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Littérature scientifique sur le sujet « Ansys Q3D »

Auteur : Grafiati

Publié le 9 mars 2023

Mis à jour le 10 mars 2023

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Articles de revues sur le sujet "Ansys Q3D"

Gao, Yin Han, Jun Dong Zhang, Tian Hao Wang, Kai Yu Yang, Zhan Yang An et Yang Liu. « Extracting Parameter Matrix of Automotive Cable Harness ». Applied Mechanics and Materials 556-562 (mai 2014) : 1255–58. http://dx.doi.org/10.4028/www.scientific.net/amm.556-562.1255.

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Convert Inhomogeneous media space into infinite homogeneous medium space with method of image charges, obtain the relations between Inhomogeneous media wire bound charge and free charge rely on electromagnetic theory and deduced analytical the model of parasitic capacitance per unit length of Inhomogeneous dielectric wire in insulation in automotive cable harness. Taking a car harness for example, analytical formulas and Ansys Q3D Extractor software were used to calculation and analysis harness unit length parameter matrix. Among them, the algorithm of Ansys Q3D Extractor software to calculate the parasitic of automotive cable harness is two-dimensional static finite element method, numerical methods belong.

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Xucai, Shao, Zhao Jinghong, Chen Hansi, Zhou Yinping et Mao Yinhao. « Predictive Model for Conducting Electromagnetic Interference by Bidirectional Excitation Controller ». E3S Web of Conferences 256 (2021) : 01006. http://dx.doi.org/10.1051/e3sconf/202125601006.

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Bidirectional excitation controller is used in the excitation system of brushed DC motor. There are many monitoring sensors and weak current switches nearby. Therefore, it is necessary to study the conduction interference of the excitation controller. Firstly, based on the working principle of bidirectional excitation controller, the propagation path model and corresponding equivalent circuit of bidirectional excitation controller are established. Then, the parasitic capacitance parameters between the switch tube and the heat sink were extracted by ANSYS Q3D software, and the dynamic model of IGBT was established by using ANSYS Simplorer software. Based on ANSYS software, the prediction model of the equipment conducted electromagnetic interference was obtained. Finally an excitation controller conducting interference test platform was built, and the predicted results were compared with the measured interference results of the experimental platform to verify the accuracy of the prediction model.

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Wang, Yifan, Jinlong Gong, Qihua Song, Li luo, Bin Zhang et Qing Guo. « Design of Low Parasitic Inductance SiC MOSFETs Halfbridge Power Modules ». Journal of Physics : Conference Series 2224, n^o 1 (1 avril 2022) : 012120. http://dx.doi.org/10.1088/1742-6596/2224/1/012120.

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Abstract The working mechanism of a half-bridge SiC MOSFETs two chips parallel module is studied. Its parasitic inductance of the power module is simulated by using the Ansoft Q3D Extractor software, and its heat transfer mechanism is simulated using the finite element software ANSYS software. Aiming at reducing the parasitic inductance, a new topology of power chips inside the module is designed, which places the chips that are in the same working circuit loop in close vicinity to reduce the whole circuit length and area. Meanwhile, the thermal characteristics are also analyzed. Considering the factors of parasitic inductance and heat dissipation, the optimal module design scheme is finally determined.

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Makki, Loreine, Marc Anthony Mannah, Christophe Batard, Nicolas Ginot et Julien Weckbrodt. « Investigating the Shielding Effect of Pulse Transformer Operation in Isolated Gate Drivers for SiC MOSFETs ». Energies 14, n^o 13 (27 juin 2021) : 3866. http://dx.doi.org/10.3390/en14133866.

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Wide-bandgap technology evolution compels the advancement of efficient pulse-width gate-driver devices. Integrated enhanced gate-driver planar transformers are a source of electromagnetic disturbances due to inter-winding capacitances, which serve as a route to common-mode(CM) currents. This paper will simulate, via ANSYS Q3D Extractor, the unforeseen parasitic effects of a pulse planar transformer integrated in a SiC MOSFET gate-driver card. Moreover, the pulse transformer will be ameliorated by adding distinctive shielding layers aiming to suppress CM noise effects and endure high dv/dt occurrences intending to validate experimental tests. The correlation between stray capacitance and dv/dt immunity results after shielding insertion will be reported.

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Kovacevic-Badstuebner, Ivana, Daniele Romano, Giulio Antonini, Jonas Ekman et Ulrike Grossner. « Broadband Circuit-Oriented Electromagnetic Modeling for Power Electronics : 3-D PEEC Solver vs. RLCG-Solver ». Energies 14, n^o 10 (14 mai 2021) : 2835. http://dx.doi.org/10.3390/en14102835.

