Articles de revues sur le sujet « Metrologie augmentée »
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1
Poon, Ting-Chung, Yaping Zhang, Liangcai Cao et Hiroshi Yoshikawa. « Editorial on Special Issue “Holography, 3-D Imaging and 3-D Display” ». Applied Sciences 10, no 20 (11 octobre 2020) : 7057. http://dx.doi.org/10.3390/app10207057.
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Modern holographic techniques have been successfully applied in many important areas, such as 3D inspection, 3D microscopy, metrology and profilometry, augmented reality, and industrial informatics [...]
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Siv, Julie, Rafael Mayer, Guillaume Beaugrand, Guillaume Tison, Rémy Juvénal et Guillaume Dovillaire. « Testing and characterization of challenging optics and optical systems with Shack Hartmann wavefront sensors ». EPJ Web of Conferences 215 (2019) : 06003. http://dx.doi.org/10.1051/epjconf/201921506003.
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The Shack-Hartman wavefront sensor is a common metrology tool in the field of laser, adaptive optics and astronomy. However, this technique is still scarcely used in optics and optical system metrology. With the development of manufacturing techniques and the increasing need for optical characterization in the industry, the Shack-Hartmann wavefront sensor emerges as an efficient complementary tool to the well-established Fizeau interferometry for optical system metrology. Moreover, the raise of smart vehicles equipped with optical sensors and augmented reality, the optical characterization of glass and transparent flat materials becomes an issue that can be addressed with Shack-Hartmann sensors. Aberration measurements of challenging optics will be presented such as optical filters, thin flat optics, aspheric lenses and large optical assemblies.
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Young, Woo Han, et Mike Marshall. « IMPROVE CONTROL AMIDST DIE SHRINKAGE AND 3D PACKAGE COMPLICATION ». International Symposium on Microelectronics 2019, no 1 (1 octobre 2019) : 000260–67. http://dx.doi.org/10.4071/2380-4505-2019.1.000260.
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Abstract Die sizes continue to shrink and packaging technologies continue to evolve, but the common thread for all of them is the need for increased precision and tighter process control limits to achieve final package yield. Nearly all packaging technologies require connections in the third dimension, above or below the die, thus adding, quite literally, a new dimension to inspection and metrology requirements. Increased focus on reliability for automotive, health care and even mobile electronics is driving the need for improved process control solutions. The combination of higher packaging complexity and the need for improved reliability are driving changes to the requirements around inspection and metrology. Vertical integration continues to grow at a pervasive rate and the need for improved process control in the third dimension is growing rapidly in order to ensure reliability. Vertical integration is designed into nearly all packaging forms, including TSV, RDL, WLP, Fan-in, Fan-out, with a focus on continued increase in the number of I/Os, the pitch of features (RDL and bump) and the overall package size increasing. This integration drives the need for 3D metrology of feature height and coplanarity. In addition, the need to augment raw 3D metrology with defect inspection and 2D metrology data enables a comprehensive view (insight) into the packaging process. Achieve total bump process control with the combination of data from: (1) 2D defect detection – voids and shorts, foreign material, misprocessing; (2) 2D metrology – bump diameter, bump position, bump presence; (3) 3D inspection – bump too tall, bump too short, statistical process control (SPC); (4) Auto classifications – data must make sense and be easy to interpret. By combining high speed 2D, 3D metrology with defect inspection and advanced analytics, the quality of process control data can be exponentially improved to enable quick time-to-results for both process development and HVM control. This paper describes the inspection and metrology challenges of bumps in advanced packaging and the next generation high-throughput bump inspection methodology for wafers with extremely high bump counts as well as the data analysis
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Kerst, Thomas, Mohammad Bitarafan, Laura Jokinen, Ilkka Alasaarela, Seppo Tillanen, David Zautasvili et Nikhil Pachhandara. « 82‐3 : Rapid AR/VR Device Eye‐Box Measurement Using a Wide‐FOV Lens ». SID Symposium Digest of Technical Papers 54, no 1 (juin 2023) : 1155–57. http://dx.doi.org/10.1002/sdtp.16779.
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We present a method to rapidly and accurately measure the eye box of Augmented Reality (AR) and Virtual Reality (VR) eyewear. We demonstrate that this rapid method measures the eye box with a fidelity comparable to slower, traditional methods. The presented rapid method uses a lens that mimics the human eye in core aspects like pupil position, pupil size and field of view to get an impression of the eyewear performance as it appears to a human user with single image capture. By combining as few as three such image captures with such a lens, one can rapidly and accurately measure the entire eye box geometry of any given AR or VR eyewear. We further demonstrate the advantages of adopting this new method by referencing the display metrology industry, where this method has already been adopted as the new metrology standard.
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Shiue, Ren-Jye, Dmitri K. Efetov, Gabriele Grosso, Cheng Peng, Kin Chung Fong et Dirk Englund. « Active 2D materials for on-chip nanophotonics and quantum optics ». Nanophotonics 6, no 6 (15 mars 2017) : 1329–42. http://dx.doi.org/10.1515/nanoph-2016-0172.
