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Articles de revues sur le sujet « CMUT arrays »

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Auteur : Grafiati
Publié le 10 mars 2023

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1

Wang, Ziyuan, Changde He, Wendong Zhang, Yifan Li, Pengfei Gao, Yanan Meng, Guojun Zhang et al. « Fabrication of 2-D Capacitive Micromachined Ultrasonic Transducer (CMUT) Array through Silicon Wafer Bonding ». Micromachines 13, no 1 (8 janvier 2022) : 99. http://dx.doi.org/10.3390/mi13010099.

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Capacitive micromachined ultrasound transducers (CMUTs) have broad application prospects in medical imaging, flow monitoring, and nondestructive testing. CMUT arrays are limited by their fabrication process, which seriously restricts their further development and application. In this paper, a vacuum-sealed device for medical applications is introduced, which has the advantages of simple manufacturing process, no static friction, repeatability, and high reliability. The CMUT array suitable for medical imaging frequency band was fabricated by a silicon wafer bonding technology, and the adjacent array devices were isolated by an isolation slot, which was cut through the silicon film. The CMUT device fabricated following this process is a 4 × 16 array with a single element size of 1 mm × 1 mm. Device performance tests were conducted, where the center frequency of the transducer was 3.8 MHz, and the 6 dB fractional bandwidth was 110%. The static capacitance (29.4 pF) and center frequency (3.78 MHz) of each element of the array were tested, and the results revealed that the array has good consistency. Moreover, the transmitting and receiving performance of the transducer was evaluated by acoustic tests, and the receiving sensitivity was −211 dB @ 3 MHz, −213 dB @ 4 MHz. Finally, reflection imaging was performed using the array, which provides certain technical support for the research of two-dimensional CMUT arrays in the field of 3D ultrasound imaging.
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Yashvanth, Varshitha, et Sazzadur Chowdhury. « An Investigation of Silica Aerogel to Reduce Acoustic Crosstalk in CMUT Arrays ». Sensors 21, no 4 (19 février 2021) : 1459. http://dx.doi.org/10.3390/s21041459.

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This paper presents a novel technique to reduce acoustic crosstalk in capacitive micromachined ultrasonic transducer (CMUT) arrays. The technique involves fabricating a thin layer of diisocyanate enhanced silica aerogel on the top surface of a CMUT array. The silica aerogel layer introduces a highly nanoporous permeable layer to reduce the intensity of the Scholte wave at the CMUT-fluid interface. 3D finite element analysis (FEA) simulation in COMSOL shows that the developed technique can provide a 31.5% improvement in crosstalk reduction for the first neighboring element in a 7.5 MHz CMUT array. The average improvement of crosstalk level over the −6 dB fractional bandwidth was 22.1%, which is approximately 5 dB lower than that without an aerogel layer. The results are in excellent agreement with published experimental results to validate the efficacy of the new technique.
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Atalar, Abdullah, Hayrettin Köymen et H. Kaan Oğuz. « Rayleigh–bloch waves in CMUT arrays ». IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control 61, no 12 (décembre 2014) : 2139–48. http://dx.doi.org/10.1109/tuffc.2014.006610.

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Demirci, U., A. S. Ergun, O. Oralkan, M. Karaman et B. T. Khuri-Yakub. « Forward-viewing CMUT arrays for medical imaging ». IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control 51, no 7 (juillet 2004) : 887–95. http://dx.doi.org/10.1109/tuffc.2004.1320749.

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Oralkan, O., A. S. Ergun, Ching-Hsiang Cheng, J. A. Johnson, M. Karaman, T. H. Lee et B. T. Khuri-Yakub. « Volumetric ultrasound imaging using 2-D CMUT arrays ». IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control 50, no 11 (novembre 2003) : 1581–94. http://dx.doi.org/10.1109/tuffc.2003.1251142.

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Caronti, Alessandro, G. Caliano, R. Carotenuto, A. Savoia, M. Pappalardo, E. Cianci et V. Foglietti. « Capacitive micromachined ultrasonic transducer (CMUT) arrays for medical imaging ». Microelectronics Journal 37, no 8 (août 2006) : 770–77. http://dx.doi.org/10.1016/j.mejo.2005.10.012.

