Littérature scientifique sur le sujet « High density interconnection PCBs »
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Articles de revues sur le sujet "High density interconnection PCBs"
Cauwe, Maarten, Bart Vandevelde, Chinmay Nawghane, Marnix Van De Slyeke, Erwin Bosman, Joachim Verhegge, Alexia Coulon et Stan Heltzel. « High-Density Interconnect Technology Assessment of Printed Circuit Boards for Space Applications ». Journal of Microelectronics and Electronic Packaging 17, no 3 (1 juillet 2020) : 79–88. http://dx.doi.org/10.4071/imaps.1212898.
Texte intégralBernhard, T., L. Gregoriades, S. Branagan, L. Stamp, E. Steinhäuser, R. Schulz et F. Brüning. « Nanovoid Formation at Cu/Cu/Cu Interconnections of Blind Microvias : A Field Study ». International Symposium on Microelectronics 2019, no 1 (1 octobre 2019) : 000492–502. http://dx.doi.org/10.4071/2380-4505-2019.1.000492.
Texte intégralPetrosyants, Konstantin O., et Anton A. Popov. « Experimental Investigation of Temperature-Current Rise in Fine PCB Copper Traces on Polyimide, Aluminium and Ceramic (Al2O3) Substrates ». Advanced Materials Research 739 (août 2013) : 155–60. http://dx.doi.org/10.4028/www.scientific.net/amr.739.155.
Texte intégralJi, Linxian, Chong Wang, Shouxu Wang, Wei He, Dingjun Xiao et Ze Tan. « Multiphysics coupling simulation of RDE for PCB manufacturing ». Circuit World 41, no 1 (2 février 2015) : 20–28. http://dx.doi.org/10.1108/cw-09-2014-0037.
Texte intégralAvitabile, Gianfranco, Antonello Florio, Vito Leonardo Gallo, Alessandro Pali et Lorenzo Forni. « An Optimization Framework for the Design of High-Speed PCB VIAs ». Electronics 11, no 3 (6 février 2022) : 475. http://dx.doi.org/10.3390/electronics11030475.
Texte intégralBernhard, T., S. Branagan, R. Schulz, F. Brüning, L. Stamp, K. Wurdinger et S. Kempa. « The Formation of Nano-voids in electroless Cu Layers ». MRS Advances 4, no 41-42 (2019) : 2231–40. http://dx.doi.org/10.1557/adv.2019.336.
Texte intégralHe, Huirong, Jida Chen, Shengtao Zhang, Minhui Liao, Lingxing Li, Wei He, Yuanming Chen et Shijin Chen. « Fabrication and surface treatment of fine copper lines for HDI printed circuit board with modified full-additive method ». Circuit World 43, no 3 (7 août 2017) : 131–38. http://dx.doi.org/10.1108/cw-02-2017-0004.
Texte intégralShearer, Catherine, Ken Holcomb et Jim Haley. « Shrinking Package Footprint by Embedding Top-Side Real Estate Using Core-to-Core Joining ». Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, DPC (1 janvier 2015) : 001982–2014. http://dx.doi.org/10.4071/2015dpc-tha22.
Texte intégralHübner, Henning, Christian Ohde et Dirk Ruess. « Upscaling panel size for Cu plating on FOPLP (Fan Out Panel Level Packaging) applications to reduce manufacturing cost ». International Symposium on Microelectronics 2018, no 1 (1 octobre 2018) : 000037–42. http://dx.doi.org/10.4071/2380-4505-2018.1.000037.
Texte intégralKatahira, Takayoshi, Ilkka Kartio, Hiroshi Segawa, Michimasa Takahashi et Katsumi Sagisaka. « Vertically high-density interconnection for mobile application ». Microelectronics Reliability 46, no 5-6 (mai 2006) : 756–62. http://dx.doi.org/10.1016/j.microrel.2005.07.001.