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AbstractTwo-dimensional materials have emerged as promising candidates to augment existing optical networks for metrology, sensing, and telecommunication, both in the classical and quantum mechanical regimes. Here, we review the development of several on-chip photonic components ranging from electro-optic modulators, photodetectors, bolometers, and light sources that are essential building blocks for a fully integrated nanophotonic and quantum photonic circuit.
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Nawab, Rahma, et Angela Davies Allen. « Low-Cost AR-Based Dimensional Metrology for Assembly ». Machines 10, no 4 (30 mars 2022) : 243. http://dx.doi.org/10.3390/machines10040243.
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The goal of this study was to create and demonstrate a system to perform fast and inexpensive quality dimensional inspection for industrial assembly line applications with submillimeter uncertainty. Our focus is on the positional errors of the assembled pieces on a larger part as it is assembled. This is achieved by using an open-source photogrammetry architecture to gather a point cloud data of an assembled part and then comparing this to a computer-aided design (CAD) model. The point cloud comparison to the CAD model is used to quantify errors in position using the iterative closest point (ICP) algorithm. Augmented reality is utilized to view the errors in a live-video feed and effectively display said errors. The initial demonstration showed an assembled position error of 9 mm ± 0.4 mm for a 40-mm high post.
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Arpaia, Pasquale, Egidio De Benedetto, Concetta Anna Dodaro, Luigi Duraccio et Giuseppe Servillo. « Metrology-Based Design of a Wearable Augmented Reality System for Monitoring Patient’s Vitals in Real Time ». IEEE Sensors Journal 21, no 9 (1 mai 2021) : 11176–83. http://dx.doi.org/10.1109/jsen.2021.3059636.
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Gonçalves, GL, JU Delgado et FB Razuck. « The use of Augmented Reality for the teaching of dosimetry and metrology of ionizing radiation at IRD ». Journal of Physics : Conference Series 1826, no 1 (1 mars 2021) : 012041. http://dx.doi.org/10.1088/1742-6596/1826/1/012041.
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Ho, P. T., J. A. Albajez, J. A. Yagüe et J. Santolaria. « Preliminary study of Augmented Reality based manufacturing for further integration of Quality Control 4.0 supported by metrology ». IOP Conference Series : Materials Science and Engineering 1193, no 1 (1 octobre 2021) : 012105. http://dx.doi.org/10.1088/1757-899x/1193/1/012105.
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Abstract Augmented Reality (AR) is a key technology enabling Industry 4.0, which enriches human perspectives by overlaying digital information onto the real world. The maturity of AR technology has grown recently. As processes in the automotive and aeronautic sectors require high quality and near-zero error rates to ensure the safety of end-users, AR can be implemented to facilitate workers with immersive interfaces to enhance productivity, accuracy and autonomy in the quality sector. In order to analyse whether there is a real and growing interest in the use of AR as assisting technology for manufacturing sector in general and quality control in particular, two specific research questions are defined. In addition, two well-known research databases (Scopus, Web of Science) are used for the paper selection phase in accordance with the Preferred Reporting Items for Systematic Reviews and Meta-Analyses (PRISMA) methodology to conduct a preliminary study and evaluate the current development of AR applications in manufacturing sector in order to answer the defined questions. It is found that while the development of AR technology has widely implemented to assign real-time information to several systems and processes in assembly and maintenance sectors, this tendency has only emerged in the quality sector over the last few years. However, AR-based quality control has proved its advantages in improving productivity, accuracy and precision of operators as well as benefits to manufacturing in terms of product and process quality control across different manufacturing phases.
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Prusakov, A. N., V. V. Popadyev et V. F. Pankin. « The Working Week of the International Federation of Surveyors under the motto “From digitalization to augmented reality” ». Geodesy and Cartography 926, no 8 (20 septembre 2017) : 25–38. http://dx.doi.org/10.22389/0016-7126-2017-926-8-25-38.
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The information on the last regular Working week, International Federation of Surveyors (FIG) 2017 hold in May-June 2017 in Helsinki (Finland) was given. The article reflects a brief summary of the scientific program of the Working week, which was implemented in the framework of 3 Plenary sessions and 10 technical committees of the International Federation of surveyors (FIG). Also, within sectional meetings organized by the FIG together with its partners, for example, the World Bank and FIG, and the Inspirational Short Sessions (ISS). Information on the technical exhibition, attended by 24 manufacturers of survey equipment, software and accessories is provided. The main areas of developing geodetic science, production and education, and suggested ways of integration by scientists and specialists of the FSBE “Centre of geodesy, cartography and SDI” in the activities of the International Federation of surveyors (FIG) were summarized. The information on the working meeting between the delegation of the FSBE "Centre of geodesy, cartography and SDI" and Finnish Geospatial Research Institute of data on scientific and technical cooperation between the two organizations in the field of geodesy, gravimetry, geodynamics, metrology and standardization was given.
