Articles de revues : « C-connection »

1

Cheraskin, E. « The Vitamin C Connection ». Diabetic Medicine 12, n^o 8 (août 1995) : 724–25. http://dx.doi.org/10.1111/j.1464-5491.1995.tb00581.x.

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Schumann, Susanne, Kirsten Zeitler, Martin Jäger, Kurt Polborn et Wolfgang Steglich. « Stereocontrolled Backbone Connection of Peptides by C C-Double Bonds ». Tetrahedron 56, n^o 25 (juin 2000) : 4187–95. http://dx.doi.org/10.1016/s0040-4020(00)00343-4.

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Hui, Shyamal Kumar, et Tanumoy Pal. « Totally real submanifolds of (LCS)n-manifolds ». Facta Universitatis, Series : Mathematics and Informatics 33, n^o 2 (7 septembre 2018) : 141. http://dx.doi.org/10.22190/fumi1802141h.

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The present paper deals with the study of totally real submanifolds and C-totally real submanifolds of (LCS)n-manifolds withrespect to Levi-Civita connection as well as quarter symmetric metric connection. It is proved that scalar curvature of C-totally real submanifolds of (LCS)n-manifold with respect to both the said connections are same.

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Miglino, Nicola. « Asthma and COPD - The C/EBP Connection ». Open Respiratory Medicine Journal 6, n^o 1 (20 avril 2012) : 1–13. http://dx.doi.org/10.2174/1874306401206010001.

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Thompson, Mollie E., et André Barkhuizen. « Fibromyalgia, hepatitis C infection, and the cytokine connection ». Current Pain and Headache Reports 7, n^o 5 (octobre 2003) : 342–47. http://dx.doi.org/10.1007/s11916-003-0032-2.

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Singh, Sanjay K., Madathilparambil V. Suresh, Bhavya Voleti et Alok Agrawal. « The connection between C‐reactive protein and atherosclerosis ». Annals of Medicine 40, n^o 2 (janvier 2008) : 110–20. http://dx.doi.org/10.1080/07853890701749225.

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Dillen, Franki, Luc Vrancken et Sahnur Yaprak. « Affine hypersurfaces with parallel cubic form ». Nagoya Mathematical Journal 135 (septembre 1994) : 153–64. http://dx.doi.org/10.1017/s0027763000005006.

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As is well known, there exists a canonical transversal vector field on a non-degenerate affine hypersurface M. This vector field is called the affine normal. The second fundamental form associated to this affine normal is called the affine metric. If M is locally strongly convex, then this affine metric is a Riemannian metric. And also, using the affine normal and the Gauss formula one can introduce an affine connection ∇ on M which is called the induced affine connection. Thus there are in general two different connections on M: one is the induced connection ∇ and the other is the Levi Civita connection of the affine metric h. The difference tensor K is defined by K(X, Y) = KXY — ∇XY — XY. The cubic form C is defined by C = ∇h and is related to the difference tensor by.

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Lee. « Behavior of C-Shaped Beam to Square Hollow Section Column Connection in Modular Frame ». Journal of Korean Society of Steel Construction 27, n^o 5 (2015) : 471. http://dx.doi.org/10.7781/kjoss.2015.27.5.471.

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Richter, Jessica, Anna Steenmann, Benjamin Schellscheidt et Thomas Licht. « On-Chip Diffusion Bonding creates Stable Interconnections Usable at Temperatures over 300°C ». International Symposium on Microelectronics 2019, n^o 1 (1 octobre 2019) : 000530–34. http://dx.doi.org/10.4071/2380-4505-2019.1.000530.

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Abstract In this paper, we present a conceptual design of an on-chip solder stack to connect silicon devices faster and more reliable. Almost all electronic devices rely on solder layers to provide electrical, mechanical, and thermal connections between components. We improve the solder connection with industry-standard solder parameters of 300°C and some minutes of soldering time. An ideal solder connection is composed of intermetallic phases (IMPs) at the interfaces between device and solder, and substrate and solder. Typically, a thin region of Sn-based solder remains between the two IMP layers at the interfaces. IMPs of copper (Cu) and tin (Sn) are Cu6Sn5 and Cu3Sn. The formation of IMPs is decisive for a good mechanical connection because of their high melting point and mechanical stability. To achieve these requirements, we implement the solder stack as a transient liquid phase bonding (TLPB) system. To realize durable interconnections, we use the diffusion of a high-melting first component in a second component, which is liquid at solder process temperature. Ongoing diffusion leads to the formation of IMPs with a melting point above process temperature, resulting in a solidification of the connection at constant temperature. By this isothermal solidification, the solder connection becomes more durable against mechanical and thermal load and is usable at temperatures exceeding 300°C.

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Qiang, Xuhong, Nianduo Wu, Xu Jiang, Frans Bijlaard et Henk Kolstein. « Performance assessment on high strength steel endplate connections after fire ». Journal of Structural Fire Engineering 8, n^o 2 (12 juin 2017) : 202–14. http://dx.doi.org/10.1108/jsfe-11-2016-0018.