Texte intégralThèses sur le sujet "High density interconnection PCBs"
Sahel, Faten. « Contribution à la modélisation du couplage entre les alimentations et les signaux sensibles dans les cartes électroniques à haute densité d'interconnexions ». Electronic Thesis or Diss., Sorbonne université, 2022. http://www.theses.fr/2022SORUS053.
Texte intégralThe high-density interconnection boards that Atos develop for HPC (High Performance Computing) applications contain processors functioning at very high currents and low voltages, along with high-speed serial links. With HDI (High Density Interconnection) technology, fast switching power supplies create coupling noise on nearby sensitive signals, that can lead to errors in the transmitted data, and in the worst case, may result in a malfunctioning circuit. Therefore, virtual prototyping is required to verify the signals’ behaviour in transmission lines, detect the parasitic effects on sensitive signals due to crosstalk, and thus allowing necessary adjustments to be made to reduce the noise. Today’s EDA tools lack a dedicated application able to model the impact of power supplies on their neighbouring signals. In this thesis, we suggest a simulation method using existing EDA tools, that would allow the modelling of the coupling between power supplies and nearby conductors in HDI boards. The simulation method is first applied to a case study board, then to a more complex one. This virtual prototyping method simplifies the coupling mode detection and allows us to test solutions to reduce the coupling noise, prior to their implementation
Liu, Wenduo. « Alternative structures for integrated electromagnetic passives ». Diss., Virginia Tech, 2006. http://hdl.handle.net/10919/27419.
Texte intégralPh. D.
Mota, Pinheiro Júlio. « Development of passive circuits in nanowire-membrane technology in millimeter wave frequencies : application to functionalized interposer ». Thesis, Université Grenoble Alpes, 2020. http://www.theses.fr/2020GRALT024.
Texte intégralThis work aims at the development of passive circuits in millimeter-wave frequency in the interposer called MnM – metallic nanowire-filled membrane. This interposer is inserted in the context where the miniaturization of passive circuits due to the high operating frequency (roughly above 10 GHz up to 300 GHz for millimeter-waves) makes it interesting to insert passive circuits in integrated technologies such as CMOS, but that due to the limitations linked to the technology do not present high quality, being therefore more interesting in terms of performance and cost the use of an auxiliary substrate for the design of passive circuits that allows their integration with active circuits in integrated technology; this substrate is called an interposer. For the development of a good interposer, it is necessary that it presents high quality transmission lines and vias. The MnM interposer is a low cost alumina membrane that naturally has nanopores caused by its fabrication process that can be used to grow copper nanowires. For the development of this interposer and passive circuits on it, the manufacturing process is improved, with the focus on the growth of nanowires in specific regions and on the fabrication yield. The substrate is electrically characterized for extracting its losses and its dielectric constant, which has been shown to be influenced by the nanopores. With the improvement of the manufacturing process, nanowire-vias are developed and their performance analyzed in the context of a transition between one face and another of the substrate through an electrical model related to the physical layout validated by the measurement results. For the electrical model, an analytical and a matrix approach are proposed, with the verification that the nanowire-via behaves as a solid via with a conductance that takes into account the material of the nanowires and their surface density. It is verified that the nanowire-via have a state-of-the-art performance, besides its small dimensions such radius and pitch between vias, dictated only by the minimum dimension achieved in photolithography. Two, three, five and ten spires solenoid-type inductions that make use of these vias are proposed and analyzed, with the proposal of an electrical model, which relates to its physical layout, to be used by designers. These inductances are compact, due to the small size of the nanowire-vias, and have a high self-resonance frequency, 98 GHz for two-spire inductance. Finally, a new linear electric model for microstrip transmission lines with slow-wave effect caused by the nanowires is proposed, to facilitate its design and simulation, since its electromagnetic simulation presents a high computational cost. This same model is also used for transmission lines in PCB technology, which present the same slow-wave effect but with operating in microwave frequency. Thus, this work presents a significant advance for MnM interposer, presenting at the end a fully functional millimeter wave interposer
Lee, Yu-Wei, et 李育維. « Self-annealing Mechanism of Electroplated Cu in the Blind-hole Structure of High-density-interconnection Printed Circuit Boards (HDI-PCBs) ». Thesis, 2016. http://ndltd.ncl.edu.tw/handle/46593551772826064723.