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Zhao, Lei, et Chaohao Wang. « 50.2 : Invited Paper : A Closer Look : Advancements in Near‐Eye Display Testing and Metrology ». SID Symposium Digest of Technical Papers 54, S1 (avril 2023) : 354–60. http://dx.doi.org/10.1002/sdtp.16303.
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This paper discusses the importance of optical testing metrology for near‐eye displays (NED) used in virtual reality (VR) and augmented reality (AR) environments. The accuracy of parameters such as resolution, contrast, field of view, and color accuracy is critical to the effectiveness of NED. However, existing testing methods for these parameters may not consider the visual characteristics of NED. The paper proposes innovative testing methods for evaluating contrast, pupil swim, and pixel per degree (PPD) in NED. The proposed ANSI contrast test method is found to be more suitable for evaluating the contrast of VR headsets than traditional methods. The paper also proposes two advanced PPD testing methods that take into account lens design and image rendering, providing a more accurate and comprehensive evaluation of pixel distribution on screens at different viewing angles. These testing methods have the potential to improve the development of high‐resolution displays and advance our understanding of the perception of visual stimuli.
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Vicentini, Edoardo, Zhenhai Wang, Kasper Van Gasse, Theodor W. Hänsch et Nathalie Picqué. « Dual-comb hyperspectral digital holography ». Nature Photonics 15, no 12 (22 novembre 2021) : 890–94. http://dx.doi.org/10.1038/s41566-021-00892-x.
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AbstractHolography1 has always held special appeal as it is able to record and display spatial information in three dimensions2–10. Here we show how to augment the capabilities of digital holography11,12 by using a large number of narrow laser lines at precisely defined optical frequencies simultaneously. Using an interferometer based on two frequency combs13–15 of slightly different repetition frequencies and a lensless camera sensor, we record time-varying spatial interference patterns that generate spectral hypercubes of complex holograms, revealing the amplitudes and phases of scattered wave-fields for each comb line frequency. Advancing beyond multicolour holography and low-coherence holography (including with a frequency comb16), the synergy of broad spectral bandwidth and high temporal coherence in dual-comb holography opens up novel optical diagnostics, such as precise dimensional metrology over large distances without interferometric phase ambiguity, or hyperspectral three-dimensional imaging with high spectral resolving power, as we demonstrate with molecule-selective imaging of an absorbing gas.
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Ho, Phuong Thao, José Antonio Albajez, Jorge Santolaria et José A. Yagüe-Fabra. « Study of Augmented Reality Based Manufacturing for Further Integration of Quality Control 4.0 : A Systematic Literature Review ». Applied Sciences 12, no 4 (13 février 2022) : 1961. http://dx.doi.org/10.3390/app12041961.
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Augmented Reality (AR) has gradually become a mainstream technology enabling Industry 4.0 and its maturity has also grown over time. AR has been applied to support different processes on the shop-floor level, such as assembly, maintenance, etc. As various processes in manufacturing require high quality and near-zero error rates to ensure the demands and safety of end-users, AR can also equip operators with immersive interfaces to enhance productivity, accuracy and autonomy in the quality sector. However, there is currently no systematic review paper about AR technology enhancing the quality sector. The purpose of this paper is to conduct a systematic literature review (SLR) to conclude about the emerging interest in using AR as an assisting technology for the quality sector in an industry 4.0 context. Five research questions (RQs), with a set of selection criteria, are predefined to support the objectives of this SLR. In addition, different research databases are used for the paper identification phase following the Preferred Reporting Items for Systematic Reviews and Meta-Analysis (PRISMA) methodology to find the answers for the predefined RQs. It is found that, in spite of staying behind the assembly and maintenance sector in terms of AR-based solutions, there is a tendency towards interest in developing and implementing AR-assisted quality applications. There are three main categories of current AR-based solutions for quality sector, which are AR-based apps as a virtual Lean tool, AR-assisted metrology and AR-based solutions for in-line quality control. In this SLR, an AR architecture layer framework has been improved to classify articles into different layers which are finally integrated into a systematic design and development methodology for the development of long-term AR-based solutions for the quality sector in the future.
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Ćirić, Ivan, Milan Banić, Miloš Simonović, Aleksandar Miltenović, Dušan Stamenković et Vlastimir Nikolić. « TOWARDS MACHINE VISION BASED RAILWAY ASSETS PREDICTIVE MAINTENANCE ». Facta Universitatis, Series : Automatic Control and Robotics 19, no 2 (8 décembre 2020) : 125. http://dx.doi.org/10.22190/fuacr2002125c.
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The main goal of this paper is to present novel technologies that can contribute to safety, competitiveness, efficiency and operational reliability of Railway infrastructure through the development of innovative solutions for measuring and monitoring of railway assets based on machine vision. Measuring the transversal position of the wheels on the rail, as well as identification of the defects of the wheel and the rail (such as deformation of rail head edge, lateral wear, worn wheels, cracks in wheel and rail, rolling contact fatigue, corrugation and other irregularities) can increase reliability and lower maintenance costs. Currently, there is a need on the market for the innovative solution, namely the on-board high-speed stereo camera system augmented with a system that projects custom pattern (fringe scanner system) for measuring the transversal position of the wheels on the rail, robust to environmental conditions and waste along the track that can provide reliable measurements of transversal position of the wheels up to 200 km/h. New trends in Precise Industrial 3D Metrology are showing that stereo vision is an absolute must have in modern specialized optical precision measuring systems for the three-dimensional coordinate measurement.