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Broadband electromagnetic (EM) modeling increases in importance for virtual prototyping of advanced power electronics systems (PES), enabling a more accurate prediction of fast switching converter operation and its impact on energy conversion efficiency and EM interference. With the aim to predict and reduce an adverse impact of parasitics on the dynamic performance of fast switching power semiconductor devices, the circuit-oriented EM modeling based on the extraction of equivalent lumped R-L-C-G circuits is frequently selected over the Finite Element Method (FEM)-based EM modeling, mainly due to its lower computational complexity. With requirements for more accurate virtual prototyping of fast-switching PES, the modeling accuracy of the equivalent-RLCG-circuit-based EM modeling has to be re-evaluated. In the literature, the equivalent-RLCG-circuit-based EM techniques are frequently misinterpreted as the quasi-static (QS) 3-D Partial Element Equivalent Circuit (PEEC) method, and the observed inaccuracies of modeling HF effects are attributed to the QS field assumption. This paper presents a comprehensive analysis on the differences between the QS 3-D PEEC-based and the equivalent-RLCG-circuit-based EM modeling for simulating the dynamics of fast switching power devices. Using two modeling examples of fast switching power MOSFETs, a 3-D PEEC solver developed in-house and the well-known equivalent-RLCG-circuit-based EM modeling tool, ANSYS Q3D, are compared to the full-wave 3-D FEM-based EM tool, ANSYS HFSS. It is shown that the QS 3-D PEEC method can model the fast switching transients more accurately than Q3D. Accordingly, the accuracy of equivalent-RLCG-circuit-based modeling approaches in the HF range is rather related to the approximations made on modeling electric-field induced effects than to the QS field assumption.

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Abed Ali, Fatme, Yvan Avenas, Pierre Lefranc, Pierre Olivier Jeannin, Hadi Alawieh, Toni Youssef et Hassan Moussa. « Design of an Integrated Power Module for Silicon Carbide MOSFET with Self-Compensation of the Magnetic Field ». Materials Science Forum 1062 (31 mai 2022) : 637–41. http://dx.doi.org/10.4028/p-gvcp58.

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Compactness, efficiency, and light weight are the key topics in the design of power conversion systems for transportation applications. This demand is achievable by using wide band gap devices such as SiC devices, characterized by the high switching speed and low on-resistance. However, this trend imposes new challenges and the effect of parasitic elements of power package during switching transient becomes significant. Hence, new packaging solutions should be investigated for addressing this concern. This paper presents a new multichip power module architecture, where its design considering capacitive and inductive stray elements is carried out. Using Ansys Q3D Extractor, electromagnetic simulations are achieved to extract the inductive and capacitive parasitic element of one leg of a three-phase inverter.

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Venugopal, Aravind, et Femi Robert. « Influence of physical parameters on the capacitance of laminated busbars for electric vehicles ». Journal of Physics : Conference Series 2335, n^o 1 (1 septembre 2022) : 012046. http://dx.doi.org/10.1088/1742-6596/2335/1/012046.

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Abstract Laminated busbars are essential for highly efficient, high power density applications, especially in the electric transportation sector, due to their unique electrical and mechanical characteristics. Stray parameters in laminated busbars pose a real challenge to designers in industries and researchers in the field since controlling these are crucial in busbar performance. Laminated busbar inductance has been studied extensively in the literature. However, very few works have focussed exclusively on the capacitance of the laminated busbar. In this paper, the impacts of busbar physical parameters on capacitance are studied in detail using Finite Element Modelling (FEM) software, ANSYS Q3D Extractor. The variation of capacitances on laminated busbars concerning several factors such as the busbar dimensions, terminals and apertures on the busbar structure, conductor and insulator materials are analysed.

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Piekielny, Pawel, et Andrzej Waindok. « Using a Current Shunt for the Purpose of High-Current Pulse Measurement ». Sensors 21, n^o 5 (6 mars 2021) : 1835. http://dx.doi.org/10.3390/s21051835.

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Measurement of high-current pulses is crucial in some special applications, e.g., electrodynamic accelerators (EA) and converters. In such cases, the current shunts have limitations concerning the frequency bandwidth. To overcome the problem, a method based on the shunt mathematical model is proposed. In the method, the solution of ordinary differential equations for the RL circuit is carried out in order to obtain the real current shape. To check the method, as a referee, a Rogowski coil dedicated to measuring high-current pulses was used. Additionally, the measurement results were compared with the mathematical model of the tested power supply system. Measurements were made for the short power supply circuit, which allows eliminating the nonlinearity. The calculations were carried out using a circuit model. In order to obtain the parameters of the shunt (resistance and inductance), it was modeled using an ANSYS/Q3D Extractor software. Comparison of calculation and measurement results confirms the correctness of our method. In order to compare results, the normalized root mean square error (NRMSE) was used.

