Bibliographies thématiques / Chemical-mechanical cleaning / Articles de revues

Articles de revues sur le sujet « Chemical-mechanical cleaning »

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Auteur : Grafiati
Publié le 10 mars 2023

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1

Liu, Chi-Wen, Bau-Tong Dai et Ching-Fa Yeh. « Post cleaning of chemical mechanical polishing process ». Applied Surface Science 92 (février 1996) : 176–79. http://dx.doi.org/10.1016/0169-4332(95)00226-x.

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2

Shang, Cass, Taishih Maw et Fadi Coder. « Post Chemical Mechanical Polish Cleaning Chemistry for through Silicon via Process ». Solid State Phenomena 195 (décembre 2012) : 154–57. http://dx.doi.org/10.4028/www.scientific.net/ssp.195.154.

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In order to achieve high cleaning efficiency requirement for post Chemical Mechanical Polish (CMP) cleaning in Through Silicon Via (TSV) application due to the aggressive CMP process. More comprehensive wafer defect evaluation techniques are needed to understand the cleaning mechanisms and assist the formulation design process. In this paper, the CSX-T series chemistry is applied to the post CMP cleaning process of various wafer substrates commonly used in TSV integration schemes. The data collected by several techniques are analyzed in detail and compared to demonstrate how and when it can be used in new formulation screening process to ensure good cleaning performance.
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Zhou, Kan, Shuguang Sang, Chengyu Wang et Yihua Zhou. « Principle, application and development trend of laser cleaning ». Journal of Physics : Conference Series 2383, no 1 (1 décembre 2022) : 012075. http://dx.doi.org/10.1088/1742-6596/2383/1/012075.

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Many areas of industrial production are inseparable from cleaning technology, and traditional cleaning technology is increasingly unable to meet the requirements of modern industry. Laser cleaning technology is a new cleaning technology with high efficiency and no chemical pollution. It has the characteristics of non-contact, environmental protection, high efficiency, flexibility, energy saving and wide application range. Compared with mechanical friction cleaning, chemical corrosion cleaning, ultrasonic cleaning, dry ice cleaning and other technologies, it has obvious advantages. At present, laser cleaning technology has been widely used in the fields of aerospace body paint removal, cultural relics sample cleaning, mold and mechanical parts product cleaning, mainly used for paint treatment, rust removal, oil removal and particles. This paper discusses the development trend of laser cleaning technology compared with the traditional laser cleaning technology.
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Wang, Y. L., T. C. Wang, J. Wu, W. T. Tseng et C. F. Lin. « A modified multi-chemical spray cleaning process for post shallow trench isolation chemical mechanical polishing cleaning application ». Thin Solid Films 332, no 1-2 (novembre 1998) : 385–90. http://dx.doi.org/10.1016/s0040-6090(98)01207-3.

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Cooper, Kevin, Anand Gupta et Stephen Beaudoin. « Simulation of Particle Adhesion : Implications in Chemical Mechanical Polishing and Post Chemical Mechanical Polishing Cleaning ». Journal of The Electrochemical Society 148, no 11 (2001) : G662. http://dx.doi.org/10.1149/1.1409975.

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Kim, Young-Min, Han-Chul Cho et Hae-Do Jeong. « Effect of Chemical Mechanical Cleaning(CMC) on Particle Removal in Post-Cu CMP Cleaning ». Transactions of the Korean Society of Mechanical Engineers A 33, no 10 (1 octobre 2009) : 1023–28. http://dx.doi.org/10.3795/ksme-a.2009.33.10.1023.

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Yang, Chan Ki, Jin Goo Park, Jung Hun Jo, Geun Sik Lim, Tae Hyung Kim et In Soo Jo. « Removal of Slurry Residues in Tungsten Plug during Chemical Mechanical Planarization ». Solid State Phenomena 124-126 (juin 2007) : 157–60. http://dx.doi.org/10.4028/www.scientific.net/ssp.124-126.157.

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One of key processes in tungsten (W) CMP is to remove slurry particles inside W plug after CMP. In general, HF cleaning is well known to remove the slurry residue particles in W plugs. HF chemistry lifts off the particles by etching the plug during scrubbing and effectively removes particles. It is sometimes impossible to apply HF chemisty on W plug due to the degradation of electrical characteristics of a device. In this paper, a post W CMP cleaning process is proposed to remove residue particles without applying HF chemistry. After W CMP, recessed plugs are created, therefore they easily trap slurry particles during CMP process. These particles in recessed plug are not easy to remove by brush scrubbing when NH4OH chemistry is used for the cleaning because the brush surface can not reach the recessed area of plugs. Buffing with oxide slurry was followed by W CMP due to its high selectivity to W. The buffing polishes only oxide slightly which creates higher plug profiles than surrounding oxide. Higher profiles make the brush contact much more effectively and result in a similar particle removal efficiency even in NH4OH cleaning to that in HF brush scrubbing.
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Ramachandran, Manivannan, Byoung-Jun Cho, Tae-Young Kwon et Jin-Goo Park. « Hybrid Cleaning Technology for Enhanced Post-Cu/Low-Dielectric Constant Chemical Mechanical Planarization Cleaning Performance ». Japanese Journal of Applied Physics 52, no 5S3 (1 mai 2013) : 05FC02. http://dx.doi.org/10.7567/jjap.52.05fc02.