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Fisher, William P. « Bateson and Wright on Number and Quantity : How to Not Separate Thinking from Its Relational Context ». Symmetry 13, no 8 (3 août 2021) : 1415. http://dx.doi.org/10.3390/sym13081415.
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As part of his explication of the epistemological error made in separating thinking from its ecological context, Bateson distinguished counts from measurements. With no reference to Bateson, the measurement theory and practice of Benjamin Wright also recognizes that number and quantity are different logical types. Describing the confusion of counts and measures as schizophrenic, like Bateson, Wright, a physicist and certified psychoanalyst, showed mathematically that convergent stochastic processes informing counts are predictable in ways that facilitate methodical measurements. Wright’s methods experimentally evaluate the complex symmetries of nonlinear and stochastic numeric patterns as a basis for estimating interval quantities. These methods also retain connections with locally situated concrete expressions, mediating the data display by contextualizing it in relation to the abstractly communicable and navigable quantitative unit and its uncertainty. Decades of successful use of Wright’s methods in research and practice are augmented in recent collaborations of metrology engineers and psychometricians who are systematically distinguishing numeric counts from measured quantities in new classes of knowledge infrastructure. Situating Wright’s work in the context of Bateson’s ideas may be useful for infrastructuring new political, economic, and scientific outcomes.
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Abbasi, W. A., S. C. Ridgeway, P. D. Adsit, C. D. Crane et J. Duffy. « Investigation of a Special 6-6 Parallel Platform for Contour Milling ». Journal of Manufacturing Science and Engineering 122, no 1 (1 janvier 1998) : 132–39. http://dx.doi.org/10.1115/1.538927.
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Recently, companies have been experimenting with parallel-mechanism based approaches for milling machines. This research presents an investigation into the development of a special 6-6 parallel mechanism for application to contour milling. The idea behind this approach is that existing non-CNC milling equipment can be augmented to increase its capability at a lower cost than purchasing traditional 5-axis machining centers. This paper presents the phase of research associated with developing a parametric kinestatic design methodology for a special 6-6 parallel mechanism (Kinestatic Platform, KP). This methodology was applied to the design specifications associated with 5-axis contour milling. The resulting kinestatic design’s dynamics were evaluated to determine the actuation requirements of each connector. A prototype connector was built to allow the evaluation of actuator response under simulated loading conditions. Joint stiffness and control strategy were of primary concern in evaluating the performance of the prototype connector. The parametric kinestatic design and control strategy results are presented. Several observations are evidenced from the research. Joint deflection is an obvious critical issue and the most difficult to quantify. A scheme is proposed detailing the concept of using a separate metrology frame to overcome difficulties associated with accurate connector length determination. [S1087-1357(00)70101-8]
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Garcia-González, Wendy, Wendy Flores-Fuentes, Oleg Sergiyenko, Julio C. Rodríguez-Quiñonez, Jesús E. Miranda-Vega et Daniel Hernández-Balbuena. « Shannon Entropy Used for Feature Extractions of Optical Patterns in the Context of Structural Health Monitoring ». Entropy 25, no 8 (14 août 2023) : 1207. http://dx.doi.org/10.3390/e25081207.
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A novelty signal processing method is proposed for a technical vision system (TVS). During data acquisition of an optoelectrical signal, part of this is random electrical fluctuation of voltages. Information theory (IT) is a well-known field that deals with random processes. A method based on using of the Shannon Entropy for feature extractions of optical patterns is presented. IT is implemented in structural health monitoring (SHM) to augment the accuracy of optoelectronic signal classifiers for a metrology subsystem of the TVS. To enhance the TVS spatial coordinate measurement performance at real operation conditions with electrical and optical noisy environments to estimate structural displacement better and evaluate its health for a better estimation of structural displacement and the evaluation of its health. Five different machine learning (ML) techniques are used in this work to classify optical patterns captured with the TVS. Linear predictive coding (LPC) and Autocorrelation function (ACC) are for extraction of optical patterns. The Shannon entropy segmentation (SH) method extracts relevant information from optical patterns, and the model’s performance can be improved. The results reveal that segmentation with Shannon’s entropy can achieve over 95.33%. Without Shannon’s entropy, the worst accuracy was 33.33%.
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Lemesle, Julie, Clement Moreau, Raphael Deltombe, François Blateyron, Joseph Martin, Maxence Bigerelle et Christopher A. Brown. « Top-down Determination of Fluctuations in Topographic Measurements ». Materials 16, no 2 (4 janvier 2023) : 473. http://dx.doi.org/10.3390/ma16020473.
