Bibliographies thématiques / MICRO-BONDING

Littérature scientifique sur le sujet « MICRO-BONDING »

Auteur : Grafiati
Publié le 11 septembre 2023

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Articles de revues sur le sujet "MICRO-BONDING"

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Kim, Joo-Han, et Chul-Ku Lee. « Laser Micro Bonding Technology ». Journal of the Korean Welding and Joining Society 25, no 2 (30 avril 2007) : 1–2. http://dx.doi.org/10.5781/kwjs.2007.25.2.001.

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Gu, Yao Xin, et Hong Chao Qiao. « Study on the Manufacturing Process of Polymer Microfluidic Chip with Integrated Cu Micro Array Electrode ». Applied Mechanics and Materials 723 (janvier 2015) : 884–87. http://dx.doi.org/10.4028/www.scientific.net/amm.723.884.

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To produce perfect polymer microfluidic chip with integrated metal micro array electrode, an oxygen-plasma assisted manufacturing process was developed. The Cu micro array electrodes on the poly substrate was formed by photolithography, sputtering and wet etching; the micro channels on the polymer plate were hot-embossed using metal master; the bonding of cover plate and substrate using thermal bonding. The surface of the polymer plate with micro channels was treated by oxygen-plasma before thermal bonding. The oxygen-plasma treatment could decrease thermal bonding temperature from 100 °C to 85 °C. The bonding of this chip is complete, the micro electrode array keeps its integrity, and the micro channel is not distorted obviously.
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Shoda, Koki, Minori Tanaka, Kensuke Mino et Yutaka Kazoe. « A Simple Low-Temperature Glass Bonding Process with Surface Activation by Oxygen Plasma for Micro/Nanofluidic Devices ». Micromachines 11, no 9 (25 août 2020) : 804. http://dx.doi.org/10.3390/mi11090804.

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The bonding of glass substrates is necessary when constructing micro/nanofluidic devices for sealing micro- and nanochannels. Recently, a low-temperature glass bonding method utilizing surface activation with plasma was developed to realize micro/nanofluidic devices for various applications, but it still has issues for general use. Here, we propose a simple process of low-temperature glass bonding utilizing typical facilities available in clean rooms and applied it to the fabrication of micro/nanofluidic devices made of different glasses. In the process, the substrate surface was activated with oxygen plasma, and the glass substrates were placed in contact in a class ISO 5 clean room. The pre-bonded substrates were heated for annealing. We found an optimal concentration of oxygen plasma and achieved a bonding energy of 0.33–0.48 J/m2 in fused-silica/fused-silica glass bonding. The process was applied to the bonding of fused-silica glass and borosilicate glass, which is generally used in optical microscopy, and revealed higher bonding energy than fused-silica/fused-silica glass bonding. An annealing temperature lower than 200 °C was necessary to avoid crack generation by thermal stress due to the different thermal properties of the glasses. A fabricated micro/nanofluidic device exhibited a pressure resistance higher than 600 kPa. This work will contribute to the advancement of micro/nanofluidics.
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Ohashi, Osamu, Miho Narui, Kensaku Aihara, Kazutoshi Harada, Masaki Hosaka, Hajime Inagaki et Osamu Tsuya. « Ancient Micro Bonding of Gold ; Granulation ». Materia Japan 55, no 10 (2016) : 468–74. http://dx.doi.org/10.2320/materia.55.468.

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Yang Mengsheng, 杨蒙生, 邢丕峰 Xing Pifeng, 郑凤成 Zheng Fengcheng, 谢军 Xie Jun, 刘学 Liu Xue, 马小军 Ma Xiaojun et 易泰民 Yi Taimin. « Precise bonding of Cu micro-sphere ». High Power Laser and Particle Beams 26, no 5 (2014) : 52008. http://dx.doi.org/10.3788/hplpb20142605.52008.

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SHI Ya-li, 史亚莉, 张文生 ZHANG Wen-sheng, 徐德 XU De, 张正涛 ZHANG Zheng-tao et 张娟 ZHANG Juan. « Time/pressure pL micro-bonding technology ». Optics and Precision Engineering 19, no 11 (2011) : 2724–30. http://dx.doi.org/10.3788/ope.20111911.2724.

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Mehlmann, Benjamin, Elmar Gehlen, Alexander Olowinsky et Arnold Gillner. « Laser Micro Welding for Ribbon Bonding ». Physics Procedia 56 (2014) : 776–81. http://dx.doi.org/10.1016/j.phpro.2014.08.085.

