Bibliographies thématiques / Metrologie augmentée

Littérature scientifique sur le sujet « Metrologie augmentée »

Auteur : Grafiati
Publié le 7 juillet 2024
Mis à jour le 7 juillet 2024

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Articles de revues sur le sujet "Metrologie augmentée"

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Poon, Ting-Chung, Yaping Zhang, Liangcai Cao et Hiroshi Yoshikawa. « Editorial on Special Issue “Holography, 3-D Imaging and 3-D Display” ». Applied Sciences 10, no 20 (11 octobre 2020) : 7057. http://dx.doi.org/10.3390/app10207057.

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Modern holographic techniques have been successfully applied in many important areas, such as 3D inspection, 3D microscopy, metrology and profilometry, augmented reality, and industrial informatics [...]
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Siv, Julie, Rafael Mayer, Guillaume Beaugrand, Guillaume Tison, Rémy Juvénal et Guillaume Dovillaire. « Testing and characterization of challenging optics and optical systems with Shack Hartmann wavefront sensors ». EPJ Web of Conferences 215 (2019) : 06003. http://dx.doi.org/10.1051/epjconf/201921506003.

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The Shack-Hartman wavefront sensor is a common metrology tool in the field of laser, adaptive optics and astronomy. However, this technique is still scarcely used in optics and optical system metrology. With the development of manufacturing techniques and the increasing need for optical characterization in the industry, the Shack-Hartmann wavefront sensor emerges as an efficient complementary tool to the well-established Fizeau interferometry for optical system metrology. Moreover, the raise of smart vehicles equipped with optical sensors and augmented reality, the optical characterization of glass and transparent flat materials becomes an issue that can be addressed with Shack-Hartmann sensors. Aberration measurements of challenging optics will be presented such as optical filters, thin flat optics, aspheric lenses and large optical assemblies.
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Young, Woo Han, et Mike Marshall. « IMPROVE CONTROL AMIDST DIE SHRINKAGE AND 3D PACKAGE COMPLICATION ». International Symposium on Microelectronics 2019, no 1 (1 octobre 2019) : 000260–67. http://dx.doi.org/10.4071/2380-4505-2019.1.000260.

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Abstract Die sizes continue to shrink and packaging technologies continue to evolve, but the common thread for all of them is the need for increased precision and tighter process control limits to achieve final package yield. Nearly all packaging technologies require connections in the third dimension, above or below the die, thus adding, quite literally, a new dimension to inspection and metrology requirements. Increased focus on reliability for automotive, health care and even mobile electronics is driving the need for improved process control solutions. The combination of higher packaging complexity and the need for improved reliability are driving changes to the requirements around inspection and metrology. Vertical integration continues to grow at a pervasive rate and the need for improved process control in the third dimension is growing rapidly in order to ensure reliability. Vertical integration is designed into nearly all packaging forms, including TSV, RDL, WLP, Fan-in, Fan-out, with a focus on continued increase in the number of I/Os, the pitch of features (RDL and bump) and the overall package size increasing. This integration drives the need for 3D metrology of feature height and coplanarity. In addition, the need to augment raw 3D metrology with defect inspection and 2D metrology data enables a comprehensive view (insight) into the packaging process. Achieve total bump process control with the combination of data from: (1) 2D defect detection – voids and shorts, foreign material, misprocessing; (2) 2D metrology – bump diameter, bump position, bump presence; (3) 3D inspection – bump too tall, bump too short, statistical process control (SPC); (4) Auto classifications – data must make sense and be easy to interpret. By combining high speed 2D, 3D metrology with defect inspection and advanced analytics, the quality of process control data can be exponentially improved to enable quick time-to-results for both process development and HVM control. This paper describes the inspection and metrology challenges of bumps in advanced packaging and the next generation high-throughput bump inspection methodology for wafers with extremely high bump counts as well as the data analysis
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Kerst, Thomas, Mohammad Bitarafan, Laura Jokinen, Ilkka Alasaarela, Seppo Tillanen, David Zautasvili et Nikhil Pachhandara. « 82‐3 : Rapid AR/VR Device Eye‐Box Measurement Using a Wide‐FOV Lens ». SID Symposium Digest of Technical Papers 54, no 1 (juin 2023) : 1155–57. http://dx.doi.org/10.1002/sdtp.16779.

