Articles de revues : « MICRO-BONDING »

1

Kim, Joo-Han, et Chul-Ku Lee. « Laser Micro Bonding Technology ». Journal of the Korean Welding and Joining Society 25, n^o 2 (30 avril 2007) : 1–2. http://dx.doi.org/10.5781/kwjs.2007.25.2.001.

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Gu, Yao Xin, et Hong Chao Qiao. « Study on the Manufacturing Process of Polymer Microfluidic Chip with Integrated Cu Micro Array Electrode ». Applied Mechanics and Materials 723 (janvier 2015) : 884–87. http://dx.doi.org/10.4028/www.scientific.net/amm.723.884.

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To produce perfect polymer microfluidic chip with integrated metal micro array electrode, an oxygen-plasma assisted manufacturing process was developed. The Cu micro array electrodes on the poly substrate was formed by photolithography, sputtering and wet etching; the micro channels on the polymer plate were hot-embossed using metal master; the bonding of cover plate and substrate using thermal bonding. The surface of the polymer plate with micro channels was treated by oxygen-plasma before thermal bonding. The oxygen-plasma treatment could decrease thermal bonding temperature from 100 °C to 85 °C. The bonding of this chip is complete, the micro electrode array keeps its integrity, and the micro channel is not distorted obviously.

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Shoda, Koki, Minori Tanaka, Kensuke Mino et Yutaka Kazoe. « A Simple Low-Temperature Glass Bonding Process with Surface Activation by Oxygen Plasma for Micro/Nanofluidic Devices ». Micromachines 11, n^o 9 (25 août 2020) : 804. http://dx.doi.org/10.3390/mi11090804.

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The bonding of glass substrates is necessary when constructing micro/nanofluidic devices for sealing micro- and nanochannels. Recently, a low-temperature glass bonding method utilizing surface activation with plasma was developed to realize micro/nanofluidic devices for various applications, but it still has issues for general use. Here, we propose a simple process of low-temperature glass bonding utilizing typical facilities available in clean rooms and applied it to the fabrication of micro/nanofluidic devices made of different glasses. In the process, the substrate surface was activated with oxygen plasma, and the glass substrates were placed in contact in a class ISO 5 clean room. The pre-bonded substrates were heated for annealing. We found an optimal concentration of oxygen plasma and achieved a bonding energy of 0.33–0.48 J/m2 in fused-silica/fused-silica glass bonding. The process was applied to the bonding of fused-silica glass and borosilicate glass, which is generally used in optical microscopy, and revealed higher bonding energy than fused-silica/fused-silica glass bonding. An annealing temperature lower than 200 °C was necessary to avoid crack generation by thermal stress due to the different thermal properties of the glasses. A fabricated micro/nanofluidic device exhibited a pressure resistance higher than 600 kPa. This work will contribute to the advancement of micro/nanofluidics.

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Ohashi, Osamu, Miho Narui, Kensaku Aihara, Kazutoshi Harada, Masaki Hosaka, Hajime Inagaki et Osamu Tsuya. « Ancient Micro Bonding of Gold ; Granulation ». Materia Japan 55, n^o 10 (2016) : 468–74. http://dx.doi.org/10.2320/materia.55.468.

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Yang Mengsheng, 杨蒙生, 邢丕峰 Xing Pifeng, 郑凤成 Zheng Fengcheng, 谢军 Xie Jun, 刘学 Liu Xue, 马小军 Ma Xiaojun et 易泰民 Yi Taimin. « Precise bonding of Cu micro-sphere ». High Power Laser and Particle Beams 26, n^o 5 (2014) : 52008. http://dx.doi.org/10.3788/hplpb20142605.52008.

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SHI Ya-li, 史亚莉, 张文生 ZHANG Wen-sheng, 徐德 XU De, 张正涛 ZHANG Zheng-tao et 张娟 ZHANG Juan. « Time/pressure pL micro-bonding technology ». Optics and Precision Engineering 19, n^o 11 (2011) : 2724–30. http://dx.doi.org/10.3788/ope.20111911.2724.

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Mehlmann, Benjamin, Elmar Gehlen, Alexander Olowinsky et Arnold Gillner. « Laser Micro Welding for Ribbon Bonding ». Physics Procedia 56 (2014) : 776–81. http://dx.doi.org/10.1016/j.phpro.2014.08.085.

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Böhm, S., K. Dilger, J. Hesselbach, J. Wrege, S. Rathmann, W. Ma, E. Stammen et G. Hemken. « Micro bonding with non-viscous adhesives ». Microsystem Technologies 12, n^o 7 (7 février 2006) : 676–79. http://dx.doi.org/10.1007/s00542-006-0101-7.

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Wang, Chun Yu, Qing Wang, Han Zhu Li, Xiao Zhi Ji et Zhi Long Kang. « Optimized Wire Bonding Process on Micro-Connection Pad with Ni/CeO₂ Coatings ». Applied Mechanics and Materials 275-277 (janvier 2013) : 1925–28. http://dx.doi.org/10.4028/www.scientific.net/amm.275-277.1925.

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Keywords: Electroless plating Ni, CeO2, Micro-connection pad, Wire bonding Abstract. It is Ni/CeO2 coatings that have been prepared on SiC/Al composites surfaces (electroless plating Ni and depositing CeO2 conversion coatings). It is employed to wire bonding process as a new micro-connection pad in this paper. During bonding process, ultrasonic time, ultrasonic power, bonding pressure, etc. have been investigated. The optimized parameters are obtained with the best bonding properties.