Texte intégral元智大學
化學工程與材料科學學系
104
Blind-hole (BH) metallization by electrolytic Cu fillings technology has become a critical process for fabricating high density interconnection (HDI) circuit boards in electronic industry because it it provides high thermal and electrical conductivity. Although numerous publications concerning the room-temperature recrystallization (i.e., self-annealing) of electroplated Cu, there is still limited information regarding the self-annealing behavior of the Cu electrodeposition in the BH structure. The morphology and crystallographic orientation/texture of the Cu fillings governs the electrical, thermal, and mechanical properties of the interconnections, affecting the overall reliability of an electronic device. In this study, the resistance, morphologies and microstructures in the BH Cu filling with self-annealing time (t) was analyzed by employing a source meter, field-emission scanning electron microscope (FE-SEM), and electron backscattered diffraction (EBSD).
Sun, Hsiang-Wei, et 孫詳崴. « The Study of Plasma Treatment of Polyimide Film Used in High Density Interconnection Board ». Thesis, 2002. http://ndltd.ncl.edu.tw/handle/49405545052898026895.
Texte intégral元智大學
化學工程學系
90
The effect of plasma treatment on the chemical compositions, morphologies, and energies of the polyimide (PI) surfaces is studied with attenuated total reflection infrared spectroscopy (ATR), contact angle measurement, and atomic force microscopy (AFM). PI studied includes Dupont H and E films. The surface energies of all three PI increase after plasma treatment and respond similarly under different plasmas. However, the ATR spectra confirm that the generated functional groups on the surfaces of PI’s are different. The surface morphologies after plasma are also different. The type of plasma also affects the extents of changes of surface functional groups and morphologies.
Chen, Yu-Pin, et 陳育斌. « Applications and Development for CO2 Laser Drilling Machine of High-Density Interconnection Printed Circuit Boards ». Thesis, 2007. http://ndltd.ncl.edu.tw/handle/25630227792779329061.
Texte intégral國立彰化師範大學
機電工程學系
96
The current trend in the microelectronics industry is towards smaller, lighter and more powerful electronic products, and electronic circuit designers are designing high-density interconnected printed circuit boards (HDI PCBs). The board design, transformed from the conventional through hole to the sequence stacking then to blind buried via structure– called HDI technology, which can highly increase the routing density and components assembly density. Laser drilling machines, including CO2 laser drilling machine and UV laser drilling machine, have been widely adopted in forming the microvias of high-density interconnected printed circuit boards. Due to the work efficiency of CO2 laser drilling machine is higher than UV laser drilling machine, CO2 laser drilling machines are main equipment of choice for the microvias formation in the PCB industries. Accordingly, the CO2 laser drilling machine is developed and discussed in this study. In order to develop the CO2 laser drilling machine, several techniques should be developed, including the mechanical structure, the optical system, the PC-base controller, the CAD/CAM interpretation and the compensation methods, and they are discussed in this study. The high positioning accuracy of feeding system is one of the heavy components in precision machine systems, and its compensation method for the positioning accuracy is also an important technique in machine systems. The investigation develops a compensation method of positioning accuracy for two-dimensional feeding system, which using the two-dimensional Lagrange polynomial amend the positioning error of feeding system. First, positioning errors of XY tables are measured by a CCD image processing system by using a standard specimen. Then the two-dimensional compensation function can be determined by the two-dimensional positioning errors curve of the XY feeding system – the system is responsible for correcting the positioning error of the XY table. The positioning accuracy of the amended XY feeding system is measured by a HP 5519A Interferometer, and is verified can effectively increase the accuracy of XY table. According to the experimental results, the positioning accuracy of the X-axis of the XY feeding system has decreased from 7 microns to 2.8 microns and that of the Y-axis is from 17 microns to 2.6 microns. Furthermore, the compensation method does not affect the perpendicular accuracy and the repeatability accuracy of