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Wei, Kuo-Hsiu, Chi-Cheng Hung, Yu-Sheng Wang, Chuan-Pu Liu, Kei-Wei Chen et Ying-Lang Wang. « Cleaning methodology of small residue defect with surfactant in copper chemical mechanical polishing post-cleaning ». Thin Solid Films 618 (novembre 2016) : 77–80. http://dx.doi.org/10.1016/j.tsf.2016.05.007.

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Suzuki, Kazunari, Ki Han, Shoichi Okano, Jyunichiro Soejima et Yoshikazu Koike. « Application of Novel Ultrasonic Cleaning Equipment Using Waveguide mode for Post-Chemical-Mechanical-Planarization Cleaning ». Japanese Journal of Applied Physics 48, no 7 (21 juillet 2009) : 07GM04. http://dx.doi.org/10.1143/jjap.48.07gm04.

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11

Shay, Kenneth. « Denture Hygiene : A Review and Update ». Journal of Contemporary Dental Practice 1, no 2 (1999) : 36–43. http://dx.doi.org/10.5005/jcdp-1-2-36.

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Abstract Growth in the aging population has resulted in an increasing number of older persons requiring dentures. The microporous surfaces of an acrylic denture provide a wide range of environments to support microorganisms that can threaten the health of a physically vulnerable patient. The maintenance of denture prostheses is important for the health of patients and to maintain an esthetic, odor-free appliance. Mechanical, chemical, and a combination of mechanical and chemical strategies are available to patients to facilitate denture hygiene. Brushing is an ineffective method of denture disinfection. Household bleach or vinegar are effective as are the commercial, effervescent products sold for denture soaking. A new denture cleaner contains silicone polymer that provides a protective coating for dentures as a final step in the cleaning process. The coating helps to minimize the adhesion of accretions to the denture throughout the day until the next cleaning. Dental professionals must have a current knowledge of denture cleansing strategies in order to maximize the service offered to denture patients.
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Park, Kihong, Sang-hyeon Park, Seokjun Hong, Jongsoo Han, Sanghcuk Jeon, Chang min Kim et Taesung Kim. « Post Chemical Mechanical Planarization (CMP) Cleaning Using Hydrogen Dissolved Water ». ECS Meeting Abstracts MA2021-01, no 20 (30 mai 2021) : 813. http://dx.doi.org/10.1149/ma2021-0120813mtgabs.

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Tung Ming Pan, Tan Fu Lei, Chao Chyi Chen, Tien Sheng Chao, Ming Chi Liaw, Wen Lu Yang, Ming Shih Tsai, C. P. Lu et W. H. Chang. « Novel cleaning solutions for polysilicon film post chemical mechanical polishing ». IEEE Electron Device Letters 21, no 7 (juillet 2000) : 338–40. http://dx.doi.org/10.1109/55.847373.

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14

Cahue, Kiana A., Abigail L. Dudek, Mantas M. Miliauskas, Tatiana R. Cahue, Amy Mlynarski et Jason J. Keleher. « Design of “Low Stress” Post-CMP Cleaning Processes for Advanced Technology Nodes ». ECS Transactions 108, no 4 (20 mai 2022) : 3–15. http://dx.doi.org/10.1149/10804.0003ecst.

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The Chemical Mechanical Planarization (CMP) process can cause various defects, and they can be classified as mechanical (i.e., scratching), chemical (i.e., corrosion), or physiochemical (i.e., adsorbed contaminants) according to the mechanism of formation. Traditionally, a contact cleaning method involving a poly-vinyl alcohol (PVA) brush is used to transfer cleaning chemistry to the substrate of interest as well as provide the necessary mechanical energy for defect removal. While this process is effective in contaminant removal its reliance on shear forces can induce secondary defect modes, such as scratching. To minimize the aforementioned induced defectivity during contact p-CMP processes, the implementation of non-contact modalities has become of the utmost importance. This work will focus on the rationale design of p-CMP cleaning systems for emerging materials such as SiC, carbon-doped oxides, and metals. “Soft” cleaning chemistry structure (i.e., shape and charge), and processes play a critical role in cleaning efficacy under low stress conditions.
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Cahue, Kiana A., Abigail L. Dudek, Mantas M. Miliauskas, Tatiana R. Cahue, Amy Mlynarski et Jason J. Keleher. « Design of “Low Stress” Post-CMP Cleaning Processes for Advanced Technology Nodes ». ECS Meeting Abstracts MA2022-01, no 28 (7 juillet 2022) : 1242. http://dx.doi.org/10.1149/ma2022-01281242mtgabs.