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Lee, Gi-Young, Min-Shin Cho et Rae-Young Kim. « Lumped Parameter Modeling Based Power Loop Analysis Technique of Power Circuit Board with Wide Conduction Area for WBG Semiconductors ». Electronics 10, n^o 14 (18 juillet 2021) : 1722. http://dx.doi.org/10.3390/electronics10141722.

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With the development of wide-bandgap (WBG) power semiconductor technology, such as silicon carbide (SiC) and gallium nitride (GaN), the technology of power converters with high efficiency and high-power density is rapidly developing. However, due to the high rate-of-rise of voltage (dv/dt) and of current (di/dt), compared to conventional Si-based power semiconductor devices, the reliability of the device is greatly affected by the parasitic inductance component in the switching loop. In this paper, we propose a power loop analysis method based on lumped parameter modeling of a power circuit board with a wide conduction area for WBG power semiconductors. The proposed analysis technique is modeled based on lumped parameters, so that power loops with various current paths can be analyzed; thus, the analysis is intuitive, easy to apply and realizes dynamic power loop analysis. Through the proposed analysis technique, it is possible to derive the effective parasitic inductance component for the main points in the power circuit board. The effectiveness of the lumped parameter model is verified through PSpice and Ansys Q3D simulation results.

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Hao, Feng Bin, Xiao Xing Jin, Ao Liu, Shi Yan Li, Song Bai et Gang Chen. « Research of 3.3kV, 60A H-Bridge High-Voltage SiC Diode Modules ». Materials Science Forum 1014 (novembre 2020) : 163–70. http://dx.doi.org/10.4028/www.scientific.net/msf.1014.163.

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The simulation, fabrication and measurement of the high-voltage H-bridge SiC diode module is reported. The SiC module is consisted with 8 self-designed 3.3 kV30 A SiC Schottky diodes (SBDs), in which each bridge arm is connected by double SBD chips to achieve 60A current. Q3D is used to establish simulation model and make network division of the module. Two parasitic parameters, parasitic inductor and circuit resistance, are extracted from the circuits, which are about 37.5 nH and 1.9 mΩ, respectively. By establishing the geometric model and finite element model, finite element analysis software ANSYS is used to calculate steady-state thermal conduction, and the temperature gradient distribution of the formed chips. The results show that the maximum junction temperature of the chip is about 100°C, and the distribution of the temperature field is reasonable. As the lateral conduction of heat increases the effective heat dissipation area, there is no obvious concentration of heat. Under the condition of the test at room temperature and static, the module voltage drop is about 2.1 V, the leakage current is less than 5 uA, and the breakdown voltage is more than 3700 V, respectively. The fabricated 3300 V devices exhibit large safety margin. The insulation voltage exceeds 7000V, thus ensure the safety of the system. The thermal resistance of the chip is about 0.21 K/W, which is basically consistent with the simulation results.

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Thèses sur le sujet "Ansys Q3D"

NIANG, DJIBRIL. « Performance evaluation of LIDAR demonstrator ». Doctoral thesis, Università degli Studi di Milano-Bicocca, 2023. https://hdl.handle.net/10281/404777.

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In questa tesi, sono state realizzate tre diverse board: un DC-DC per il supply, un control unit per programmare i segnali d'ingresso del driver, un firing unit che contiene il chip principale(driver e GaN). Abbiamo usato il nitruro di galio perché è meglio adatto del silicio ad alte frequenze. L'obbiettivo principale è di raggiungere 50A di picco di corrente con soli 5ns di pulse. Sono stati usati Altium design per il disegno delle board e Ansys per l'evaluazione delle induttanze parassite. Questo ultimo crea diversi problemi e può limitare il raggiungimento del picco di corrente. Quindi bisogna fare il layout tenendo molta attenzione ai parassiti
In our three years of work, we have achieved the realization of a Firing unit board with the GaN and driver in a system in package. Three different boards were realized: A first board with only the resistor, the second one with the resistor and a shunt resistor and a third board with the laser diode and a shunt resistor. A DC-DC was realized for the supply while a control unit was realized for the control of the input signals of the driver.Unfortunately, no measurements of the firing unit have been done yet as we are still waiting for the chip to be completed. The DC-DC and the control unit board have been measured and tested. LIDAR application is the most attractive and efficient solution for this market. The challenges of LIDAR application consist in the development of the electronics generating a current pulse of 50A that lasts for less than 5ns. The technical area of this activity is fully autonomous self-driving car, and in particular what helps an autonomous vehicle to understand the world around it.