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Pei, Yu, Guojun Zhang, Yu Zhang et Wendong Zhang. « Breast Acoustic Parameter Reconstruction Method Based on Capacitive Micromachined Ultrasonic Transducer Array ». Micromachines 12, no 8 (14 août 2021) : 963. http://dx.doi.org/10.3390/mi12080963.

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Ultrasound computed tomography (USCT) systems based on capacitive micromachined ultrasonic transducer (CMUT) arrays have a wide range of application prospects. For this paper, a high-precision image reconstruction method based on the propagation path of ultrasound in breast tissue are designed for the CMUT ring array; that is, time-reversal algorithms and FBP algorithms are respectively used to reconstruct sound speed distribution and acoustic attenuation distribution. The feasibility of this reconstruction method is verified by numerical simulation and breast model experiments. According to reconstruction results, sound speed distribution reconstruction deviation can be reduced by 53.15% through a time-reversal algorithm based on wave propagation theory. The attenuation coefficient distribution reconstruction deviation can be reduced by 61.53% through FBP based on ray propagation theory. The research results in this paper will provide key technological support for a new generation of ultrasound computed tomography systems.
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8

Oguz, H. Kagan, A. Atalar et H. Koymen. « Equivalent circuit-based analysis of CMUT cell dynamics in arrays ». IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control 60, no 5 (mai 2013) : 1016–24. http://dx.doi.org/10.1109/tuffc.2013.2660.

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Satir, Sarp, et F. Levent Degertekin. « A nonlinear lumped model for ultrasound systems using CMUT arrays ». IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control 62, no 10 (octobre 2015) : 1865–79. http://dx.doi.org/10.1109/tuffc.2015.007145.

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Jung, Gwangrok, Coskun Tekes, Amirabbas Pirouz, F. Levent Degertekin et Maysam Ghovanloo. « Supply-Doubled Pulse-Shaping High Voltage Pulser for CMUT Arrays ». IEEE Transactions on Circuits and Systems II : Express Briefs 65, no 3 (mars 2018) : 306–10. http://dx.doi.org/10.1109/tcsii.2017.2691676.

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11

Meynier, Cyril, Franck Teston, Edgard Jeanne, Jean Edouard Bernard et Dominique Certon. « Combined finite difference–lumped modelling of fluid loaded Cmut arrays ». Physics Procedia 3, no 1 (janvier 2010) : 1017–23. http://dx.doi.org/10.1016/j.phpro.2010.01.131.

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12

Bhuyan, Anshuman, Jung Woo Choe, Byung Chul Lee, Ira O. Wygant, Amin Nikoozadeh, Omer Oralkan et Butrus T. Khuri-Yakub. « Integrated Circuits for Volumetric Ultrasound Imaging With 2-D CMUT Arrays ». IEEE Transactions on Biomedical Circuits and Systems 7, no 6 (décembre 2013) : 796–804. http://dx.doi.org/10.1109/tbcas.2014.2298197.

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Ge, Chang, et Edmond Cretu. « Design and fabrication of SU-8 CMUT arrays through grayscale lithography ». Sensors and Actuators A : Physical 280 (septembre 2018) : 368–75. http://dx.doi.org/10.1016/j.sna.2018.08.006.

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Klemm, Markus, Anartz Unamuno, Linus Elsaber et Werner Jeroch. « Performance Assessment of CMUT Arrays Based on Electrical Impedance Test Results ». Journal of Microelectromechanical Systems 24, no 6 (décembre 2015) : 1848–55. http://dx.doi.org/10.1109/jmems.2015.2445937.

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Hery, Maxime, Nicolas Senegond et Dominique Certon. « A Boundary Element Model for CMUT-Arrays Loaded by a Viscoelastic Medium ». IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control 67, no 4 (avril 2020) : 779–88. http://dx.doi.org/10.1109/tuffc.2019.2954579.