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As integrated circuit and logic device feature sizes approach the 3-nm node, limiting induced defectivity during Chemical Mechanical Planarization (CMP) process (polishing and substrate cleaning) is of utmost importance. The CMP process can cause various defects, and they can be classified as mechanical (i.e., scratching), chemical (i.e., corrosion), or physiochemical (i.e., adsorbed contaminants) according to the mechanism of formation. Traditionally, a contact cleaning method involving a poly-vinyl alcohol (PVA) brush is used to transfer cleaning chemistry to the substrate of interest as well as provide the necessary mechanical energy for defect removal. While this process is effective in contaminant removal its reliance on shear forces can induce secondary defect modes, such as scratching. To minimize the aforementioned induced defectivity during contact p-CMP processes, the implementation of non-contact modalities has become of the utmost importance. This work will focus on the rationale design of p-CMP cleaning systems for emerging materials such as SiC, GaN, carbon-doped oxides, and metals. More specifically, “OVER”-cutting and “soft” cleaning processes that balance the modulation of surface reaction kinetics (chemical and adsorption) with advanced low shear force environment will be evaluated. For example, employing supramolecular cleaning chemistries coupled with reactive oxygen species (ROS) generating complexes under megasonic action were evaluated for effective SiC cleaning. Results from a second order kinetic model indicate that processing conditions (i.e., time and power), “soft” cleaning chemistry structure (i.e., shape and charge), and the generation of ROS all play a critical role in cleaning efficacy under low stress conditions in the megasonic field. Utilizing a suite of dynamic analytical techniques (i.e., atomic force microscopy, quartz crystal microbalance, contact angle, zeta potential, and electrochemical analysis, shear force analysis) a correlation between interfacial reaction mechanisms and effective p-CMP cleaning will be presented.
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16

Jamal, Alainna Juliette, Rajni Pantelidis, Rachael Sawicki, Angel Li, Wayne Chiu, Deborah Morrison, John Marshman et al. « Chemical, Mechanical, and Heat Cleaning to Decontaminate Hospital Drains Harboring Carbapenemase-Producing Enterobacteriales ». Infection Control & ; Hospital Epidemiology 41, S1 (octobre 2020) : s466—s467. http://dx.doi.org/10.1017/ice.2020.1141.

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Background: Carbapenemase-producing Enterobacteriales (CPE) outbreaks have been linked to contaminated wastewater drainage systems in hospitals. The optimal strategy for CPE decontamination of drains is unknown. In this randomized controlled trial, we aimed to determine whether combining chemical, mechanical, and heat cleaning was superior to routine cleaning for drain decontamination. Methods: We enrolled CPE-contaminated hospital drains at 2 geographic locations. Eligible drains were those initially found to be culture positive in a 2017 study and that remained positive (by RT-PCR) when retested twice in August 2018. Drains were stratified by type (sink versus shower) and randomized with a 1:1 allocation ratio (as per computer-generated randomization) to standard-of-care cleaning (comparator) or combined chemical, mechanical, and heat cleaning (intervention) on day 0. Drain tail pieces were swabbed on days 0 (before administration of the intervention), 1, 2, 3, 7, and 14, and at months 1, 2, 3, 4, 5, and 6. Swabs were placed into brain heart infusion with 10% Dey-Engley neutralizing broth and incubated overnight. Direct RT-PCR was performed to detect KPC, VIM, NDM, OXA-48–like, IMP, GES, and SME genes. The primary outcome was drain decontamination, defined as no detectable carbapenemase gene in the drain from day 1 to 7 (inclusive). Results: Overall, 33 CPE-contaminated drains were enrolled (7 sink and 26 shower); 17 and 16 drains were randomized to the intervention and comparator, respectively. Moreover, 12 (36%) drains met the primary outcome of decontamination, 18 (55%) remained contaminated, and 3 (9%) could not be assessed. Among drains that could be assessed, 11 of 15 (74%) in the intervention group met the primary outcome of decontamination compared to 1 of 15 (7%) in the comparator group (P = .0005). Of the 11 drains in the intervention group that were decontaminated, the carbapenemase gene present at enrollment was subsequently detected in 10 (91%): 1 (10%) at day 14, 3 (30%) at month 1, 4 (40%) at month 3, 1 (10%) at month 4, and 1 (10%) at month 6. The median time to a swab yielding CPE was 1 day in the comparator group versus 14 days in the intervention group (Fig. 1). Overall, 24 drains (73%) had a carbapenemase gene (that was not detectable at enrollment) appear in the follow-up. Of patients identified as CPE colonized or infected during this study, none occupied rooms with these drains. Conclusions: Chemical, mechanical, and heat cleaning were superior to standard cleaning for CPE decontamination of hospital drains at 7 days, but these trends were not sustained. Such cleaning may be useful if applied repeatedly.Funding: NoneDisclosures: Allison McGeer reports funds to her institution for studies for which she is the principal investigator from Pfizer and Merck as well as consulting fees from Sanofi-Pasteur, Sunovion, GSK, Pfizer, and Cidara.
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17

Hupka, Lukasz. « SURFACE FORCES IN CHEMICAL MECHANICAL PLANARIZATION AND SEMICONDUCTOR WAFER CLEANING SYSTEMS ». Wiadomości Chemiczne 75, no 9 (15 octobre 2021) : 1229–40. http://dx.doi.org/10.53584/wiadchem.2021.10.5.

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18

Harada, Ken, Atsushi Ito, Yasuhiro Kawase, Toshiyuki Suzuki, Makoto Hara, Rina Sakae, Chiharu Kimura et Hidemitsu Aoki. « Study of Cu-Inhibitor State for Post-Chemical Mechanical Polishing Cleaning ». Japanese Journal of Applied Physics 50, no 5S1 (1 mai 2011) : 05EC06. http://dx.doi.org/10.7567/jjap.50.05ec06.

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19

Zhang, Liming, Srini Raghavan et Milind Weling. « Minimization of chemical-mechanical planarization (CMP) defects and post-CMP cleaning ». Journal of Vacuum Science & ; Technology B : Microelectronics and Nanometer Structures 17, no 5 (1999) : 2248. http://dx.doi.org/10.1116/1.590901.