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Yang, Jun Ru, Kun Guo, Yu Rong Chi, Xue Cheng Chen et Hai Tao Feng. « Molecular Dynamics Simulation of the Propagation Property of the Interface Micro Crack in Ternary Boride Hard Cladding Material ». Materials Science Forum 861 (juillet 2016) : 264–69. http://dx.doi.org/10.4028/www.scientific.net/msf.861.264.

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The interface of the ternary boride hard cladding material consists of hard phase (Mo2FeB2) and bonding phase (α-Fe). In this paper, on the basis of the ideal interface model of Mo2FeB2 (100)/α-Fe (001) built with the molecular dynamics software, the Mo2FeB2 (100)/α-Fe (001) interface models with micro-cracks parallel with the interface, normal to the interface, and inclined to the interface have been built separately. The interface bonding energies of these four different interface models have been calculated, which shows that the interface model with the micro crack inclined to the interface has the biggest interface bonding energy, while the interface model with the micro crack parallel with the interface has the smallest bonding energy, the interface crack will be the most easily to propagate. The change rule of bonding energy of the interface model with the micro crack parallel with the interface with different lengths has been simulated and analyzed.

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Kim, Joo Han, Hyang Tae Kim et Chul Ku Lee. « UV Laser Bonding of Optical Devices on Polymers ». Materials Science Forum 580-582 (juin 2008) : 459–62. http://dx.doi.org/10.4028/www.scientific.net/msf.580-582.459.

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UV curing adhesives have been introduced for bonding various materials at a room temperature. It has the advantage of putting minimum thermal load on the system; however, it is not suitable for precision bonding of micro systems such as micro optical devices because of its high viscosity and poor control of the UV light source. In the present work, a laser-curing bonding process of micro optical devices with a low-viscosity UV polymer adhesive has been developed. A focused Nd:YVO4 laser beam with a spot size of 30 µm with a laser power of 100 ~ 700 mW is used for curing a UV adhesive locally. A thin bonding layer with a thickness of a few hundred nanometers without any thermal effects can be obtained for precision laser bonding for optical fibers. Experimental results are provided and the process characteristics have been discussed. Moreover, potential applications in the field of micro optical systems are introduced as well.

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Zhang, Zong Bo, Qing Qiang He et Cao Qing Yan. « Non-Melt Ultrasonic Bonding Method for Polymer MEMS Devices ». Applied Mechanics and Materials 607 (juillet 2014) : 133–38. http://dx.doi.org/10.4028/www.scientific.net/amm.607.133.

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Based on the theoretical study in our previous work, a novel thermal assisted ultrasonic bonding method for polymer Micro/nanoElectro-Mechanical Systems (M/NEMS) has been demonstrated. Bonding experiments of PMMA microfluidic chips with micro-channel of 80 μm in depth and width were conducted. The result shows numerous superiorities of this method including high bonding strength (0.95 MPa), low dimension loss (0.8% in depth and 0.3% in width, respectively) and short bonding duration.

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13

Wang, Xuelei, Mao Ye, Fei Lu, Yunkai Mao, Hao Tian et Jianli Li. « Recent Progress on Micro-Fabricated Alkali Metal Vapor Cells ». Biosensors 12, n^o 3 (6 mars 2022) : 165. http://dx.doi.org/10.3390/bios12030165.

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Alkali vapor cells are the core components of atomic sensing instruments such as atomic gyroscopes, atomic magnetometers, atomic clocks, etc. Emerging integrated atomic sensing devices require high-performance miniaturized alkali vapor cells, especially micro-fabricated vapor cells. In this review, bonding methods for vapor cells of this kind are summarized in detail, including anodic bonding, sacrificial micro-channel bonding, and metal thermocompression bonding. Compared with traditional through-lighting schemes, researchers have developed novel methods for micro-fabricated vapor cells under both single- and double-beam schemes. In addition, emerging packaging methods for alkali metals in micro-fabricated vapor cells can be categorized as physical or chemical approaches. Physical methods include liquid transfer and wax pack filling. Chemical methods include the reaction of barium azide with rubidium chloride, ultraviolet light decomposition (of rubidium azide), and the high-temperature electrolysis of rubidium-rich glass. Finally, the application trend of micro-fabricated alkali vapor cells in the field of micro-scale gyroscopes, micro-scale atomic clocks, and especially micro-scale biomagnetometers is reviewed. Currently, the sensing industry has become a major driving force for the miniaturization of atomic sensing devices, and in the near future, the micro-fabricated alkali vapor cell technology of atomic sensing devices may experience extensive developments.

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Bi, Gui Jun, Sum Huan Ng, Khin Thet May et Cong Zhi Chan. « Micro-Laser Welding of Plastics for the Applications in Micro-Fluidic Devices ». Key Engineering Materials 447-448 (septembre 2010) : 745–49. http://dx.doi.org/10.4028/www.scientific.net/kem.447-448.745.

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This study aims to investigate laser welding process for the bonding of micro-fluidic devices. PMMA was selected for the investigation. The devices consist of an opaque substrate with micro-channels and a transparent cover. The welding process was optimized according to laser power, welding speed and clamping pressure. The cross-sectional analysis, flow and pressure tests, as well as the lap-shear test were conducted on the samples welded with the optimized process parameters. The results show that the laser welding can meet the requirements for bonding the plastic micro-fluidic devices.