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Böhm, S., K. Dilger, J. Hesselbach, J. Wrege, S. Rathmann, W. Ma, E. Stammen et G. Hemken. « Micro bonding with non-viscous adhesives ». Microsystem Technologies 12, no 7 (7 février 2006) : 676–79. http://dx.doi.org/10.1007/s00542-006-0101-7.

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Wang, Chun Yu, Qing Wang, Han Zhu Li, Xiao Zhi Ji et Zhi Long Kang. « Optimized Wire Bonding Process on Micro-Connection Pad with Ni/CeO2 Coatings ». Applied Mechanics and Materials 275-277 (janvier 2013) : 1925–28. http://dx.doi.org/10.4028/www.scientific.net/amm.275-277.1925.

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Keywords: Electroless plating Ni, CeO2, Micro-connection pad, Wire bonding Abstract. It is Ni/CeO2 coatings that have been prepared on SiC/Al composites surfaces (electroless plating Ni and depositing CeO2 conversion coatings). It is employed to wire bonding process as a new micro-connection pad in this paper. During bonding process, ultrasonic time, ultrasonic power, bonding pressure, etc. have been investigated. The optimized parameters are obtained with the best bonding properties.
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Yang, Jun Ru, Kun Guo, Yu Rong Chi, Xue Cheng Chen et Hai Tao Feng. « Molecular Dynamics Simulation of the Propagation Property of the Interface Micro Crack in Ternary Boride Hard Cladding Material ». Materials Science Forum 861 (juillet 2016) : 264–69. http://dx.doi.org/10.4028/www.scientific.net/msf.861.264.

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The interface of the ternary boride hard cladding material consists of hard phase (Mo2FeB2) and bonding phase (α-Fe). In this paper, on the basis of the ideal interface model of Mo2FeB2 (100)/α-Fe (001) built with the molecular dynamics software, the Mo2FeB2 (100)/α-Fe (001) interface models with micro-cracks parallel with the interface, normal to the interface, and inclined to the interface have been built separately. The interface bonding energies of these four different interface models have been calculated, which shows that the interface model with the micro crack inclined to the interface has the biggest interface bonding energy, while the interface model with the micro crack parallel with the interface has the smallest bonding energy, the interface crack will be the most easily to propagate. The change rule of bonding energy of the interface model with the micro crack parallel with the interface with different lengths has been simulated and analyzed.
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Thèses sur le sujet "MICRO-BONDING"

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Kay, Robert William. « Novel micro-engineered stencils for flip-chip bonding and wafer level packaging ». Thesis, Heriot-Watt University, 2008. http://hdl.handle.net/10399/2193.

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Andersson, Martin. « Ag-In transient liquid phase bonding for high temperature stainless steel micro actuators ». Thesis, Uppsala universitet, Mikrosystemteknik, 2013. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-207559.

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A stainless steel, high temperature, phase change micro actuator has been demonstrated using the solid-liquid phase transition of mannitol at 168°C and In-Ag transient liquid phase diffusion bonding. Joints created with this bonding technique can sustain temperatures up to 695°C, while being bonded at only 180°C, and have thicknesses between 1.4 to 6.0 μm. Physical vapour deposition, inkjet printing and electroplating have been evaluated as deposition methods for bond layers. For actuation, cavities were filled with mannitol and when heated, the expansion was used to deflect a 10 μm thick stainless steel membrane. Bond strengths of the joints are found to be in the region of 0.51 to 2.53 MPa and pressurised cavities sustained pressures of up to 30 bar. Bond strength is limited by the bond contact area and the surface roughness of the bonding layers.
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Ahmad, Zakiah. « Nano-and micro-particle filled epoxy-based adhesives for in-situ timber bonding ». Thesis, University of Bath, 2008. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.478940.

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Lu, Chunmeng. « Development of novel micro-embossing methods and microfluidic designs for biomedical applications ». Columbus, Ohio : Ohio State University, 2006. http://rave.ohiolink.edu/etdc/view?acc%5Fnum=osu1156820643.

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Leal, Ayala Angel Andres. « Effect of intermolecular hydrogen bonding on the micro-mechanical properties of high performance organic fibers ». Access to citation, abstract and download form provided by ProQuest Information and Learning Company ; downloadable PDF file, 307 p, 2008. http://proquest.umi.com/pqdweb?did=1597616621&sid=11&Fmt=2&clientId=8331&RQT=309&VName=PQD.

