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1
Beltrão, Mariana, Fernando M. Duarte, Júlio C. Viana et Vitor Paulo. « A review on in‐mold electronics technology ». Polymer Engineering & ; Science 62, no 4 (11 février 2022) : 967–90. http://dx.doi.org/10.1002/pen.25918.
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Madadnia, Behnam, Jan Vanfleteren et Frederick Bossuyt. « Methods to Improve Accuracy of Electronic Component Positioning in Thermoformed Electronics ». Micromachines 14, no 12 (16 décembre 2023) : 2248. http://dx.doi.org/10.3390/mi14122248.
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Three new methods for accurate electronic component positioning for thermoformed electronics are presented in this paper. To maintain the mechanical and electrical properties of printed-ink tracks, prevent deformation and stretching during thermoforming, and ensure reproducibility, the component positioning principle for all three proposed methods is based on keeping the temperature of some regions in the thermoplastic substrate less than the glass transition temperature of the thermoplastic carrier, to keep those regions resistant to plastic deformation. We have verified the accuracy of the different approaches by implementing these methods in a semi-sphere mold for positioning seven LEDs and one printed capacitive touch sensor. We compared the result of our fabrication processes with the typical fabrication process of in-mold electronics (direct printing on a thermoplastic foil and followed by a thermoforming step) and noticed that the sample produced by the typical process had tracks that were randomly stretched, tracks were not in a straight path after thermoforming and they were not electrically conductive. Furthermore, the final 3D position of the components was not reproducible sample by sample. However, with our proposed fabrication methods, the tracks and pads do not deform or expand during thermoforming and are electrically conductive after. Moreover, the round shape of the touch sensor remains the same as in the 2D design. Based on the results of the experiments, it appears that the proposed methods are capable of positioning electronic components with high precision in thermoformed electronics.
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Srinivasan, KP, et T. Muthuramalingam. « In-depth scrutinization of In- Mold Electronics for Automotive applications ». Journal of Physics : Conference Series 1969, no 1 (1 juillet 2021) : 012064. http://dx.doi.org/10.1088/1742-6596/1969/1/012064.
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Holdford, Becky, et Roger Stierman. « What “Green” Means : Challenges for Failure Analysis ». EDFA Technical Articles 8, no 4 (1 novembre 2006) : 12–14. http://dx.doi.org/10.31399/asm.edfa.2006-4.p012.
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Abstract With the July 2006 implementation of RoHS (the restriction of the use of certain hazardous substances in electrical and electronic equipment), the electronics reliability industry has seen a changeover to lead-free solders and “green” mold compounds that have no bromine- or antimony-based flame retardants. This article addresses some of the challenges caused by implementation of the new requirements.
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Morishige, Koichi. « Special Issue on Dies and Molds ». International Journal of Automation Technology 2, no 6 (5 novembre 2008) : 417. http://dx.doi.org/10.20965/ijat.2008.p0417.
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Mass-produced items such as cars, consumer electronics, electronic parts, precision instruments, office supplies, daily necessities, toys, etc., are invariably connected to dies and molds, basic manufacturing technology whose quality determines product quality. Die and mold production is difficult due to the complexity of structures and the requirement for high precision. Advances in both processing and elemental technology such as machine tool and CAD/CAM software determine the results of die and mold acceptability and the level of productive techniques in the country of manufacture. This special issue focuses on die and mold manufacturing technology. Among the many interesting papers are those on rapid prototyping, end mill machining, electric discharge machining, machine tools, press working, and CAD/CAM. We are certain that you will find this issue both interesting and informative. We thank the authors for their generous cooperation and the editing staff for their many contributions.
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Rusyana, Mohammad Purwa, et Rizky Maulana. « PENGARUH REKONDISI MOLD TYPE-2186 TERHADAP PENINGKATAN PRODUKTIVITAS DAN KUALITAS HASIL PRODUKSI ». Jurnal Permadi : Perancangan, Manufaktur, Material dan Energi 3, no 1 (29 janvier 2021) : 54–62. http://dx.doi.org/10.52005/permadi.v3i1.47.
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PT. STAR COMGISTIC INDONESIA is a company engaged in household electronics production field that makes 3 types of electronic products namely cooking utensils, electric iron and coffee pot. In the production process must pay attention to the quality at each stage in order to get the best production results optimal. Internship practice shows that the process of making a product that used in the production process must be done carefully and activities according to the existing standard operating procedures (SOP), so that the results of production can be of good quality or the results of production get good results optimal. The internship that was carried out at PT STAR COMGISTIC INDONESIA was on repair molding field. (molding) basically consists of two parts, namely the stationary part of the mold (stationary platen) in which the molten polymer is deposited, and the movable platen on the cover side or ejector side of a injection molding parts.Repair molding is a work in which repairing mold or mold that is damaged or needs maintenance, repair mold is done so that the mold can work properly. After done repair, when the molding is damaged before being repaired then the result production becomes defective or imperfect, for results from before being repaired and after fixing there is already an image in the testing section, for this case it is hoped that the mold can work as before it was damaged so that the product produced from the mold to produce an optimal product.
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Anzai, Masahiro. « Special Issue on Die and Mold Technology ». International Journal of Automation Technology 4, no 5 (5 septembre 2010) : 414. http://dx.doi.org/10.20965/ijat.2010.p0414.
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Mass-produced items such as cars, consumer electronics, electronic parts, precision instruments, office supplies, and daily necessities are invariably connected to dies and molds – basic manufacturing technology whose quality determines product quality. Die and mold production is difficult due to product complexity and high-precision requirement. Advances in processing and elemental technology such as machine tools and CAD/CAM software determine whether die and mold products are acceptability and the level of production techniques in the country of manufacture. This special issue focuses on advanced die and mold manufacturing technology. Among the many interesting papers are those on machining and measurement of texture, fabrication of parts using welding, high-speed servo press, CAM system for metal forming, surface inspection system, development of liner motor machining centers, and machine tools. We are certain that you will find this issue both interesting and informative. We thank the authors for their generous cooperation and the editing staff for their many helpful suggestions.
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Chen, Feng Jun, Shao Hui Yin, Jian Wu Yu, Ke Jun Zhu et Yu Wang. « Ultra-Precision Fabrication of Small-Size Aspherical Glass Lens Mold ». Key Engineering Materials 487 (juillet 2011) : 29–33. http://dx.doi.org/10.4028/www.scientific.net/kem.487.29.
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With the rapid development of opto-electronics communications, optics, aerospace and other industries, ultra-precision aspheric glass lenses are widely used in middle/high-grade optical opponent because of its high resolution and imaging quality. To achieve ultra-precision molding pressing of micro-lens, ultra-precision mold must be fabricated firstly. In this paper, some key new technologies were proposed for fabricating ultra-precision mold of small-size aspheric optical lens. A method of finite element simulation was employed to predict mould pressing process of the glass lens for correcting molds and improving the formation efficiency. An ultra-precision inclined-axis grinding and error compensation technology was also used to improve form accuracy of micro lens mold.
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Zhang, Sam, Xianting Zeng, Zhenggui Tang et Ming Jen Tan. « EXPLORING THE ANTISTICKING PROPERTIES OF SOLID LUBRICANT THIN FILMS IN TRANSFER MOLDING ». International Journal of Modern Physics B 16, no 06n07 (20 mars 2002) : 1080–85. http://dx.doi.org/10.1142/s0217979202010890.
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In the plastic molding industry, plastic parts like pager and handphone cases, plastic containers, etc. are formed in a mold by applying temperature and pressure. The transfer molding is the standard workhorse for the electronics industry. Although the transfer molding is widely used, it is far from being optimized. Mold sticking is a serious practical problem in this industry. A solution to the problem is to apply mold-releasing agents on the mold to act as a lubricant layer between the plastic and the mold. This easily results in stains and degraded surface finish. This paper investigates the effectiveness of solid thin films on reducing the adhesion between polymer and mold steel of different surface roughness. WS2, MoS2, and DLC coatings are deposited on test surfaces via unbalanced magnetron sputtering before polymer blocks are molded on and pulled apart using an Instron Machine. The force required to separate the plastic part and the mold steel is used as an indication of the stickiness. After the separation, the coating surface is also examined under microscope for stains and polymer residues. The coatings are characterized using Raman spectroscopy and contact angle measurements. Generally, the stickiness increases with initial surface roughness for all coatings. Initial test indicates that the DLC coating has the highest contact angle with water (100°) and the best anti-sticking properties among the samples tested, and could reduce the stickiness by 80% as compared to bare steel.