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Liu, Hang, Yan Xu, Kai Leung Yung et Chun Lei Kang. « The Interface Behavior of Micro Overmolding ». Advanced Materials Research 591-593 (novembre 2012) : 896–99. http://dx.doi.org/10.4028/www.scientific.net/amr.591-593.896.

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Micro overmolding is becoming more important with the rapid development and applications of microproducts in bioengineering, electronics and other areas in recent years. This paper presents our findings in studying polymer interfaces in micro channels of a micro mold during overmolding process. The bonding strengths between polycarbonate (PC) and thermoplastic polyurethanes (TPU) were examined and compared under different overmolding conditions. Results show bonding behaviors in micro channels are not only affected by temperatures, they are also influenced by surface roughness.

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MIURA, Kazuma, et Koii SERIZAWA. « Micro-Metal Bonding Technology for LSI Package ». Journal of the Society of Materials Science, Japan 50, n^o 6Appendix (2001) : 127–31. http://dx.doi.org/10.2472/jsms.50.6appendix_127.

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Yasuda, Kiyokazu. « Ultrasonic Bonding Technology for Micro System Integration ». Journal of The Japan Institute of Electronics Packaging 22, n^o 5 (1 août 2019) : 395–99. http://dx.doi.org/10.5104/jiep.22.395.

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Thomas, S., et H. Berg. « Micro-Corrosion of Al-Cu Bonding Pads ». IEEE Transactions on Components, Hybrids, and Manufacturing Technology 10, n^o 2 (juin 1987) : 252–57. http://dx.doi.org/10.1109/tchmt.1987.1134741.

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MIZUNO, Jun, Katsuyuki SAKUMA, Masatsugu NIMURA, Fumihiro WAKAI et Shuichi SHOJI. « Thermo-compression Micro Bonding Technology Using Au ». Journal of the Japan Society for Precision Engineering 79, n^o 8 (2013) : 714–18. http://dx.doi.org/10.2493/jjspe.79.714.

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Hofmann, Christian, Maulik Satwara, Martin Kroll, Sushant Panhale, Patrick Rochala, Maik Wiemer, Karla Hiller et Harald Kuhn. « Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized Coils ». Micromachines 13, n^o 8 (12 août 2022) : 1307. http://dx.doi.org/10.3390/mi13081307.

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Considering the demand for low temperature bonding in 3D integration and packaging of microelectronic or micromechanical components, this paper presents the development and application of an innovative inductive heating system using micro coils for rapid Cu-Sn solid-liquid interdiffusion (SLID) bonding at chip-level. The design and optimization of the micro coil as well as the analysis of the heating process were carried out by means of finite element method (FEM). The micro coil is a composite material of an aluminum nitride (AlN) carrier substrate and embedded metallic coil conductors. The conductive coil geometry is generated by electroplating of 500 µm thick copper into the AlN carrier. By using the aforementioned micro coil for inductive Cu-Sn SLID bonding, a complete transformation into the thermodynamic stable ε-phase Cu3Sn with an average shear strength of 45.1 N/mm2 could be achieved in 130 s by applying a bond pressure of 3 MPa. In comparison to conventional bonding methods using conduction-based global heating, the presented inductive bonding approach is characterized by combining very high heating rates of about 180 K/s as well as localized heating and efficient cooling of the bond structures. In future, the technology will open new opportunities in the field of wafer-level bonding.

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Naito, Makio, Hiroya Abe et Kazuyoshi Sato. « Nanoparticle Bonding Technology for Composite Materials ». Advances in Science and Technology 45 (octobre 2006) : 1704–10. http://dx.doi.org/10.4028/www.scientific.net/ast.45.1704.

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Nanoparticle bonding technology can present a promising method for nano/micro structural controls of composite particles as well as composite materials. The nanoparticle bonding can be well conducted by making use of the unique properties of nanoparticle surface at lower temperature without any binder in dry phase. In this paper, the concept of nanoparticle bonding technology is introduced. The examples of nano/micro structural controls of particles including composite particles and the composite materials are shown.

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Yoshida, Yoshinori, Takashi Ishikawa et Tomoaki Suganuma. « Mechanism of Forming Joining on Backward Extrusion Forged Bonding Process ». Advanced Materials Research 966-967 (juin 2014) : 461–70. http://dx.doi.org/10.4028/www.scientific.net/amr.966-967.461.

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A backward extrusion forged bonding using low carbon steel and pure aluminum is conducted. The bonding strength between the materials is evaluated by a micro tensile test that is cut out at the bonding boundary. The maximum bonding strength is larger than that of the aluminum. In addition, the metallurgical mechanism of the joining of the backward extrusion forged bonding is investigated by means of a scanning transmission electron microscope (STEM). An intermetallic compound (IMC) layer is produced at the boundary with a thickness of about 3 nm. The process is applied for bonding between aluminum-nickel and between aluminum-copper. The bonding strength between the materials was evaluated by using a micro tensile test and the maximum bonding strength is shown. Fractured surfaces of the tensile specimens are observed by scanning electron microscope (SEM) and relationship between bonding strength and position on the boundary is discussed.

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Kim, Uk-Su, Seung-Sik Shin, Ki-Gwon Kim, Ba-Wi Jeong et Jeong-Woo Park. « Bonding properties on diffusion bonding layer for micro PCD-WC tool fabrication ». Journal of Mechanical Science and Technology 33, n^o 8 (août 2019) : 3749–54. http://dx.doi.org/10.1007/s12206-019-0717-z.