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Struble, John D. « Micro-scale planar and two-dimensional modeling of two phase composites with imperfect bonding between matrix and inclusion ». Thesis, Georgia Institute of Technology, 2002. http://hdl.handle.net/1853/17345.

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Yang, Keqin. « Inter-tube bonding and defects in carbon nanotubes and the impact on the transport properties and micro-morphology ». Connect to this title online, 2009. http://etd.lib.clemson.edu/documents/1263408693/.

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Dutto, Mathieu. « Procédé micro-ondes pour l’élaboration de composites B4C-SiC par infiltration et réaction de silicium, en vue d’applications balistiques ». Thesis, Lyon, 2017. http://www.theses.fr/2017LYSEM021/document.

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De nombreuses études ont montré la faisabilité de la fabrication de pièces composites en carbure de bore et de silicium par l’infiltration de silicium fondu dans une préforme poreuse en carbure de bore (Reaction bonding). Cette méthode permet l’obtention d'un composite fortement chargé en carbure de bore (phase qui nous intéresse pour les applications balistiques), sans pour autant avoir besoin de monter à des températures de frittage de plus de 2200°C (température habituellement utilisée pour fritter le B4C). Dans notre cas la température maximale est comprise entre 1400-1600°C. Cette thèse s’intéresse plus particulièrement à l’adaptation du procédé de « reaction bonding » au chauffage sous champ micro-ondes. Les micro-ondes sont particulièrement intéressantes en ce qui concerne la rapidité du cycle thermique et le chauffage préférentiel de certaines phases (dans le cas des multi-matériaux). Pour ce faire, plusieurs verrous technologiques ont dû être levés (travail sous atmosphère et sous champs électromagnétiques, température élevée, …). Les composites obtenus sont comparés à leurs équivalents en chauffage conventionnel. Des différences microstructurales ont été observées au niveau du SiC formé lors de la réaction. Cette thèse nous a donc permis de :-trouver des conditions de fabrication de pièces en carbure de bore par chauffage micro-ondes (Argon/Hydrogéné10%, légère surpression : 1.4 bars)-montrer que les propriétés mécaniques (dureté, module d’Young,…) obtenues en four micro-ondes sont équivalentes à celles obtenus en four conventionnel (dureté : 14-20GPa) -montrer d’importante différences microstructurales du carbure de silicium formé, entre les échantillons obtenus sous vide (four conventionnel) et ceux obtenus sous atmosphère contrôlée (micro-ondes et four conventionnel).-montrer que le passage à des plus grandes tailles est possible, il est même plus simple d’infiltrer de grandes pièces que de petites à cause de l’effet de la masse sur la réponse du matériau aux champs électromagnétiques des micro-ondes.Ces résultats sont très prometteurs pour des applications balistiques : fabrication de gilets pare-balles et blindages légers
Many studies have shown the feasibility of processing silicon-boron carbide composite by infiltration of molten silicon through a porous preform made of boron carbide (Reaction Bonding Process). Using this method, the obtained composite contains a large amount of boron carbide, which is the hardest and the most interesting phase for ballistic application. In our developed process, the maximum processing temperature is 1600°C, which is far below the usual high temperature stage/pressure conditions commonly used to sinter B4C by conventional method (respectively 2200°C and40MPa). The main goal of this thesis is to develop a novel reaction bonded process based on microwave heating. Microwaves heating has many interesting features, including fast heating process, selective heating mechanism (in case of heating multi-materials) and volumetric heating distribution. . To fulfill our goal, many technological issues need to be addressed (working in controlled atmosphere and under microwave field, high temperature ...). This thesis reports the development of this novel process, and materials made from it, exhibit similar properties compared to those made conventionally. However, some microstructural differences were observed in SiC resulting phases. This thesis has allowed to-find out the boron carbide composite piece fabrication conditions in microwave cavity (Argon/Hydrogen10%, slight overpressure: 14bars)-show that mechanical properties (hardness, Young’s modulus…) obtained are comparable to those measured on conventionally reaction bonded produced materials. -show that formed SiC has some microstructural peculiarities, between vacuum samples (for conventional) and ones obtained in hydrogenous argon (using microwave).-show that it is possible to produce larger size piece (66mm of diameter). These results are shown to be promising for ballistic applications, including the fabrication of bulletproof jacket and light armor
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Allenet, Timothée. « Réalisation d'un micro-capteur optofluidique pour la mesure déportée de radionucléides ». Thesis, Université Grenoble Alpes (ComUE), 2018. http://www.theses.fr/2018GREAT041/document.