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Hwang, Chul Jin, Y. B. Ko, Hyung Pil Park, S. T. Chung et Byung Ohk Rhee. « Development of Dental Scaler Tip Mold with Powder Injection Molding Process ». Materials Science Forum 534-536 (janvier 2007) : 345–48. http://dx.doi.org/10.4028/www.scientific.net/msf.534-536.345.
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With the capability of net shaping for complex 3D geometry, powder injection molding (PIM) is widely used for automotive parts, electronics and medical industry. In this study, an ultrasonic dental scaler tip produced by machining process was redesigned for the PIM process. An injection mold was designed and machined to produce the dental scaler tip by the PIM process. The mold design was aided by CAE analysis. A PIM feedstock was made of SUS316L powder and a wax based binder. The filling balance in the mold was checked by a short shot test with LDPE and the PIM feedstock. Production capability of the PIM process for the dental scaler tip was examined with the mold. Although there were minor problems such as a discoloration around the gate and a flashing at the air vent, the PIM process turned out to be an excellent substitute for machining process to manufacture the ultrasonic dental scaler tip.
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Zhao, Zhong Li, Hai Peng Yu, Da Ming Wu, Ying Liu, Xiu Ting Zheng, Jian Zhuang et Peng Sheng Jing. « Research on the Key Technology in Ultra-Precision Machining of Optical Micro V-Groove Mold Roller ». Advanced Materials Research 712-715 (juin 2013) : 1563–67. http://dx.doi.org/10.4028/www.scientific.net/amr.712-715.1563.
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The optical properties of micro-structure surface mold roller in the field of optics, machinery and electronics, biomedical and defense sectors are showing an increasingly important application value and broad application prospects. There is still no more mature method to machining ultra-precision large-size optical V-groove mold roller, and the roller surface treatment technology cant meet the technical requirements of the field of optical applications. This article takes advantage of ultra-precision diamond turning to machining V-groove structure on nickel-phosphorus plating steel roller by spiral cutting method. The helix angle of the mold roller was designed 0.9", which meet the requirements of the experimental error, while using a nickel-phosphorus alloy coating can eliminate the secondary polishing process and achieve a cost-efficient ultra-precision machining. Analyzed the processed tool wear, high-temperature graphitization and micro-chipping were the main reason for tool wear.
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Sulong, Abu Bakar, Gan Tek Keong et Jaafar Sahari. « Effects of Molding Parameters and Addition of Fillers on Gate Chip Off Formation during the Degating Process in Transfer Molding ». Key Engineering Materials 447-448 (septembre 2010) : 790–94. http://dx.doi.org/10.4028/www.scientific.net/kem.447-448.790.
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In the electronics packaging industry, Epoxy Mold Compound (EMC) polymer matrix is filled with fused silica (SiO2) to obtain the required roughness and hardness. Gate chip off, which occurs during the degating process in transfer molding is one of the common defects which contributes to the failure in the proper functioning of the package. During the degating process, surface contact between two solid bodies (degating blade and gate) generate a high shear stress on package, thus creating a high potential for the incidence of gate chip of. In this study, the influence of transfer molding parameters and size of fillers (normal and fine) on the gate chip off were investigated. The application of Design of Experiments (DOE) using regression model and Analysis of Variance (ANOVA) showed that molding parameters do not significantly influence the incidence of gate chip off. Numerical simulation was used to investigate effect of two filler sizes and molding parameters on the mold fill time, end pressure of fill and shear stress at the wall. The results showed there were no significant influences on mold fill time but the fine filler showed lower pressure at the end of fill and lower shear stress at the wall. Experimental results of two sizes if filler shown that fine filler mold compound exhibited in reduction of gate chip off formation, compared to normal filler mold compound. Smooth surface of fine mold compound lead to decrease of friction shear stress during degating is expected contribute to this finding.
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Shearer, Catherine. « Transient Liquid Phase Sintering Pastes in Heterogeneous Integration ». Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2017, DPC (1 janvier 2017) : 1–26. http://dx.doi.org/10.4071/2017dpc-wp1_presentation5.
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Integrated package technologies continue to be the dominant trend in the electronics packaging industry. In particular, heterogeneous integration of logic and memory or sensing is an enormous growth segment for both mobile electronics and IoT applications. In the mobile microprocessor segment of the field, the most advanced technologies will be implemented in the early adopter class. New package architectures and interconnect schemes will be vetted and implemented without significant cost pressure, performance is the driver. In the IoT segment and downstream mobile, however; lower cost alternatives to cutting edge packaging architectures are needed to drive market growth. Sintering pastes offer an opportunity to cost-effectively enable cutting edge 3D package capability for a wider variety of applications. In this paper we will explore the use of transient liquid phase sintering (TLPS) pastes in package-on-package (POP) schemes for integrated logic with memory or sensing functions in through mold via architectures. Through mold via technology has been well established in the industry and has significantly contributed to the adoption of three dimensional packaging architectures. The advantages of using TLPS pastes in similar structures will be detailed.
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Liu, Xiangyang, Derek Li, Hiroshi Fukutani, Paul Trudeau, LoleÏ Khoun, Olga Mozenson, Kathleen L. Sampson et al. « UV‐Sinterable Silver Oxalate‐Based Molecular Inks and Their Application for In‐Mold Electronics ». Advanced Electronic Materials 7, no 9 (18 juillet 2021) : 2100194. http://dx.doi.org/10.1002/aelm.202100194.
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Anzai, Masahiro. « Special Issue on Die and Mold Technology ». International Journal of Automation Technology 6, no 4 (5 juillet 2012) : 521. http://dx.doi.org/10.20965/ijat.2012.p0521.
Texte intégralRésumé :
Such mass-produced items as cars, consumer electronics equipment, precision instruments, office supplies, and daily necessities are inevitably connected to dies and molds – basic manufacturing technology whose quality determines product quality. The difficulties of die and mold production lie in the complexity of the structures and their requirements for high precision. Advances in both processing and basic technology such as machine tools and CAD/CAM software determine the results of die and mold acceptability and the level of productive techniques in the country of manufacture. This special issue focuses on advanced die and mold manufacturing technology. Included among the many interesting papers and reports are “The Influence Capitalize of Properties Improvement for Reinforced Plastics by Resin Flow Control Molding Method,” “Improving the Properties of Reinforced Plastics Using the Resin Flow Control Method of Molding – Evaluation of Sealing Performance of Molded Plastic Parts –,” “The Relation Between Mirror SurfaceMachining and Transcription Accuracy in the Nano Range – Molded Surface Transcription Through Accurate Mirror Surface Mold –,” and “High Precise Milling Process by cBN End Mills.” We are certain that you will find this issue both interesting and informative. We thank the authors for their generous cooperation and the editing staff for their invaluable assistance.
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Hubmann, Martin, Behnam Madadnia, Jonas Groten, Martin Pletz, Jan Vanfleteren, Barbara Stadlober, Frederick Bossuyt, Jatinder Kaur et Thomas Lucyshyn. « Process Optimization of Injection Overmolding Structural Electronics with Regard to Film Distortion ». Polymers 14, no 23 (22 novembre 2022) : 5060. http://dx.doi.org/10.3390/polym14235060.