XY feeding systems. The CO2 laser drilling machine utilizes a galvanometric scanning system that can effectively increase the speed of laser drilling procedure, and most of the laser materials processing systems have used the scanning systems improving the efficiency of processing. However, laser galvanometric scanning systems are usually associated with a field distortion error. Accordingly, techniques must be developed to compensate for distortion error. Hence, the investigation discusses the field distortion error of a laser scanning system based on a CO2 laser drilling machine and a method for the correcting this distortion error. The field distortion error is a random error in the laser galvanometric scanning system. This irregular error is usually corrected using pre-compensation methods that apply an error function. The study gives a pre-compensation technique to correct the distortion error of scanning image, which using the two-dimensional Lagrange polynomials modified the control commands of the galvanometric scanning system. The results in this study indicate that the compensation method effectively amended the field distortion and increased the accuracy of the positioning of the holes that were drilled using a laser galvanometric scanning drilling machine. The positioning errors of drilling holes have reduced from ±0.3mm to ±0.05 mm after error compensation. Although Lagrange polynomial can effectively reduce the errors of the scanning system, the non-continuous result of scanning image would be occurred in the marking pictures. Hence, the dissertation develops a new method to decrease the field distortion of the laser marking image, which using the surface curve fitting method to obtain the function of the correction control commands of the galvos. The experimental results indicate that the method can effectively amend the field distortion of laser marking system. Finally, the result of microvias of HDI PCBs that uses the CO2 laser drilling machine is also presented in this study. The conformal mask drilling for microvias formation is presented, and these microvias are formed by a shaped laser beam to improve the quality of microvias. The technology of laser coding on the eggshell and the laser direct write patterning technique of ITO film are presented in this dissertation. Furthermore, the study has developed a laser marking system that uses the DSP controller. The technology of laser marking system is presented in this study, including the dot marking, the vector marking and the error diffusion techniques for the picture marking.
Livres sur le sujet "High density interconnection PCBs"
National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging. Materials for high-density electronic packaging and interconnection : Report of the Committee on Materials for High-Density Electronic Pakaging. Washington, D.C : National Academy Press, 1990.
Trouver le texte intégralNational Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging. Materials for high-density electronic packaging and interconnection : Report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council. Washington, D.C : National Academy Press, 1990.
Trouver le texte intégralMaterials for High-Density Electronic Packaging and Interconnection. Washington, D.C. : National Academies Press, 1990. http://dx.doi.org/10.17226/1624.
Texte intégralChapitres de livres sur le sujet "High density interconnection PCBs"
Guo, Fengrui, Xingming Li, Shanqing Hu et Yanyan Qin. « An Optimized Daisy-chain Topology for Multi-load Interconnection in High–speed and High–density Electronic Systems ». Dans Lecture Notes in Electrical Engineering, 139–46. Singapore : Springer Singapore, 2017. http://dx.doi.org/10.1007/978-981-10-7521-6_17.
Texte intégralDe Martino, Raffaela, Rossella Franchino et Caterina Frettoloso. « A “Stepping Stone” Approach to Exploiting Urban Density ». Dans The Urban Book Series, 639–47. Cham : Springer International Publishing, 2023. http://dx.doi.org/10.1007/978-3-031-29515-7_57.
Texte intégralSkulimowski, Andrzej M. J. « Visions of a Future Research Workplace Arising from Recent Foresight Exercises ». Dans Progress in IS, 169–85. Cham : Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-66262-2_11.
Texte intégral« Landscape Influences on Stream Habitats and Biological Assemblages ». Dans Landscape Influences on Stream Habitats and Biological Assemblages, sous la direction de Michael R. Rosen, Timothy G. Rowe, Steven L. Goodbred, Douglas O. Shipley et Jorge A. Arufe. American Fisheries Society, 2006. http://dx.doi.org/10.47886/9781888569766.ch7.