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L’exploitation de l’énergie nucléaire pour la production d’électricité présente un défi de gestion des e˜uents radiotoxiques pour les générations présentes et futures. Face à ce constat, la communauté des chimistes recherche continument à améliorer les solutions de traitement et de recyclage du combustible usé. Dans le contrôle de ces procédés, les opérations d’analyse jouent un rôle primordial. La miniaturisation des procédés est un des enjeux principaux de la recherche en sûreté nucléaire, dans un e˙ort de réduction des risques, des délais et des coûts des activités de laboratoire. Dans ce contexte, les travaux présentés ici sont issus d’une collaboration entre le CEA de Marcoule et l’IMEP-LAHC et traitent de la mise au point d’un microsystème optofluidique sur verre, adapté à la mesure de concentration de plutonium (VI) en acide nitrique. Une source de lumière sonde est confinée dans un guide d’onde obtenu par échange d’ions et interagit par onde évanescente avec un canal microfluidique. La raie d’absorption à 832 nm du Pu(VI) dans la solution à analyser devient donc observable dans le spectre de la lumière après une certaine longueur d’interaction. Un des enjeux principaux est de fabriquer un capteur très robuste, fonctionnel en boîte à gants. L’assemblage du dispositif est e˙ectué par collage moléculaire avec un procédé permettant d’atteindre une énergie de surface > 2, 5 J·m2 suÿsante à garantir la tenue du dispositifs à des pressions testées jusqu’à 2 bars dans les canaux. Les fonctions optiques et fluidiques du dispositif sont complètement interfacées avec des fibres optiques et des capillaires fluidiques. Des mesures spectrales d’une solution de plutonium (VI) en acide nitrique ont permis de vérifier la compatibilité de la solution technologique abordée pour la manipulation d’acides forts et la résistance à l’irradiation. Le système présente une limite de détection de 1,6·10−2 mol·L−1 Pu(VI) pour un volume sondé inférieur à 1 nano-litre, au sein d’un microcanal de 21 micro-litres. Une structure permettant d’optimiser la sensibilité du capteur ainsi que le volume du canal est étudiée en perspective du travail de thèse, afin d’atteindre les performances équivalentes à des outils commerciaux pour des volumes sondés de l’ordre de quelques nano-litres
.The use of nuclear energy for electricity production presents an important concern with radiotoxic waste management for present and future generations. In view of this fact, the chemists’ community has been searching for solutions to treat and recycle nu-clear fuel. The miniaturization of chemical processes is extensively sought out nowerdays, in an attempt to reduce laboratory acivity risks, delays and costs. The researched ana-lytical innovation requires subsequent development of appropriate analysis tools. In this respect, the work presented here addresses the development of co-integrated optofluidic micro-systems on borosilicate glass, compatible with nuclear e˜uent analysis constraints. A spectrometric sensor is designed, fabricated, interfaced and characterized in a nuclear environement. An optical waveguide and a microfluidic channel are designed adjacent to one another in order to obtain wide-spectrum absorption spectroscopy measurements by light/fluid evanescent interaction. Both ion-exchange technology and wet-etching tech-nologies were used to create the optical and fluidic planar functions. The device is assem-bled by direct molecular bonding with an optimized protocole which withstands surface energies > 2, 5 J·m2. Sensor optical and fluidic functions are interfaced with fiber optics and fluid capillaries in order for the chip to be used within a plug-and-play detection chain. Spectral measurements of a plutonium(VI) in nitric acid solution have allowed to verify the technological solution’s compatibility with harsh acid manipulation and irra-diation resistance. The system put together for the detection of plutonium(VI) displays a detection limit of 1.6×10−2 mol·L−1 for a probed volume below 1 nano-liter, inside a 21 micro-liter channel. A new sensor design is studied in the thesis work perspectives in order to optimize sensor detection limit and channel volume and reach industrial tools analytical performances with nano-liter sample volumes
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Samel, Björn. « Novel Microfluidic Devices Based on a Thermally Responsive PDMS Composite ». Doctoral thesis, KTH, Mikrosystemteknik, 2007. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-4470.