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Maadi, Mohammad, et Roger J. Zemp. « Self and Mutual Radiation Impedances for Modeling of Multi-Frequency CMUT Arrays ». IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control 63, no 9 (septembre 2016) : 1441–54. http://dx.doi.org/10.1109/tuffc.2016.2587868.

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Koymen, Hayrettin, Abdullah Atalar et A. Sinan Tasdelen. « Bilateral CMUT Cells and Arrays : Equivalent Circuits, Diffraction Constants, and Substrate Impedance ». IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control 64, no 2 (février 2017) : 414–23. http://dx.doi.org/10.1109/tuffc.2016.2628882.

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18

Ilkhechi, Afshin Kashani, Christopher Ceroici, Zhenhao Li et Roger Zemp. « Transparent capacitive micromachined ultrasonic transducer (CMUT) arrays for real-time photoacoustic applications ». Optics Express 28, no 9 (22 avril 2020) : 13750. http://dx.doi.org/10.1364/oe.390612.

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19

Degertekin, F. L., R. O. Guldiken et M. Karaman. « Annular-ring CMUT arrays for forward-looking IVUS : transducer characterization and imaging ». IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control 53, no 2 (février 2006) : 474–82. http://dx.doi.org/10.1109/tuffc.2006.1593387.

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Bavaro, V., G. Caliano et M. Pappalardo. « Element shape design of 2-D CMUT arrays for reducing grating lobes ». IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control 55, no 2 (février 2008) : 308–18. http://dx.doi.org/10.1109/tuffc.2008.650.

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Engholm, Mathias, Hamed Bouzari, Thomas Lehrmann Christiansen, Christopher Beers, Jan Peter Bagge, Lars Nordahl Moesner, Søren Elmin Diederichsen, Matthias Bo Stuart, Jørgen Arendt Jensen et Erik Vilain Thomsen. « Probe development of CMUT and PZT row–column-addressed 2-D arrays ». Sensors and Actuators A : Physical 273 (avril 2018) : 121–33. http://dx.doi.org/10.1016/j.sna.2018.02.031.

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22

Greenlay, Benjamin A., et Roger J. Zemp. « Fabrication of Linear Array and Top-Orthogonal-to-Bottom Electrode CMUT Arrays With a Sacrificial Release Process ». IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control 64, no 1 (janvier 2017) : 93–107. http://dx.doi.org/10.1109/tuffc.2016.2620425.

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23

Sampaleanu, Alex, Peiyu Zhang, Abhijeet Kshirsagar, Walied Moussa et Roger J. Zemp. « Top-orthogonal-to-bottom-electrode (TOBE) CMUT arrays for 3-D ultrasound imaging ». IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control 61, no 2 (février 2014) : 266–76. http://dx.doi.org/10.1109/tuffc.2014.6722612.

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Bayram, Baris, Mario Kupnik, Goksen Yaralioglu, Omer Oralkan, Arif Ergun, Der-song Lin, Serena Wong et Butrus Khuri-yakub. « Finite element modeling and experimental characterization of crosstalk in 1-D CMUT arrays ». IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control 54, no 2 (février 2007) : 418–30. http://dx.doi.org/10.1109/tuffc.2007.256.

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Wygant, I. O., Xuefeng Zhuang, D. T. Yeh, O. Oralkan, A. S. Ergun, M. Karaman et B. T. Khuri-Yakub. « Integration of 2D CMUT arrays with front-end electronics for volumetric ultrasound imaging ». IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control 55, no 2 (février 2008) : 327–42. http://dx.doi.org/10.1109/tuffc.2008.652.

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26

Gurun, G., P. Hasler et F. L. Degertekin. « Front-end receiver electronics for high-frequency monolithic CMUT-on-CMOS imaging arrays ». IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control 58, no 8 (août 2011) : 1658–68. http://dx.doi.org/10.1109/tuffc.2011.1993.