Texte intégralActes de conférences sur le sujet "High density interconnection PCBs"
Borecki, Janusz. « High density interconnections in PCBs - an overview of plating techniques ». Dans SPIE Proceedings, sous la direction de Ryszard S. Romaniuk. SPIE, 2006. http://dx.doi.org/10.1117/12.675093.
Texte intégralSahel, Faten, Pascal Guilbault, Farouk Vallette et Sylvain Feruglio. « A Crosstalk Modelling Method between a Power Supply and a Nearby Signal in High-density Interconnection PCBs ». Dans 2021 22nd International Symposium on Quality Electronic Design (ISQED). IEEE, 2021. http://dx.doi.org/10.1109/isqed51717.2021.9424304.
Texte intégralGhaffarian, Reza. « Damage and Failures of CGA/BGA Assemblies Under Thermal Cycling and Dynamic Loadings ». Dans ASME 2013 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/imece2013-63062.
Texte intégralHe, Baofeng, Dennis Patrick Webb, Jon Petzing et Richard Leach. « Improving plated copper adhesion for metallisation of glass PCBs ». Dans High Density Packaging (ICEPT-HDP). IEEE, 2011. http://dx.doi.org/10.1109/icept.2011.6066836.
Texte intégralArruda, Luciano, Quayle Chen et Jairo Quintero. « Failure evaluation of flexible-rigid PCBs by thermo-mechanical simulation ». Dans High Density Packaging (ICEPT-HDP). IEEE, 2009. http://dx.doi.org/10.1109/icept.2009.5270619.
Texte intégralZhou, Liangjie, Weihong Peng, Dong Liu, Rubin Zou, Xuefei Jiang, Weisheng Xia et Fengshun Wu. « Research on dimensional change characteristics of silver halide films for multi-layer PCBs ». Dans High Density Packaging (ICEPT-HDP). IEEE, 2011. http://dx.doi.org/10.1109/icept.2011.6066931.
Texte intégralZhang, Shunong, Anshul Shrivastava, Michael Osterman, Michael Pecht et Rui Kang. « The influence of SO2 environments on immersion silver finished PCBs by mixed flow gas testing ». Dans High Density Packaging (ICEPT-HDP). IEEE, 2009. http://dx.doi.org/10.1109/icept.2009.5270782.
Texte intégralArruda, Luciano, Willy Ferreira et Marco Andolfatto. « Experimental analysis of propagation of the delamination in Flex-PCBs subjected to thermal cycling loading ». Dans High Density Packaging (ICEPT-HDP). IEEE, 2010. http://dx.doi.org/10.1109/icept.2010.5582797.
Texte intégralKrusius, J. P. « System interconnection of high-density multichip modules ». Dans Boston - DL tentative, sous la direction de Stuart K. Tewksbury et John R. Carruthers. SPIE, 1991. http://dx.doi.org/10.1117/12.25582.
Texte intégralBeyne, E., et R. Mertens. « Trends in packaging and high density interconnection ». Dans Proceedings of International Conference on Microelectronics (ICM'99). IEEE, 2000. http://dx.doi.org/10.1109/icm.2000.884794.
Texte intégralRapports d'organisations sur le sujet "High density interconnection PCBs"
Wang, Michael R. High Density Optical Interconnection Based on Free Space Non-Diffracting Beams. Fort Belvoir, VA : Defense Technical Information Center, mars 1999. http://dx.doi.org/10.21236/ada361509.
Texte intégralLotufo, Guilherme, Mandy Michalsen, Danny Reible, Philip Gschwend, Upal Ghosh, Alan Kennedy, Kristen Kerns et al. Interlaboratory study of polyethylene and polydimethylsiloxane polymeric samplers for ex situ measurement of freely dissolved hydrophobic organic compounds in sediment porewater. Engineer Research and Development Center (U.S.), mai 2024. http://dx.doi.org/10.21079/11681/48512.
Texte intégral