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The field of micro total analysis systems (μTAS) aims at developments toward miniaturized and fully integrated lab-on-a-chip systems for applications, such as drug screening, drug delivery, cellular assays, protein analysis, genomic analysis and handheld point-of-care diagnostics. Such systems offer to dramatically reduce liquid sample and reagent quantities, increase sensitivity as well as speed of analysis and facilitate portable systems via the integration of components such as pumps, valves, mixers, separation units, reactors and detectors. Precise microfluidic control for such systems has long been considered one of the most difficult technical barriers due to integration of on-chip fluidic handling components and complicated off-chip liquid control as well as fluidic interconnections. Actuation principles and materials with the advantages of low cost, easy fabrication, easy integration, high reliability, and compact size are required to promote the development of such systems. Within this thesis, liquid displacement in microfluidic applications, by means of expandable microspheres, is presented as an innovative approach addressing some of the previously mentioned issues. Furthermore, these expandable microspheres are embedded into a PDMS matrix, which composes a novel thermally responsive silicone elastomer composite actuator for liquid handling. Due to the merits of PDMS and expandable microspheres, the composite actuator's main characteristic to expand irreversibly upon generated heat makes it possible to locally alter its surface topography. The composite actuator concept, along with a novel adhesive PDMS bonding technique, is used to design and fabricate liquid handling components such as pumps and valves, which operate at work-ranges from nanoliters to microliters. The integration of several such microfluidic components promotes the development of disposable lab-on-a-chip platforms for precise sample volume control addressing, e.g. active dosing, transportation, merging and mixing of nanoliter liquid volumes. Moreover, microfluidic pumps based on the composite actuator have been incorporated with sharp and hollow microneedles to realize a microneedle-based transdermal patch which exhibits on-board liquid storage and active dispensing functionality. Such a system represents a first step toward painless, minimally invasive and transdermal administration of macromolecular drugs such as insulin or vaccines. The presented on-chip liquid handling concept does not require external actuators for pumping and valving, uses low-cost materials and wafer-level processes only, is highly integrable and potentially enables controlled and cost-effective transdermal microfluidic applications, as well as large-scale integrated fluidic networks for point-of care diagnostics, disposable biochips or lab-on-a-chip applications. This thesis discusses several design concepts for a large variety of microfluidic components, which are promoted by the use of the novel composite actuator. Results on the successful fabrication and evaluation of prototype devices are reported herein along with comprehensive process parameters on a novel full-wafer adhesive bonding technique for the fabrication of PDMS based microfluidic devices.
QC 20100817
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Livres sur le sujet "MICRO-BONDING"

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Center for Women's Resources (Philippines) et International Consultation on Micro-Chips Technology (1986 Manila, Philippines). From bonding wires to banding women : Proceedings of the International Consultation on Micro-Chips Technology, Manila, Philippines, 1986. Quezon City : Center for Women's Resources, 1988.

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Al-dhalaan, Hussein. Plate-bonding analysis in a micro-computer environment. 1986.

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Ayala, Angel Andres Leal. Effect of Intermolecular Hydrogen Bonding on the Micro-Mechanical Properties of High Performance Organic Fibers. ProQuest, UMI Dissertation Publishing, 2012.

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From bonding wires to banding women : Proceedings of the International Consultation on Micro-Chips Technology, Manila, Philippines, 1986. Center for Women's Resources, 1988.

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Chapitres de livres sur le sujet "MICRO-BONDING"

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Bushnell, Cade. « Chapter 8. Micro-bonding moments ». Dans Bonding through Context, 173–96. Amsterdam : John Benjamins Publishing Company, 2020. http://dx.doi.org/10.1075/pbns.314.08bus.

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Yu, Haiyang. « Immediate Dentin Sealing and Micro Bonding ». Dans Digital Guided Micro Prosthodontics, 179–206. Singapore : Springer Nature Singapore, 2022. http://dx.doi.org/10.1007/978-981-19-0256-7_12.

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Colinge, Cynthia A. « Wafer Bonding for Micro-ElectroMechanical Systems (MEMS) ». Dans Perspectives, Science and Technologies for Novel Silicon on Insulator Devices, 269–80. Dordrecht : Springer Netherlands, 2000. http://dx.doi.org/10.1007/978-94-011-4261-8_26.

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Koller-Hodac, Agathe, Manuel Altmeyer et Silvio Walpen. « Precision Assembling and Hybrid Bonding for Micro Fluidic Systems ». Dans Precision Assembly Technologies and Systems, 65–72. Berlin, Heidelberg : Springer Berlin Heidelberg, 2010. http://dx.doi.org/10.1007/978-3-642-11598-1_7.

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Takahashi, Yasuo, Masakatsu Maeda, Takehisa Doki et Souta Matsusaka. « Room Temperature Micro-Bonding of Fine Wires to Foils ». Dans Solid State Phenomena, 277–82. Stafa : Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/3-908451-33-7.277.