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We present a method to rapidly and accurately measure the eye box of Augmented Reality (AR) and Virtual Reality (VR) eyewear. We demonstrate that this rapid method measures the eye box with a fidelity comparable to slower, traditional methods. The presented rapid method uses a lens that mimics the human eye in core aspects like pupil position, pupil size and field of view to get an impression of the eyewear performance as it appears to a human user with single image capture. By combining as few as three such image captures with such a lens, one can rapidly and accurately measure the entire eye box geometry of any given AR or VR eyewear. We further demonstrate the advantages of adopting this new method by referencing the display metrology industry, where this method has already been adopted as the new metrology standard.
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Shiue, Ren-Jye, Dmitri K. Efetov, Gabriele Grosso, Cheng Peng, Kin Chung Fong et Dirk Englund. « Active 2D materials for on-chip nanophotonics and quantum optics ». Nanophotonics 6, no 6 (15 mars 2017) : 1329–42. http://dx.doi.org/10.1515/nanoph-2016-0172.

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AbstractTwo-dimensional materials have emerged as promising candidates to augment existing optical networks for metrology, sensing, and telecommunication, both in the classical and quantum mechanical regimes. Here, we review the development of several on-chip photonic components ranging from electro-optic modulators, photodetectors, bolometers, and light sources that are essential building blocks for a fully integrated nanophotonic and quantum photonic circuit.
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Nawab, Rahma, et Angela Davies Allen. « Low-Cost AR-Based Dimensional Metrology for Assembly ». Machines 10, no 4 (30 mars 2022) : 243. http://dx.doi.org/10.3390/machines10040243.

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The goal of this study was to create and demonstrate a system to perform fast and inexpensive quality dimensional inspection for industrial assembly line applications with submillimeter uncertainty. Our focus is on the positional errors of the assembled pieces on a larger part as it is assembled. This is achieved by using an open-source photogrammetry architecture to gather a point cloud data of an assembled part and then comparing this to a computer-aided design (CAD) model. The point cloud comparison to the CAD model is used to quantify errors in position using the iterative closest point (ICP) algorithm. Augmented reality is utilized to view the errors in a live-video feed and effectively display said errors. The initial demonstration showed an assembled position error of 9 mm ± 0.4 mm for a 40-mm high post.
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Arpaia, Pasquale, Egidio De Benedetto, Concetta Anna Dodaro, Luigi Duraccio et Giuseppe Servillo. « Metrology-Based Design of a Wearable Augmented Reality System for Monitoring Patient’s Vitals in Real Time ». IEEE Sensors Journal 21, no 9 (1 mai 2021) : 11176–83. http://dx.doi.org/10.1109/jsen.2021.3059636.

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Gonçalves, GL, JU Delgado et FB Razuck. « The use of Augmented Reality for the teaching of dosimetry and metrology of ionizing radiation at IRD ». Journal of Physics : Conference Series 1826, no 1 (1 mars 2021) : 012041. http://dx.doi.org/10.1088/1742-6596/1826/1/012041.

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Ho, P. T., J. A. Albajez, J. A. Yagüe et J. Santolaria. « Preliminary study of Augmented Reality based manufacturing for further integration of Quality Control 4.0 supported by metrology ». IOP Conference Series : Materials Science and Engineering 1193, no 1 (1 octobre 2021) : 012105. http://dx.doi.org/10.1088/1757-899x/1193/1/012105.

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Abstract Augmented Reality (AR) is a key technology enabling Industry 4.0, which enriches human perspectives by overlaying digital information onto the real world. The maturity of AR technology has grown recently. As processes in the automotive and aeronautic sectors require high quality and near-zero error rates to ensure the safety of end-users, AR can be implemented to facilitate workers with immersive interfaces to enhance productivity, accuracy and autonomy in the quality sector. In order to analyse whether there is a real and growing interest in the use of AR as assisting technology for manufacturing sector in general and quality control in particular, two specific research questions are defined. In addition, two well-known research databases (Scopus, Web of Science) are used for the paper selection phase in accordance with the Preferred Reporting Items for Systematic Reviews and Meta-Analyses (PRISMA) methodology to conduct a preliminary study and evaluate the current development of AR applications in manufacturing sector in order to answer the defined questions. It is found that while the development of AR technology has widely implemented to assign real-time information to several systems and processes in assembly and maintenance sectors, this tendency has only emerged in the quality sector over the last few years. However, AR-based quality control has proved its advantages in improving productivity, accuracy and precision of operators as well as benefits to manufacturing in terms of product and process quality control across different manufacturing phases.
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Prusakov, A. N., V. V. Popadyev et V. F. Pankin. « The Working Week of the International Federation of Surveyors under the motto “From digitalization to augmented reality” ». Geodesy and Cartography 926, no 8 (20 septembre 2017) : 25–38. http://dx.doi.org/10.22389/0016-7126-2017-926-8-25-38.

