Littérature scientifique sur le sujet « Electromechanical admittance »
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Articles de revues sur le sujet "Electromechanical admittance"
Ai, Demi, Chengxing Lin, Hui Luo et Hongping Zhu. « Temperature effect on electromechanical admittance–based concrete structural health monitoring ». Structural Health Monitoring 19, no 3 (9 juillet 2019) : 661–92. http://dx.doi.org/10.1177/1475921719860397.
Texte intégralAPARNA, M., M. RAGHAVENDER, G. PRASAD et G. S. KUMAR. « ELECTROMECHANICAL CHARACTERIZATION OF LANTHANUM-DOPED SODIUM BISMUTH TITANATE CERAMICS ». Modern Physics Letters B 20, no 09 (10 avril 2006) : 475–80. http://dx.doi.org/10.1142/s0217984906010664.
Texte intégralXu, Guidong, Baiqiang Xu, Chenguang Xu et Ying Luo. « Temperature effects in the analysis of electromechanical impedance by using spectral element method ». Multidiscipline Modeling in Materials and Structures 12, no 1 (13 juin 2016) : 119–32. http://dx.doi.org/10.1108/mmms-03-2015-0015.
Texte intégralZuo, Chunyuan, Xin Feng et Jing Zhou. « A Three-Dimensional Model of the Effective Electromechanical Impedance for an Embedded PZT Transducer ». Mathematical Problems in Engineering 2013 (2013) : 1–10. http://dx.doi.org/10.1155/2013/218026.
Texte intégralProvidakis, Costas P. « Repair of Cracked Structures under Dynamic Load Using Electromechanical Admittance Approach ». Key Engineering Materials 348-349 (septembre 2007) : 49–52. http://dx.doi.org/10.4028/www.scientific.net/kem.348-349.49.
Texte intégralVIJAYA BHASKAR RAO, P., et T. BHIMA SANKARAM. « ELECTRO MECHANICAL AND IMPEDANCE STUDIES OF (Na1-xKx)1/2Bi1/2TiO3 ». International Journal of Modern Physics B 23, no 14 (10 juin 2009) : 3131–45. http://dx.doi.org/10.1142/s0217979209052443.
Texte intégralKarlash, V. « Modeling of the energy-loss piezoceramic resonators by electric equivalent networks with passive elements ». Mathematical Modeling and Computing 1, no 2 (2014) : 163–77. http://dx.doi.org/10.23939/mmc2014.02.163.
Texte intégralSofuoğlu, Mehmet A., Gökhan Haydarlar, Melih C. Kuşhan, Sezan Orak et Mesut Tekkalmaz. « Investigation of electromechanical impedance and residual stress relation for samples machined by hot ultrasonic-assisted turning ». Proceedings of the Institution of Mechanical Engineers, Part C : Journal of Mechanical Engineering Science 236, no 8 (30 octobre 2021) : 4180–93. http://dx.doi.org/10.1177/09544062211050473.
Texte intégralChoi, S.-B., H. S. Kim et J.-S. Park. « New design methodology for piezoelectric shunt structures using admittance analysis ». Proceedings of the Institution of Mechanical Engineers, Part C : Journal of Mechanical Engineering Science 222, no 2 (1 février 2008) : 131–45. http://dx.doi.org/10.1243/09544062jmes591.
Texte intégralZhang, Chenxu. « Pavement damage monitoring using electromechanical impedance of embedded piezoelectric plate ». Applied and Computational Engineering 25, no 5 (30 novembre 2023) : 30–42. http://dx.doi.org/10.54254/2755-2721/25/ojs/20230729.
Texte intégralThèses sur le sujet "Electromechanical admittance"
Ding, Wenxiang. « Structural health monitoring of piezoelectric ultrasonic transducers ». Electronic Thesis or Diss., Bourges, INSA Centre Val de Loire, 2021. http://www.theses.fr/2021ISAB0008.