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Pavan, Kumar Maareddygari Pavan Kumar, et Bharadwaj Yellambalse Prem Kumar Anoop Anoop. « Design and Construction of Chassis for Uniti L7e Vehicle ». Thesis, Högskolan i Halmstad, Akademin för ekonomi, teknik och naturvetenskap, 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:hh:diva-32946.

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Chassis is the primary structural component of an automobile. It is the main supporting structure of a vehicle to which all other systems like braking, suspension and differential are attached. In this thesis, a methodology for L7e category vehicle chassis design and structural stability analysis is presented. The present car being developed at Uniti Sweden AB is classified as L7e category vehicle as per the European Union, therefore the chassis developed in this thesis considers the specific characteristics that vehicles under this category demands for. A literature study is carried out to review various existing designs of vehicle chassis, latest innovations and advanced materials used to manufacture the same. The various types of forces and stresses commonly acting on chassis structures are analyzed and their effects on the vehicle is understood. After completing literature study, several findings are listed in a systematic manner, by providing ample arguments to justify each of them. The pro-con analysis is conducted to evaluate merits and demerits of each alternative type of chassis and the material to manufacture it. The most essential design criteria are derived from the QFD (Quality function deployment) which then acts as important guidelines during the actual design process. Structural chassis frame is designed as per the design criteria, using the CAD software CATIAV5R19 and the structural stability of the same is tested and analyzed using ANSYS 15.0 software. From the results of these analysis tests the static structural stability of the design is confirmed.

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Actes de conférences sur le sujet "Ansys Q3D"

Zhang, Kailin, Miao Cai, Minghui Yun, Lei Song et Daoguo Yang. « Comparison experiment of Parasitic Inductance Extraction of power module based on ANSYS Q3D software ». Dans 2021 18th China International Forum on Solid State Lighting & 2021 7th International Forum on Wide Bandgap Semiconductors (SSLChina : IFWS). IEEE, 2021. http://dx.doi.org/10.1109/sslchinaifws54608.2021.9675224.

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De, Ankan, Adam Morgan, Subhashish Bhattacharya et Douglas C. Hopkins. « Design Considerations of Packaging a High Voltage Current Switch ». Dans ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2015. http://dx.doi.org/10.1115/ipack2015-48714.

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In this paper an attempt has been made to demonstrate various package design considerations to accommodate series connection of high voltage Si-IGBT (6500V/25A die) and SiC-Diode (6500V/25A die). The effects of connecting the cathode of the series diode to the collector of the IGBT versus connecting the emitter of the IGBT to the anode of the series diode has been analyzed in regards to gate terminal operation and the parasitic line inductance of the structure. ANSYS Q3D/MAXWELL software have been used to analyze and extract parasitic inductance and capacitances in the package along with electromagnetic fields, electric potentials, and current density distributions throughout the package for variable parameters. SIMPLIS-SIMETRIX is used to simulate typical switch behavior for different parasitic parameters under hard switched conditions. Various simulation results have then been used to redesign and justify the optimized package structure for the final current switch design. The thermal behavior of such a package is also conducted in COMSOL in order to ensure that the thermal ratings of the power devices is not exceeded, and to understand where potentially harmful hotspots could arise and estimate the maximum attainable frequency of operation. The main motivation of this work is to enumerate detailed design considerations for packing a high voltage current switch package.

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Seidler, Marcel, et Jens Friedrichs. « Introduction Of An Improved Axial Compressor Profile Shape Modelling Approach For Increased Flexibility In Transonic Profile Design ». Dans GPPS Xi'an21. GPPS, 2022. http://dx.doi.org/10.33737/gpps21-tc-173.

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With the goal to reduce carbon emissions of future aircraft engines the concept of shape adaptive rotor blading for transonic fan and compressor applications is researched within the Excellence Cluster SE2A. As the aerodynamic design point is shifted by the morphing of the blade shape, the transonic profile design plays a major role in keeping the respective operation point efficiency close to the initial design point efficiency. To increase flexibility and accuracy in transonic profile design, an improved profile modelling approach is presented. To keep the number of modelling parameters to a minimum, a superposition of a generalized parabolic arc camber with a CSM (Class Function / Shape Function) thickness distribution is applied. As the CSM methodology offers an extension of the modelling parameters, the number of parameters is successively increased within this research to enable a better representation of transonic profile shapes. Additionally, the impact of leading edge design and suction side curvature on the blade-shock interaction is explored by specifically manipulating the CSM thickness distribution in the leading edge area. The proposed modelling approach is then applied to a redesign of the tip area of the NASA rotor 67 and evaluated through Q3D RANS simulations in Ansys CFX.

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