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The information on the last regular Working week, International Federation of Surveyors (FIG) 2017 hold in May-June 2017 in Helsinki (Finland) was given. The article reflects a brief summary of the scientific program of the Working week, which was implemented in the framework of 3 Plenary sessions and 10 technical committees of the International Federation of surveyors (FIG). Also, within sectional meetings organized by the FIG together with its partners, for example, the World Bank and FIG, and the Inspirational Short Sessions (ISS). Information on the technical exhibition, attended by 24 manufacturers of survey equipment, software and accessories is provided. The main areas of developing geodetic science, production and education, and suggested ways of integration by scientists and specialists of the FSBE “Centre of geodesy, cartography and SDI” in the activities of the International Federation of surveyors (FIG) were summarized. The information on the working meeting between the delegation of the FSBE "Centre of geodesy, cartography and SDI" and Finnish Geospatial Research Institute of data on scientific and technical cooperation between the two organizations in the field of geodesy, gravimetry, geodynamics, metrology and standardization was given.
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Thèses sur le sujet "Metrologie augmentée"

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Bourguignon, Thibaut. « Implémentation et évaluation de la mesure Overlay in-situ par microscopie électronique pour la production de puces électroniques ». Electronic Thesis or Diss., Université Grenoble Alpes, 2024. http://www.theses.fr/2024GRALT001.

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Les circuits intégrés sont fabriqués via un empilement de diverses couches. L’alignement précis de ces niveaux, dit « overlay (OVL)», est critique pour assurer la fiabilité des puces. Les spécifications sont très strictes : sur une plaque de 300mm de diamètre, chaque motif doit être aligné avec une précision de quelques nanomètres. Les méthodes actuelles, basées sur l'observation optique de mires dédiées, montrent leurs limites en termes de représentativité et d'évaluation de la variabilité locale.Cette thèse propose une approche novatrice, exploitant la microscopie électronique à balayage (SEM), afin de mesurer avec précision ces variations locales et d'appréhender les biais induits par les mires. Pour cela, un algorithme innovant permettant la mesure de l’overlay à partir de contours SEM a été développé. Par le recalage de contours de référence sur les contours extraits, l’overlay est mesuré directement sur le produit, nécessiter de mire spécifique, même en présence de niveaux partiellement masqués.Suite à l'évaluation de cette méthode sur des images synthétiques, son application sur des plaques de production a permis de quantifier la variabilité locale de l'overlay sur le produit, de mettre en évidence les écarts par rapport aux mesures en ligne, tout en révélant les limites de la métrologie SEM-OVL
Integrated circuits are manufactured via a stack of various layers. The precise alignment of these layers, known as "overlay" (OVL), is critical to chip reliability. The specifications are very strict: on a 300mm-diameter wafer, each pattern must be aligned to within a few nanometres. Current methods, based on optical observation of dedicated test patterns, show their limitations in terms of representativeness and assessment of local variability.This thesis proposes an innovative approach, using scanning electron microscopy (SEM), to accurately measure these local variations and to understand the biases induced by the test patterns. To this end, an algorithm for measuring the overlay from SEM contours has been developed. By registering reference contours on the extracted contours, the overlay is measured directly on the product, without the need for a specific test pattern, even in the presence of partially masked levels.Following the evaluation of this method on synthetic images, its application to production wafers enabled us to quantify the local variability of the overlay on the product, highlighting deviations from on-line measurements, while revealing the limits of SEM-OVL metrology
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Actes de conférences sur le sujet "Metrologie augmentée"

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Schmid, Stephan, et Dieter Fritsch. « Precision analysis of triangulations using forward-facing vehicle-mounted cameras for augmented reality applications ». Dans SPIE Optical Metrology, sous la direction de Fabio Remondino et Mark R. Shortis. SPIE, 2017. http://dx.doi.org/10.1117/12.2269716.

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Migukin, Artem, Vladimir Katkovnik et Jaakko Astola. « Optimal phase retrieval from multiple observations with Gaussian noise : augmented Lagrangian algorithm for phase objects ». Dans SPIE Optical Metrology, sous la direction de Peter H. Lehmann, Wolfgang Osten et Kay Gastinger. SPIE, 2011. http://dx.doi.org/10.1117/12.889118.