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Harada, Ken, Atsushi Ito, Yasuhiro Kawase, Toshiyuki Suzuki, Makoto Hara, Rina Sakae, Chiharu Kimura et Hidemitsu Aoki. « Study of Cu-Inhibitor State for Post-Chemical Mechanical Polishing Cleaning ». Japanese Journal of Applied Physics 50, no 5 (20 mai 2011) : 05EC06. http://dx.doi.org/10.1143/jjap.50.05ec06.

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Zhang, F., et A. Busnaina. « Submicron particle removal in post-oxide chemical-mechanical planarization (CMP) cleaning ». Applied Physics A : Materials Science & ; Processing 69, no 4 (1 octobre 1999) : 437–40. http://dx.doi.org/10.1007/s003390051028.

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Serpokrylov, Nikolai, Alla Smolyanichenko et Vladimir Nelidin. « Development of technology for water purification by filtration using vibration ». E3S Web of Conferences 175 (2020) : 12009. http://dx.doi.org/10.1051/e3sconf/202017512009.

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Improving the quality of water treatment is accompanied by an increase in technology requirements. An important role in solving problems of technological ensuring the quality of treatment, among which a prominent place is occupied by filtration methods, biological, chemical and mechanical methods. Among the mentioned cleaning methods, mechanical cleaning methods and one of its varieties are widely used, a new model water purification by filtration using vibrationtechnology.
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Han, Ja Hyung, Ja Eung Koo, Kyo Se Choi, Byung Lyul Park, Ju Hyuk Chung, Sang Rok Hah, Sun Yong Lee, Young Jae Kang et Jin Goo Park. « A Study on Water-Mark Defects in Copper/Low-k Chemical Mechanical Polishing ». Solid State Phenomena 134 (novembre 2007) : 295–98. http://dx.doi.org/10.4028/www.scientific.net/ssp.134.295.

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The prevention of watermark defect after copper/low-k CMP is a critical barrier for the successful integration of sub-100 nm devices. The water-mark can act as a leakage source and cause electrical shorts. The mechanism of water-mark formation during Cu/low-k CMP is suggested and its prevention methods are proposed in this study. A suitable surfactant treatment can improve the wettability of low-k films and reduce the watermark defects very effectively. The relatively stable low-k film surface is activated during polishing and prone to adsorb surfactant molecules during cleaning, which results in the reduction of water-marks after CMP. Another solution to eliminate water-mark is the application of IPA dryer in post CMP cleaning.
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Taylor, Keyanna P., et Debra D Harris. « Cleaning and disinfecting protocols for hospital environmental surfaces : A systematic review of the literature ». Journal of Hospital Administration 8, no 6 (22 octobre 2019) : 27. http://dx.doi.org/10.5430/jha.v8n6p27.

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Background: Healthcare associated infections are a leading cause of illness and death in the United States and across the world. Environmental surfaces are considered non-critical, although recent evidence suggests that the built environment may contribute to the transmission of pathogens. Ineffective cleaning and disinfecting of environmental non-critical surfaces may increase risk of transmitting nosocomial pathogens leading to hospital acquired infections among hospital patients.Objective: This systematic review identifies elements of cleaning and disinfecting protocols, synthesizing the evidence to evaluate cleaning protocols that effectively reduce surface contamination and minimize risk of hospital acquired illness.Methods: A systematic literature review was conducted with a clearly formulated research question and systematic approach to identify publications, select relevant studies, critically appraise the research through analysis of reported data, and reported the results according to the Cochrane methodology.Results: In total, 245 studies were initially identified with 19 studies meeting inclusion criteria. Emerging categories include chemical application methods, chemical application time, cleaning type and frequency, and interventions for training and monitoring.Conclusions: Establishing adequate cleaning protocols for hospital environments is a complex process which requires consideration of multiple components including mechanical action, chemical application materials, types of cleaning, chemical contact times, education and training of EVS staff, cleaning monitoring and feedback, no-contact cleaning methods, and self-disinfecting surfaces. Recommendations for protocol development based on the study results are provided.
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Bhushan, Bharat, et Victor Multanen. « Designing liquid repellent, icephobic and self-cleaning surfaces with high mechanical and chemical durability ». Philosophical Transactions of the Royal Society A : Mathematical, Physical and Engineering Sciences 377, no 2138 (24 décembre 2018) : 20180270. http://dx.doi.org/10.1098/rsta.2018.0270.

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Liquid repellent, icephobic and self-cleaning surfaces are of interest in industrial applications, including solar panels, self-cleaning windows, wind turbines, and automotive and aerospace components. In this study, a coating using a simple and scalable fabrication technique was used to produce superliquiphobic surfaces with a low tilt angle. The coating comprises hydrophobic SiO 2 nanoparticles with a binder of methylphenyl silicone resin to achieve superhydrophobicity. After ultraviolet–ozone treatment of the coating, an additional coating of fluorosilane was deposited to achieve superliquiphobicity with low tilt angle. Data for these coatings are presented showing the ability to repel water and oil, anti-icing properties down to −60°C, self-cleaning, and the ability to maintain superliquiphobicity in hot environments up to about 95°C, after soaking in deionized water for more than 200 h at room temperature and for about 50 h at 50°C and 70°C, and in chemical environments with low pH values. The coatings were found to be mechanically durable. Detailed characterization for anti-icing provides an insight into the mechanisms of icephobicity. This article is part of the theme issue ‘Bioinspired materials and surfaces for green science and technology’.
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Harada, Ken, Tomohiro Kusano, Toshiaki Shibata et Yasuhiro Kawase. « Investigation of Co surface reaction by in situ measurement for chemical mechanical planarization and post-chemical mechanical planarization cleaning ». Japanese Journal of Applied Physics 57, no 7S2 (20 juin 2018) : 07MD02. http://dx.doi.org/10.7567/jjap.57.07md02.