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Suganuma, Katsuaki, et Jinting Jiu. « Advanced Bonding Technology Based on Nano- and Micro-metal Pastes ». Dans Materials for Advanced Packaging, 589–626. Cham : Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-45098-8_14.

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Berthold, A., P. M. Sarro et M. J. Vellekoop. « Quartz-to-Silicon Fusion Bonding for Micro Acoustic Wave Applications ». Dans Sensor Technology in the Netherlands : State of the Art, 213–17. Dordrecht : Springer Netherlands, 1998. http://dx.doi.org/10.1007/978-94-011-5010-1_34.

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Azmi, Tengku Muhammad Afif bin Tengku, et Nadzril bin Sulaiman. « Simulation and Fabrication of Micro Magnetometer Using Flip-Chip Bonding Technique ». Dans Lecture Notes in Electrical Engineering, 493–502. Singapore : Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-13-2622-6_48.

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Sugimoto, Masahiro, Hitoshi Saika, Shinsuke Shibata, Shouji Shinohara et Osamu Tabata. « A Novel Bonding Technique for Micro Polymer Chip Using Sacrificial Channel and Adhesive Printing ». Dans Micro Total Analysis Systems 2002, 398–400. Dordrecht : Springer Netherlands, 2002. http://dx.doi.org/10.1007/978-94-010-0295-0_133.

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Chan, Yick Chuen, Ralf Lenigk, Maria Carles, Nikolaus J. Sucher, Man Wong et Yitshak Zohar. « Glass-Silicon Bonding Technology with Feed-Through Electrodes for Micro Capillary Electrophoresis ». Dans Transducers ’01 Eurosensors XV, 1138–41. Berlin, Heidelberg : Springer Berlin Heidelberg, 2001. http://dx.doi.org/10.1007/978-3-642-59497-7_269.

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Actes de conférences sur le sujet "MICRO-BONDING"

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Gillner, Arnold, Michael J. Wild et Reinhart Poprawe. « Laser bonding of micro-optical components ». Dans Photonics Fabrication Europe, sous la direction de Andreas Ostendorf. SPIE, 2003. http://dx.doi.org/10.1117/12.468518.

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den Besten, C., R. E. G. van Hal, J. Munoz et P. Bergveld. « Polymer bonding of micro-machined silicon structures ». Dans [1992] Proceedings IEEE Micro Electro Mechanical Systems. IEEE, 1992. http://dx.doi.org/10.1109/memsys.1992.187699.

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Diller, Eric, Naicheng Zhang et Metin Sitti. « Bonding methods for modular micro-robotic assemblies ». Dans 2013 IEEE International Conference on Robotics and Automation (ICRA). IEEE, 2013. http://dx.doi.org/10.1109/icra.2013.6630931.

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Thomas, Simon, et Howard M. Berg. « Micro-Corrosion of Al-Cu Bonding Pads ». Dans 23rd International Reliability Physics Symposium. IEEE, 1985. http://dx.doi.org/10.1109/irps.1985.362091.

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Hwang, Tao-Joo, Dan O. Popa, Jian-Qiang Lu, Byoung-Hun Kang et Harry E. Stephanou. « BCB Wafer Bonding Compatible With Bulk Micro Machining ». Dans ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35011.

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Adhesive wafer bonding is a good substitute in wafer-to-wafer bonding applications requiring low processing temperatures and electrical potentials, though at the expense of difficulty with chemical, mechanical, and thermal stability over time. In the case of wafer bonding for Micro-Electro-Mechanical System (MEMS) applications, the problem is compounded not just by consideration of bond strength, but also by limitations in the way adhesives are delivered to the interface, since traditional spin-coating methods cannot be directly employed. A typical approach is the formation of micro-fluidic channels via wafer bonding, where the adhesive layer should only be present on the mesa structures. The introduction of BCB (benzocyclobutene), dry-etchable polymers, makes it possible to pattern the adhesive layer in a similar fashion with the rest of the bulk material. In this paper we present a BCB-based wafer bonding process, which is compatible with bulk micro machining. Depending on applications, BCB can replace the silicon oxide or silicon nitride as a hard mask in bulk micro machining. A process using BCB as both bonding adhesive and bulk-etch mask is a good option for stacking microstructures such as building micro-fluidic circuitry.
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Andrijasevic, Daniela, Ioanna Giouroudi, Walter Smetana, Stefan Boehm et Werner Brenner. « Hot gas stream application in micro-bonding technique ». Dans MOEMS-MEMS 2006 Micro and Nanofabrication, sous la direction de Danelle M. Tanner et Rajeshuni Ramesham. SPIE, 2006. http://dx.doi.org/10.1117/12.644688.