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Arkan, Evren Fatih, et F. Levent Degertekin. « Analysis and Design of High-Frequency 1-D CMUT Imaging Arrays in Noncollapsed Mode ». IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control 66, no 2 (février 2019) : 382–93. http://dx.doi.org/10.1109/tuffc.2018.2887043.

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Chee, Ryan K. W., Alexander Sampaleanu, Deepak Rishi et Roger J. Zemp. « Top orthogonal to bottom electrode (TOBE) 2-D CMUT arrays for 3-D photoacoustic imaging ». IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control 61, no 8 (août 2014) : 1393–95. http://dx.doi.org/10.1109/tuffc.2014.3048.

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Cicek, I., A. Bozkurt et M. Karaman. « Design of a front-end integrated circuit for 3D acoustic imaging using 2D CMUT arrays ». IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control 52, no 12 (décembre 2005) : 2235–41. http://dx.doi.org/10.1109/tuffc.2005.1563266.

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Lascaud, J., T. Defforge, L. Colin, C. Meynier, D. Alquier, G. Gautier et D. Certon. « Integrating porous silicon layer backing to capacitive micromachined ultrasonic transducers (CMUT)-based linear arrays for acoustic Lamb wave attenuation ». Journal of Applied Physics 131, no 10 (14 mars 2022) : 105107. http://dx.doi.org/10.1063/5.0083052.

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Lamb waves propagating in the substrate of linear arrays integrated on a silicon (Si) chip may degrade the elementary performances of the imaging device. In fact, these waves are radiated in the imaging medium. Their superimposition with the relevant ultrasonic signals alters the image performances (i.e., lateral and axial resolutions). In this article, we investigate the interest of using a thin layer of porous silicon (PS) as an absorbing material, aiming to reduce the total device dimensions compared to more traditional backing materials and facilitate device integration with on-chip electronics. The proposed method was applied to Capacitive Micromachined Ultrasonic Transducers. To this purpose, a PS layer with a thickness of 60 μm and a porosity of 50% was etched on the rear side of a 256-elements linear array. The electroacoustic response of the elements integrated on the Si substrate was compared to those on the Si/PS substrate, showing no deterioration of the acoustic characteristics (i.e., center frequency and bandwidth) after PS layer fabrication. To assess the PS silicon layer influence on Lamb wave attenuation, acoustic cross-talks were measured for each array element. The radio-frequency dataset was used to determine the dispersion curves of Lamb waves in the substrate. The comparison between the two substrates showed a significant attenuation value (superior to 30 dB) of Lamb waves induced by the PS layer.
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Oguz, H., Abdullah Atalar et Hayrettin Koymen. « Erratum to "Equivalent circuit-based analysis of CMUT cell dynamics in arrays" [May 13 1016-1024] ». IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control 60, no 6 (juin 2013) : 1277. http://dx.doi.org/10.1109/tuffc.2013.2693.

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Satir, Sarp, Jaime Zahorian et F. Levent Degertekin. « A large-signal model for CMUT arrays with arbitrary membrane geometry operating in non-collapsed mode ». IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control 60, no 11 (novembre 2013) : 2426–39. http://dx.doi.org/10.1109/tuffc.2013.6644745.

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Xuefeng Zhuang, I. Wygant, Der-Song Lin, M. Kupnik, O. Oralkan et B. Khuri-Yakub. « Wafer-bonded 2-D CMUT arrays incorporating through-wafer trench-isolated interconnects with a supporting frame ». IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control 56, no 1 (janvier 2009) : 182–92. http://dx.doi.org/10.1109/tuffc.2009.1018.

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Due-Hansen, J., K. Midtbø, E. Poppe, A. Summanwar, G. U. Jensen, L. Breivik, D. T. Wang et K. Schjølberg-Henriksen. « Fabrication process for CMUT arrays with polysilicon electrodes, nanometre precision cavity gaps and through-silicon vias ». Journal of Micromechanics and Microengineering 22, no 7 (22 juin 2012) : 074009. http://dx.doi.org/10.1088/0960-1317/22/7/074009.