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Parisi, Erica I., Nicole Bonelli, Emiliano Carretti, Rodorico Giorgi, Gabriel M. Ingo et Piero Baglioni. « Film forming PVA-based cleaning systems for the removal of corrosion products from historical bronzes ». Pure and Applied Chemistry 90, no 3 (23 février 2018) : 507–22. http://dx.doi.org/10.1515/pac-2017-0204.

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AbstractThis paper presents an innovative poly(vinyl)alcohol-based film forming system, specifically devised for the controllable and selective cleaning of copper-based artifacts. Traditional cleaning procedures are commonly performed using mechanical and/or chemical methods. Unfortunately, both these methods present some limitations related to both the poor selectivity and invasiveness in case of the mechanical procedure, and to the scarce control over the involved reactions when dealing with a chemical approach. The innovative system proposed in this work allows combining the advantages of chemical and mechanical treatments thanks to the confinement of a complexing agent (EDTA) within a fluid, polymeric matrix, that is able to form a solid thin film upon drying. After treatment, the polymeric film can be completely removed from the artwork through a gentle peeling action. In this contribution, the film formation mechanism was investigated by means of thermal analysis and rheology; the role of plasticizers, volatile solvent fraction, and quantity of loaded EDTA is also discussed. Finally, the results of cleaning tests performed on artificially aged samples, and on a real case study, the “Fontana dei Mostri Marini” by Pietro Tacca in Florence, are presented.
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Choi, Jae Gon, Hyo Geun Yoon, Woo Jin Kim, Geun Min Choi, Young Wook Song et Jin Goo Park. « The Dependence of Chemical Mechanical Polishing Residue Removal on Post-Cleaning Treatments ». Solid State Phenomena 134 (novembre 2007) : 303–6. http://dx.doi.org/10.4028/www.scientific.net/ssp.134.303.

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Miyamoto, Makoto, Shinya Hirano, Hiroyuki Chibahara, Takashi Watadani, Moriaki Akazawa et Seiji Furukawa. « Enhancement of Post-Cu-Chemical Mechanical Polishing Cleaning Process for Low-kSubstrate ». Japanese Journal of Applied Physics 45, no 10A (6 octobre 2006) : 7637–44. http://dx.doi.org/10.1143/jjap.45.7637.

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Ueda, Takayuki, Keitaro Kubo, Takeshi Saito, Tomokuni Obata, Takeshi Wada, Koichiro Yanagisawa et Kaoru Sakurai. « Surface morphology of silicone soft relining material after mechanical and chemical cleaning ». Journal of Prosthodontic Research 62, no 4 (octobre 2018) : 422–25. http://dx.doi.org/10.1016/j.jpor.2018.03.002.

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Manivannan, Ramachandran, Byoung-Jun Cho, Xiong Hailin, Srinivasan Ramanathan et Jin-Goo Park. « Characterization of non-amine-based post-copper chemical mechanical planarization cleaning solution ». Microelectronic Engineering 122 (juin 2014) : 33–39. http://dx.doi.org/10.1016/j.mee.2014.02.034.

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Devarapalli, Vamsi Krishna, Ying Li et Cetin Cetinkaya. « Post-chemical mechanical polishing cleaning of silicon wafers with laser-induced plasma ». Journal of Adhesion Science and Technology 18, no 7 (janvier 2004) : 779–94. http://dx.doi.org/10.1163/156856104840273.

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Zhang, Fan, Ahmed A. Busnaina et Goodarz Ahmadi. « Particle Adhesion and Removal in Chemical Mechanical Polishing and Post‐CMP Cleaning ». Journal of The Electrochemical Society 146, no 7 (1 juillet 1999) : 2665–69. http://dx.doi.org/10.1149/1.1391989.

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34

Bu, Nai Jing, Hong Lei, Ru Ling Chen et Xiao Li Hu. « Post-CMP Cleaning of Atom-Scale Planarization Surface of Computer Hard Disk Substrate ». Advanced Materials Research 97-101 (mars 2010) : 1181–85. http://dx.doi.org/10.4028/www.scientific.net/amr.97-101.1181.

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At present, the surface of computer hard disk substrate has reached atom-scale planarization after chemical mechanical polishing (CMP). Post-CMP cleaning is one of the key factors influencing the CMP performances. During cleaning, cleaning solution and cleaning methods play a key role in cleaning quality and effectiveness. In the present paper, alkylpolyoxyethylene alcohol carboxylic ester (FAC) surfactant was synthesized and its cleaning performances on atom-scale planarization surface of computer hard disk substrate were investigated. Microscope analysis indicated that the prepared detergent containing FAC surfactant exhibited improved cleaning performances compared with the commercial detergent. Further, inductively coupled plasma (ICP) atomic emission spectrometer, auger electron spectrogram (AES) and atomic force microscopy (AFM) analyses after static corrosion test showed that the prepared cleaning solution had lower corrosion to hard disk substrate.
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Gupta, R. K., A. Kumar, P. Ganesh et R. Kaul. « Failure Analysis of Stainless Steel Sheets of Heat Shield Assembly of a Vacuum Degassing Furnace ». Practical Metallography 58, no 1 (1 janvier 2021) : 48–61. http://dx.doi.org/10.1515/pm-2020-0003.