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A top-down method is presented and studied for quantifying topographic map height (z) fluctuations directly from measurements on surfaces of interest. Contrary to bottom-up methods used in dimensional metrology, this method does not require knowledge of transfer functions and fluctuations of an instrument. Fluctuations are considered here to be indicative of some kinds of uncertainties. Multiple (n), successive topographic measurements (z = z(x,y)) are made at one location without moving the measurand relative to the measurement instrument. The measured heights (z) at each position (x,y) are analyzed statistically. Fluctuation maps are generated from the calculated variances. Three surfaces were measured with two interferometric measuring microscopes (Bruker ContourGT™ and Zygo NewView™ 7300). These surfaces included an anisotropic, turned surface; an isotropic, sandblasted surface; and an abraded, heterogeneous, multilayer surface having different, complex, multiscale morphologies. In demonstrating the method, it was found that few non-measured points persisted for all 100 measurements at any location. The distributions of uncertainties are similar to those of certain features on topographic maps at the same locations, suggesting that topographic features can augment measurement fluctuations. This was especially observed on the abraded ophthalmic lens; a scratch divides the topographic map into two zones with different uncertainty values. The distributions of fluctuations can be non-Gaussian. Additionally, they can vary between regions within some measurements.
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Anderson, Stephen A. « Innovative digital inspection methodology ». APPEA Journal 60, no 1 (2020) : 77. http://dx.doi.org/10.1071/aj19109.
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The paper describes an innovative digital inspection methodology that combines 3D laser scanning, metrology and advanced non-destructive testing data that is merged in 3D space to provide a digital record of the condition and mechanical integrity of critical assets. This advanced inspection method supports condition-based maintenance programs and digital twin models to determine future equipment condition, work scope and inspection schedules, while maintaining a digital record throughout the equipment lifecycle. Testing of the methodology includes 3D scanning of drill platforms, baseline scanning of blowout preventers and sheaves, for quality purposes, and the use of augmented reality for viewing scans. Phased array testing has been conducted on sub-components such as slew ring bolting. Data are combined into digital reports that show 3D images of the equipment with precise dimensional data and identified inspection areas. Such reports can be combined with digital twin models to confirm integrity of the equipment for certificate of conformance and baseline data for future integrity comparisons as equipment ages. This innovative inspection methodology will set a new standard for how equipment data are captured, stored and represented. The process provides a range of benefits for OEMs, drilling contractors and operators alike, including digital quality programs to baseline new equipment condition and compare with design parameters, delivering condition and integrity assessments of critical equipment items in-situ or on deck, providing a consistent methodology for inspection and dimensional control of operational equipment items, and providing precise equipment data that can complement digital twin and real time monitoring programs.
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Salido-Monzú, D., et A. Wieser. « AN INSTRUMENTAL BASIS FOR MULTISPECTRAL LIDAR WITH SPECTRALLY-RESOLVED DISTANCE MEASUREMENTS ». ISPRS - International Archives of the Photogrammetry, Remote Sensing and Spatial Information Sciences XLII-2/W13 (5 juin 2019) : 1121–26. http://dx.doi.org/10.5194/isprs-archives-xlii-2-w13-1121-2019.
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<p><strong>Abstract.</strong> Hyperspectral solutions augment laser scanning technology with material probing capabilities by measuring target reflectance along with topography. We propose a novel instrumental basis that enables also spectrally-resolved distance measurement with sufficient sensitivity as to access dispersive phenomena on the reflecting target and along the propagation medium, further enhancing the material analysis capabilities of hyperspectral approaches. To this end we have extended distance metrology using intermode beat notes of a mode-locked femtosecond laser to cover flexibly selected spectral regions. The approach is based on an ultra-broadband source derived from a femtosecond laser via coherent supercontinuum generation. Herein we provide a first demonstration of the successful application of this technique to reflectorless measurements and thus its feasibility for multispectral LiDAR. We use a table-top experimental set-up to assess the approach by measuring distance, spectrally-resolved relative distance and reflectance to 5 different material samples on 5 multiplexed contiguous spectral bands of 50 nm in the range of 600&thinsp;nm to 850&thinsp;nm. We have achieved a distance measurement precision and accuracy better than 100&thinsp;&mu;m using integration times of about 30&thinsp;ms, with promising perspectives regarding scalability to practical distances. The spectrally-resolved distance measurements also show repeatable material-dependent profiles with differences between materials up to several tenths of mm in some spectral bands. Combined with simultaneously acquired reflectance estimations, these profiles enable collecting additional target information, indicating the potential of the approach to enhance the material probing capabilities of prospective multispectral laser scanners.</p>
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Lee, Dong Hun, Yuxuan Zhang, Kwangsoo No, Han Wook Song et Sunghwan Lee. « (Digital Presentation) Multimodal Encapsulation of p-SnOx to Engineer the Carrier Density for Thin Film Transistor Applications ». ECS Meeting Abstracts MA2022-02, no 15 (9 octobre 2022) : 821. http://dx.doi.org/10.1149/ma2022-0215821mtgabs.