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Purpose This study aims to reveal more information and understanding on performance and failure mechanisms of high strength steel endplate connections after fire. Design/methodology/approach An experimental and numerical study on seven endplate connections after cooling down from fire temperature of 550°C has been carried out and reported herein. Moreover, the provisions of European design standard for steel structures, Eurocode 3, were validated with test results of high strength steel endplate connections. Findings In endplate connections, a proper design using a thinner high strength steel endplate can achieve the same failure mode, similar residual load bearing capacity and comparable or even higher rotation capacity after cooling down from fire. It is found that high strength steel endplate connection can regain more than 90 per cent of its original load bearing capacity after cooling down from fire temperature of 550°C. Originality/value The post-fire performance of high strength steel endplate connection has been reported. The accuracy of Eurocode 3 for endplate connections is validated against test results.

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Garrido, Antonio, F. J. Guerrero, J. A. Lepe, S. Palomo et A. Grilo. « Hepatitis C and diabetes mellitus : what is the connection ? » Journal of Hepatology 36 (avril 2002) : 108. http://dx.doi.org/10.1016/s0168-8278(02)80382-8.

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Ghiya, Rakesh, et Laurie J. Hendren. « Connection Analysis : A Practical Interprocedural Heap Analysis for C ». International Journal of Parallel Programming 24, n^o 6 (décembre 1996) : 547–78. http://dx.doi.org/10.1007/bf03356759.

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Yu, Jian Bing, Zheng Xing Guo et Dong Zhi Guan. « Low Reversed Cyclic Loading Test for New Precast Concrete Beam to Column Connection ». Advanced Materials Research 1079-1080 (décembre 2014) : 160–65. http://dx.doi.org/10.4028/www.scientific.net/amr.1079-1080.160.

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On the basis of the domestic and overseas scholars’ research, it is innovative to put forward a new precast frame beam-to-column connection. One full-scale beam-to-column connection in a precast concrete（PC）frame and a beam-to-column connection in a cast-in-place concrete structures were tested under uni-directional cyclic loading that simulated earthquake-type motions. The new-type beam-to-column joint in a precast concrete frame consisted of cast-in-place columns and precast beams. Test results showed that（a）The property and action of precast connections are similar to the cast-in-place connection, it showed that both precast connections and cast-in-place connection have similar seismic performance; (b) The cracking load of precast connection are similar to the cast-in-place connection; (c) All the columns of all specimens did not destroy, it illustrate that it conform to the strong column weak beam. (d) In this experiment test, because the control factor use the bending capacity of beam, it also play the same plastic hinge mechanism as the traditional component. All the longitudinal reinforcement destruction ahead of stirrup in beams, which should be confirmed the guiding ideology of strong shear weak bending. On the basis of the test results, design considerations for the beam-to column connection were recommended.

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Parthasarathy, M. « Evolutionary connection between C-rich AGB stars and C-rich central stars of PNe ». Symposium - International Astronomical Union 191 (1999) : 475–80. http://dx.doi.org/10.1017/s0074180900203434.

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On the basis of C/O ratios the evolutionary connection between C-rich AGB/post-AGB stars and C-rich central stars of PNe is discussed. The proportion of carbon-rich post-AGB stars is comparable to that of carbon-rich PNe. The post-AGB stars with 21μm emission are found to be over abundant in carbon and s-process elements indicating that they have gone through the third dredge-up and carbon star phase on the AGB. As these stars evolve to higher temperature they will form carbon-rich PNe with carbon-rich central stars. Analysis of C/O ratios of PNe suggests that 68 percent of PNe have C/O > 1 indicating that the progenitors have gone through the third dredge-up and carbon-rich phase on the AGB. The Type I PNe can be divided into two groups. Group I Type I PNe are those with C/O < 1 indicating that their massive progenitors have gone through the third dredge-up and hot bottom burning on the AGB. Group II Type I PNe are those with C/O > 1. Their progenitors have gone through third dredge-up only and may not have experienced hot bottom burning. Carbon stars with silicate dust and or carbon-rich post-AGB stars (such as post-AGB stars with 21μm emission) may be the progenitors of PNe with [WC] central stars. The evolutionary sequence seems to be: carbon-rich AGB → carbon-rich post-AGB → [WC late type] → [WC early type] → [WC-PG 1159] → PG 1159.

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YANG, RENHUAN, AIGUO SONG et WUJIE YUAN. « ENHANCEMENT OF SPIKE SYNCHRONY IN HINDMARSH–ROSE NEURAL NETWORKS BY RANDOMLY REWIRING CONNECTIONS ». Modern Physics Letters B 23, n^o 11 (10 mai 2009) : 1405–14. http://dx.doi.org/10.1142/s0217984909019533.

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Spike synchrony of the neural system is thought to have very dichotomous roles. On the one hand, it is ubiquitously present in the healthy brain and is thought to underlie feature binding during information processing. On the other hand, large scale synchronization is an underlying mechanism of epileptic seizures. In this paper, we investigate the spike synchrony of Hindmarsh–Rose (HR) neural networks. Our focus is the influence of the network connections on the spike synchrony of the neural networks. The simulations show that desynchronization in the nearest-neighbor coupled network evolves into accurate synchronization with connection-rewiring probability p increasing. We uncover a phenomenon of enhancement of spike synchrony by randomly rewiring connections. With connection strength c and average connection number m increasing spike synchrony is enhanced but it is not the whole story. Furthermore, the possible mechanism behind such synchronization is also addressed.