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Abstract A twenty-five-year-old vacuum furnace is being used for degassing of ultra-high vacuum components. The heat shield assembly of the furnace comprised of one molybdenum (Mo) front sheet, followed by four 304 stainless steel (SS) sheets. During prolonged service of the furnace, SS sheets developed thick black oxide scale. As a part of refurbishment drive, the SS sheets were subjected to chemical cleaning in 20 % HNO3 + 1.5 % HF, which caused severe thinning along the edges of some sheets. Detailed analysis of a damaged SS sheet showed that the damage was caused by severe sensitization of edge region which underwent extensive intergranular corrosion during chemical cleaning. Important remedial measures suggested to avoid similar failures included: (i) use of type 316L or stabilized grades of austenitic SS sheets, (ii) use of two Mo front sheets in place of one and (iii) use of mechanical cleaning in place of chemical cleaning.
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Choi, Hoo Mi, Jang Ah Kim, Yu Jin Cho, Taeh Yun Hwang, Jon Woo Lee et Tae Sung Kim. « Surface Cleaning of Graphene by CO2 Cluster ». Solid State Phenomena 219 (septembre 2014) : 68–70. http://dx.doi.org/10.4028/www.scientific.net/ssp.219.68.

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Graphene has attracted researchers due to its unique physical properties [1]. However, residues on surface can act as contaminants which further have adverse effects on its performance. As synthetic graphene has inherent surface roughness which can also affect the weak adhesion of layers and leakage points. In order to improve the mechanical and electrical properties, the graphene surface should be uncontaminated. In general practice wet cleaning methods, containing hazardous chemical and solvents are used to remove the residues from graphene surface [2, 3]. To avoid chemicals, mechanical cleaning of graphene using contact mode atomic force microscopy (AFM) has been tried. However, the contact mode AFM cleaning is a limited in cleaning area and the cleaning procedure takes a long time. Recently, CO2 cluster cleaning shows benefits that overcomes these problems. Herein we report the use of CO2 cluster to clean the graphene surface without affecting its inherent properties for the first time. The CO2 cluster treated graphene samples were evaluated by AFM for its roughness change and residual contamination.
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Tudu, Balraj Krishnan, Aditya Kumar et Bharat Bhushan. « Facile approach to develop anti-corrosive superhydrophobic aluminium with high mechanical, chemical and thermal durability ». Philosophical Transactions of the Royal Society A : Mathematical, Physical and Engineering Sciences 377, no 2138 (24 décembre 2018) : 20180272. http://dx.doi.org/10.1098/rsta.2018.0272.

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Durable, superhydrophobic and self-cleaning aluminium surfaces with high corrosion resistance are desirable in many industrial applications. In this study, a facile approach is used to produce aluminium surfaces with superhydrophobicity with a low tilt angle by creating desired roughness structure by immersing in NaOH solution followed by lowering the surface energy by immersing in hexadecyltrimethoxysilane solution. The coated samples show water contact angle of 164 ± 7° and tilt angle of 5 ± 1°. Droplet dynamics of the coated surfaces was investigated. Surfaces exhibited self-cleaning properties. In addition, mechanical, chemical and thermal stability tests were performed. Electrochemical tests of coated surfaces demonstrated anti-corrosion properties with low corrosion current density and high corrosion potential. This article is part of the theme issue ‘Bioinspired materials and surfaces for green science and technology’.
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Cho, Han Chul, Young Min Kim, Hyun Seop Lee, Suk Bae Joo et Hae Do Jeong. « The Effect of PVA Brush Scrubbing on Post CMP Cleaning Process for Damascene Cu Interconnection ». Solid State Phenomena 145-146 (janvier 2009) : 367–70. http://dx.doi.org/10.4028/www.scientific.net/ssp.145-146.367.

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Cu (copper) has been widely used for interconnection structure in integrated circuits because of its properties such as a low resistivity and high resistance to electromigration when compared with aluminum [1, 2]. Damascene process for the interconnection structure utilizes 2-steps CMP (chemical mechanical polishing). After 2-steps CMP process, many abrasive particles leave on the wafer surface, which should be removed in post-Cu CMP cleaning process. Cleaning efficiency affects directly on the subsequent process and device yield [3]. Therefore, cleaning of abrasive particles is the critical issue in semiconductor manufacturing.
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Sampurno, Yasa, Yun Zhuang, Xun Gu, Sian Theng, Takenao Nemoto, Ting Sun, Fransisca Sudargho, Akinobu Teramoto, Ara Philipossian et Tadahiro Ohmi. « Effect of Various Cleaning Solutions and Brush Scrubber Kinematics on the Frictional Attributes of Post Copper CMP Cleaning Process ». Solid State Phenomena 145-146 (janvier 2009) : 363–66. http://dx.doi.org/10.4028/www.scientific.net/ssp.145-146.363.

