organization) et Sandia National Laboratories, dir. Reliability, packaging, testing, and characterization of MEMS/MOEMS IV : 24-25 January 2005, San Jose, California, USA. Bellingham, Wash : SPIE, 2005.
Trouver le texte intégralChapitres de livres sur le sujet "Reliability characterization"
Varde, Prabhakar V., et Michael G. Pecht. « Risk Characterization ». Dans Springer Series in Reliability Engineering, 15–29. Singapore : Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-13-0090-5_2.
Texte intégralKlebanov, Lev, et Gabor Szekely. « Characterization of Distributions in Reliability ». Dans Recent Advances in Reliability Theory, 105–15. Boston, MA : Birkhäuser Boston, 2000. http://dx.doi.org/10.1007/978-1-4612-1384-0_7.
Texte intégralGreen, Robert E. « Nondestructive Materials Characterization ». Dans Materials Characterization for Systems Performance and Reliability, 31–58. Boston, MA : Springer US, 1986. http://dx.doi.org/10.1007/978-1-4613-2119-4_3.
Texte intégralSoares, J. C. « Nuclear Methods in the Characterization of Semiconductor Reliability ». Dans Semiconductor Device Reliability, 291–300. Dordrecht : Springer Netherlands, 1990. http://dx.doi.org/10.1007/978-94-009-2482-6_15.
Texte intégralRomero, Paulo, et Martins Maciel. « Workload Characterization ». Dans Performance, Reliability, and Availability Evaluation of Computational Systems, Volume 2, 445–526. Boca Raton : Chapman and Hall/CRC, 2023. http://dx.doi.org/10.1201/9781003306030-12.
Texte intégralLau, John H., et Ning-Cheng Lee. « Solder Joint Characterization ». Dans Assembly and Reliability of Lead-Free Solder Joints, 299–354. Singapore : Springer Singapore, 2020. http://dx.doi.org/10.1007/978-981-15-3920-6_5.
Texte intégralSato, Takashi, et Hiromitsu Awano. « On-Chip Characterization of Statistical Device Degradation ». Dans Circuit Design for Reliability, 69–92. New York, NY : Springer New York, 2014. http://dx.doi.org/10.1007/978-1-4614-4078-9_5.
Texte intégralWachtman, John B. « Materials Characterization at a University ». Dans Materials Characterization for Systems Performance and Reliability, 475–78. Boston, MA : Springer US, 1986. http://dx.doi.org/10.1007/978-1-4613-2119-4_26.
Texte intégralSmyth, D. M. « Compositional Characterization Of Dielectric Oxides ». Dans Materials Characterization for Systems Performance and Reliability, 59–68. Boston, MA : Springer US, 1986. http://dx.doi.org/10.1007/978-1-4613-2119-4_4.
Texte intégralHagnauer, Gary L. « Polymers and Polymer Precursor Characterization ». Dans Materials Characterization for Systems Performance and Reliability, 189–243. Boston, MA : Springer US, 1986. http://dx.doi.org/10.1007/978-1-4613-2119-4_9.
Texte intégralActes de conférences sur le sujet "Reliability characterization"
Suehle, J. S. « Reliability characterization of ultra-thin film dielectrics ». Dans CHARACTERIZATION AND METROLOGY FOR ULSI TECHNOLOGY. ASCE, 1998. http://dx.doi.org/10.1063/1.56786.
Texte intégralWeide-Zaage, Kirsten, Yuqi Tan et Verena Hein. « Thick AlCu-metal reliability characterization ». Dans 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, 2018. http://dx.doi.org/10.1109/eurosime.2018.8369904.
Texte intégralHartzell, Allyson L., et David J. Woodilla. « MEMS reliability, characterization, and test ». Dans Micromachining and Microfabrication, sous la direction de Rajeshuni Ramesham. SPIE, 2001. http://dx.doi.org/10.1117/12.442987.
Texte intégral« Poster session : Reliability and characterization ». Dans 2014 IEEE 29th International Conference on Microelectronics (MIEL). IEEE, 2014. http://dx.doi.org/10.1109/miel.2014.6842153.
Texte intégralWategaonkar, Dhanashri N., et Vivek S. Deshpande. « Characterization of reliability in WSN ». Dans 2012 World Congress on Information and Communication Technologies (WICT). IEEE, 2012. http://dx.doi.org/10.1109/wict.2012.6409215.
Texte intégralReczek, W., F. Bonner et B. Murphy. « Reliability of latchup characterization procedures ». Dans International Conference on Microelectronic Test Structures. IEEE, 1990. http://dx.doi.org/10.1109/icmts.1990.67879.