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It has been challenging to synthesize p-type SnOx (1≤x<2) and engineer the electrical properties such as carrier density and mobility due to the narrow processing window and the localized oxygen 2p orbitals near the valence band. We recently reported on the processing of p-type SnOx and an oxide-based p-n heterostructures, demonstrating high on/off rectification ratio (>103), small turn-on voltage (<0.5 V), and low saturation current (~1×10-10 A)1. In order to further understand the p-type oxide and engineer the properties for various electronic device applications, it is important to identify (or establish) the dominating doping and transport mechanisms. The low dopability in p-type SnOx, of which the causation is also closely related to the narrow processing window, needs to be mitigated so that the electrical properties of the material are to be adequately engineered 2, 3. Herein, we report on the multifunctional encapsulation of p-SnOx to limit the surface adsorption of oxygen and selectively permeate hydrogen into the p-SnOx channel for thin film transistor (TFT) applications. Time-of-flight secondary ion mass spectrometry measurements identified that ultra-thin SiO2 as a multifunctional encapsulation layer effectively suppressed the oxygen adsorption on the back channel surface of p-SnOx and augmented hydrogen density across the entire thickness of the channel. Encapsulated p-SnOx-based TFTs demonstrated much-enhanced channel conductance modulation in response to the gate bias applied, featuring higher on-state current and lower off-state current. The relevance between the TFT performance and the effects of oxygen suppression and hydrogen permeation is discussed in regard to the intrinsic and extrinsic doping mechanisms. These results are supported by density-functional-theory calculations. Acknowledgement This work was supported by the U.S. National Science Foundation (NSF) Award No. ECCS-1931088. S.L. and H.W.S. acknowledge the support from the Improvement of Measurement Standards and Technology for Mechanical Metrology (Grant No. 20011028) by KRISS. K.N. was supported by Basic Science Research Program (NRF-2021R11A1A01051246) through the NRF Korea funded by the Ministry of Education. References Lee, D. H.; Park, H.; Clevenger, M.; Kim, H.; Kim, C. S.; Liu, M.; Kim, G.; Song, H. W.; No, K.; Kim, S. Y.; Ko, D.-K.; Lucietto, A.; Park, H.; Lee, S., High-Performance Oxide-Based p–n Heterojunctions Integrating p-SnOx and n-InGaZnO. ACS Applied Materials & Interfaces 2021, 13 (46), 55676-55686. Hautier, G.; Miglio, A.; Ceder, G.; Rignanese, G.-M.; Gonze, X., Identification and design principles of low hole effective mass p-type transparent conducting oxides. Nat Commun 2013, 4. Yim, K.; Youn, Y.; Lee, M.; Yoo, D.; Lee, J.; Cho, S. H.; Han, S., Computational discovery of p-type transparent oxide semiconductors using hydrogen descriptor. npj Computational Materials 2018, 4 (1), 17. Figure 1
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Booth, James C., Nathan Orloff, Christian Long, Aaron Hagerstrom, Angela Stelson, Nicholas Jungwirth et Luckshitha Suriyasena Liyanage. « (Invited, Digital Presentation) Nonlinear and Electro-Thermo-Mechanical Effects in Heterogeneous Electronics at Microwave Frequencies ». ECS Meeting Abstracts MA2022-02, no 17 (9 octobre 2022) : 862. http://dx.doi.org/10.1149/ma2022-0217862mtgabs.
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Materials properties are an essential component for the accurate modeling of integrated devices and circuits. The accuracy of such models depends explicitly on the accuracy of the input material parameters and interfaces between them. With the trend toward increasing heterogeneous integration, the relationships between electromagnetic, thermal, and mechanical material properties of heterogeneously integrated devices are even more important. Recent trends toward co-design emphasize the optimization of all aspects of circuit performance from the beginning, rather than sequentially optimizing the electromagnetic, thermal, mechanical characteristics. It can be critical for modeling success to understand, for example, where losses due to an electromagnetic signal are significant, as those losses can lead to energy dissipation with the subsequent temperature rise being a function of local thermal properties such as the thermal conductivity and heat capacity. Beyond losses, nonuniform temperature distributions generate mechanical stress that can impact interfaces between materials with dissimilar coefficients of thermal expansion. Furthermore, change in temperature and stress can lead to changes in the linear electromagnetic properties, resulting in changes in signal propagation and the generation of nonlinear effects. Material properties are also important as they connect device response to underlying materials physics. This connection allows one to exploit different physical phenomena to add functionality at materials level, and to understand and mitigate non-idealities such as nonlinear response. As such, it is critically important to quantify nonlinear electromagnetic and electro-thermo-mechanical properties of heterogeneous integrated devices. In Fig. 1, the Heckmann diagram shows the electro-thermo-mechanical relations in a crystal, where T, S, E, D, θ, and σ are stress, strain, electric field, electric displacement, temperature, and entropy, respectively. This diagram illustrates the various nonlinear interactions that can be important for determining the overall response of microelectronic devices composed of a wide range of material systems. Here, we present an overview of experimental efforts designed to accurately characterize the linear electromagnetic properties of materials relevant for microelectronics, including dielectrics and conductors as a function of frequency from 100 kHz through 220 GHz. Dispersion and absorption imply frequency dependence of complex quantities such as the dielectric permittivity and magnetic permeability, and this in turn necessitates broadband characterization techniques. We describe efforts to characterize broadband frequency-dependent linear electromagnetic properties over a wide range of temperatures, including cryogenic temperatures relevant for quantum computing, and augment these techniques with approaches to characterize the relevant thermal material parameters. We then describe measurements of nonlinear response of different material systems to quantify the nonlinear relationships between different thermodynamic fields in integrated structures. We conclude with a discussion of the needs for additional metrology to characterize these complex interactions inside complex 3D and packaged microelectronic devices and at buried interfaces within these heterogeneous integrated structures. Figure 1
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Engel, Thomas. « 3D-optical measurement techniques ». Measurement Science and Technology, 2 décembre 2022. http://dx.doi.org/10.1088/1361-6501/aca818.