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The integration of structural electronics in injection-molded parts is a challenging step. The films—comprising of laminated stacks with electronics—are exposed to shear stresses and elevated temperatures by the molten thermoplastic. Hence, molding settings have a significant impact on the successful, damage-free manufacturing of such parts. In this paper, test films with polycarbonate (PC) sheets as outer and two different thermoplastic polyurethanes (TPUs) as middle layers incorporating conductive tracks on a flexible printed circuit board (flexPCB) are manufactured and overmolded with PC. Parameter studies investigating the influence of the melt temperature, mold temperature, injection speed and used TPU layer were performed. The molded parts were inspected visually and compared with a numerical simulation using injection molding software. A shear distortion factor for the TPU layer was derived based on the simulations that linked the shear stresses with the injection time and the softening (melting) of the TPU. The distortion of the films was found to reduce with higher melt temperature, lower mold temperature and faster injection speed. Films using the TPU with the higher melting temperature yielded significantly better results. Moreover, distortion on the films reduced with the increasing distance to the gate and a larger cavity thickness was found to be beneficial. All those relations could be correlated with the shear distortion factor.
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Ullah, Misbah, Nicolò Maria Ippolito, Loredana Spera et Francesco Vegliò. « Treatment of wastewater produced during the hydrometallurgical extraction of silver from in-mold structural electronics ». Case Studies in Chemical and Environmental Engineering 10 (décembre 2024) : 100916. http://dx.doi.org/10.1016/j.cscee.2024.100916.
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Hopmann, Christian, Kirsten Bobzin, Tobias Brögelmann, Christian Schäfer, Maximilian Schöngart, Malte Röbig et Mona Naderi. « Improved molding of micro structures using PVD-coated mold inserts ». Journal of Polymer Engineering 36, no 6 (1 août 2016) : 575–82. http://dx.doi.org/10.1515/polyeng-2015-0270.
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Abstract Micro structured optical plastics components are intensively used, i.e. in consumer electronics, for optical sensors in metrology, innovative LED-lighting, or laser technology. Injection molding has been proven successful for the large-scale production of these parts. However, the production of these parts still causes difficulties due to challenges in the molding and demolding of plastics parts created with laser-structured mold inserts. A complete molding of the structures often leads to increased demolding forces, which then cause a breaking of the structures and a clogging of the mold. An innovative approach is to combine physical vapor deposition (PVD)-coated, laser-structured inserts and a variothermal molding process to create functional micro structures in a one-step process. Therefore, a PVD coating is applied after the laser-structuring process in order to improve the wear resistance and the anti-adhesive properties against the plastics melt. In a series of molding trials with polycarbonate (PC) and polymethyl methacrylate (PMMA) using different coated molds, the mold temperature during injection was varied in the range of the glass transition and the melt temperature of the polymers. Subsequently, the surface topography of the molded parts was evaluated by digital three-dimensional laser-scanning microscopy. The influence of the molding parameters and the coating of the mold insert on the molding accuracy and the demolding behavior were analyzed. It was shown that micro structures created by ultra-short pulse laser ablation can be successfully replicated in a variothermal molding process. Due to the mold coating, significant improvements could be achieved in producing micro structured optical plastics components.
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Gong, Yao, Kyoung Je Cha et Jang Min Park. « Deformation characteristics and resistance distribution in thermoforming of printed electrical circuits for in-mold electronics application ». International Journal of Advanced Manufacturing Technology 108, no 3 (mai 2020) : 749–58. http://dx.doi.org/10.1007/s00170-020-05377-9.
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Goto, Hiroshi. « Overview on Nanoimprint Technology - Process, Tools, Applications and Technical Issues for Industrialization ». Key Engineering Materials 345-346 (août 2007) : 1073–77. http://dx.doi.org/10.4028/www.scientific.net/kem.345-346.1073.
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Nanoimprint process is a simple and a low cost micro/nano fabrication method based on mold replication principle. Various kinds of applications such as optical devices for flat panel displays or electronic papers, patterned medias, bio-medical devices and electronics devices using nanoimprint process are expected. In the past a decade, many researches and developments on the process, the tool, the application relating to nanoimprint were carried out and partly commercialized. In this paper, overview on nanoimprint technology including recent progress is described. And important issues to be solved and solution idea for industrialization of nanoimprint process are pointed out. Also, our recent R&D activities on nanoimprint tool and process, which are UV/thermal nanoimorint tool and process, roll to roll type imprint system are introduced.
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Park, Keon Joo, Chae Won Kim, Min Jae Sung, Jiyoul Lee et Young Tea Chun. « Semiconducting Polymer Nanowires with Highly Aligned Molecules for Polymer Field Effect Transistors ». Electronics 11, no 4 (18 février 2022) : 648. http://dx.doi.org/10.3390/electronics11040648.
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Conjugated polymers have emerged as promising materials for next-generation electronics. However, in spite of having several advantages, such as a low cost, large area processability and flexibility, polymer-based electronics have their own limitations concerning low electrical performance. To achieve high-performance polymer electronic devices, various strategies have been suggested, including aligning polymer backbones in the desired orientation. In the present paper, we report a simple patterning technique using a polydimethylsiloxane (PDMS) mold that can fabricate highly aligned nanowires of a diketopyrrolopyrrole (DPP)-based donor–acceptor-type copolymer (poly (diketopyrrolopyrrole-alt-thieno [3,2-b] thiophene), DPP-DTT) for high-performance field effect transistors. The morphology of the patterns was controlled by changing the concentration of the DPP-based copolymer solution (1, 3, 5 mg mL−1). The molecular alignment properties of three different patterns were observed with a polarized optical microscope, polarized UV-vis spectroscopy and an X-ray diffractometer. DPP-DTT nanowires made with 1 mg mL−1 solution are highly aligned and the polymer field-effect transistors based on nanowires exhibit more than a five times higher charge carrier mobility as compared to spin-coated film-based devices.
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Khaliq, Amin, Muhammad Ahmad Kamran et Myung Yung Jeong. « Nanoimprint Mold Consisting of an Adhesive Lap Joint between a Nanopatterned Metal Sleeve and a Carbon Composite Roll ». Nanomaterials 13, no 10 (20 mai 2023) : 1685. http://dx.doi.org/10.3390/nano13101685.
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Roll-to-roll nanoimprinting is an emerging technology that has revolutionized the sectors of flexible electronics, thin films, and solar cells with its high throughput. However, there is still room for improvement. In this study, a FEM analysis (in ANSYS) was carried out on a large-area roll-to-roll nanoimprint system in which the master roller consists of a large nanopatterned nickel mold joined to a carbon fiber reinforced polymer (CFRP) base roller using epoxy adhesive. Deflections and pressure uniformity of the nano-mold assembly were analyzed under loadings of different magnitudes in a roll-to-roll nanoimprinting setup. Optimization of deflections was performed with applied loadings, and the lowest deflection value was 97.69 nm. The adhesive bond viability was assessed under a range of applied forces. Finally, potential strategies to reduce deflections were also discussed, which can be helpful in increasing pressure uniformity.
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Syed-Khaja, Aarief, et Jörg Franke. « Design and Solder Process Optimization in MID Technology for High Power Applications ». Advanced Materials Research 1038 (septembre 2014) : 107–12. http://dx.doi.org/10.4028/www.scientific.net/amr.1038.107.
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Molded interconnect device (MID) technology is a key enabling technology with growing markets in automotive, communications, consumer electronics through integration with lighting and sensor technologies. The MID technology is yet to be explored for high temperature applications in automotive or consumer lighting. One of the hindering factors for such implementation in the serial production and time to market is the improper electronic and thermal packaging of the light emitting diodes (LEDs) on the MID substrates. This paper addresses the optimization of mold design, surface metallization and soldering process for the effective thermal management of the high-power LED systems. By using a simulation model, the thermal distribution and the resultant decrease in temperatures for varying forward electrical currents in high-power LEDs by design optimization is demonstrated. In addition, the optimization of solder process with respect to solder profile in context of vacuum vapor-phase soldering for void-free solder connections is discussed.
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Liu, Hang, Yan Xu, Kai Leung Yung et Chun Lei Kang. « The Interface Behavior of Micro Overmolding ». Advanced Materials Research 591-593 (novembre 2012) : 896–99. http://dx.doi.org/10.4028/www.scientific.net/amr.591-593.896.