Texte intégralUltrasonic transducers have been widely used in medical diagnostic, therapy, non-destructive evaluation, cleaning, underwater sonar, and other applications. The proper functioning of the transducer itself is a key factor in the reliability of the entire system. However, due to the misuse of operators or material degradation, defects may occur, such as breakages in cables, cracks, damaged or weakened crystals, and delamination between layers. This contribution focuses on a detail analysis of the influence of bonding delamination on the performance of the transducer, aiming to determine procedures to facilitate the monitoring of the behavior of the transducer during its lifetime and the detection of degradations before they significantly affect the performance of the system.In the frame of this work, an original two-dimensional analytical model for coupled vibrations of finite piezoelectric resonators is proposed. General solutions for all the physical quantities in Cartesian and cylindrical coordinate systems are deduced from the governing equations. They are expressed as a series of trigonometric or Bessel functions. Electrical impedance, mode shape, and frequency spectrum of piezoceramics are calculated by the proposed analytical method as well as by the finite element method. Comparison of the results of these two methods shows an excellent agreement.A systematic investigation of the influence of different kinds of bonding delamination on the performance of single-element and linear array ultrasonic transducers is presented. Finite element models are developed to show the impact of bonding delamination as well as other factors on the electromechanical admittance (EMA) of ultrasonic transducers, which are composed of a piezoceramic disk or parallelepiped, a backing, and a matching layer. Experimental studies are set up to validate the models and quantitative indicators are proposed. 3D printed backings and matching layers are mounted on piezoceramic elements to obtain an intact model transducer and delaminated ones. Comparison between numerical and experimental results show a good agreement, which allows to affirm that changes in EMA can reveal the occurrence and extent of a delamination in an ultrasound probe
Chapitres de livres sur le sujet "Electromechanical admittance"
Providakis, C. P. « Repair of Cracked Structures under Dynamic Load Using Electromechanical Admittance Approach ». Dans Advances in Fracture and Damage Mechanics VI, 49–52. Stafa : Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-448-0.49.
Texte intégralActes de conférences sur le sujet "Electromechanical admittance"
Otitoju, Shola, Hanz Richter et Antonie J. van den Bogert. « Admittance control for an electromechanical rowing machine ». Dans 2016 IEEE International Conference on Advanced Intelligent Mechatronics (AIM). IEEE, 2016. http://dx.doi.org/10.1109/aim.2016.7576757.
Texte intégralZhang, Yang, Kai Zhou et Jiong Tang. « Memetic Optimizer for Structural Damage Identification Using Electromechanical Admittance ». Dans ASME 2022 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. American Society of Mechanical Engineers, 2022. http://dx.doi.org/10.1115/detc2022-91039.
Texte intégralChen, Yuntong, et Siyi Lu. « Study of six-degree-of-freedom wave characteristics simulator based on admittance control ». Dans Fourth International Conference on Artificial Intelligence and Electromechanical Automation (AIEA 2023), sous la direction de Fushuan Wen, chuanjun Zhao et Yanjiao Chen. SPIE, 2023. http://dx.doi.org/10.1117/12.2684879.
Texte intégralZhao, Liuxian, Lingyu Yu, Mattieu Gresil, Michael Sutton et Siming Guo. « Electromechanical Impedance Modeling for Structural Health Monitoring ». Dans ASME 2012 Conference on Smart Materials, Adaptive Structures and Intelligent Systems. American Society of Mechanical Engineers, 2012. http://dx.doi.org/10.1115/smasis2012-8094.
Texte intégralCoorpender, Steven J., Daniel Finkel, Jennifer Kyzar, Robert Sims, Alexandra B. Smirnova, Mohamed Tawhid, Chad E. Bouton et Ralph C. Smith. « Modeling and Optimization Issues Concerning a Circular Piezoelectric Actuator Design ». Dans ASME 1999 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 1999. http://dx.doi.org/10.1115/imece1999-0544.
Texte intégralZhang, Boying, Hamad Hameed, Yuxin Xu, Chonglin Zhang et Yong Bai. « Electromechanical Impedance Method for Damage Detection of Typical Joint on Jacket Platform ». Dans ASME 2018 37th International Conference on Ocean, Offshore and Arctic Engineering. American Society of Mechanical Engineers, 2018. http://dx.doi.org/10.1115/omae2018-77385.
Texte intégralDai, Zishu, Yongchang Cai, Yiying Han et Jiao Tian. « Influence of Parameter Variation on Electromechanical Admittance Spectrum of a Multiple Degree of Freedom System ». Dans 2015 International Conference on Mechatronics, Electronic, Industrial and Control Engineering. Paris, France : Atlantis Press, 2015. http://dx.doi.org/10.2991/meic-15.2015.354.
Texte intégralMaheshwari, Muneesh, Venu Gopal Madhav Annamdas, John H. L. Pang, Swee Chuan Tjin et Anand Asundi. « Fibre optic sensors for load-displacement measurements and comparisons to piezo sensor based electromechanical admittance signatures ». Dans SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, sous la direction de Peter J. Shull. SPIE, 2015. http://dx.doi.org/10.1117/12.2084039.
Texte intégralShahab, Shima, et Alper Erturk. « Underwater Dynamic Actuation of Macro-Fiber Composite Flaps With Different Aspect Ratios : Electrohydroelastic Modeling, Testing, and Characterization ». Dans ASME 2014 Conference on Smart Materials, Adaptive Structures and Intelligent Systems. American Society of Mechanical Engineers, 2014. http://dx.doi.org/10.1115/smasis2014-7538.
Texte intégralGiurgiutiu, Victor, et Craig A. Rogers. « Modeling of the Electro-Mechanical (E/M) Impedance Response of a Damaged Composite Beam ». Dans ASME 1999 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 1999. http://dx.doi.org/10.1115/imece1999-0525.
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