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Caronti, Alessandro, Giosue' Caliano, Philipp Gatta, Cristina Longo, Alessandro Savoia et Massimo Pappalardo. « A finite element tool for the analysis and the design of capacitive micromachined ultrasonic transducer (cMUT) arrays for medical imaging ». Journal of the Acoustical Society of America 123, no 5 (mai 2008) : 3375. http://dx.doi.org/10.1121/1.2934002.

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36

Adelegan, Oluwafemi J., Zachary A. Coutant, Xiao Zhang, Feysel Yalcin Yamaner et Omer Oralkan. « Fabrication of 2D Capacitive Micromachined Ultrasonic Transducer (CMUT) Arrays on Insulating Substrates With Through-Wafer Interconnects Using Sacrificial Release Process ». Journal of Microelectromechanical Systems 29, no 4 (août 2020) : 553–61. http://dx.doi.org/10.1109/jmems.2020.2990069.

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Zhang, Rui, Wendong Zhang, Changde He, Jinlong Song, Linfeng Mu, Juan Cui, Yongmei Zhang et Chenyang Xue. « Design of capacitive micromachined ultrasonic transducer (CMUT) linear array for underwater imaging ». Sensor Review 36, no 1 (18 janvier 2016) : 77–85. http://dx.doi.org/10.1108/sr-05-2015-0076.

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Purpose – The purpose of this paper was to develop a novel capacitive micromachined ultrasonic transducer (CMUT) reception and transmission linear array for underwater imaging at 400 kHz. Compared with traditional CMUTs, the developed transducer array offers higher electromechanical coupling coefficient and higher directivity performance. Design/methodology/approach – The configuration of the newly developed CMUT reception and transmission array was determined by the authors’ previous research into new element structures with patterned top electrodes and into directivity simulation analysis. Using the Si-Silicon on insulator (Si-SOI) bonding technique and the principle of acoustic impedance matching, the CMUT array was fabricated and packaged. In addition, underwater imaging system design and testing based on the packaged CMUT 1 × 16 array were completed. Findings – The simulation results showed that the optimized CMUT array configuration was selected. Furthermore, the designed configuration of the CMUT 1 × 16 linear array was good enough to guarantee high angular resolution. The underwater experiments were conducted to demonstrate that this CMUT array can be of great benefit in imaging applications. Practical implications – Based on our research, the CMUT linear array has good directivity and good impedance matching with water and can be used for obstacle avoidance, distance measurement and imaging underwater. Originality/value – This research provides a basis for CMUT directivity theory and array design. CMUT array presented in this paper has good directivity and has been applied in the underwater imaging, resulting in a huge market potential in underwater detection systems.
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Yildiz, Fikret, Tadao Matsunaga et Yoichi Haga. « Fabrication and Packaging of CMUT Using Low Temperature Co-Fired Ceramic ». Micromachines 9, no 11 (27 octobre 2018) : 553. http://dx.doi.org/10.3390/mi9110553.

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This paper presents fabrication and packaging of a capacitive micromachined ultrasonic transducer (CMUT) using anodically bondable low temperature co-fired ceramic (LTCC). Anodic bonding of LTCC with Au vias-silicon on insulator (SOI) has been used to fabricate CMUTs with different membrane radii, 24 µm, 25 µm, 36 µm, 40 µm and 60 µm. Bottom electrodes were directly patterned on remained vias after wet etching of LTCC vias. CMUT cavities and Au bumps were micromachined on the Si part of the SOI wafer. This high conductive Si was also used as top electrode. Electrical connections between the top and bottom of the CMUT were achieved by Au-Au bonding of wet etched LTCC vias and bumps during anodic bonding. Three key parameters, infrared images, complex admittance plots, and static membrane displacement, were used to evaluate bonding success. CMUTs with a membrane thickness of 2.6 µm were fabricated for experimental analyses. A novel CMUT-IC packaging process has been described following the fabrication process. This process enables indirect packaging of the CMUT and integrated circuit (IC) using a lateral side via of LTCC. Lateral side vias were obtained by micromachining of fabricated CMUTs and used to drive CMUTs elements. Connection electrodes are patterned on LTCC side via and a catheter was assembled at the backside of the CMUT. The IC was mounted on the bonding pad on the catheter by a flip-chip bonding process. Bonding performance was evaluated by measurement of bond resistance between pads on the IC and catheter. This study demonstrates that the LTCC and LTCC side vias scheme can be a potential approach for high density CMUT array fabrication and indirect integration of CMUT-IC for miniature size packaging, which eliminates problems related with direct integration.
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Ahn, Bong Young, Ki Bok Kim, Hae Won Park, Young Joo Kim et Yong Seok Kwak. « Design and Characterization of Capacitive Micromachined Ultrasonic Transducer ». Key Engineering Materials 321-323 (octobre 2006) : 132–35. http://dx.doi.org/10.4028/www.scientific.net/kem.321-323.132.