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Micro overmolding is becoming more important with the rapid development and applications of microproducts in bioengineering, electronics and other areas in recent years. This paper presents our findings in studying polymer interfaces in micro channels of a micro mold during overmolding process. The bonding strengths between polycarbonate (PC) and thermoplastic polyurethanes (TPU) were examined and compared under different overmolding conditions. Results show bonding behaviors in micro channels are not only affected by temperatures, they are also influenced by surface roughness.
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Lee, Sang Yoon, Seong Hyun Jang, Hyun Kyung Lee, Jong Sun Kim, SangKug Lee, Ho Jun Song, Jae Woong Jung, Eui Sang Yoo et Jun Choi. « The development and investigation of highly stretchable conductive inks for 3-dimensional printed in-mold electronics ». Organic Electronics 85 (octobre 2020) : 105881. http://dx.doi.org/10.1016/j.orgel.2020.105881.
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Zhan, Yujie, Liangui Deng, Wei Dai, Yongxue Qiu, Shicheng Sun, Dizhi Sun, Bowen Hu et Jianguo Guan. « Fabrication of Large-Area Nanostructures Using Cross-Nanoimprint Strategy ». Nanomaterials 14, no 12 (8 juin 2024) : 998. http://dx.doi.org/10.3390/nano14120998.
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Nanostructures with sufficiently large areas are necessary for the development of practical devices. Current efforts to fabricate large-area nanostructures using step-and-repeat nanoimprint lithography, however, result in either wide seams or low efficiency due to ultraviolet light leakage and the overflow of imprint resin. In this study, we propose an efficient method for large-area nanostructure fabrication using step-and-repeat nanoimprint lithography with a composite mold. The composite mold consists of a quartz support layer, a soft polydimethylsiloxane buffer layer, and multiple intermediate polymer stamps arranged in a cross pattern. The distance between the adjacent stamp pattern areas is equal to the width of the pattern area. This design combines the high imprinting precision of hard molds with the uniform large-area imprinting offered by soft molds. In this experiment, we utilized a composite mold consisting of three sub-molds combined with a cross-nanoimprint strategy to create large-area nanostructures measuring 5 mm × 30 mm on a silicon substrate, with the minimum linewidth of the structure being 100 nm. Compared with traditional step-and-flash nanoimprint lithography, the present method enhances manufacturing efficiency and generates large-area patterns with seam errors only at the micron level. This research could help advance micro–nano optics, flexible electronics, optical communication, and biomedicine studies.
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Chen, Yanyan, Shengfei Zhang, Shunchang Hu, Yangjing Zhao, Guojun Zhang, Yang Cao et Wuyi Ming. « Study of Heat Transfer Strategy of Metal Heating/Conduction Plates for Energy Efficiency of Large-Sized Automotive Glass Molding Process ». Metals 13, no 7 (30 juin 2023) : 1218. http://dx.doi.org/10.3390/met13071218.
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In recent years, as an important functional material, glass has been widely used in architecture, electronics, optics, and other fields. As an emerging glass processing technology, the glass molding process (GMP) has received widespread attention and research in recent years. In this paper, we study the modeling and analysis of different heat transfer strategies for the energy efficiency of large-sized automotive instrument glass. The heat transfer model of the metal heating plate–conducting plate mold is established, the thermal energy efficiency in the forming process of large automobile glass is analyzed, and the energy efficiency of the mold in the heating stage is compared. The energy consumption per piece generated by the GMP heating device is reduced from 4865.2 to 4668.5 kJ, a reduction of 4.04%. By optimizing the heat flow density, the energy consumption per piece generated by the GMP heating device was reduced from 4865.2 to 4625.5 kJ, a reduction of 4.92%, meeting the sustainable manufacturing requirements.
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Arafat Bagoes Setyawan, Muhammad Khaerudin et Siti Setiawati. « Perancangan Aplikasi Enkripsi dan Dekripsi Gambar Cetak Biru Pada PT. Patco Elektronik Teknologi Menggunakan Algoritma RSA Berbasis Android ». NUANSA INFORMATIKA 18, no 2 (20 juillet 2024) : 19–25. http://dx.doi.org/10.25134/ilkom.v18i2.145.
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PT. Patco Elektronik Teknologi, a leading company in the Electronics industry, urgently needs to enhance the security of blueprint mold data in its Moldshop division. The process of mold repair using CNC machines requires secure access to the company's standard blueprint drawings. Hence, this study aims to develop an Android-based application for encrypting and decrypting blueprint images using the Rivest Shamir Adleman algorithm. It also addresses challenges such as budget constraints, Android device availability, and data security. The method chosen, Rivest Shamir Adleman, is renowned for its asymmetric cryptography and will be implemented in the Android application for securing blueprint images. The research successfully resulted in the creation, implementation, and testing of the Rivest Shamir Adleman Android application. Testing demonstrated that the program can efficiently encrypt and decrypt blueprint images, with encryption averaging 4 to 15 seconds and decryption 2 to 5 seconds using this method. By employing Rivest Shamir Adleman, the application ensures high-level security for blueprint image files.
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Nodin, Muhamad Nor, et Mohd Sallehuddin Yusof. « A Preliminary Study of PDMS Stamp towards Flexography Printing Technique : An Overview ». Advanced Materials Research 844 (novembre 2013) : 201–4. http://dx.doi.org/10.4028/www.scientific.net/amr.844.201.
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Polydimethylsiloxane (PDMS) commonly used for microcontact printing is essential towards the successful introduction of high speed printing of reel-to-reel or reel-to-plate manufacturing processes. Here, it is proposed that extending flexography printing method into the multiple micro-scale printing solid line onto subtract by using PDMS stamp as a plate. Flexography is a high-speed technique commonly used for printing onto substrates in a lot of paper printing industry. It was introduces a decade ago where it is very useful for large production. In this area of printing, the expanding demand on printing electronics leads to a lot of study needed for high speed and large production of electronic industries. This work elaborates the feasibility of PDMS stamp (12in x 4in) use in flexography printing for multiple micro solid lines. It will undergo by using simple and inexpensive fabrication PDMS mold process. This paper illustrates the use of PDMS in microcontact printing fusing with flexography printing to produce multiple micro-solid line printing capability by using conductive ink as application of printing electronic industry applications.
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Panneerselvam, Vivekanandan, et Faiz Mohd Turan. « Optimization of Process Parameters of Injection Moldings for Plastic Pallets Manufacturing Industry ». Journal of Modern Manufacturing Systems and Technology 2 (26 mars 2019) : 75–83. http://dx.doi.org/10.15282/jmmst.v2i1.1802.
Texte intégralRésumé :
Plastics have been heavily used in industries like automobile, manufacturing, electrical and electronics industry all over the world. Injection molding is one of the ways to process plastics polymers. However, one of the difficulties they have to face is to set the optimal parameter for the injection molding process. Incorrect parameter selection can lead to parts defects such as warpage, shrinkage, sink marks, weld marks and so on. In this study, the optimal process parameter of injection molding for manufacturing of plastic pallets which is used for warehousing was determined by the orthogonal array of Taguchi’s L9 which has 3 factors and 3 levels for each factor, experimental design, and Regression Analysis. The three main parameters such as Mold temperature, holding pressure and charging speed were choosen to study their effect on the Compressive strength. S/N ratios were utilized for determining the optimal set of parameters. According to the results, 230 °C of mold temperature, 98 RPM of charging speed, 25 MPa of Holding pressure make the products in the shape and proportion of the product satisfactory. Statically the most significant parameters were found to be as mold temperature and Charging speed for the Polypropylene moldings, respectively. Holding pressure had the least effect on the compressive strength of PP material. After the degree of significance of the studied process parameters was determined, the linear Regression model was generated and was shown to be an effective predictive tool for Compressive strength.
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Lombard, Ph, T. Gerges, J. Y. Charmeau, B. Allard et M. Cabrera. « Procédé plastronique Electronique Structurelle Surmoulée (ESS, IME – In Mold Electronics) dans un projet de mise en œuvre pratique ». J3eA 21 (2022) : 1012. http://dx.doi.org/10.1051/j3ea/20221012.