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Huang, Teng. « On a topology property for the moduli space of Kapustin–Witten equations ». Forum Mathematicum 31, n^o 5 (1 septembre 2019) : 1119–38. http://dx.doi.org/10.1515/forum-2018-0085.

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AbstractIn this article, we study the Kapustin–Witten equations on a closed, simply connected, four-dimensional manifold which were introduced by Kapustin and Witten. We use Taubes’ compactness theorem [C. H. Taubes, Compactness theorems for {\mathrm{SL}(2;\mathbb{C})} generalizations of the 4-dimensional anti-self dual equations, preprint 2014, https://arxiv.org/abs/1307.6447v4] to prove that if {(A,\phi)} is a smooth solution to the Kapustin–Witten equations and the connection A is closed to a generic ASD connection {A_{\infty}}, then {(A,\phi)} must be a trivial solution. We also prove that the moduli space of the solutions to the Kapustin–Witten equations is non-connected if the connections on the compactification of moduli space of ASD connections are all generic. At last, we extend the results for the Kapustin–Witten equations to other equations on gauge theory such as the Hitchin–Simpson equations and the Vafa–Witten on a compact Kähler surface.

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Cimmino, Maddalena, Gennaro Magliulo et Gaetano Manfredi. « Seismic collapse assessment of new European single-story RC precast buildings with weak connections ». Bulletin of Earthquake Engineering 18, n^o 15 (17 septembre 2020) : 6661–86. http://dx.doi.org/10.1007/s10518-020-00952-7.

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Abstract Capacity design, according to the modern seismic building codes, requires the application of specific rules and construction details in order to prevent brittle failure modes at material, element and structural level. In particular, with reference to single-story precast reinforced concrete structures with columns joined by pinned beams, the Italian seismic building code, following the Eurocode 8 general principles, requires that beam-to-column connection should be designed in order to avoid the connection failure before the formation of the plastic hinge at the column base. However, no specific details are provided in order to reach such a performance. Recent European earthquakes showed that seismic performance of beam-to-column dowel connections can be very poor. Hence, for European typical dowel beam-to-column connections, this study aims to investigate: (a) possible connection configurations obtained according to seismic design; (b) possible failure modes involving connection elements (steel dowel, transversal steel reinforcement, dowel concrete cover); (c) how available formulations are able to describe such failure modes and the related shear strength; (d) influence of connection failure on the global seismic safety at collapse of new designed single-story RC precast buildings. The reference buildings and beam-to-column connections are designed considering different geometrical layouts of the primary structure and different seismic hazard levels, i.e. four sites and two soil types. Structural capacity is estimated considering global, i.e. related to column plastic hinge degradation measured in terms of top lateral displacements, and local, i.e. related to connection shear strength, failure modes. Nonlinear multi-stripe analyses are performed for the seismic assessment.

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Qiang, Xuhong, Xu Jiang, Frans Bijlaard et Henk Kolstein. « Performance assessment on high strength steel endplate connections in fire ». Journal of Structural Fire Engineering 7, n^o 2 (13 juin 2016) : 168–78. http://dx.doi.org/10.1108/jsfe-06-2016-013.

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Purpose This paper aims to investigate and assess a perspective of combining high-strength-steel endplate with mild-steel beam and column in endplate connections. Design/methodology/approach First, experimental tests on high strength steel endplate connections were conducted at fire temperature 550°C and at an ambient temperature for reference. Findings The moment-rotation characteristic, rotation capacity and failure mode of high-strength-steel endplate connections in fire and at an ambient temperature were obtained through tests and compared with those of mild-steel endplate connections. Further, the provisions of Eurocode 3 were validated with test results. Moreover, the numerical study was carried out via ABAQUS and verified against the experimental results. Originality/value It is found that a thinner high-strength-steel endplate can enhance the connection’s rotation capacity both at an ambient temperature and in fire (which guarantees the safety of an entire structure) and simultaneously achieve almost the same moment resistance with a mild steel endplate connection.

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Anderson, E. N. « Sing C. Chew. The Southeast Asian Connection : Trade and Polities ». Journal of World-Systems Research 25, n^o 1 (25 mars 2019) : 206–8. http://dx.doi.org/10.5195/jwsr.2019.851.

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Heuberger, Julian, Undine Hill, Susann Förster, Karin Zimmermann, Victoria Malchin, Anja A. Kühl, Ulrike Stein, Michael Vieth, Walter Birchmeier et Achim Leutz. « A C/EBPα–Wnt connection in gut homeostasis and carcinogenesis ». Life Science Alliance 2, n^o 1 (26 décembre 2018) : e201800173. http://dx.doi.org/10.26508/lsa.201800173.