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Ye, Yiyun, Qi Zou, Yinan Xiao, Junke Jiao, Beining Du, Yuezhan Liu et Liyuan Sheng. « Effect of Interface Pretreatment of Al Alloy on Bonding Strength of the Laser Joined Al/CFRTP Butt Joint ». Micromachines 12, n^o 2 (11 février 2021) : 179. http://dx.doi.org/10.3390/mi12020179.

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In the present research, the carbon fiber reinforced thermoplastic (CFRTP) was laser joined with the Al alloy whose joining interface was pretreated by laser micro-texturing, anodizing, and hybrid of laser micro-texturing and anodizing. The surface morphology of the pretreated Al joining interface and bonding strength of the corresponding Al/CFRTP butt joint were investigated. The results show that the laser micro-texturing has fabricated the micro-pit or micro-furrow in the Al joining interface. With the increasing of laser scanning times, the size of the micro-pit or micro-furrow decreases, when the laser scanning distance is constant. The bonding strength of the Al/CFRTP butt joint with Al joining interface pretreated by micro-texturing fluctuates with the increasing of laser scanning distance and times, reaching the maximum value of 20 MPa at laser scanning distance of 0.1 mm and 1 time. The anodizing pretreatment has formed the Al2O3 oxide layer on the Al joining interface. The Al/CFRTP butt joint with Al joining interface pretreated by anodizing obtains the maximum bonding strength of 11 MPa at anodizing time of 10 min. The hybrid pretreatment of micro-texturing and subsequent anodizing fabricates the regular grid structure with smooth micro-furrow and micro-pit, while the hybrid pretreatment of anodizing and subsequent micro-texturing fabricates the Al joining interface with explosive micro-pit and micro-furrow. The bonding strength of the Al/CFRTP butt joint with hybrid-pretreated Al joining interface is relative better than that of the Al/CFRTP butt joint with anodizing-pretreated Al joining interface but almost lower than that of the Al/CFRTP butt joint with micro-texturing pretreated Al joining interface. Such results should be attributed to the surface morphology of the Al joining interface.

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Long, Zhi Li, Lu Fan Zhang et Jian Guo Zhang. « FEM Design and Experiment of a Micro-Gripper Based on Piezoelectric Material ». Advanced Materials Research 479-481 (février 2012) : 434–38. http://dx.doi.org/10.4028/www.scientific.net/amr.479-481.434.

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Micro-gripper is a key module in IC/LED wire bonding. The paper presents a micro-gripper combining with piezoelectric material and flexible structure. The dynamic and static characteristics of the micro-gripper are calculated by finite element method, and the natural frequencies, the vibration modes, as well as the deflection range of the micro-gripper are obtained. In the experiment, the high-speed camera was used to track the vibration of the micro-gripper, and the relationship between deflection range and driven voltage was established. The vibration behavior was measured by a non-contact laser measuring device. These results can help improve the reliability of the micro-gripper used in wire bonding.

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Lecarpentier, Gilbert, et Joeri De Vos. « Die to Die and Die To Wafer Bonding Solution for High Density, Fine Pitch Micro-Bumped Die ». Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (1 janvier 2012) : 002251–84. http://dx.doi.org/10.4071/2012dpc-tha15.

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Higher density interconnection using 3-Dimensional technology implies a pitch reduction and the use of micro-bumps. The micro-bump size reduction has a direct impact on the placement accuracy needed on the die placement and flip chip bonding equipment. The paper presents a Die-to-Die and Die-to-Wafer, high accuracy, die bonding solution illustrated by the flip chip assembly of a large 2x2cm die consisting of 1 million 10 μm micro-bumps at 20 μm pitch

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Sun, Yibo, Yi Luo et Xiaodong Wang. « Micro energy director array in ultrasonic precise bonding for thermoplastic micro assembly ». Journal of Materials Processing Technology 212, n^o 6 (juin 2012) : 1331–37. http://dx.doi.org/10.1016/j.jmatprotec.2012.01.013.

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Zhang, Wei Xiang, et Shuang Min Du. « Investigation into Cu-Interlayered Diffusion Bonding Trial of AZ31B Alloy ». Advanced Materials Research 631-632 (janvier 2013) : 167–71. http://dx.doi.org/10.4028/www.scientific.net/amr.631-632.167.

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For effective bonding of Magnesium alloy, Cu foil was used as the interlayer to conduct the diffusion bonding experiment of AZ31B alloy. The microstructure and properties of the diffusion bonding joint was analyzed by means of SEM, EDS and micro-hardness tester. Experiment results show that compact bonding joint was obtained at the temperature of 480°C, holding time of 30 minutes, pressure of 10 MPa and the vacuum degree of 1.0×10-2Pa. The bonding joint consists of a interfacial diffusion region which is a mixture of Mg2Cu, MgCu2, and Mg(Cu) solid solution, and the transitional zone which is composed of Mg(Cu,Al) solid solution base and Mg17(Al, Cu)12 phase. Within the bonding joint,the micro-hardness shows a step pattern of increasing, which is well accord with the the microstructural feature of the joint.This trial has prove that using Cu as the interlayer is effective to improve the quality of the AZ31B bonding joint.