Texte intégralRésumé :
Au croisement des métiers de la plasturgie et de l’électronique, la plastronique constitue un nouveau champ technologique et ouvre de nouvelles opportunités pour miniaturiser et intégrer de manière optimale des systèmes électroniques aux objets polymères en trois dimensions – 3D. De nouveaux procédés émergent et trouvent des applications innovantes dans de nombreux secteurs d’activité. A cet égard, l’intérêt des industriels et des étudiants est en pleine croissance. Il convient de répondre à ces attentes avec un éventail de formations appropriées et de les accompagner par des enseignements spécifiques que nous souhaitons originaux. Cet article introduit la plastronique et plus particulièrement le procédé plastronique 3D appelé Electronique Structurelle Surmoulée (ESS, IME – In Mold Electronics). Il présente également les étapes du travail expérimental et pratique de mise en oeuvre d’un projet étudiant. L’objectif est de s’adapter aux niveaux des apprenants et aux objectifs pédagogiques désirés. Il s’agit de réaliser, dans son ensemble, un dispositif fonctionnel concret suscitant l’éveille et l’intérêt des apprenants.
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Pham, Tuan Nghia. « Cooling channel design for improving quality of injection plastic product ». TẠP CHÍ KHOA HỌC TRƯỜNG ĐẠI HỌC QUỐC TẾ HỒNG BÀNG 4 (24 juin 2023) : 101–8. http://dx.doi.org/10.59294/hiujs.vol.4.2023.392.
Texte intégralRésumé :
Injection molding is the most widely used technique for making the related plastic parts for consumer electronics goods with limited lifespans, like mobile phones, which are growing more and more popular. The molten plastic beads must be injected into a mold cavity, cooled, then part-formed and ejected. Filling, packing, cooling, and ejection are the four key steps in an injection molding process. The length of the molding cycle affects how economical the procedure is. The cooling step is the most crucial of the three since it controls how quickly are produced. Otherwise, cooling systems are important for the injection molding process in terms of productivity, quality, and mold-making costs. In this paper, three conformal cooling channel designs are proposed for obtaining uniform cooling over the molded parts. The research is conducted by using CAE software (MOLDEX 3D) to simulate the injection process and compare the results of three conformal cooling channel designs with molded part cooling by moldbase. All three designs show that warpage and cycle time improve significantly, helping to decrease cost and increase productivity. In which the combination of a conformal cooling channel outside and a baffle cooling channel significantly reduces the warpage.
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Furusawa, Takeshi, Naomi Kawamura, Toshiki Furutani et Takashi Kariya. « Control of Package Warpage by Package Substrate Design for Low Profile Package-on-Package Structure ». International Symposium on Microelectronics 2012, no 1 (1 janvier 2012) : 000491–96. http://dx.doi.org/10.4071/isom-2012-tp65.
Texte intégralRésumé :
In recent years, with increasing demand for high-density assembly in mobile electronics products, a package-on-package (PoP) structure has been standardized. The demand for lowering the PoP profile is getting stronger as consumers demand thinner mobile devices. To assemble a low profile PoP and mount it on a mother board, it is necessary to have a precise warpage control of PoP components, including its bottom package. It is expected that a flip-chip chip-scale-package (FCCSP) with thin mold cap will be used as the bottom package of the PoP in the next 2–3 years. In order to control the package warpage, it is necessary to optimize a large number of parameters related to the package substrate, silicon die and mold compound. Among them, equivalent coefficient of thermal expansion (CTE) of the package substrate is one of the most important factors. In this paper, control of the package warpage was studied by focusing on the glass-cloth content ratio in the package substrate. Glass-cloth has the lowest CTE among the constituent materials of the substrate, so it contributes to reduce the equivalent CTE of the substrate. To maximize the glass-cloth content, a substrate with a thick core and thin build-up structure was prepared, and the package with thin mold cap was subsequently formed. Compared with a similar package with a conventional substrate structure, its warpage, measured experimentally, was about 20% smaller. Consequently, it was concluded that the glass-cloth content ratio is a key factor to control package warpage behavior in the PoP assembly process.
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Unno, Noriyuki, et Tapio Mäkelä. « Thermal Nanoimprint Lithography—A Review of the Process, Mold Fabrication, and Material ». Nanomaterials 13, no 14 (8 juillet 2023) : 2031. http://dx.doi.org/10.3390/nano13142031.
Texte intégralRésumé :
Micro- and nanopatterns perform unique functions and have attracted attention in various industrial fields, such as electronic devices, microfluidics, biotechnology, optics, sensors, and smart and anti-adhesion surfaces. To put fine-patterned products to practical use, low-cost patterning technology is necessary. Nanoimprint lithography (NIL) is a promising technique for high-throughput nanopattern fabrication. In particular, thermal nanoimprint lithography (T-NIL) has the advantage of employing flexible materials and eliminating chemicals and solvents. Moreover, T-NIL is particularly suitable for compostable and recyclable materials, especially when applying biobased materials for use in optics and electronics. These attributes make T-NIL an eco-friendly process. However, the processing time of normal T-NIL is longer than that of ultraviolet (UV) NIL using a UV-curable resin because the T-NIL process requires heating and cooling time. Therefore, many studies focus on improving the throughput of T-NIL. Specifically, a T-NIL process based on a roll-to-roll web system shows promise for next-generation nanopatterning techniques because it enables large-area applications with the capability to process webs several meters in width. In this review, the T-NIL process, roll mold fabrication techniques, and various materials are introduced. Moreover, metal pattern transfer techniques using a combination of nanotransfer printing, T-NIL, and a reverse offset are introduced.
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Huda, Miftakul. « ANALISIS PERBAIKAN KUALITAS INJECTION PART DENGAN PENDEKATAN LEAN SIX SIGMA ». EKOMABIS : Jurnal Ekonomi Manajemen Bisnis 1, no 01 (21 janvier 2020) : 79–90. http://dx.doi.org/10.37366/ekomabis.v1i01.7.
Texte intégralRésumé :
Lean Six Sigma is a collective approach, which uses various techniques and tools for quality improvement. Here, Lean Six Sigma methodology was applied to a small injection molding unit (which can be taken as representative of small and medium-size industries) manufacturing casing of electronics part. The DMAIC (Define, Measure, Analyze, Improve and Control) approach of Lean Six Sigma was applied to reduce the rejection rate of the casing (child part of an electronic product) by changing setting parameters: mold temperature, injection pressure and injection speed in the injection mold process. The statistical techniques such as DOE full factorial experiment, and process capability analysis were done to finding the process capability before and after the Lean Six Sigma implementation. After implementing the Lean Six Sigma DMAIC approach it was found that injection molding firms can increase their profit by increase yield rate and deleting rejection rate of casing part. Lean Six Sigma implementation increase the process sigma level from 4,3σ to 4,7σ by a reduction in casing flow mark variation and transparency. This increase in sigma level will give defect cost reduction to the industry which is a good figure for such an industry.
Abstrak
Lean Six Sigma adalah pendekatan kolektif, yang menggunakan berbagai teknik dan alat untuk peningkatan kualitas. Di sini, metodologi Lean Six Sigma diterapkan pada unit injection molding kecil (yang dapat dianggap mewakili industri ukuran kecil dan menengah) manufaktur casing part. Pendekatan DMAIC (Define, Measure, Analyze, Improve and Control) Lean Six Sigma diterapkan untuk mengurangi tingkat penolakan casing part (bagian anak dari produk elektronik) dengan mengubah tiga setting parameter: suhu mold, tekanan dan kecepatan injection dalam proses cetakan injeksi. Teknik statistik seperti DOE full factorial experiment,dan analisis kemampuan proses dilakukan untuk menemukan kemampuan proses sebelum dan sesudah implementasi Lean Six Sigma. Setelah menerapkan pendekatan Lean Six Sigma DMAIC ditemukan bahwa perusahaan injection molding dapat meningkatkan keuntungannya dengan menaikan yield rate dengan mengendalikan tingkat penolakan casing part. Implementasi Lean Six Sigma meningkatkan tingkat sigma proses dari 4,3σ menjadi 4,8σ dengan mengurangi variasi flow mark dan transperancy. Kenaikan tingkat sigma ini akan memberikan pengurangan biaya akibat cacat ke industri yang merupakan contoh yang baik untuk industri semacam ini.