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We explored the connection between C/EBPα (CCAAT/enhancer-binding protein α) and Wnt signaling in gut homeostasis and carcinogenesis. C/EBPα was expressed in human and murine intestinal epithelia in the transit-amplifying region of the crypts and was absent in intestinal stem cells and Paneth cells with activated Wnt signaling. In human colorectal cancer and murine APCMin/+polyps, C/EBPα was absent in the nuclear β-catenin–positive tumor cells. In chemically induced intestinal carcinogenesis, C/EBPα KO in murine gut epithelia increased tumor volume. C/EBPα deletion extended the S-phase cell zone in intestinal organoids and activated typical proliferation gene expression signatures, including that of Wnt target genes. Genetic activation of β-catenin in organoids attenuated C/EBPα expression, and ectopic C/EBPα expression in HCT116 cells abrogated proliferation. C/EBPα expression accompanied differentiation of the colon cancer cell line Caco-2, whereas β-catenin stabilization suppressed C/EBPα. These data suggest homeostatic and oncogenic suppressor functions of C/EBPα in the gut by restricting Wnt signaling.

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Alvisi, Gualtiero, Vanesa Madan et Ralf Bartenschlager. « Hepatitis c virus and host cell lipids : An intimate connection ». RNA Biology 8, n^o 2 (mars 2011) : 258–69. http://dx.doi.org/10.4161/rna.8.2.15011.

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Denker, C., et K. G. Strassmeier. « Solar Physics and the Solar-Stellar Connection at Dome C ». EAS Publications Series 33 (2008) : 97–104. http://dx.doi.org/10.1051/eas:0833014.

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Firdaus, Muhammad, Anis Saggaff, Mahmood Md Tahir, Shek Poi Ngian, Tan Cher Siang, K. M. Aminuddin et Musab Nimir Ali Salih. « Experimental study on composite connection with double lipped C- Sections ». IOP Conference Series : Materials Science and Engineering 849 (30 mai 2020) : 012067. http://dx.doi.org/10.1088/1757-899x/849/1/012067.

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., Nessa. « BILANGAN RAINBOW CONNECTION UNTUK GRAF KUBIK C n;2n;n ». Jurnal Matematika UNAND 7, n^o 1 (14 février 2018) : 115. http://dx.doi.org/10.25077/jmu.7.1.115-124.2018.

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Abstrak. Misalkan G = (V (G); E(G)) adalah suatu graf terhubung tak trivial. Suatu pewarnaanterhadap sisi-sisi di G adalah suatu pemetaan c : E(G) ! f1; 2; ; kg; k 2 N.Lintasan u v path P di G dinamakan rainbow path jika tidak terdapat dua sisi diP yang berwarna sama. Graf G disebut rainbow connected jika setiap dua titik yangberbeda di G dihubungkan oleh rainbow path. Bilangan rainbow connection dari grafterhubung G, ditulis rc(G), didenisikan sebagai banyaknya warna minimal yang diperlukanuntuk membuat graf G bersifat rainbow connected. Suatu Graf Kubik Cmerupakan graf kubik terhubung yang terbentuk dari tiga lingkaran dengan banyak titikpada lingkaran pertama sama dengan lingkaran ketiga yaitu sebanyak n dan banyak titikpada lingkaran kedua sebanyak 2n dengan himpunan sisi Emerupakan himpunan sisiyang menghubungkan lingkaran ke-i dengan lingkaran ke- i + 1. Pada paper ini ditunjukkanbahwa rc(C5;10;5) = 7 dan rc(C6;12;6) = 8.Kata Kunci: Graf kubik, graf lingkaran, bilangan rainbow connectionin;2n;n

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Bissaldi, E., F. Calura, F. Matteucci, F. Longo et G. Barbiellini. « The connection between gamma-ray bursts and supernovae Ib/c ». Astronomy & ; Astrophysics 471, n^o 2 (16 mai 2007) : 585–97. http://dx.doi.org/10.1051/0004-6361:20066750.

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Yen, T. S. Benedict. « Nuclear factor ?B and hepatitis C?is there a connection ? » Hepatology 31, n^o 3 (mars 2000) : 785–87. http://dx.doi.org/10.1002/hep.510310334.

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CONSTANTINESCU, OANA, et MIRCEA CRASMAREANU. « SUB-WEYL GEOMETRY AND ITS LINEAR CONNECTIONS ». International Journal of Geometric Methods in Modern Physics 09, n^o 05 (3 juillet 2012) : 1250047. http://dx.doi.org/10.1142/s0219887812500478.

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The aim of this paper is to study from the point of view of linear connections the data [Formula: see text] with M a smooth (n+p)-dimensional real manifold, [Formula: see text] an n-dimensional manifold semi-Riemannian distribution on M, [Formula: see text] the conformal structure generated by g and W a Weyl substructure: a map [Formula: see text] such that W(ḡ) = W(g) - du, ḡ = eug;u ∈ C∞(M). Compatible linear connections are introduced as a natural extension of similar notions from Weyl geometry and such a connection is unique if a symmetry condition is imposed. In the foliated case the local expression of this unique connection is obtained. The notion of Vranceanu connection is introduced for a pair (Weyl structure, distribution) and it is computed for the tangent bundle of Finsler spaces, particularly Riemannian, choosing as distribution the vertical bundle of tangent bundle projection and as one-form the Cartan form.