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As cMUTs (capacitive Micromachined Ultrasonic Transducer) offer numerous advantages over traditional transducers in terms of efficiency, bandwidth, and cost, they are expected to replace piezoelectric transducers in many applications. In particular, 2D-array cMUTs have aroused great interest in the medical engineering society because of their ability to materialize a true volumetric ultrasonic image. In this study, single element cMUTs with 32 x 32 and 64 x 64 cells were successfully fabricated. The diameter and thickness of the membrane are 35 and 1000 nm, respectively, with a sacrificial layer thickness of 600 nm. The electric characteristics of the fabricated cMUT were measured. Tests on the efficiencies of the cMUT in terms of wave generation and in terms of detection according to the bias and pulse voltage were performed in an air atmosphere.
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Zhang, Wen, Hui Zhang, Shijiu Jin et Zhoumo Zeng. « A Two-Dimensional CMUT Linear Array for Underwater Applications : Directivity Analysis and Design Optimization ». Journal of Sensors 2016 (2016) : 1–8. http://dx.doi.org/10.1155/2016/5298197.

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Capacitive micromachined ultrasonic transducers (CMUTs) are one of the promising MEMS devices. This paper proposed an integrated vibration membrane structure to design a two-dimensional CMUT linear array for underwater applications. The operation frequencies for different medium have been calculated and simulated, which are 2.5 MHz in air and 0.7 MHz in water. The directivity analyses for the CMUT cell, subarray, and linear array have been provided. According to the product theorems, the directivity function of the complex array is obtained using a combination of the directivity functions of certain simple structures. Results show that the directivity of a CMUT cell is weak due to the small size, but the directivity of the designed linear array is very strong. Influential parameters of the linear array have been discussed, including the cell numbers, the adjacent distance, and the operation medium. In order to further suppress the side lobe interference and improve the resolution and the imaging quality of the imaging system, several weighting methods are used for optimization and comparison. Satisfactory side lobe suppression results are obtained, which can meet the actual requirements.
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Kim, Bae-Hyung, Seungheun Lee et Kang-Sik Kim. « Orthogonal Chirp Coded Excitation in a Capacitive Micro-machined Ultrasonic Transducer Array for Ultrasound Imaging : A Feasibility Study ». Sensors 19, no 4 (20 février 2019) : 883. http://dx.doi.org/10.3390/s19040883.

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It has been reported that the frequency bandwidth of capacitive micro-machined ultrasonic transducers (CMUTs) is relatively broader than that of other ceramic-based conventional ultrasonic transducers. In this paper, a feasibility study for orthogonal chirp coded excitation to efficiently make use of the wide bandwidth characteristic of CMUT array is presented. The experimental result shows that the two orthogonal chirps mixed and simultaneously fired in CMUT array can be perfectly separated in decoding process of the received echo signal without sacrificing the frequency bandwidth each chirp. The experimental study also shows that frequency band-divided orthogonal chirps are successfully compressed to two short pulses having the −6 dB axial beam-width of 0.26- and 0.31-micro second for high frequency and low frequency chirp, respectively. B-mode image simulations are performed using Field II to estimate the improvement of image quality assuming that the orthogonal chirps designed for the experiments are used for simultaneous transmission multiple-zone focusing (STMF) technique. The simulation results show that the STMF technique used in CMUT array can improve the lateral resolution up to 77.1% and the contrast resolution up to 74.7%, respectively. It is shown that the penetration depth also increases by more than 3 cm.
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Ye, Lei, Jian Li, Hui Zhang, Dongmei Liang et Zhuochen Wang. « An Integrated Front-end Circuit Board for Air-Coupled CMUT Burst-Echo Imaging ». Sensors 20, no 21 (28 octobre 2020) : 6128. http://dx.doi.org/10.3390/s20216128.