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Basir, Al, Norhamidi Muhamad, Mohammad Fadhli Izuddin Mohd Nor, Muhammad Mohamed et Nashrah Hani Jamadon. « Moldability and Solvent Debinding of Hydroxyapatite Micro-Part Processed through Micro-Powder Injection Molding ». Jurnal Kejuruteraan 36, no 2 (30 mars 2024) : 399–405. http://dx.doi.org/10.17576/jkukm-2024-36(2)-01.
Texte intégralRésumé :
The development of the micro-powder injection molding (µPIM) process from the powder injection molding (PIM) process has been prompted by the demand of the worldwide market to produce micro-sized components. The need for µPIM-processed components is currently rising across a range of industries, including automotive, aerospace, food, biomedical, electronics, and telecommunications. In the current research work, homogeneous HA feedstock with a powder loading of 57 vol.% was prepared by mixing HA powder particles with palm stearin and low-density polyethylene (LDPE) binders at a mixing temperature of 150 °C for 6 h. Defect-free injection molded or green micro-sized components of HA were produced by employing injection pressure, injection time, mold temperature, and melt temperature of 12 bar, 5 s, 110 °C, and 180 °C, respectively. When mold temperatures less than 110 °C were used, short shot defects were frequently observed in green specimens. After solvent debinding at 60 °C for 50 min, 82.2% of the palm stearin was removed from the green part. No difference in dimension between the solvent debound part and the green part was noticed. An open-pore structure developed in the solvent debound HA microcomponent is helpful for eliminating the insoluble LDPE binder during the thermal debinding phase.
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Lombard, Ph, H. Cauchy-Clerc, B. Allard et M. Cabrera. « Etude de cas en plastronique IME – Alliance de la plasturgie et de l’électronique pour le packaging de systèmes 3D ». J3eA 23 (2024) : 1003. http://dx.doi.org/10.1051/j3ea/20241003.
Texte intégralRésumé :
Au croisement des métiers de la plasturgie et de l’électronique, la plastronique ouvre de nouvelles opportunités pour miniaturiser et intégrer de manière optimale des systèmes électroniques aux objets polymères en trois dimensions – 3D. De nouveaux procédés émergent et trouvent des applications innovantes dans des secteurs d’activité très diversifiés. Cet article introduit une étude de cas qui a été développé avec le procédé plastronique 3D d’Electronique Structurelle Surmoulée (ESS) également appelé IME (In Mold Electronics). Dans un objectif pédagogique, nous illustrons un travail pratiques de mise en œuvre. Nous passons en revue l’ensemble des étapes de fabrication d’un système appelé « La Boucle infinie ». L’étude de cas se prête à un travail de Travaux Pratiques dans une approche d’enseignement par projets qui vise l’attractivité et la pluridisciplinarité.
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Jin, Weikan, Zhiheng Yu, Guohong Hu, Hui Zhang, Fengli Huang et Jinmei Gu. « Effects of Three-Dimensional Circular Truncated Cone Microstructures on the Performance of Flexible Pressure Sensors ». Materials 15, no 13 (5 juillet 2022) : 4708. http://dx.doi.org/10.3390/ma15134708.
Texte intégralRésumé :
Three-dimensional microstructures play a key role in the fabrication of flexible electronic products. However, the development of flexible electronics is limited in further applications due to low positioning accuracy, the complex process, and low production efficiency. In this study, a novel method for fabricating three-dimensional circular truncated cone microstructures via low-frequency ultrasonic resonance printing is proposed. Simultaneously, to simplify the manufacturing process of flexible sensors, the microstructure and printed interdigital electrodes were fabricated into an integrated structure, and a flexible pressure sensor with microstructures was fabricated. Additionally, the effects of flexible pressure sensors with and without microstructures on performance were studied. The results show that the overall performance of the designed sensor with microstructures could be effectively improved by 69%. Moreover, the sensitivity of the flexible pressure sensor with microstructures was 0.042 kPa−1 in the working range of pressure from 2.5 to 10 kPa, and the sensitivity was as low as 0.013 kPa−1 within the pressure range of 10 to 30 kPa. Meanwhile, the sensor showed a fast response time, which was 112 ms. The stability remained good after the 100 cycles of testing. The performance was better than that of the flexible sensor fabricated by the traditional inverted mold method. This lays a foundation for the development of flexible electronic technology in the future.
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TSAI, HUNG-YIN, et CHIA-JEN TING. « LOW COST FABRICATION OF SUB-WAVELENGTH STRUCTURES ON LARGE-AREA POLYMER SHEET BY UV CURING AND NANO-IMPRINTING PROCESSES ». Surface Review and Letters 17, no 03 (juin 2010) : 345–51. http://dx.doi.org/10.1142/s0218625x10013977.
Texte intégralRésumé :
Anti-reflection layers made from sub-wavelength structures or nanostructure arrays have been extensively studied due to the high demand of the solar cell markets and the use of consuming electronics such as plane displays, glasses, prisms, videos, and the monitors of the camera. Conventionally, this anti-reflection layer was fabricated by multilayer films deposition through sputtering, wet-coating or sol-gel. However, these methods have several disadvantages such as process instability, high cost and high temperature procedure. In the current study, fabrication methods of UV curing and nano-imprinting processes are proposed to produce large-area polymer sheets with sub-wavelength structures (SWS). Porous anodic alumina (PAA) mold of nano-holes was used to fabricate SWS on a PET sheet with UV photoresists of refractive index of 1.53 by roll-to-roll processing. The reflectance of SWS on PET decreases from 9.39 to 4.25% at the wavelength of 550 nm. The contact angle changes from 78.1° to 103.2°. The porous anodic alumina mold was also used to imprint a PMMA film and SWS were obtained by hot embossing at different temperatures. The reflectance changes from 4.25 to 2.16% at the wavelength of 550 nm after nano-imprinting. A successful low cost approach to produce large-area polymer sheets with SWS is obtained by both UV curing and nano-imprinting processes.
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Ren, Dayang, Changzhong Wu, Qiuqi Sun, Shengqiang Wang, Jiaxin Tian et Chengyu Wang. « Principle, application and development trend of dry ice cleaning hub fixture ». E3S Web of Conferences 385 (2023) : 04023. http://dx.doi.org/10.1051/e3sconf/202338504023.
Texte intégralRésumé :
As an engineering technology, industrial cleaning plays an increasingly important role in industrial production; The development of the cleaning industry not only provides effective technical services for the whole society, but also has become an important symbol of today’s social civilization. With the industrialization process of the country and the needs of social production and life, the application field of the cleaning industry is becoming more and more extensive. As an emerging technology, dry ice cleaning has the characteristics of high efficiency, wide application range and no pollution, and is widely used in mold, power electronics, petrochemical and automotive industries. Dry ice cleaning is an advanced and efficient industrial cleaning technology, which has advantages over other cleaning methods in terms of cleaning effect, cleaning applicability, and environmental protection.
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Yan, Honghao, Jun Zhou, Chengyun Wang, Huaqiang Gong, Wu Liu, Weihong Cen, Guixin Yuan et Yu Long. « 3D printing of dual cross-linked hydrogel for fingerprint-like iontronic pressure sensor ». Smart Materials and Structures 31, no 1 (25 novembre 2021) : 015019. http://dx.doi.org/10.1088/1361-665x/ac383c.