Texte intégralGossner, Harald, et Alessandro Paccagnella. « Session 14 : Characterization, reliability, and yield - ESD/memory reliability ». Dans 2008 IEEE International Electron Devices Meeting (IEDM). IEEE, 2008. http://dx.doi.org/10.1109/iedm.2008.4796687.
Texte intégralDemertzi, Melina, Bardia Zandian, Ricardo Rojas et Murali Annavaram. « Benchmarking ISA reliability to intermittent errors ». Dans 2012 IEEE International Symposium on Workload Characterization (IISWC). IEEE, 2012. http://dx.doi.org/10.1109/iiswc.2012.6402906.
Texte intégralKeller, R. R., M. C. Strus, A. N. Chiaramonti, Y. L. Kim, Y. J. Jung, D. T. Read, David G. Seiler et al. « Reliability Testing of Advanced Interconnect Materials ». Dans FRONTIERS OF CHARACTERIZATION AND METROLOGY FOR NANOELECTRONICS : 2011. AIP, 2011. http://dx.doi.org/10.1063/1.3657900.
Texte intégralLiu, Ji, et Huiyang Zhou. « Reliability Modeling of NISQ- Era Quantum Computers ». Dans 2020 IEEE International Symposium on Workload Characterization (IISWC). IEEE, 2020. http://dx.doi.org/10.1109/iiswc50251.2020.00018.
Texte intégralRapports d'organisations sur le sujet "Reliability characterization"
Spratt, Randolph W. STOVL Fighter Propulsion Reliability, Maintainability and Supportability Characterization. Fort Belvoir, VA : Defense Technical Information Center, mars 1990. http://dx.doi.org/10.21236/ada224221.
Texte intégralYang, Benjamin Bing-Yeh, Jose Luis Cruz-Campa, Gad S. Haase, Paiboon Tangyunyong, Edward Isaac Colr, Murat Okandan et Gregory N. Nielson. Defect localization, characterization and reliability assessment in emerging photovoltaic devices. Office of Scientific and Technical Information (OSTI), avril 2014. http://dx.doi.org/10.2172/1177042.
Texte intégralKramer, K. Status Quo of PVT Characterization. Sous la direction de Korbinian Kramer,. IEA SHC Task 60, septembre 2020. http://dx.doi.org/10.18777/ieashc-task60-2020-0004.
Texte intégralRobert W Youngblood. Treatment of Passive Component Reliability in Risk-Informed Safety Margin Characterization FY 2010 Report. Office of Scientific and Technical Information (OSTI), septembre 2010. http://dx.doi.org/10.2172/1004257.
Texte intégralFrench, Roger, Bryan Huey, Alexandra Longacre, Michael Martin, Thomas Moran, Oleg Kolosov, Eric Schneller et al. Reliability and Power Degradation Rates of PERC Modules Using Differentiated Packaging Strategies and Characterization Tools. Office of Scientific and Technical Information (OSTI), juin 2021. http://dx.doi.org/10.2172/1804123.
Texte intégralJohnson, D. R., R. W. McClung, M. A. Janney et W. M. Hanusiak. Needs assessment for nondestructive testing and materials characterization for improved reliability in structural ceramics for heat engines. Office of Scientific and Technical Information (OSTI), août 1987. http://dx.doi.org/10.2172/6185356.
Texte intégralBoring, Ronald, Diego Mandelli, Martin Rasmussen, Sarah Herberger, Thomas Ulrich, Katrina Groth et Curtis Smith. Integration of Human Reliability Analysis Models into the Simulation-Based Framework for the Risk-Informed Safety Margin Characterization Toolkit. Office of Scientific and Technical Information (OSTI), juin 2016. http://dx.doi.org/10.2172/1371517.
Texte intégralBoesch, F. T., A. Satyanarayana et C. L. Suffel. Some Alternate Characterizations of Reliability Domination. Fort Belvoir, VA : Defense Technical Information Center, janvier 1990. http://dx.doi.org/10.21236/ada264594.
Texte intégralBaral, Aniruddha, Jeffery Roesler et Junryu Fu. Early-age Properties of High-volume Fly Ash Concrete Mixes for Pavement : Volume 2. Illinois Center for Transportation, septembre 2021. http://dx.doi.org/10.36501/0197-9191/21-031.
Texte intégralWarrick, Arthur, Uri Shani, Dani Or et Muluneh Yitayew. In situ Evaluation of Unsaturated Hydraulic Properties Using Subsurface Points. United States Department of Agriculture, octobre 1999. http://dx.doi.org/10.32747/1999.7570566.bard.
Texte intégral