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Fromel, J., Y. C. Lin, M. Wiemer, T. Gessner et M. Esashi. « Low temperature metal interdiffusion bonding for micro devices ». Dans 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). IEEE, 2012. http://dx.doi.org/10.1109/ltb-3d.2012.6238080.

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Lu, Qin, Zhuo Chen, Anmin Hu, Ming Li et Dali Mao. « Low temperature bonding method using Cu micro cones ». Dans 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP). IEEE, 2012. http://dx.doi.org/10.1109/icept-hdp.2012.6474606.

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Guan, Rongfeng, Zhiyin Gan, Zhu Fulong, Xuefang Wang et Sheng Liu. « Anodic Bonding Study on Vacuum Micro Sealing Cavity ». Dans 2006 7th International Conference on Electronic Packaging Technology. IEEE, 2006. http://dx.doi.org/10.1109/icept.2006.359851.

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Eichwald, Paul, Andreas Unger, Florian Eacock, Simon Althoff, Walter Sextro, Karsten Guth, Michael Brokelmann et Matthias Hunstig. « Micro wear modeling in copper wire wedge bonding ». Dans 2016 IEEE CPMT Symposium Japan (ICSJ). IEEE, 2016. http://dx.doi.org/10.1109/icsj.2016.7801279.

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Rapports d'organisations sur le sujet "MICRO-BONDING"

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Rao, Nitya, Sheetal Patil, Maitreyi Koduganti, Chandni Singh, Ashwin Mahalingam, Prathijna Poonacha et Nishant Singh. Sowing Sustainable Cities : Lessons for Urban Agriculture Practices in India. Indian Institute for Human Settlements, 2023. http://dx.doi.org/10.24943/ssc12.2022.

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Despite growing interest and recognition of urban and peri-urban agriculture (UPA) as a nature- based solution, there is limited empirical evidence in countries like India on its role in reconfiguring goals on environmental functions (such as biodiversity, waste management, water recycling, micro-climate regulation, etc.) and social wellbeing (such as food and nutrition security, gender relations, work burdens, land tenure and community ties). A need to address this gap led to the ideation of the project ‘Urban and peri-urban agriculture as green infrastructures’ ( UPAGrI ). When UPAGrI started in 2019, the research on UPA in India was thin but growing. However, the practical experience of urban farming across Indian cities is thriving and diverse, built on decades of bottom-up experimentation. Within the landscape of our ever-changing cities, we found vibrant communities-of-practice sharing seeds and knowledge, engaged online influencers discussing composting and water reuse, and stories of farming becoming sites of multi-generational bonding and nutritional security. This compendium is a collection of 29 such innovative UPA practices from across the different cities in the country. These diverse case studies are loosely categorized into four themes: environment and sustainability; food, nutrition and livelihood; gender and subjective well-being; and urban policy and planning. Written mostly by practitioners themselves, the case studies collectively recognise and celebrate UPA innovations and practices, serving as a repository of lessons for peer-to-peer learning, and demonstrating how UPA can be one of the many solutions towards sustainable, liveable Indian cities.
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Rao, Nitya. Sowing Sustainable Cities : Lessons for Urban Agriculture Practices in India. Indian Institute for Human Settlements, 2023. http://dx.doi.org/10.24943/ssc12.2023.

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Despite growing interest and recognition of urban and peri-urban agriculture (UPA) as a nature- based solution, there is limited empirical evidence in countries like India on its role in reconfiguring goals on environmental functions (such as biodiversity, waste management, water recycling, micro-climate regulation, etc.) and social wellbeing (such as food and nutrition security, gender relations, work burdens, land tenure and community ties). A need to address this gap led to the ideation of the project ‘Urban and peri-urban agriculture as green infrastructures’ ( UPAGrI ). When UPAGrI started in 2019, the research on UPA in India was thin but growing. However, the practical experience of urban farming across Indian cities is thriving and diverse, built on decades of bottom-up experimentation. Within the landscape of our ever-changing cities, we found vibrant communities-of-practice sharing seeds and knowledge, engaged online influencers discussing composting and water reuse, and stories of farming becoming sites of multi-generational bonding and nutritional security. This compendium is a collection of 29 such innovative UPA practices from across the different cities in the country. These diverse case studies are loosely categorized into four themes: environment and sustainability; food, nutrition and livelihood; gender and subjective well-being; and urban policy and planning. Written mostly by practitioners themselves, the case studies collectively recognise and celebrate UPA innovations and practices, serving as a repository of lessons for peer-to-peer learning, and demonstrating how UPA can be one of the many solutions towards sustainable, liveable Indian cities.
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Litaor, Iggy, James Ippolito, Iris Zohar et Michael Massey. Phosphorus capture recycling and utilization for sustainable agriculture using Al/organic composite water treatment residuals. United States Department of Agriculture, janvier 2015. http://dx.doi.org/10.32747/2015.7600037.bard.