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Brush scrubbing has been widely used in post chemical mechanical planarization (CMP) applications to remove contaminations, such as slurry residues and particles, from the wafer surface. During brush scrubbing, particle removal results from direct contact between a soft poly vinyl alcohol (PVA) brush and the wafer surface in which the brush asperities engulf the particles while the rotating motion of the brush, as well as the cleaning fluid at the surface, dislodge and carry the particles away from the wafer. The cleaning performance of brush scrubbing depends heavily on the choice of the cleaning solution and brush scrubber kinematics. In this work, the effect of various cleaning solutions and brush scrubber kinematics on the frictional attributes of post copper CMP cleaning process was investigated.
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Zhu, Yong Qiang, Feng Gao, Ping Cao et Zhan Jun Zhang. « A Preliminary Study on the Effect of WEC Cleaner Papermaking Chemical on the Improvement of Paper Physical Strength ». Applied Mechanics and Materials 541-542 (mars 2014) : 18–24. http://dx.doi.org/10.4028/www.scientific.net/amm.541-542.18.

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In this paper, the stiffness and folding endurance of the paper were investigated with three kinds of pulp, such as the mechanical wood pulp, chemical pulp and composite pulp, after using common additives and cleaning additives. The results indicated that the stiffness of the paper can be increased by 20% ~ 30% and folding endurance can improve 20% ~ 60% after using new kind of cleaning additives no matter what kind of filler. New cleaning additives can not only improve the physical properties of paper, but also change "acidic papermaking" of the traditional paper industry into clean neutral papermaking environment. Especially, it is suitable for the production of food card paper.
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41

Sahoo, Bichitra N., Sonil Nanda, Janusz A. Kozinski et Sushanta K. Mitra. « PDMS/camphor soot composite coating : towards a self-healing and a self-cleaning superhydrophobic surface ». RSC Advances 7, no 25 (2017) : 15027–40. http://dx.doi.org/10.1039/c6ra28581c.

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A novel self-cleaning polymer composite with self-healing ability to self-repair after chemical and mechanical damage using readily available materials like polydimethylsiloxane (PDMS) and camphor soot particles is developed.
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42

Mahadik, Sonalee Nitin, et V. Balasubramanian. « A Novel Engraving Planarization Innovation to Rectify Non-Consistency Post Chemical Mechanical Cleaning ». Indian Journal of Public Health Research & ; Development 8, no 3s (2017) : 129. http://dx.doi.org/10.5958/0976-5506.2017.00258.3.

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Strohwald, N. K. H., et E. P. Jacobs. « An Investigation into UF Systems in the Pretreatment of Seawater for RO Desalination ». Water Science and Technology 25, no 10 (1 mai 1992) : 69–78. http://dx.doi.org/10.2166/wst.1992.0238.

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Low-cost tubular and capillary polyethersulphone ultrafiltration modules have been developed and their use in the pretreatment of seawater for reverse osmosis desalination investigated. Mechanical and chemical cleaning regimes were evaluated for the restoration of the productivity of fouled membranes. The cost-effectiveness of using these UF membranes for pretreatment to RO, was found to depend on a combination of membrane configuration, type and frequency of cleaning regime and average productivity.
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Senftleben, Oliver, Hermann Baumgärtner et Ignaz Eisele. « Cleaning of Silicon Surfaces for Nanotechnology ». Materials Science Forum 573-574 (mars 2008) : 77–117. http://dx.doi.org/10.4028/www.scientific.net/msf.573-574.77.

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An overview of various cleaning procedures for silicon surfaces is presented. Because in-situ cleaning becomes more and more important for nanotechnology the paper concentrates on physical and dry chemical techniques. As standard ex-situ wet chemical cleaning has a significant impact on surface quality und thus device properties, its influence on further processes is also considered. Oxygen and carbon are unavoidable contaminations after wet chemical treatment and therefore we discuss their in-situ removal as one of the main goals of modern silicon substrate cleaning. As surface roughness strongly influences the electrical quality of interfaces for epitaxy and dielectric growth, we concentrate on techniques, which meet this requirement. It will be shown that multi-step thermal sequences in combination with simultaneous passivation of the clean surface are necessary in order to avoid recontamination. This can be achieved not only for ultra hich vacuum but also for inert gas atmosphere. In this case the process gases have to be extremely purified and the residual partial pressure of contaminats such as oxygen and carbon has to be negligible. It will be demonstrated that 800°C is an upper limit for thermal treatment of silicon surfaces in the presence of carbon because at this temperature SiC formation in combination with a high mobility of silicon monomers leads to surface roughness. In addition mechanical stress causes dislocations and crystal defects.
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Wirayuni, Kadek Ayu, et Sintha Nugrahini. « JUMLAH KOLONI CANDIDA ALBICANS PADA PLAT RESIN AKRILIK HEAT CURED SETELAH DILAKUKAN PERENDAMAN EKSTRAK DAUN KEMANGI (OCIMUM BASSILICUM LINN) 50% ». Interdental Jurnal Kedokteran Gigi (IJKG) 16, no 2 (10 décembre 2020) : 61–63. http://dx.doi.org/10.46862/interdental.v16i2.1126.