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To conduct burst-echo imaging with air-coupled capacitive micromachined ultrasonic transducers (CMUTs) using the same elements in transmission and reception, this work proposes a dedicated and integrated front-end circuit board design to build an imaging system. To the best of the authors’ knowledge, this is the first air-coupled CMUT burst-echo imaging using the same elements in transmission and reception. The reported front-end circuit board, controlled by field programmable gate array (FPGA), consisted of four parts: an on-board pulser, a bias-tee, a T/R switch and an amplifier. Working with our 217 kHz 16-element air-coupled CMUT array under 100 V DC bias, the front-end circuit board and imaging system could achieve 22.94 dB signal-to-noise ratio (SNR) in burst-echo imaging in air, which could represent the surface morphology and the three-dimensional form factor of the target. In addition, the burst-echo imaging range of our air-coupled CMUT imaging system, which could work between 52 and 273 mm, was discussed. This work suggests good potential for ultrasound imaging and gesture recognition applications.
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Eren, Ezgi Can, Ram Dixit et Natarajan Gautam. « A Three-Dimensional Computer Simulation Model Reveals the Mechanisms for Self-Organization of Plant Cortical Microtubules into Oblique Arrays ». Molecular Biology of the Cell 21, no 15 (août 2010) : 2674–84. http://dx.doi.org/10.1091/mbc.e10-02-0136.

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The noncentrosomal cortical microtubules (CMTs) of plant cells self-organize into a parallel three-dimensional (3D) array that is oriented transverse to the cell elongation axis in wild-type plants and is oblique in some of the mutants that show twisted growth. To study the mechanisms of CMT array organization, we developed a 3D computer simulation model based on experimentally observed properties of CMTs. Our computer model accurately mimics transverse array organization and other fundamental properties of CMTs observed in rapidly elongating wild-type cells as well as the defective CMT phenotypes observed in the Arabidopsis mor1-1 and fra2 mutants. We found that CMT interactions, boundary conditions, and the bundling cutoff angle impact the rate and extent of CMT organization, whereas branch-form CMT nucleation did not significantly impact the rate of CMT organization but was necessary to generate polarity during CMT organization. We also found that the dynamic instability parameters from twisted growth mutants were not sufficient to generate oblique CMT arrays. Instead, we found that parameters regulating branch-form CMT nucleation and boundary conditions at the end walls are important for forming oblique CMT arrays. Together, our computer model provides new mechanistic insights into how plant CMTs self-organize into specific 3D arrangements.
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Zhang, Tian, Wendong Zhang, Xingling Shao, Yuhua Yang, Zhihao Wang, Yang Wu et Yu Pei. « A Study on Capacitive Micromachined Ultrasonic Transducer Periodic Sparse Array ». Micromachines 12, no 6 (11 juin 2021) : 684. http://dx.doi.org/10.3390/mi12060684.

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Capacitive micromachined ultrasonic transducer (CMUT) is an ultrasonic transducer based on the microelectromechanical system (MEMS). CMUT elements are easily made into a high-density array, which will increase the hardware complexity. In order to reduce the number of active channels, this paper studies the grating lobes generated by CMUT periodic sparse array (PSA) pairs. Through the design of active element positions in the transmitting and receiving processes, the simulation results of effective aperture and beam patterns show that the common grating lobes (CGLs) generated by the transmit and receive array are eliminated. On the basis of point targets imaging, a CMUT linear array with 256 elements is used to carry out the PSA pairs experiment. Under the same sparse factor (SF), the optimal sparse array configuration can be selected to reduce the imaging artifacts. This conclusion is of great significance for the application of CMUT in three-dimensional ultrasound imaging.
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Zhang, Tian, Wendong Zhang, XingLing Shao et Yang Wu. « Research on optimization sparse method for capacitive micromachined ultrasonic transducer array : heuristic algorithm ». Sensor Review 41, no 3 (21 juin 2021) : 260–70. http://dx.doi.org/10.1108/sr-03-2021-0082.