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Objectives: 1) develop a thorough understanding of the sorption mechanisms of Pi and Po onto the Al/O- WTR; 2) determine the breakthrough range of the composite Al/O-WTR during P capturing from agro- wastewaters; and 3) critically evaluate the performance of the composite Al/O-WTR as a fertilizer using selected plants grown in lysimeters and test-field studies. Instead of lysimeters we used pots (Israel) and one- liter cone-tainers (USA). We conducted one field study but in spite of major pretreatments the soils still exhibited high enough P from previous experiments so no differences between control and P additions were noticeable. Due to time constrains the field study was discontinued. Background: Phosphorous, a non-renewable resource, has been applied extensively in fields to increase crop yield, yet consequently has increased the potential of waterway eutrophication. Our proposal impetus is the need to develop an innovative method of P capturing, recycling and reuse that will sustain agricultural productivity while concurrently reducing the level of P discharge from and to agricultural settings. Major Conclusions & Achievements: An innovative approach was developed for P removal from soil leachate, dairy wastewater (Israel), and swine effluents (USA) using Al-based water treatment residuals (Al- WTR) to create an organic-Al-WTR composite (Al/O-WTR), potentially capable of serving as a P fertilizer source. The Al-WTR removed 95% inorganic-P, 80% to 99.9% organic P, and over 60% dissolved organic carbon from the agro-industrial waste streams. Organic C accumulation on particles surfaces possibly enhanced weak P bonding and facilitated P desorption. Analysis by scanning electron microscope (SEM- EDS), indicated that P was sparsely sorbed on both calcic and Al (hydr)oxide surfaces. Sorption of P onto WW-Al/O-WTR was reversible due to weak Ca-P and Al-P bonds induced by the slight alkaline nature and in the presence of organic moieties. Synchrotron-based microfocused X-ray fluorescence (micro-XRF) spectrometry, bulk P K-edge X-ray absorption near edge structure spectroscopy (XANES), and P K-edge micro-XANES spectroscopy indicated that adsorption was the primary P retention mechanism in the Al- WTR materials. However, distinct apatite- or octocalciumphosphatelike P grains were also observed. Synchrotron micro-XRF mapping further suggested that exposure of the aggregate exteriors to wastewater caused P to diffuse into the porous Al-WTR aggregates. Organic P species were not explicitly identified via P K-edge XANES despite high organic matter content, suggesting that organic P may have been predominantly associated with mineral surfaces. In screen houses experiments (Israel) we showed that the highest additions of Al/O-WTR (5 and 7 g kg⁻¹) produced the highest lettuce (Lactuca sativa L. var. longifolial) yield. Lettuce yield and P concentration were similar across treatments, indicating that Al/O- WTR can provide sufficient P to perform similarly to common fertilizers. A greenhouse study (USA) was utilized to compare increasing rates of swine wastewater derived Al/O-WTR and inorganic P fertilizer (both applied at 33.6, 67.3, and 134.5 kg P₂O₅ ha⁻¹) to supply plant-available P to spring wheat (TriticumaestivumL.) in either sandy loam or sandy clay loam soil. Spring wheat straw and grain P uptake were comparable across all treatments in the sandy loam, while Al/O-WTR application to the sandy clay loam reduced straw and grain P uptake. The Al/O-WTR did not affect soil organic P concentrations, but did increase phosphatase activity in both soils; this suggests that Al/O-WTR application stimulated microorganisms and enhance the extent to which microbial communities can mineralize Al/O-WTR-bound organic P. Implications: Overall, results suggest that creating a new P fertilizer from Al-WTR and agro-industrial waste sources may be a feasible alternative to mining inorganic P fertilizer sources, while protecting the environment from unnecessary waste disposal.
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