Texte intégralRésumé :
Abstract Hydrogels with intrinsic high stretchability and flexibility are extremely attractive for soft electronics. However, the existing complicated and laborious methods (such as mold curing) to fabricate microstructured hydrogel (MH) still limit the development of hydrogel-based sensors for flexible devices. Herein, we use digital light processing 3D printing technology to rapidly construct double-network (DN) ionic conductive hydrogel, and then design and print fingerprint-like MH film to manufacture an iontronic pressure sensor. In particular, the DN hydrogel consists of acrylamide/acrylic acid to form a covalently cross-linked network, and magnesium chloride is introduced to form an ionic cross-linked physical network in the hydrogel. The printability (with resolution 150 μm) and mechanical property tunability of DN hydrogel enable the convenient fabrication of sensors. With the biomimetic fingerprint MH film, the iontronic pressure sensor not only has a high sensitivity (0.06 kPa−1), but also has a large detection range (26 Pa–70 kPa) and good stability (200 cycles of pressure loading). We demonstrated that our sensor can be applied to realize tactile sensing in a prosthetic application and detect human motion. With the easy strategy of constructing DN hydrogel with microstructures by 3D printing technology, hydrogel-based sensors are anticipated to be employed in more smart electronics.
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Wang, Xuelin, Yi Ren et Jing Liu. « Liquid Metal Enabled Electrobiology : A New Frontier to Tackle Disease Challenges ». Micromachines 9, no 7 (21 juillet 2018) : 360. http://dx.doi.org/10.3390/mi9070360.
Texte intégralRésumé :
In this article, a new conceptual biomedical engineering strategy to tackle modern disease challenges, called liquid metal (LM) enabled electrobiology, is proposed. This generalized and simple method is based on the physiological fact that specially administrated electricity induces a series of subsequent desired biological effects, either shortly, transitionally, or permanently. Due to high compliance within biological tissues, LM would help mold a pervasive method for treating physiological or psychological diseases. As highly conductive and non-toxic multifunctional flexible materials, such LMs can generate any requested electric treating fields (ETFields), which can adapt to various sites inside the human body. The basic mechanisms of electrobiology in delivering electricity to the target tissues and then inducing expected outputs for disease treatment are interpreted. The methods for realizing soft and conformable electronics based on LM are illustrated. Furthermore, a group of typical disease challenges are observed to illustrate the basic strategies for performing LM electrobiology therapy, which include but are not limited to: tissue electronics, brain disorder, immunotherapy, neural functional recovery, muscle stimulation, skin rejuvenation, cosmetology and dieting, artificial organs, cardiac pacing, cancer therapy, etc. Some practical issues regarding electrobiology for future disease therapy are discussed. Perspectives in this direction for incubating a simple biomedical tool for health care are pointed out.
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Nagato, Keisuke, Yuki Yajima et Masayuki Nakao. « Laser-Assisted Thermal Imprinting of Microlens Arrays—Effects of Pressing Pressure and Pattern Size ». Materials 12, no 4 (25 février 2019) : 675. http://dx.doi.org/10.3390/ma12040675.
Texte intégralRésumé :
Polymer films with nano- or microstructured surfaces have been widely applied to optical devices, bioplates, and printed electronics. Laser-assisted thermal imprinting (LATI), in which a laser directly heats the surfaces of a mold and a thermoplastic polymer, is one of the high-throughput methods of replicating nano- or microstructures on polymer films. Only the surfaces of the mold and polymer film are heated and cooled rapidly, therefore it is possible to replicate nano- or microstructures on polymer films more rapidly than by using conventional thermal nanoimprinting. In this study, microlens arrays (MLAs) were replicated on polymethylmethacrylate (PMMA) films using LATI, and the effects of the pressing pressure (10−50 MPa) and the pattern size (33- and 5-μm pitch) of the MLA on the filling ratio were investigated by analyzing a microlens replicated using different laser-irradiation times (0.1−2 ms). The filling ratio increased with increasing pressing pressure and laser-irradiation time in the replication of MLAs with varying sizes, while the flow of the PMMA varied with the pressing pressure and laser-irradiation time. It was found that during filling, the shape of the polymer cross-sectional surface demonstrated a double and single peak in the 33- and 5-μm-pitch patterns, respectively. This was because the depth of the heated area in the 33-μm-pitch pattern was smaller than the pattern size, whereas that of the 5-μm-pitch pattern was comparable to (or larger) than the pattern size.
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Ota, Hiroki. « (Invited) Fabriations and Applications Using Liquid Metal Towards Stretchable Electronics ». ECS Meeting Abstracts MA2023-02, no 34 (22 décembre 2023) : 1672. http://dx.doi.org/10.1149/ma2023-02341672mtgabs.
Texte intégralRésumé :
Highly deformable devices have many potential applications, including wearable electronics, robotics and health monitoring. Mechanically deformable devices and sensors can conformally cover electronic systems on curved or soft surfaces. Liquids deform more easily than solids, so sensors and actuators that utilise liquids trapped in soft templates as sensing components are ideal platforms for such applications. Such highly deformable electronics using ultra-flexible conductive materials are called stretchable electronics. Liquid metals (LMs) are one of the leading materials. In the last few years, liquid metals have steadily gained interest, especially in the field of flexible soft electronics and related applications. The term liquid metal has several definitions and many research efforts are underway to utilise liquid metals in various fields. The simplest definition can be given as 'a composite of low-melting alloys that retain their liquid state at room temperature, are easily deformable and have high electrical conductivity'. Here, an overview of liquid metals, new processing methods, sensors and actuators, batteries and smart devices are reported in focus. To date, we have adopted a patterned method using microfluidic channels with regard to processing methods for liquid metals such as EGaIn and Galinstan. Microfluidic channels are one of the most accurate and reliable method of producing electrode patterns among the three processing methods, although they are limited by the substrate material and pattern design for pattern fabrication. The creation of microfluidic channels follows the method used in Micro Electro Mechanical Systems (MEMS) and micro Total Analysis Systems (microTAS). In practice, the molds are fabricated by photolithography using SU-8 photoresist. Rubber materials such as polydimethylsiloxane (PDMS) are poured into the mold and allowed to cure. Microfluidic channels are fabricated by chemically bonding the flat PDMS with the PDMS to which the pattern has been transferred. We have succeeded in fabricating a two-dimensional pattern of liquid metal by the method described above. Furthermore, we have successfully fabricated microfluidic channels by 3D printing of rubber materials and constructed 3D circuits by using liquid metal. As liquid metal is a liquid material, processing methods centred on "printing" processing can be used, and the most suitable processing method can be selected according to the device and application. Physical sensors such as strain sensors and chemical sensors such as oxygen gas sensors have been reported using liquid metal wiring. By optimising the wiring of the liquid metal, capacitor structures and resistors can be fabricated. By encapsulating these in a flexible material, PDMS, it is possible to realize sensors that can measure displacements such as strain. Indeed, by optimising three sensor structures, we have reported a physical sensor capable of sensing three sensing modes: two-dimensional tension and vertical compression. However, taking into account the actual application in wearable devices for healthcare applications such as pulse rate, a detection sensitivity below 1 k Pa is required. The authors realized a high-sensitivity pressure sensor by using a Wheatstone bridge circuit structure for the liquid metal wiring in the PDMS to form a Diaphragm sensor. In fact, a pulse rate sensing device was realized based on the developed device. Furthermore, a PDMS glove capable of measuring 16 points simultaneously was realized by attaching the developed pressure sensor to a hand mold using 3D printing5). Such physical sensors are very easy to construct and can be realized with one type of liquid metal. While there are many different types of liquid metals as described above, liquid metals easily mix when they come into contact with each other. Therefore, the authors proposed a "liquid" state heterojunction using ionic liquids and liquid metals with extremely low vapor pressure. By using ionic liquids [EMIM][Otf], [EMIM][PF6] and [EMPYR][NTf2], sensors for temperature, humidity and oxygen gas were realized. Furthermore, with regard to their sensitivity, the detection sensitivity was 10 times higher than that of normal metal temperature and humidity sensors for temperature and humidity sensors. In this study, heterojunctions were realized using microfluidics. Due to the low Reynolds number of the microfluidics, the robustness of the liquid state heterojunction with respect to deformation was also very high due to the high viscosity effect, making the configuration suitable for stretchable sensors. In addition to electrodes and sensors, development of batteries and smart devices has also been initiated and will be reported in this presentation.
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Chang, Hanjui, Yue Sun, Shuzhou Lu et Yuntao Lan. « Enhancing Brain–Computer Interfaces through Kriging-Based Fusion of Sparse Regression Partial Differential Equations to Counter Injection Molding View of Node Displacement Effects ». Polymers 16, no 17 (3 septembre 2024) : 2507. http://dx.doi.org/10.3390/polym16172507.