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Accumulation of plaque and food scraps on an acrylic resin base will increase bacterial colonies and C. albicans which will cause denture stomatitis. Maintenance of denture hygiene using mechanical, chemical and combination of two methods. Basil leaf extract contain essential oils which are important in fight against resistant C. albicans biofilms. The purpose of this study was to determine the comparison of C. albicans colonies after cleaning various denture cleaning methods. The method of this study is used an experimental method, the study design is posttest only with control group design. Sample size of heat-cured acrylic resin plate is 40x12x3mm. this study use Kruskall-Wallis test and Mann-Whitney test as data analysis for comparison tests between groups (non-parametric test). The results showed that there were significant differences between the various cleansing methods used in reducing C. albicans colonies. The compotition of flavonoids basil leaf extract is anti-microbial which can prevent the entry of fungi that harm the body.
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46

Heo, Kyuyoung, Brian J. Ree, Kyeung-Keun Choi et Moonhor Ree. « Structural reliability evaluation of low-k nanoporous dielectric interlayers integrated into microelectronic devices ». RSC Advances 5, no 106 (2015) : 87084–89. http://dx.doi.org/10.1039/c5ra16983f.

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Structural reliability assessment on the integration of low-k nanoporous dielectrics into a multilayer structure, involving capping, chemical mechanical polishing, post-cleaning, and thermal annealing processes, was successfully demonstrated in a nondestructive manner.
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Wang, Lin, Yi Shang, Xia Xiao, Bo Mu et Guang Wen Zhang. « Research Progress of the Polyurethane-nTiO2 Self-Cleaning Coating ». Applied Mechanics and Materials 633-634 (septembre 2014) : 261–65. http://dx.doi.org/10.4028/www.scientific.net/amm.633-634.261.

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Self-cleaning coatings are getting tremendous attention from both the academic interest and industrial communities. Among the two kinks of self-cleaning coatings, which are super-hydrophobic and super-hydrophilic coatings, the super-hydrophilic self-cleaning coating comprised of TiO2/doped-TiO2has four unique features when exposed to ultraviolet (UV) light or sunlight, which are self-cleaning property, anti-bacterial properties, environmental friendly, and visible-light photocatalysts and indoor usage. And PU-TiO2self-cleaning coating produced by “grafting” method, which can accomplish stable chemical attachment between the nTiO2and the PU substrates, may potentially show an increase of the thermal properties, an increase of the amount of active sites for photo-catalysis, and a decrease in the self-degradation of the resulting polymer nanocomposite than the traditional mechanical shear method. There is a tremendous scope for the application of polyurethane-nTiO2self-cleaning coatings in industrial, health care and consumer sectors.
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48

Li, Jie, Huichao Jia, Jing Lin, Han Luo, Zhenya Liu, Xuewen Xu, Yang Huang et al. « Free-standing membranes made of activated boron nitride for efficient water cleaning ». RSC Advances 5, no 88 (2015) : 71537–43. http://dx.doi.org/10.1039/c5ra11899a.

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Sundberg, Martin, Anders Christiansson, Cecilia Lindahl, Lotten Wahlund et Carol Birgersson. « Cleaning effectiveness of chlorine-free detergents for use on dairy farms ». Journal of Dairy Research 78, no 1 (7 décembre 2010) : 105–10. http://dx.doi.org/10.1017/s0022029910000762.

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A method for evaluating cleaning effect based on Bacillus cereus spores was developed and tested in a model system designed to resemble actual farm conditions. A test rig with four removable sampling plates was mounted in a milk line. The plates were attached at the end of T-junctions protruding either 1·5 or 3-times the milk pipe diameter from the main loop to reflect different levels of cleaning difficulty. In each cleaning test, B. cereus spores were applied to the four sampling plates to simulate soil. A series of cleaning tests was conducted at 35, 45, 55 and 65°C with six commercial chlorine-free, alkaline detergents; three liquid and three powder-based products. A commercial alkaline detergent with chlorine, a sodium hydroxide solution, a sodium hydroxider/hypochlorite solution and pure water were also tested. Triplicate tests were performed with each cleaning solution, giving a total of 120 cleaning tests. The cleaning effect was evaluated by comparing the number of spores before and after cleaning. At all temperatures, the two chlorine-based cleaning solutions gave significantly greater reductions in B. cereus spores than the chlorine-free products. All six commercial chlorine-free, alkaline detergents generally gave similar cleaning effects, with no differences in the performance of powder-based and liquid forms. The mechanical spore reduction effect with water alone was greater (1·5–1·8 log-units) than the additional chemical effect of sodium hydroxide or chlorine-free detergents (0·5–1·2 log-units). The chlorine-based solutions had a considerably more powerful chemical effect (2–4 log-units depending on temperature). In general, an increase in cleaning solution temperature up to 55°C gave a greater reduction in spores. A further increase to 65°C did not improve cleaning effectiveness.
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Лебедев, Валерий, Valeriy Lebedev, Михаил Тамаркин, Mihail Tamarkin, Марина Бойко et Marina Boiko. « Energy condition of efficient product vibratory cleaning at stage of product preparation to utilization ». Science intensive technologies in mechanical engineering 2018, no 2 (20 février 2019) : 8–15. http://dx.doi.org/10.30987/article_5c486cc3471ce9.56869432.

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One of the main stages of product preparation to the utilization providing for product decontamination is considered. It is shown that the most promising decontamination methods are mechanical-chemical methods for cleaning based on the application of different oscillation ranges of processing environment. There is offered an energy condition of effectiveness which allows carrying out the development and optimization of a vibro-cleaning technological process for specified pollutants and product material and also dependence for the assessment of its duration.
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