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Myśliwiec, Marcin, Ryszard Kisiel et Marek Guziewicz. « Material and technological aspects of high-temperature SiC device packages reliability ». Microelectronics International 32, n^o 3 (3 août 2015) : 143–48. http://dx.doi.org/10.1108/mi-01-2015-0009.

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Purpose – The purpose of this paper is to deal with material and technological aspects of SiC diodes assembly in ceramic packages. The usefulness of combinations of different materials and assembly techniques for the creation of inner connection system in the ceramic package, as well as the formation of outer connections able to work at temperatures up to 350°C, were evaluated. Design/methodology/approach – The ceramic package consists of direct bonded copper (DBC) substrate with Cu pads electroplated by Ni or Ni/Au layers on which a SiC diode was assembled by sintering process using Ag microparticles. For the connections inside the ceramic package, the authors used Al/Ni and Au-Au material system based on aluminium or gold wire bonding. The authors sealed the ceramic package with glass encapsulation and achieved a full encapsulation. Outer connections were manufactured using Cu ribbon plated with Ag layer and sintered to DBC by Ag micro particle. The authors investigated the long-term stability of electrical parameters of SiC diodes assembled in ceramic package at temperature 350°C. Findings – The authors have shown that Schottky and PiN SiC diodes assembled with different technologies and materials in ceramic package keep their I-V characteristics unchanged during ageing at 350°C for 400 h. Originality/value – The SiC diodes assembled into ceramic package with Al/Ni or Au-Au inner electrical connection systems and outer connections system based on Ag microparticles sintering process of Cu/Ag ribbon to DBC substrate can work reliably in temperature range up to 350°C.

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Kurek, Jan, Włodzimierz Mikulski et Mariusz Plaszczyk. « How many are projectable classical linear connections with a prescribed Ricci tensor ». Filomat 35, n^o 10 (2021) : 3279–85. http://dx.doi.org/10.2298/fil2110279k.

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How many are projectable classical linear connections with a prescribed Ricci tensor and a prescribed trace of torsion tensor on the total space of a fibered manifold? The questions are answered in the analytic case by using the Cauchy-Kowalevski theorem. In the C? case, we answer how many are classical linear connections with a prescribed Ricci tensor on a 2-dimensional manifold. In the C? case, we also deduce that any 2-form on the total space of a fibered manifold with at least 2-dimensional fibres can be realized locally as the Ricci tensor of a projectable classical linear connection.

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RIEZSA DESSYLUVIANI, SUCI. « PENENTUAN RAINBOW CONNECTION NUMBER DAN STRONG RAINBOW CONNECTION NUMBER PADA GRAF BERLIAN ». Jurnal Matematika UNAND 6, n^o 3 (3 novembre 2017) : 93. http://dx.doi.org/10.25077/jmu.6.3.93-99.2017.

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Misalkan G = (V, E) adalah suatu graf. Suatu pewarnaan c : E(G) → {1, 2, · · · , k}, k ∈ N pada graf G adalah suatu pewarnaan sisi di G sedemikian sehingga setiap sisi bertetangga boleh berwarna sama. Misalkan u, v ∈ V (G) dan P adalah suatu lintasan dari u ke v. Suatu intasan P dikatakan rainbow path jika tidak terdapat dua sisi di P berwarna sama. Graf G disebut rainbow connected dengan pewarnaan c jika untuk setiap u, v ∈ V (G) terdapat rainbow path dari u ke v. Jika terdapat k warna di G maka c adalah rainbow k-coloring. Rainbow connection number dari graf terhubung dinotasikan dengan rc(G), didefinisikan sebagai banyaknya warna minimal yang diperlukan untuk membuat graf G bersifat rainbow connected. Selanjutnya, pewarnaan c dikatakan pewarnaan-k strong rainbow, jika untuk setiap titik u dan v di V terdapat lintasan pelangi dengan panjangnya sama dengan jarak u dan v. Dalam makalah ini akan ditentukan rainbow connection number dan Strong Rainbow Connection Number pada graf Berlian dengan 2n titik. Graf Berlian, dinotasikan dengan Brn, adalah graf yang diperoleh dari graf tangga segitiga dengan 2n − 1 titik, dengan menambahkan satu titik dan beberapa sisi tertentu. Dalam makalah ini akan ditentukan rc(Brn) dan src(Brn) untuk n ≥ 4. Kata Kunci: Rainbow connection number, Strong rainbow connection number, Graf Berlian, Lintasan, Pewarnaan Rainbow

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Ng, Adeline Ling Ying, et Zhi Yong Law. « Experimental Study of Cold-Formed Steel Moment Connections with Screw Fasteners ». Materials Science Forum 950 (avril 2019) : 85–89. http://dx.doi.org/10.4028/www.scientific.net/msf.950.85.

