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Livres sur le sujet « Bonding wire »

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Auteur : Grafiati

Publié le 14 mars 2023

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1

Chauhan, Preeti S., Anupam Choubey, ZhaoWei Zhong et Michael G. Pecht. Copper Wire Bonding. New York, NY : Springer New York, 2014. http://dx.doi.org/10.1007/978-1-4614-5761-9.

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2

Harman, George G. Wire bonding in microelectronics : Materials, processes, reliability, and yield. 2^e éd. New York : McGraw-Hill, 1997.

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3

Schwizer, Jürg. Force sensors for microelectronic packaging applications. Berlin : Springer, 2004.

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4

Prasad, Shankara K. Advanced wirebond interconnection technology. Boston : Kluwer Academic Publishers, 2004.

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5

Hager, Christian. Lifetime estimation of aluminum wire bonds based on computational plasticity. Konstanz : Hartung-Gorre, 2000.

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6

International Society for Hybrid Microelectronics., dir. Reliability and yield problems of wire bonding in microelectronics : The application of materials and interface science. Reston, Va : International Society for Hybrid Microelectronics, 1989.

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7

M, Mayer, et Brand Oliver 1964-, dir. Force sensors for microelectronic packaging applications. Berlin : Springer, 2005.

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8

Center for Women's Resources (Philippines) et International Consultation on Micro-Chips Technology (1986 Manila, Philippines). From bonding wires to banding women : Proceedings of the International Consultation on Micro-Chips Technology, Manila, Philippines, 1986. Quezon City : Center for Women's Resources, 1988.

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9

Copper Wire Bonding. Springer-Verlag New York Inc., 2013.

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10

Pecht, Michael G., ZhaoWei Zhong, Preeti S. Chauhan et Anupam Choubey. Copper Wire Bonding. Springer London, Limited, 2013.

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11

Copper Wire Bonding. Springer New York, 2016.

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12

Wire Bonding In Microelectronics. McGraw-Hill Professional Publishing, 2010.

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13

Gallaugher, Matthew. Surface characterization of gold bonding wire for high density interconnect applications. 2007.

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14

The 2006-2011 World Outlook for Saws and Scribing-Fracturing, Die Bonding, and Wire Bonding Semiconductor Assembly Dicing Machines. Icon Group International, Inc., 2005.

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15

Parker, Philip M. The 2007-2012 World Outlook for Saws and Scribing-Fracturing, Die Bonding, and Wire Bonding Semiconductor Assembly Dicing Machines. ICON Group International, Inc., 2006.

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16

Prasad, Shankara K. Advanced Wirebond Interconnection Technology. Springer, 2004.

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17

sr, swamy. Strong Bonding of Wife and Husband : S-Formula India. Independently Published, 2017.

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18

From bonding wires to banding women : Proceedings of the International Consultation on Micro-Chips Technology, Manila, Philippines, 1986. Center for Women's Resources, 1988.

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19

Tossell, John A., et David J. Vaughan. Theoretical Geochemistry. Oxford University Press, 1992. http://dx.doi.org/10.1093/oso/9780195044034.001.0001.

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This work is based on the observation that further major advances in geochemistry, particularly in understanding the rules that govern the ways in which elements come together to form minerals and rocks, will require the application of the theories of quantum mechanics. The book therefore outlines this theoretical background and discusses the models used to describe bonding in geochemical systems. It is the first book to describe and critically review the application of quantum mechanical theories to minerals and geochemical systems. The book consolidates valuable findings from chemistry and materials science as well as mineralogy and geochemistry, and the presentation has relevance to professionals in a wide range of disciplines. Experimental techniques are surveyed, but the emphasis is on applying theoretical tools to various groups of minerals: the oxides, silicates, carbonates, borates, and sulfides. Other topics dealt with in depth include structure, stereochemistry, bond strengths and stabilities of minerals, various physical properties, and the overall geochemical distribution of the elements.

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20

Krishnan, Kannan M. Principles of Materials Characterization and Metrology. Oxford University Press, 2021. http://dx.doi.org/10.1093/oso/9780198830252.001.0001.

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Characterization enables a microscopic understanding of the fundamental properties of materials (Science) to predict their macroscopic behavior (Engineering). With this focus, the book presents a comprehensive discussion of the principles of materials characterization and metrology. Characterization techniques are introduced through elementary concepts of bonding, electronic structure of molecules and solids, and the arrangement of atoms in crystals. Then, the range of electrons, photons, ions, neutrons and scanning probes, used in characterization, including their generation and related beam-solid interactions that determine or limit their use, are presented. This is followed by ion-scattering methods, optics, optical diffraction, microscopy, and ellipsometry. Generalization of Fraunhofer diffraction to scattering by a three-dimensional arrangement of atoms in crystals, leads to X-ray, electron, and neutron diffraction methods, both from surfaces and the bulk. Discussion of transmission and analytical electron microscopy, including recent developments, is followed by chapters on scanning electron microscopy and scanning probe microscopies. It concludes with elaborate tables to provide a convenient and easily accessible way of summarizing the key points, features, and inter-relatedness of the different spectroscopy, diffraction, and imaging techniques presented throughout. The book uniquely combines a discussion of the physical principles and practical application of these characterization techniques to explain and illustrate the fundamental properties of a wide range of materials in a tool-based approach. Based on forty years of teaching and research, and including worked examples, test your knowledge questions, and exercises, the target readership of the book is wide, for it is expected to appeal to the teaching of undergraduate and graduate students, and to post-docs, in multiple disciplines of science, engineering, biology and art conservation, and to professionals in industry.

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