Texte intégralRésumé :
Abstract The field of optical 3D metrology is gaining significant interest in the past years. Optical sensors can probe the geometry of workpieces and biological samples very fast, highly accurate and without any tactile physical contact to the object’s surface. In this respect, optical sensors are a pre-requisite for many applications in the big trends like Industrial Internet of Things (IIoT), Industry 4.0 or Medicine 4.0. The interest for optical 3D metrology is shifting from a metrology for quality assurance in industrial production to “digitize the real world“ to facilitate a precise digital representation of an object or an environment for documentation or as input data for virtual applications like digital fab or augmented reality. The aspiration to digitize the world necessitates fast and efficient contact free sensing principles of appropriate accuracy for solid and even soft objects with a variety of colour, surface texture and lighting conditions. This review article tries to give a concise conceptual overview about the evolution of a broad variety of optical measurement principles that evolved and gained some importance in the field of 3D metrology for industrial 3D applications and their related technological enablers.
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Zhang, Wen-Hao, Jing-Wei Yu, Wule Zhu et Bing-Feng Ju. « Unified framework for geometric error compensation and shape-adaptive scanning in five-axis metrology systems ». Measurement Science and Technology, 16 mai 2024. http://dx.doi.org/10.1088/1361-6501/ad4c83.
Texte intégralRésumé :
Abstract In response to the escalating demand for precise shape metrology of complex optical surfaces, this study unveils a unified geometric error compensation and trajectory planning framework tailored for high-accuracy five-axis scanning metrology systems, which remains a notably underexplored field compared to error compensation in machine tools. Founded on a unified geometric model, the proposed framework seamlessly integrates a versatile shape-adaptive trajectory planning strategy, a thorough global error sensitivity analysis approach, and an exhaustive geometric error compensation scheme. Leveraging inverse kinematics, an innovative shape-adaptive scanning trajectory generation strategy is mathematically formulated, thereby facilitating adaptable measurement trajectory generation for diverse surface geometries. Employing forward kinematics, an exhaustive geometric error model is established to extensively address the 53 distinct geometric errors in the metrology system. This proposed error model fundamentally augments conventional geometric error models in machine tool by managing not only the geometric errors from the motion system, but also those from the probe and workpiece. To streamline the error compensation procedure, a novel global error sensitivity analysis approach is introduced, identifying both system-oriented and process-oriented sensitive geometric errors for targeted compensation. Experimental validation using a standard ball, which achieved an exceptional 89.35% reduction in the root mean square (RMS) of the measurement errors, further confirms the feasibility and effectiveness of the proposed framework. By offering an universal trajectory planning, sensitivity analysis and error compensation trinity for five-axis scanning metrology systems, this study sets the stage for precision advancements and design optimization across diverse configurations of metrology systems.
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Nguyen, Vinh, Xiaofeng Liu et Jeremy Marvel. « Augmented Reality Interface for Robot-Sensor Coordinate Registration ». Journal of Computing and Information Science in Engineering, 8 août 2023, 1–7. http://dx.doi.org/10.1115/1.4063131.
Texte intégralRésumé :
Abstract Accurate registration of Cartesian coordinate systems is necessary to facilitate metrology-based solutions for industrial robots in production environments. Conducting coordinate registration between industrial robots and their metrological systems requires measuring multiple points in the robot's and sensor system's coordinate frames. However, operators lack intuitive tools to interface, visualize, and characterize the quality of the selected points in the robot workspace for robot-sensor coordinate registration. This paper proposes an augmented reality system for human-in-the-loop, robot-sensor coordinate registration to efficiently record and visualize the pose-dependent quality of computing the robot-sensor transformation. Furthermore, this work establishes metrics to define the relative quality of measurement points used in robot-sensor coordinate registration, which are shown by the augmented reality application. Experiments were conducted demonstrating the augmented reality environment in addition to investigating the pose-dependency of the measurement point quality. The results indicate that the proposed metrics highlight the dependency of the poses on both robot and sensor placement and that the augmented reality system can provide a human-in-the-loop interface for robot-sensor coordinate registration.