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Bai, S. L., C. M. L. Wu, Y. W. Mai, H. M. Zeng et R. K. Y. Li. « Failure Mechanisms of Sisal Fibres in Composites ». Advanced Composites Letters 8, n^o 1 (janvier 1999) : 096369359900800. http://dx.doi.org/10.1177/096369359900800102.

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Model specimens, each containing five embedded continuous sisal fibres in an epoxy matrix, were subjected to four-point bending tests. The micro-failure behaviour of sisal fibres was examined using scanning electron microscopy (SEM). Interfacial debonding of both sisal fibre bundle/epoxy matrix and tubular micro-fibre/bonding material was also noted in all embedded fibres. The fibre bundle/matrix interface had a moderate high strength; but the adhesive strength between the micro-tubular fibre and the bonding material appeared to be small.

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Murayama, Kei, Mitsuhiro Aizawa et Mitsutoshi Higashi. « TLP Bonding Technologies for Micro Joining and 3D Packaging ». Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, DPC (1 janvier 2010) : 001221–52. http://dx.doi.org/10.4071/2010dpc-wa12.

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The bonding technique for High density Flip Chip(F.C.) packages requires a low temperature and a low stress process to have high reliability of the micro joining ,especially that for sensor MEMS packages requires hermetic sealing so as to ensure their performance. The Transient Liquid Phase (TLP) bonding, that is a kind of diffusion bonding is a technique that connects the low melting point material such as Indium to the higher melting point metal such as Gold by the isothermal solidification and high-melting-point intermetallic compounds are formed. Therefore, it is a unique joining technique that can achieve not only the low temperature bonding and also the high temperature reliability. The Gold-Indium TLP bonding technique can join parts at 180 degree C and after bonding the melting point of the junction is shifted to more than 495 degree C, therefore itfs possible to apply the low temperature bonding lower than the general use as a lead free material such as a SAC and raise the melting point more than AuSn solder which is used for the high temperature reliability usage. Therefore, the heat stress caused by bonding process can be expected to be lowered. We examined wafer bonding and F.C bonding plus annealing technique by using electroplated Indium and Gold as a joint material. We confirmed that the shear strength obtained at the F.C. bonding plus anneal technique was equal with that of the wafer bonding process. Moreover, it was confirmed to ensure sufficient hermetic sealing in silicon cavity packages that had been bonded at 180 degree C. And the difference of the thermal stress that affect to the device by the bonding process was confirmed. In this paper, we report on various possible application of the TLP bonding.

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Luo, Yi, Sheng Qiang He, Liang Jiang Wang et Zong Bo Zhang. « Study on Ultrasonic Fusion Bonding for Polymer Microfluidic Chips ». Key Engineering Materials 483 (juin 2011) : 311–15. http://dx.doi.org/10.4028/www.scientific.net/kem.483.311.

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Ultrasonic fusion bonding is a potential method for mass-production of polymer microfluidic chips. However, the micro structures in the chips are easily damaged or even destroyed due to poor controllability and uniformity of the melted energy directors in ultrasonic bonding process. In this paper, a novel micro joint including energy directors and flow blocks is presented. The flow profile of the melted energy directors is controlled by the dimensions of the flow blocks, auxiliary energy-equilibrating structures are also designed to prevent the uneven melt of energy directors. Polymethyl methacrylate (PMMA) microfluidic chips with the new joints were fabricated and ultrasonic bonding experiments were conducted. Micro channels with characteristic dimension of tens of microns were successfully sealed in 0.3 s and free of deformation.

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Sun, Yibo, Yuqi Feng, Pengfei Hu, Xing Zhao, Xinhua Yang et Guoxiong Wu. « Online visual monitoring and ultrasonic feedback detection in the ultrasonic precision bonding of polymers ». Advanced Composites Letters 29 (1 janvier 2020) : 2633366X2093258. http://dx.doi.org/10.1177/2633366x20932584.

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Ultrasonic bonding is a convenient bonding technology, which features sufficient cleanliness, high efficiency, no need for additional bonding aids, and other outstanding advantages. In recent years, it has been introduced into the field of the micro–nano assembly of polymer micro–nano devices, but it is still difficult for current ultrasonic bonding technology to meet the accuracy requirements of the micro–nano assembly. To improve the control accuracy of the hot-melt interface in the process of ultrasonic bonding, an online hot-melt interface monitoring method and an online ultrasonic transmission efficiency detection method are proposed in this article. With these detection methods, the real-time monitoring of the hot-melt interface can be realized on the basis of machine vision, while high-frequency dynamic force sensors can be used to detect the ultrasonic vibration transmitted from the ultrasonic horn to the anvil. Based on these methods, a functional anvil based on visual monitoring and ultrasonic detection is developed, the finite element method has been used to analyze the transmission characteristics of ultrasonic vibration, and experiments are carried out regarding online detection in the process of ultrasonic bonding. The results show that this system can realize the online detection of the hot-melt interface and ultrasonic transmission information, providing a new control method for ultrasonic bonding technology.

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Wang, Ying Hao, Xian Sheng Qi, Xian Lin Meng, Wen Bin Li, Chuan Yun Wang, Hong Chao Kou et Jin Shan Li. « The Influence of Initial Microstructures on the Diffusion Bonding Interface of High Nb Containing TiAl Alloy ». Advanced Materials Research 753-755 (août 2013) : 396–401. http://dx.doi.org/10.4028/www.scientific.net/amr.753-755.396.