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A series of connection with screw fasteners were tested to study the behavior of cold-formed steel moment connection. The test specimens included hot-rolled parallel flange channels, cold-formed lipped C-Channels, and self-drilling self-fastening screws. Two different lipped C-Channels and a various number of screws per connection were used in this study. The moment-rotation behavior, rotational rigidity, and the connection capacity differed with the number of screws. The connection behaved as a pinned connection when 4 screws were used. However, local buckling was observed in the cold-formed steel sections near the connection when 8, 10 and 14 screws were used. The connection test results were compared with theoretical results calculated in accordance to the Australian Standards. None of the connection tested could achieve the moment capacity of the section connected.

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Edwards, John Richard, George Hammersley et Edmund Newell. « COST ACCOUNTING AT KESWICK, ENGLAND, c. 1598–1615 : THE GERMAN CONNECTION ». Accounting Historians Journal 17, n^o 1 (1 juin 1990) : 61–80. http://dx.doi.org/10.2308/0148-4184.17.1.61.

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The growing literature on the history of cost and management accounting has left virtually unexplored the developments prior to the British industrial revolution. Recently the business notebooks of Daniel Hechstetter, the German manager of an English copper works from 1597 to 1633, have been transcribed and published, making available what is probably the most detailed set of business records for a British-based industrial enterprise in this period. This paper examines Hechstetter's background and role at Keswick, and translates a sample of the calculations into modern English. These calculations show that a number of modern cost accounting concepts and procedures were in use by c. 1600. The significance of this in relation to our understanding of the development of cost and management accounting is assessed, and it is shown that there is a strong case for claiming that German enterpreneurs involved in this enterprise were responsible for introducing a range of cost accounting techniques to Britain.

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Drozdovskaya, Maria Nikolayevna, Ewine F. van Dishoeck, Martin Rubin, Jes Kristian Jørgensen et Kathrin Altwegg. « The chemical connection between 67P/C-G and IRAS 16293-2422 ». Proceedings of the International Astronomical Union 13, S332 (mars 2017) : 196–201. http://dx.doi.org/10.1017/s1743921317009917.

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AbstractThe chemical evolution of a star- and planet-forming system begins in the prestellar phase and proceeds across the subsequent evolutionary phases. The chemical trail from cores to protoplanetary disks to planetary embryos can be studied by comparing distant young protostars and comets in our Solar System. One particularly chemically rich system that is thought to be analogous to our own is the low-mass IRAS 16293-2422. ALMA-PILS observations have made the study of chemistry on the disk scales (<100 AU) of this system possible. Under the assumption that comets are pristine tracers of the outer parts of the innate protosolar disk, it is possible to compare the composition of our infant Solar System to that of IRAS 16293-2422. The Rosetta mission has yielded a wealth of unique in situ measurements on comet 67P/C-G, making it the best probe to date. Herein, the initial comparisons in terms of the chemical composition and isotopic ratios are summarized. Much work is still to be carried out in the future as the analysis of both of these data sets is still ongoing.

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MOSS, MAURICE O. « Penicillium claviforme - an impressive mould with an M. C. Cooke connection ». Mycologist 18, n^o 4 (novembre 2004) : 143–44. http://dx.doi.org/10.1017/s0269915x04004124.

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Segade, Fernando. « Glucose transporter 10 and arterial tortuosity syndrome : The vitamin C connection ». FEBS Letters 584, n^o 14 (12 juin 2010) : 2990–94. http://dx.doi.org/10.1016/j.febslet.2010.06.011.

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Barger, V., Kingman Cheung et Paul Langacker. « Baryonic Z′ connection of LEP Rb,c data with Tevatron events ». Physics Letters B 381, n^o 1-3 (juillet 1996) : 226–36. http://dx.doi.org/10.1016/0370-2693(96)00554-0.

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Gong, Yanglin, et Antony Gillies. « Double-angle shear connections with short outstanding legs ». Canadian Journal of Civil Engineering 35, n^o 8 (août 2008) : 786–95. http://dx.doi.org/10.1139/l08-022.

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This paper describes an experimental study on double-angle shear connections with a narrow outstanding leg width from 31 to 37 mm. When connection angles are welded to a supporting column with a face width less than 152 mm, a common practice is either to weld the angles to the column by flare bevel groove welds or shorten the outstanding legs to accommodate fillet welds. This practice reduces the rotational capacity of the connections; and therefore confirmation of this practice is required. Three groups, comprising 12 full-scale connection specimens, were tested. Each group consisted of four specimens having three, four, five, and six bolts, respectively. Group A used 9.5 mm thick angles and fillet welds, group B used 6.4 mm thick angles and fillet welds, and group C used 9.5 mm thick angles and flare bevel groove welds. The test results demonstrated that both rotational and shear capacities of the connections are satisfactory when either of the two details are used.

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Nicolas-Silvente, Ana I., Eugenio Velasco-Ortega, Ivan Ortiz-Garcia, Alvaro Jimenez-Guerra, Loreto Monsalve-Guil, Raul Ayuso-Montero, Javier Gil et Jose Lopez-Lopez. « Influence of Connection Type and Platform Diameter on Titanium Dental Implants Fatigue : Non-Axial Loading Cyclic Test Analysis ». International Journal of Environmental Research and Public Health 17, n^o 23 (2 décembre 2020) : 8988. http://dx.doi.org/10.3390/ijerph17238988.