Texte intégralRésumé :
Injection molding is an efficient and precise manufacturing technology that is widely used in the production of plastic products. In recent years, injection molding technology has made significant progress, especially with the combination of in-mold electronics (IME) technology, which makes it possible to embed electronic components directly into the surface of a product. IME technology improves the integration and performance of a product by embedding conductive materials and functional components in the mold. Brain–computer interfaces (BCIs) are a rapidly growing field of research that aims to capture, analyze, and feedback brain signals by directly connecting the brain to external devices. The Utah array, a high-density microelectrode array, has been widely used for the recording and transmission of brain signals. However, the traditional fabrication method of the Utah array suffers from high cost and low integration, which limits its promotion in practical applications. The lines that receive EEG signals are one of the key parts of a brain–computer interface system. The optimization of injection molding parameters is particularly important in order to effectively embed these lines into thin films and to ensure the precise displacement of the line nodes and the stability of signal transmission during the injection molding process. In this study, a method based on the Kriging prediction model and sparse regression partial differential equations (PDEs) is proposed to optimize the key parameters in the injection molding process. This method can effectively predict and control the displacement of nodes in the film, ensure the stability and reliability of the line during the injection process, and improve the accuracy of EEG signal transmission and system performance. The optimal injection parameters were finally obtained: a holding pressure of 525 MPa, a holding time of 50 s, and a melting temperature of 285 °C. Under this condition, the average node displacement of UA was reduced from the initial 0.19 mm to 0.89 µm, with an optimization rate of 95.32%.
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Delplanque, Emilie, Antoine Aymard, Davy Dalmas et Julien Scheibert. « Solving curing-protocol-dependent shape errors in PDMS replication ». Journal of Micromechanics and Microengineering 32, no 4 (9 mars 2022) : 045006. http://dx.doi.org/10.1088/1361-6439/ac56ea.
Texte intégralRésumé :
Abstract PolyDiMethylSiloxane (PDMS) is an elastomer increasingly used to produce soft objects by replication, in a variety of fields including soft electronics, microfluidics, tribology, biomechanics and soft robotics. While PDMS replication is usually considered faithful at all scales, down to nanoscales, detailed quantitative comparisons between the geometric features of the mold and the replicated object are still required to further ground this commonly accepted view. Here, we show that the top surface of centimetric parallelepipedic PDMS blocks, molded on a rigid plate, deviates from its expected flatness, the amplitude of the deviation being dependent on the crosslinking protocol. As a practical solution, we identify a suitable two-steps protocol which eliminates those replication errors. Using finite element simulations, we show that the effect originates from a thermal contraction when the sample cools from the curing temperature down to the operating temperature. This phenomenon actually applies at any length scale, and finely depends on the sample’s aspect ratio and boundary conditions. Our results should help mitigating replication errors in all applications where a well-defined sample geometry is required.
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Madhavan, R. « High Performance Conductive Composites and E-skins with Large-scale Manufacturing for Wearable Electronic Sensor Systems ». Journal of Modern Nanotechnology 4 (21 novembre 2024) : 5. http://dx.doi.org/10.53964/jmn.2024005.
Texte intégralRésumé :
Objective: High performance wearable sensors for biological and bio-technological recognition of human epidermal movements and muscle tissue deformations are attracting widespread attention and demonstrate fascinating potential for future wearable electronics. Methods: This work demonstrates conductive networks and film cracks-based stretchable strain sensors using carbonic sensing layers / mold star silicone elastomer nanocomposites. Results: The as-fabricated stretchable strain sensors demonstrate captivating superiority, including simplicity in the fabrication steps and ultra-high strain sensitivity far exceeding recently reported state-of-the-art strain sensors. Prominently, the stretchable strain sensors exhibit dazzling piezoresistivity with a high gauge factor of 2,185 and a wide sensing range of 30% strain. The working mechanism depends on the electrical resistance variations, which is strikingly altered by a percolating network crack surface microstructure due to strain concentration during tensile deformations. The ultra-sensitive sensing performance in conjunction with a wide sensing range, prominent linearity (R2>0.99 in the strain range of 15-30%), excellent reversibility characteristics and remarkable durability (more than 1,300 stretch-release cycles under a large-scale strain of 30%) for large-scale tensile deformations. Conclusion: The stretchable strain sensors to be employed as wearable strain monitoring devices for the diverse-range of practical applications, including but not confined to multi-scale monitoring, electronic skins, smart robotics, human-machine / computer interfaces, as well as sports performance monitoring.
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Tokita, Masao. « Progress of Spark Plasma Sintering (SPS) Method, Systems, Ceramics Applications and Industrialization ». Ceramics 4, no 2 (25 avril 2021) : 160–98. http://dx.doi.org/10.3390/ceramics4020014.
Texte intégralRésumé :
The spark plasma sintering (SPS) method is of great interest to the powder and powder metallurgy industry and material researchers of academia for both product manufacturing and advanced material research and development. Today in Japan, a number of SPS products for different industries have already been realized. Today’s fifth-generation SPS systems are capable of producing parts of increasing size, offering improved functionality, reproducibility, productivity, and cost. For instance, pure nano-Tungsten Carbide WC powder (no additives) is fully densified with a nano-grain-sized structure for glass lens application in the optics industry. The SPS is now moving from scientific academia and/or R&D proto-type materials level usage to practical industry use product stage utilizing in the field of electronics, automotive, mold and die, cutting tools, fine ceramics, clean energy, biomaterials industries, and others. This paper reviews and introduces the peculiar phenomenon of SPS and the progress of SPS technology, method, development of SPS systems, and its industrial product applications.
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Chen, Chang Cheng, et Bo Heng Wu. « Numerical Investigation on Mini Internal Gear Forging Process ». Key Engineering Materials 725 (décembre 2016) : 560–65. http://dx.doi.org/10.4028/www.scientific.net/kem.725.560.
Texte intégralRésumé :
Gear transmission system is closely related to the consumer electronics products, factory automation industry, science and technology toys, medical equipment, electric hand tools, home appliances and the low-speed high torque applications of automotive industry. In the past, the almost manufacturers produced the metal gear of transmission system mostly by machining method. The gear machining tools of relative processing are mired in difficulties when the gear was miniaturized. In terms of the way of micro forging to produce the gear transmission components, not only a high accuracy and production rate being much times of gear machining, which achieves a significant competitive advantage. This study aims to conduct a research for a mini internal gear forging formability. For this purpose, the finite element method was used to analyze the mini internal gear forging process based on a die set of involute gear profile model. From the simulation results, the characteristic of flowing field of material filled into the gear mold and the induced strain and stress distribution were observed. All findings can be significantly provided to develop the manufacturing process of mini gear forging.
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Sun, Chang Fu, Na Jun Wang et Jian Guang Li. « Research on CNC Grinding Program of Overall End Milling Cutter ». Key Engineering Materials 579-580 (septembre 2013) : 122–27. http://dx.doi.org/10.4028/www.scientific.net/kem.579-580.122.
Texte intégralRésumé :
With high precision special rotary tool is widely used in automotive, mold, aerospace, machinery, electronics and other fields, the demand of manufacturing for such type and quantity of cutting tool is more and more big, lead to the demand for multi-axis CNC tool grinder which provides efficient, high quality production support for it also increasing. In terms of hardware and software multi-axis CNC tool grinder in developed countries are relatively mature, but domestic did not have enough for this research, especially for development of CNC tool grinding machine operation software system, and rarely reference data. In view of the domestic manufacturer in urgent need of independent research and development of CNC tool grinder, this article will research tool grinding automatic programming and simulation technology of CNC tool grinding machine operation software system, through analyzing the four main steps of NC grinding four-blade overall end milling cutter, parametric programming with MATLAB, and grinding trajectory data in the form of mixed programming of MATLAB and VC+ + will be post processed into NC programs, then simulation in VERICUT virtual machine tool, finally the actual grinding out overall end milling cutter.