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The solid-state diffusion bonding experiments of high Nb containing TiAl alloy were successfully carried out at 950°C under a uniaxial pressure of 30MPa for 45min, and the influence of different initial microstructures, such as initial forged microstructure (named duplex microstructure) with different grain sizes, near lamellar microstructure and full lamellar microstructure, on the interface of the bonding joints were investigated. And the microstructure characterization of interfaces was taken by OM, SEM, EDS and micro-hardness tester. The results indicated that the grain size and strain energy are of great importance to improve the quality of interfacial bonding. Besides, the interfacial microstructure was found different from matrix and changed during the diffusion bonding process. Meanwhile, micro-hardness tests of the three kinds of joints showed that the micro-hardness in the interface was slightly higher than matrix in all the joints, resulted from the working hardening of the interface under the uniaxial pressure.

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Jang, Woong Ki, Yoo Su Kang, Young Ho Seo et Byeong Hee Kim. « The manufacturing of a surface anchor structure for the electroless plating of a three-dimensional antenna integrated with a mobile device case ». Advances in Mechanical Engineering 12, n^o 9 (septembre 2020) : 168781402095857. http://dx.doi.org/10.1177/1687814020958576.

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This study proposes a method to improve the manufacturing process of a surface anchor structure for the injection molding along with bonding properties of the plating layer for antennas, which can be applied to the Laser Direct Plating (LDP) process for the production of a three-dimensional antenna integrated with a mobile device case. By adjusting parameters such as the output of the laser processing, scanning speed, and pulse recurrence frequency, a micro anchor structure was developed on the surface of the injection mold. The measurement of the surface roughness using a 3D surface profiler showed that the roughness improved by approximately 3.6 times, from 0.96 to 3.24 µm. In addition, the zigzag arrangement of the micro anchor structure was improved by 1.2 times compared to the even arrangement. Furthermore, if the micro anchor structure contained a wall after laser processing, the bonding strength of the plating solution was 69%; with no wall, it was 94% or higher. Thus, the existence of walls resulted in a difference of 1.4 times in the bonding strength. The laser processing improved the bonding strength of the plating solution on the micro anchor structure by approximately 19 times.

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SHI Ya-li, 史亚莉, 李福东 LI Fu-dong, 杨鑫 YANG Xin, 张正涛 ZHANG Zheng-tao et 徐德 XU De. « pL class adhesive dispensing approach for micro bonding ». Optics and Precision Engineering 20, n^o 12 (2012) : 2744–50. http://dx.doi.org/10.3788/ope.20122012.2744.

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Ito, Takeshi, Kazuharu Sobue et Seishiro Ohya. « Water glass bonding for micro-total analysis system ». Sensors and Actuators B : Chemical 81, n^o 2-3 (janvier 2002) : 187–95. http://dx.doi.org/10.1016/s0925-4005(01)00951-0.

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Ishii, Takao, et Shinji Aoyama. « Novel micro-bump fabrication for flip-chip bonding ». Journal of Electronic Materials 33, n^o 11 (novembre 2004) : L21—L23. http://dx.doi.org/10.1007/s11664-004-0172-0.

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Yin, Zhifu, et Helin Zou. « Experimental and Numerical Study on PDMS Collapse for Fabrication of Micro/Nanochannels ». Journal of Electrical Engineering 67, n^o 6 (1 décembre 2016) : 414–20. http://dx.doi.org/10.1515/jee-2016-0060.

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Abstract PDMS (polydimethylsiloxane) collapse method is a simple and low cost approach for micronanochannel fabrication. However, the bonding pressure which influences the size of the final PDMS micro/nanochannels has not yet been studied. In this study, the effect of the bonding pressure on the size and maximum local stress of the PDMS micronanochannels was investigated by both experimental and numerical simulation method. The results show that when the bonding pressure is lower than 0.15 MPa the experiment results can agree well with the simulation results. The fluorescent images demonstrate that there is no blocking or leakage over the entire micro/nanochannels.

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Hwang, Yeong-Maw, Cheng-Tang Pan, Bo-Syun Chen et Sheng-Rui Jian. « Numerical Analysis of the Welding Behaviors in Micro-Copper Bumps ». Metals 11, n^o 3 (11 mars 2021) : 460. http://dx.doi.org/10.3390/met11030460.

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In this study, three-dimensional simulations of the ultrasonic vibration bonding process of micro-copper blocks were conducted using the finite element method. We analyzed the effects of ultrasonic vibration frequency on the stress field, strain field, and temperature field at the copper bump joint surface. The results showed that the bonding process is successfully simulated at room temperature. The stress curve of the bonding process could be divided into three stages: stress rising stage, stress falling stage, and stress stabilization stage. Moreover, it was found that the end of the curve exhibited characteristics of a solid solution phase at higher frequencies. It is hypothesized that the high-density dislocations formed at this stage may result in conveyance channels that facilitate the atomic diffusion at the contact surface. The simulation results indicated that copper micro-bump bonding occurs at an ultrasonic frequency of 50 kHz or higher.

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Zhang, Lu, Wendong Zhang, Shougang Zhang et Shubin Yan. « Micro-fabrication and hermeticity measurement of alkali-atom vapor cells based on anodic bonding ». Chinese Optics Letters 17, n^o 10 (2019) : 100201. http://dx.doi.org/10.3788/col201917.100201.

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Zhu, Fu Dong, et Bi Yun Zhu. « Research on Laser-Hybrid Cladding of Ni-Cr Alloy on Copper ». Key Engineering Materials 744 (juillet 2017) : 270–74. http://dx.doi.org/10.4028/www.scientific.net/kem.744.270.