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Schen, Michael A., G. T. Davis, F. I. Mopsik, W. L. Wu, W. E. Wallace, Jr Manning, C. A. Handwerker et D. T. Read. « Electronics Packaging Materials Research at NIST ». MRS Proceedings 390 (1995). http://dx.doi.org/10.1557/proc-390-19.
Texte intégralRésumé :
ABSTRACTThe Materials Science and Engineering Laboratory at NIST has augmented its laboratory-based research in support of the U.S. commercial microelectronics industry by expanding its efforts in electronics packaging, interconnection and assembly (P/I/A) materials technologies. In conjunction with industry, university and other government agency partners, these new NIST efforts target materials technology issues that underlie the priorities contained within the various electronics industry technology roadmaps. A dominant aspect of the laboratory P/I/A program focuses on the in-situ metrology and data needs associated with the materials and complex material assemblies which comprise today's microelectronic components and circuits.
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Tóbiás, Roland, Tibor Furtenbacher, Irén Simkó, Attila G. Császár, Meissa L. Diouf, Frank M. J. Cozijn, Joey M. A. Staa, Edcel J. Salumbides et Wim Ubachs. « Spectroscopic-network-assisted precision spectroscopy and its application to water ». Nature Communications 11, no 1 (6 avril 2020). http://dx.doi.org/10.1038/s41467-020-15430-6.
Texte intégralRésumé :
AbstractFrequency combs and cavity-enhanced optical techniques have revolutionized molecular spectroscopy: their combination allows recording saturated Doppler-free lines with ultrahigh precision. Network theory, based on the generalized Ritz principle, offers a powerful tool for the intelligent design and validation of such precision-spectroscopy experiments and the subsequent derivation of accurate energy differences. As a proof of concept, 156 carefully-selected near-infrared transitions are detected for H216O, a benchmark system of molecular spectroscopy, at kHz accuracy. These measurements, augmented with 28 extremely-accurate literature lines to ensure overall connectivity, allow the precise determination of the lowest ortho-H216O energy, now set at 23.794 361 22(25) cm−1, and 160 energy levels with similarly high accuracy. Based on the limited number of observed transitions, 1219 calibration-quality lines are obtained in a wide wavenumber interval, which can be used to improve spectroscopic databases and applied to frequency metrology, astrophysics, atmospheric sensing, and combustion chemistry.
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Murray, Myles P., Laura S. Bruckman et Roger H. French. « Durability of Materials in a Stress-Response Framework : Acrylic Materials for Photovoltaic Systems ». MRS Proceedings 1391 (2012). http://dx.doi.org/10.1557/opl.2012.1241.
Texte intégralRésumé :
ABSTRACTIn the development of novel materials for enhanced photovoltaic (PV) performance, it is critical to have quantitative knowledge of the initial performance, as well as the performance of these materials over the required 25-year lifetime of the PV system. Lifetime and degradation science (L&DS) allows for the development of new metrology and metrics, coupled to degradation mechanisms and rates. Induced absorbance to dose (IAD), a new metric being developed for solar radiation durability studies of solar and environmentally exposed photovoltaic materials, is defined as the rate of photodarkening or photobleaching of a material as a function of total absorbed solar radiation dose. In a reliability engineering framework, these quantitative degradation rates can be determined at various solar irradiances making possible real time and accelerated testing. The potential to predict power losses in a photovoltaic system over time caused by the accumulation of this kind of degradation can be calculated for real time applications or extrapolated for accelerated exposure conditions. Three formulations of poly (methyl methacrylate) (PMMA) used for mirror augmented PV systems were analyzed for the changes in IAD after accelerated testing.
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Juethner, Konrad, Ted Rose, Senthil Kumar, Jianming Cao, Gregory Savela, Chris J. Zuck et Parag Mathuria. « Finite Element Analysis of Bent Rotors ». Journal of Engineering for Gas Turbines and Power, 2 septembre 2022. http://dx.doi.org/10.1115/1.4055452.
Texte intégralRésumé :
Abstract The rotor assembly of an engine is typically designed around a straight centerline. However, every manufactured rotor is bent once it undergoes careful quality inspection. Bent and bowed rotors are similar but differ in that bends are permanent, whereas rotor bow is temporary and observed in the mounted rotor assembly. The presence of bends leads to force and moment distributions along the rotor that can have dynamic implications. Unlike unbalance loads, the rotating excitation of a bent rotor remains constant. Although bent rotors are defined in the literature, their analysis is confined to simplified cases where centerline deviations at the bearing supports are zero. For realistic rotors, an additional static analysis is required to obtain the proper dynamic load distribution. Here, the finite element method is used to analyze bent rotors within an MSC NASTRAN workflow to evaluate bent rotors of any complexity. This approach can account for static, compliant, and greatly featured support structures with misaligned bearing supports. Angular and lateral offsets are explored with increasing complexity where force and moment distributions are computed to subsequently excite the bent rotor dynamically. This method can be deployed in combination with high-tech metrology equipment that can produce many measurements. In a final step, the bent rotor is augmented with unbalances and compared to its nominal counterpart to deliver the motivation for this method and its value to the turbomachinery community. All results are verified against an experimentally validated transfer matrix method.