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Two-pieces dental implants must provide stability of the implant-abutment-interface. The connection type and platform diameter could influence the biomechanical resistance and stress distribution. This study aims to evaluate the fatigue for different types of connections, external and internal, and different platform diameters. Three implant designs with the same length were used: (a) external hexagon/narrow platform; (b) internal double hexagon/narrow platform; (c) internal octagon/regular platform. A fatigue test was developed to establish the number of cycles needed before fracture. A 30º oblique load with a sinusoidal function of fatigue at a frequency of 15 Hz and 10% stress variation was applied to each system. The fatigue load limit (FLL) for design (a) was 190 N, being the nominal-curvature-moment (NCM) = 1.045; FLL = 150 N, with a NCM = 0.825 for (b), and FLL = 325 N, with a NCM = 1.788 for (c). The platform diameter affects the FLL, obtaining lower FLL on a narrow platform. The connection type interferes with the implant walls’ width, especially in narrow implants, making internal connections more unstable at this level. Long-term clinical studies to assess the restoration’s success rate and survival are mandatory.

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Zhang, Ying, Zhanghua Lian, Mi Zhou et Tiejun Lin. « Viscoelastic behavior of a casing material and its utilization in premium connections in high-temperature gas wells ». Advances in Mechanical Engineering 10, n^o 12 (décembre 2018) : 168781401881745. http://dx.doi.org/10.1177/1687814018817452.

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At the high or extra-high temperatures in a natural gas oilfield, where the premium connection is employed by casing, gas leakage in the wellbore is always detected after several years of gas production. As the viscoelastic material’s mechanical properties change with time and temperature, the relaxation of the contact pressure on the connection sealing surface is the main reason for the gas leakage in the high-temperature gas well. In this article, tension-creep experiments were conducted. Furthermore, a constitutive model of the casing material was established by the Prony series method. Moreover, the Prony series’ shift factor was calculated to study the thermo-rheological behavior of the casing material ranging from 120°C to 300°C. A linear viscoelastic model was implemented in ABAQUS, and the simulation results are compared to our experimental data to validate the methodology. Finally, the viscoelastic finite element model is applied to predict the relaxation of contact pressure on the premium connections’ sealing surface versus time under different temperatures. And, the ratio of the design contact pressure and the intending gas sealing pressure is recommended for avoiding the premium connections failure in the high-temperature gas well.

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Riches, S. T., C. Johnston et A. Lui. « Effectiveness of Barrier Layer Metallisations in Long Term High Temperature Endurance Tests on Wire Bond Interconnections ». Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, HITEN (1 janvier 2013) : 000229–36. http://dx.doi.org/10.4071/hiten-wa14.

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Silicon on Insulator (SOI) device technology has been shown to be capable of functioning satisfactorily at operating temperatures of >200°C, with device lifetimes of 5 years at 225°C being declared. One of the key areas governing the lifetime of the packaged electronic devices is the reliability of the wire bond interconnection between the device and the package or substrate connection. Extended temperature storage testing at 250°C of packaged SOI devices has highlighted end of life failure modes associated with wire bond connections. SOI devices are normally supplied with an aluminium based bond pad metallisation, which are not suitable for direct connection of Au wire at operating temperatures of >125°C, due to the formation of Au-Al intermetallics. It is possible to post-process silicon wafers to deposit barrier and connection materials to create a mono-metallic Au-Au joint at the surface. For long term endurance at temperatures >200°C, the effectiveness of the barrier layer in preventing diffusion of the aluminium bond pad metallisation to interact with the Au is a critical factor. This paper presents results of studies carried out on two post-process metallisation systems Au/TiW and Au/Pd/Ni deposited onto aluminium bond pads, which have been Au wire bonded and exposed to 250°C temperature storage for up to 13,000 hours. The results have shown that the barrier layers are not effective in preventing diffusion of the aluminium bond pad metallisation to create Au-Al based intermetallics. The results are compared with Al-1%Si wire bonding to the aluminium bond pad, where the 2nd wedge bond is attached to a Au/Ni plated metallisation, where the degradation appears to be less severe. Recommendations for designing stable wire bond interconnection systems for extended high temperature operation will be presented.

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Riches, S. T., C. Johnston et A. Lui. « Effectiveness of Barrier Layer Metallizations in Long Term High Temperature Endurance Tests on Wire Bond Interconnections ». Journal of Microelectronics and Electronic Packaging 10, n^o 4 (1 octobre 2013) : 163–70. http://dx.doi.org/10.4071/imaps.392.