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In order to improve the wear resistance of the surface of thick copperplate, A layer of Ni-Co-Cr alloy on thick copperplate surface is performed by laser –hybrid cladding process. In laser cladding processing, it is known that it is difficult to get good metallurgical bonding between the layer and copperplate. Micro-arc deposition technology is developed to get a thin alloy layer on the surface of thick copperplate, and then using laser cladding method to make thick coating. Micro organization analysis and wear resistance comparison experiments are taken to the specimen. From the microscopic structure analysis, it can be seen that the deposition and substrate form favorable metallurgy bonding, as a narrow metallurgical bonding zone, about 20μm in width. The micro- structure photos show that the coating is more compact, and crystal grains are refined grain composed of γ-Ni, Cr7C3 and CrB. The micro-hardness of the cladding zone is between 650HV~850HV, which is much higher than the copper substrate. Roughness measurement of the specimens shows that the cladding layer is smoother. The experiment’s result shows that laser-arc hybrid cladding can perform coating of Ni-Cr alloy, metallurgy bonding with the copperplate, on its surface.

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Sun, Yi Bo, Yi Luo, Xiao Dong Wang et Yu Qi Feng. « Molecular Dynamics Simulation of Diffusion Behavior for Thermalplastic Fusion Bonding ». Advanced Materials Research 217-218 (mars 2011) : 45–50. http://dx.doi.org/10.4028/www.scientific.net/amr.217-218.45.

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As a convenient way for the assembly of thermal plastic MEMS (Micro Electro-Mechanical Systems) devices fusion bonding was studied in molecular level. The diffusion behavior of polymer molecular chains was simulated by molecular dynamics. Amorphous PMMA (poly methyl methacrylate) layer were constructed. The interaction of PMMA layers in heating and cooling stages were simulated in NPT ensemble. In the simulation the PMMA molecular chains spread across the interface and entangled with the chains in the other layers. The factors including pressure and temperature which play important role in fusion bonding were analyzed in molecular level. System deformation was recorded in heating and cooling progress. Diffusion depth and binding energy in the model which had experienced heating and cooling simulation were obtained to investigate fusion degree. Deformation and fusion degree increase with larger pressure and higher temperature imposed to the system. It is concluded that only considering the diffusion of molecular chains parameters of relatively small pressure and high temperature are necessary to obtain precise bonding for micro joint, which is significant in guiding the precise bonding for micro assembly.

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Zhang, Chen, Dongbin Zhang, Can Luo, Weiping Peng et Xusheng Zang. « Nanosecond-Pulse Laser Assisted Cold Spraying of Al–Cu Aluminum Alloy ». Coatings 11, n^o 3 (25 février 2021) : 267. http://dx.doi.org/10.3390/coatings11030267.

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In this study, nanosecond-pulse laser is used in combination with cold spraying to form a hybrid solid-state forming technology: nanosecond-pulse laser assisted cold spraying. This method successfully manufactured Al-Cu high-strength aluminum alloy coatings. The nanosecond-pulse laser reduced the porosity of the coatings. The laser-induced micro-texture on the substrate surface had the ability of improving the bonding strength of the coating-substrate interface. The bonding strength was closely related to the depth of the micro-texture. The deeper micro-texture caused an unfused interface on the bottom of the texture, which produced voids and reduced the bonding strength. The nanosecond-pulse lasers can also increase the hardness of the coatings. The assistance of the nanosecond-pulse laser has proved to be an effective method to improve the quality of cold sprayed metal coatings.

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KUMAGAI, Koichi, Akira KABESHITA et Osamu YAMAZAKI. « Micro-Interconnection Technology. Production Engineering of Micro Connections in Stud-Bump-Bonding Packaging. » Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits 10, n^o 6 (1995) : 368–72. http://dx.doi.org/10.5104/jiep1995.10.368.

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Kageyama, Syotaro, Yuichi Nakazato et Sugiya satou. « 317 Study on Manipulation in Micro Region and Micro-bonding Under Vacuum Enviroment ». Proceedings of the JSME annual meeting 2008.8 (2008) : 33–34. http://dx.doi.org/10.1299/jsmemecjo.2008.8.0_33.

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Chandrappa, Kasigavi, et Joel Hemanth. « Optimization of Process Parameters of Diffusing Bonding of Titanium with Titanium and Titanium with Copper ». Advanced Materials Research 856 (décembre 2013) : 153–58. http://dx.doi.org/10.4028/www.scientific.net/amr.856.153.

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The diffusion bonding of Ti to Ti, Ti-Cu alloy at different temperatures ranging from 673 K to 923 K under an applied stress of 100 MPa for 1 h was studied. The observation of the microstructure reveals that sound joints between the Ti-Ti and dissimilar titanium/Copper metals sheet were successfully joined by diffusion bonding process. Ti-Cu alloy without any pores or cracks can be achieved through diffusion bonding at temperatures over 873 K under the applied stress of 100 MPa for 1 h. The bond is composed of the zones, and its width increases with the increase of bonding temperature. The Micro hardness at the interface of joints bonded under different conditions was evaluated through Micro hardness testing and the fracture mode was analyzed by SEM observation.

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Jiang, Zheng Yi, Mahadi Hasam, Hamidreza Kamali, Fang Hui Jia et Hai Bo Xie. « Micromanufacturing Technology and its Practice ». Solid State Phenomena 311 (octobre 2020) : 12–20. http://dx.doi.org/10.4028/www.scientific.net/ssp.311.12.