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Gaglione, S., A. Angrisano, G. Castaldo, C. Gioia, A. Innac, L. Perrotta, G. Del Core et S. Troisi. « GPS/Barometer augmented navigation system : Integration and integrity monitoring ». Dans 2015 IEEE Metrology for Aerospace (MetroAeroSpace). IEEE, 2015. http://dx.doi.org/10.1109/metroaerospace.2015.7180647.

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Winters, Daniel, Masashi Mitsui, Masamichi Ueda, Sven Sassning, Mohit Yadav, Patrik Langehanenberg et Jan-Hinrich Eggers. « High-precision 3D metrology for stacked diffractive augmented reality waveguides ». Dans Optifab 2023, sous la direction de Jessica DeGroote Nelson et Blair L. Unger. SPIE, 2023. http://dx.doi.org/10.1117/12.2688509.

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Plopski, Alexander, Varunyu Fuvattanasilp, Jarkko Poldi, Takafumi Taketomi, Christian Sandor et Hirokazu Kato. « Efficient In-Situ Creation of Augmented Reality Tutorials ». Dans 2018 Workshop on Metrology for Industry 4.0 and IoT. IEEE, 2018. http://dx.doi.org/10.1109/metroi4.2018.8428320.

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Hua, Hong. « Lightweight, Low-cost Augmented Reality Displays Enabled by Freeform Optical Technology ». Dans Applied Industrial Optics : Spectroscopy, Imaging and Metrology. Washington, D.C. : OSA, 2013. http://dx.doi.org/10.1364/aio.2013.aw1b.4.

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Notaros, Jelena, Milica Notaros, Manan Raval, Christopher V. Poulton, Matthew J. Byrd, Nanxi Li, Zhan Su et al. « Integrated Optical Phased Arrays for LiDAR, Communications, Augmented Reality, and Beyond ». Dans Applied Industrial Optics : Spectroscopy, Imaging and Metrology. Washington, D.C. : OSA, 2021. http://dx.doi.org/10.1364/aio.2021.m2a.3.

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Macmahon, Nelson Sosa, Juan Manuel Ramírez Cortés et Leopoldo Altamirano Robles. « Simulator in Augmented Reality Environment for Natural Interaction for Assembling Electrical Equipment ». Dans Applied Industrial Optics : Spectroscopy, Imaging and Metrology. Washington, D.C. : OSA, 2012. http://dx.doi.org/10.1364/aio.2012.jtu5a.22.

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Kellogg, James, Kathleen Andrea-Liner, Jennifer Jennings, Steven Timms, Robert C. Keramidas, Johnnie Berry, Tony DeLaCruz et al. « Augmented reality assisted astronaut operations in space to upgrade the cold atom lab instrument ». Dans Quantum Sensing, Imaging, and Precision Metrology, sous la direction de Selim M. Shahriar et Jacob Scheuer. SPIE, 2023. http://dx.doi.org/10.1117/12.2650750.

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Ho, Phuong Thao, José Antonio Albajez, Jorge Santolaria Mazo et José Antonio Yagüe-Fabra. « Augmented Reality in Industrial Manufacturing - Identification of Application Areas for AR-Based Quality Control/Assembly Based on Technology Suitability ». Dans 10th Manufacturing Engineering Society International Conference. Switzerland : Trans Tech Publications Ltd, 2023. http://dx.doi.org/10.4028/p-6wb7q2.

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Augmented Reality (AR) has started to be gradually utilized in industrial manufacturing. However, the gap between novel stage and industrial AR-based applications must be comprehensively solved. In this study, the task technology fit (TTF) and method of time measurement (MTM) are applied and put together to create a comprehensive map demonstrating the relationship between manufacturing tasks and AR-solution features. In addition, this map will support exploring the suitability of AR-based solutions and identifying the application areas of AR for industrial manufacturing, primarily focused on quality control, metrology and assembly tasks. By considering both the viewpoint of developers/users and the scientific principles underlying manufacturing tasks in this comprehensive map, the usability and effectiveness of the final AR solution are also ensured at an early stage of AR-based application development.As a result, this paper provides a useful system to utilize AR capabilities for more complex-multistep tasks in a standardized way. Thus, more potential development and improvement of AR-based solutions for quality 4.0, virtual metrology, and complex assemblies in an industrial manufacturing context could be holistically established and built.
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