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Silicon on insulator (SOI) device technology has been shown to be capable of functioning satisfactorily at operating temperatures of >200°C, with device lifetimes of 5 y at 225°C being declared. One of the key areas governing the lifetime of the packaged electronic devices is the reliability of the wire bond interconnection between the device and the package or substrate connection. Extended temperature storage testing at 250°C of packaged SOI devices has highlighted end of life failure modes associated with wire bond connections. SOI devices are normally supplied with an aluminum based bond pad metallization, which are not suitable for direct connection of Au wire at operating temperatures of >125°C, due to the formation of Au-Al intermetallics. It is possible to postprocess silicon wafers to deposit barrier and connection materials to create a monometallic Au-Au joint at the surface. For long term endurance at temperatures >200°C, the effectiveness of the barrier layer in preventing diffusion of the aluminum bond pad metallization to interact with the Au is a critical factor. This paper presents results of studies carried out on two postprocess metallization systems Au/TiW and Au/Pd/Ni deposited onto aluminum bond pads, which have been Au wire bonded and exposed to 250°C temperature storage for up to 13,000 h. The results have shown that the barrier layers are not effective in preventing diffusion of the aluminum bond pad metallization to create Au-Al based intermetallics. The results are compared with Al-1%Si wire bonding to the aluminum bond pad, where the second wedge bond is attached to a Au/Ni plated metallization, where the degradation appears to be less severe. Recommendations for designing stable wire bond interconnection systems for extended high temperature operation will be presented.

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Xie, Jin, Hongming Jin et A. Stephen K. Hashmi. « The recent achievements of redox-neutral radical C–C cross-coupling enabled by visible-light ». Chemical Society Reviews 46, n^o 17 (2017) : 5193–203. http://dx.doi.org/10.1039/c7cs00339k.

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Visible-light-driven redox-neutral radical C–C coupling brings a powerful platform to achieve non-classical C–C connection in the absence of external reductants or oxidants through a photoredox electron shuttling cycle.

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Du, Aijun, Ying Chen, Zhonghua Zhu, Gaoqing Lu et Sean C. Smith. « C-BN Single-Walled Nanotubes from Hybrid Connection of BN/C Nanoribbons : Prediction byab initioDensity Functional Calculations ». Journal of the American Chemical Society 131, n^o 5 (11 février 2009) : 1682–83. http://dx.doi.org/10.1021/ja809053x.

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Finck, Seidel, Hausmann et Rief. « Creep-Induced Screw Preload Loss of Carbon-Fiber Sheet Molding Compound at Elevated Temperature ». Materials 12, n^o 21 (1 novembre 2019) : 3598. http://dx.doi.org/10.3390/ma12213598.

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The application of chopped-fiber reinforced polymers in screwed connections at high temperatures raises the question of creep under long-term loading. While up to now thermoplastic materials have mainly been the focus of attention when it comes to creep, this paper shows that thermoset carbon-fiber SMCs (sheet mold compounds) can also be affected by this phenomenon. Screwed connections were investigated regarding their loss of preload force at 120 °C ambient temperature. Additionally, strain–time diagrams were recorded at different stress levels at 120 °C in a creep test setup of a universal testing machine by using optical strain tracking of SMC coupons. The transverse modulus under compression in thickness direction was determined in the same test setup. For data application within a FEA (finite element analysis) software power law curves according to Norton–Bailey creep law were fitted in the strain–time graphs. The applicability of the obtained creep law was crosschecked with a test carried out on the loss of preload force of a screwed connection. The developed simulative methodology offers the possibility to simulate various mounting situations of the bolted connection and to investigate measures against the loss of preload force easily. A promising possibility to limit the loss of preload force due to creep was simulatively evaluated.

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Sulaievа, O. M., S. V. Goncharov, O. S. Larin, N. I. Digtiar et N. D. Gerasymenko. « Connection between Il-6 -174g> ; C Polymorphism and Type II Diabetes ». Ukraïnsʹkij žurnal medicini, bìologìï ta sportu 2, n^o 5 (10 octobre 2017) : 108–11. http://dx.doi.org/10.26693/jmbs02.05.108.

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Komisarski, Andrzej. « A connection between multiplication in C(X) and the dimension of X ». Fundamenta Mathematicae 189, n^o 2 (2006) : 149–54. http://dx.doi.org/10.4064/fm189-2-4.

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Rubinstenn, Gilles, Jacques Esnault, Jean-Maurice Mallet et Pierre Sinaÿ. « Radical mediated synthesis of containing C-disaccharides via a temporary phosphoramidic connection ». Tetrahedron : Asymmetry 8, n^o 8 (avril 1997) : 1327–36. http://dx.doi.org/10.1016/s0957-4166(97)00141-9.

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Monard, François, et Gabriel P. Paternain. « The Geodesic X-ray Transform with a $$GL(n,\mathbb {C})$$-Connection ». Journal of Geometric Analysis 30, n^o 3 (12 octobre 2017) : 2515–57. http://dx.doi.org/10.1007/s12220-017-9931-z.

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Mehta, Neil K., et Kamal D. Mehta. « Protein kinase C-beta : An emerging connection between nutrient excess and obesity ». Biochimica et Biophysica Acta (BBA) - Molecular and Cell Biology of Lipids 1841, n^o 10 (octobre 2014) : 1491–97. http://dx.doi.org/10.1016/j.bbalip.2014.07.011.

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Panda, Suman, Nilanjan Banerjee et Subhrangsu Chatterjee. « Solute carrier proteins and c-Myc : a strong connection in cancer progression ». Drug Discovery Today 25, n^o 5 (mai 2020) : 891–900. http://dx.doi.org/10.1016/j.drudis.2020.02.007.

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