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In order to make micro composite drills (Fig. 1), cemented tungsten carbide (WC-10Co) and high strength (AISI 4340) steel were successfully bonded by hot compaction diffusion bonding at a low temperature. The effects of holding time, pressure and temperature on microstructure and mechanical properties of the sintered carbides and bonding strengths of the bimetallic composites were examined, and a transitional layer was found at the interface as a result of elemental inter-diffusion. The optimal bonding parameters were determined to achieve the maximum bonding strength of 226 MPa of the WC-10Co/AISI 4340 steel joints, which is helpful in producing micro composite drills. Microforming is introduced to produce lighter and more energy effective products. In this study, Magnesium-Lithium (Mg-Li) alloy, new material in microscale, was chosen to superior formed micro-cup due to its ultralight weight with outstanding ductility. The dry and oil lubrication conditions were chosen as benchmarks to investigate effects of a novel oil-based nanoparticle lubricant in micro deep drawing (MDD) process of Mg-Li alloy. Finite Element (FE) modelling was conducted and the simulation results of the drawing force were in a good agreement with the experimental results. The formed cup quality with consideration on the surface roughness has been extensively evaluated and the results illustrated the quality improvement was substantial.

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WANG, Tao, Jian CAI, Qian WANG, Hao ZHANG et Zheyao WANG. « Design and Fabrication of WLP Compatible Miniaturized Pressure Sensor System with Through Silicon Via (TSV) Interconnects ». International Symposium on Microelectronics 2011, n^o 1 (1 janvier 2011) : 000033–43. http://dx.doi.org/10.4071/isom-2011-ta1-paper5.

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In this paper, a Wafer Level Packaging (WLP) compatible pressure sensor system enabled with Through Silicon Via (TSV) and Au-Sn inter-chip micro-bump bonding is designed and fabricated in lab, in which TSV transmits electrical signal from piezoresistive circuit to processing circuit vertically. The pressure sensor system includes TSV integrated piezoresistive pressure sensor chip and Read-Out Integrated Chip (ROIC) in which TSV also incorporated. Two CMOS compatible fabrication process flows for pressure sensor system are demonstrated. And, flip chip bonding structure of TSV integrated pressure sensor with a ROIC are realized using one of these two process flows. Inter-chip interconnects enabled with TSV and micro-bump bonding is obtained.

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Zhang, Qingdong, Shuo Li, Rui Li et Boyang Zhang. « Multiscale Comparison Study of Void Closure Law and Mechanism in the Bimetal Roll-Bonding Process ». Metals 9, n^o 3 (18 mars 2019) : 343. http://dx.doi.org/10.3390/met9030343.

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The void closure mechanism during the roll-bonding process was investigated using a multiscale approach, which includes contact deformation at the macro-scale and atomic bonding at the micro-scale. The closure process of the voids was observed using roll-bonding tests of 304 stainless steel/Q235 carbon steel. A finite element model was built to simulate the macroscopic deformation process of 304/Q235 material, and a molecular dynamics model established to simulate the deformation process of the microscopic rough peaks. The closure law and mechanism of interface voids at the macro- and micro-scales were studied. The results show that the closure rate of interface voids decreases with the decrease in the average contact stress during the contact deformation process. In the atomic bonding process, the void closure rate is slow in the elastic deformation process. The ordered atoms near the interface become disordered as plastic deformation occurs, which increases the void closure rate and hinders dislocation propagation through the interface, resulting in significant strengthening effects via plastic deformation. Ultimately, a perfect lattice is reconstructed with void healing. In addition, the interface morphology after roll-bonding at the macro scale was determined by the morphology of the 304 steel with larger yield strength ratio, while the interface morphology at the micro-scale was mainly determined by the morphology of the Q235 steel with a higher yield strength.

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Stoleriu, Simona, Sorin Andrian, Irina Nica, Andrei Victor Sandu, Galina Pancu, Alice Murariu et Gianina Iovan. « Evaluation of Adhesive Capacity of Universal Bonding Agents Used in Direct Composite Resins Repair ». Materiale Plastice 54, n^o 3 (30 septembre 2017) : 574–77. http://dx.doi.org/10.37358/mp.17.3.4899.

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The aims of the study were to characterise the resin-resin interface when a universal bonding agent (UBA) was used in two different strategies in direct composite repair and to evaluate the bonding capacity of UBA by microleakage assessment. In study groups a micro-filled hybrid and a nano-filled hybrid composite resins were aged in order to simulate an old restorations. As a repair material was chosen the same micro-filled hybrid composite resin that was used as an old restoration. UBA was applied in etch-and-rinse and self-etch strategies and was used as an intermediate layer in repair procedure. After the repair the samples were aged again. In control groups were included non-aged, repaired composite resins samples. The resin-resin interface was characterised on SEM images and the microleakage at the interface was evaluated by dye penetration assessment. Universal bonding agent used in direct composite resins repair showed a very good adaptation to non-aged micro-filled hybrid and nano-filled hybrid composite resins. Aging by saliva storage of repaired composite resins leaded to an enlargement of resin-resin junction and a increased microleakage irrespective of the strategy (etch-and-rinse or self -etch) used for bonding agent application. Etch-and-rinse strategy for universal bonging agent application determined a better interface bonding when compared to self -etch strategy.

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