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Purpose Because of the small size and high integration of capacitive micromachined ultrasonic transducer (CMUT) component, it can be made into large-scale array, but this lead to high hardware complexity, so the purpose of this paper is to use less elements to achieve better imaging results. In this research, an optimized sparse array is studied, which can suppress the side lobe and reduce the imaging artifacts compared with the equispaced sparse array with the same number of elements. Design/methodology/approach Genetic algorithm is used to sparse the CMUT linear array, and Kaiser window apodization is added to reduce imaging artifacts, the beam pattern and peak-to-side lobe ratio are calculated, point targets imaging comparisons are performed. Furthermore, a 256-elements CMUT linear array is used to carry out the imaging experiment of embedded mass and forearm blood vessel, and the imaging results are compared quantitatively. Findings Through the imaging comparison of embedded mass and forearm blood vessel, the feasibility of optimized sparse array of CMUT is verified, and the purpose of reducing the hardware complexity is achieved. Originality/value This research provides a basis for the large-scale CMUT array to reduce the hardware complexity and the amount of calculation. At present, the CMUT array has been used in medical ultrasound imaging and has huge market potential.
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Daft, Christopher M. W. « PIEZOELECTRIC AND CMUT LAYERED ULTRASOUND TRANSDUCER ARRAY ». Journal of the Acoustical Society of America 133, no 4 (2013) : 2520. http://dx.doi.org/10.1121/1.4800170.

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M. W. Daft, Christopher. « MULTI-DIMENSIONAL CMUT ARRAY WITH INTEGRATED BEAMFORMATION ». Journal of the Acoustical Society of America 135, no 1 (2014) : 574. http://dx.doi.org/10.1121/1.4861516.

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Wang, Hongliang, Jiao Qu, Xiangjun Wang, Changde He et Chenyang Xue. « Investigation and Analysis of Ultrasound Imaging Based on Linear CMUT Array ». International Journal of Pattern Recognition and Artificial Intelligence 33, no 08 (25 juin 2019) : 1957004. http://dx.doi.org/10.1142/s0218001419570040.

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In the next generation of ultrasound imaging systems, Capacitive micromachined ultasonic transducer (CMUT) based on microelectromechanical systems (MEMS) is a promising research direction of transducers, which has wide application prospects. In this paper, based on the study of three imaging methods, including classical phased array (CPA) imaging, classical synthetic aperture (CSA) imaging and phased subarray (PSA) imaging, several different imaging schemes are designed for linear CMUT array, after that the performances of these imaging schemes are compared and analyzed. The effects of the three imaging methods are verified and analyzed based on the linear CMUT array. Through analysis, it is found that the image quality of the classical phased array imaging method is the best, the imaging quality of the above three imaging methods can be effectively improved by adopting the amplitude apodization and dynamic focusing method. The research results in this paper will provide theoretical basis and application reference for the design of ultrasonic imaging system based on linear CMUT array in the future.
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Ronnekleiv, A. « CMUT array modeling through free acoustic CMUT modes and analysis of the fluid CMUT interface through Fourier transform methods ». IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control 52, no 12 (décembre 2005) : 2173–84. http://dx.doi.org/10.1109/tuffc.2005.1563261.

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Wang, Mengli, et Jingkuang Chen. « Volumetric Flow Measurement Using an Implantable CMUT Array ». IEEE Transactions on Biomedical Circuits and Systems 5, no 3 (juin 2011) : 214–22. http://dx.doi.org/10.1109/tbcas.2010.2095848.

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