Littérature scientifique sur le sujet « 28nm »
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Articles de revues sur le sujet "28nm"
Kalia, Kartik, Khyati Nanda, Arushi Aggarwal, Akshita Goel et Shivani Malhotra. « Transistor Resizing Based Low Power Thermal Aware Adder Design on FPGA ». Advanced Materials Research 1098 (avril 2015) : 37–43. http://dx.doi.org/10.4028/www.scientific.net/amr.1098.37.
Texte intégralChen, Fu Ping, Hai Bo Lei, Xiao Yan Zhang, Wen Jun Wang, She Na Jia, Jane Wang, Jason Lee et al. « High Performance, Eco-Friendly SPM Cleaning Technology Using Integrated Bench-Single Wafer Cleaning System ». Solid State Phenomena 314 (février 2021) : 133–39. http://dx.doi.org/10.4028/www.scientific.net/ssp.314.133.
Texte intégralZhang, Beichao, Bin Zhang, Haibo Xiao, Hao Deng, Hao Tong, Jingjing Tan, Ming Zhou et al. « Thin Film Challenges in 28nm Technology Node ». ECS Transactions 44, no 1 (15 décembre 2019) : 391–94. http://dx.doi.org/10.1149/1.3694344.
Texte intégralAguiar, V. A. P., N. H. Medina, N. Added, E. L. A. Macchione, S. G. Alberton, C. L. Rodrigues, T. F. Silva et al. « Thermal neutron induced upsets in 28nm SRAM ». Journal of Physics : Conference Series 1291 (juillet 2019) : 012025. http://dx.doi.org/10.1088/1742-6596/1291/1/012025.
Texte intégralRochefeuille, E., F. Alicalapa, A. Douyère et T. P. Vuong. « FDSOI 28nm performances study for RF energy scavenging ». IOP Conference Series : Materials Science and Engineering 321 (mars 2018) : 012009. http://dx.doi.org/10.1088/1757-899x/321/1/012009.
Texte intégral., Anshu Gaur. « HDL IMPLEMENTATION OF AMBA AHB ON 28NM FPGA ». International Journal of Research in Engineering and Technology 06, no 06 (25 juin 2017) : 148–53. http://dx.doi.org/10.15623/ijret.2017.0606024.
Texte intégralGupta, Arpit, Aarushi Sapra, Alisha Nagpal et Sanchit Sharma. « Energy Efficient Traffic Light Controller Design on 28nm FGPA ». International Journal of Smart Home 9, no 10 (31 octobre 2015) : 133–44. http://dx.doi.org/10.14257/ijsh.2015.9.10.15.
Texte intégralChandra Verma, Puneet, Pragya Agarwal, Apurva Omer, Bhaskar Gururani et Sanchit Verma. « Designing Green ECG Machine Based on Artix7 28nm FPGA ». Gyancity Journal of Engineering and Technology 3, no 1 (1 janvier 2017) : 38–44. http://dx.doi.org/10.21058/gjet.2017.31006.
Texte intégralPhu Phu, Tran Nguyen, Dang Phuong Gia Han, Nguyen Cong Luong et Nguyen Van Cuong. « Design A Synchronous Single-Port Sram 1024x32xMUX4 Using 28NM Technology ». International Journal of Computing and Digital Systems 10, no 1 (1 janvier 2021) : 103–9. http://dx.doi.org/10.12785/ijcds/100110.
Texte intégralShi, I., E. Tian et C. Ren. « Defect Investigation of the Develop Process on 28nm Contact Mask ». ECS Transactions 60, no 1 (27 février 2014) : 199–204. http://dx.doi.org/10.1149/06001.0199ecst.
Texte intégralThèses sur le sujet "28nm"
Biswas, Avishek Ph D. Massachusetts Institute of Technology. « Energy-efficient SRAM design in 28nm FDSOI Technology ». Thesis, Massachusetts Institute of Technology, 2014. http://hdl.handle.net/1721.1/91095.
Texte intégral48
Cataloged from PDF version of thesis.
Includes bibliographical references (pages 75-81).
As CMOS scaling continues to sub-32nm regime, the effects of device variations become more prominent. This is very critical in SRAMs, which use very small transistor dimensions to achieve high memory density. The conventional 6T SRAM bit-cell, which provides the smallest cell-area, fails to operate at lower supply voltages (Vdd). This is due to the significant degradation of functional margins as the supply voltage is scaled down. However, Vdd scaling is crucial in reducing the energy consumption of SRAMs, which is a significant portion of the overall energy consumption in modern micro-processors. Energy savings in SRAM is particularly important for batteryoperated applications, which run from a very constrained power-budget. This thesis focuses on energy-efficient 6T SRAM design in a 28nm FDSOI technology. Significant savings in energy/access of the SRAM is achieved using two techniques: Vdd scaling and data prediction. A 200mV improvement in the minimum SRAM operating voltage (Vdd,min) is achieved by using dynamic forward body-biasing (FBB) on the NMOS devices of the bit-cell. The overhead of dynamic FBB is reduced by implementing it row-wise. Layout modifications are proposed to share the body terminals (n-wells) horizontally, along a row. Further savings in energy/access is achieved by incoporating data-prediction in the 6T read path, which reduces bitline switching. The proposed techniques are implemented for a 128Kb 6T SRAM, designed in a 28nm FDSOI technology. This thesis also presents a reconfigurable fully-integrated switched-capacitor based step-up DC-DC converter, which can be used to generate the body-bias voltage for a SRAM. 3 reconfigurable conversion ratios of 5/2, 2/1 and 3/2 are implemented in the converter. It provides a wide range of output voltage, 1.2V-2.4V, from a fixed input of 1V. The converter achieves a peak efficiency of 88%, using only on-chip MOS and MOM capacitors, for a high density implementation.
by Avishek Biswas.
S.M.
PIPINO, ALESSANDRA. « Design of Analog Circuits in 28nm CMOS Technology for Physics Applications ». Doctoral thesis, Università degli Studi di Milano-Bicocca, 2017. http://hdl.handle.net/10281/158126.
Texte intégralThe exponential trend of the complementary metal-oxide-semiconductor (CMOS) technologies predicted by Moores law has been successfully demonstrated over the last three decades. A constant downscaling of CMOS technologies with smaller and smaller device size has been developed, in order to comply with requirements on speed, complexity, circuit density and power consumption of advanced high performance digital applications. The minimum reachable length, which corresponds to the half the length of the channel of the smallest transistor that can be manufactured, represents every following technological node. With the arrival of nanoscale (sub-100nm) CMOS technologies, digital performance improve further, but many new challenges have been introduced for analog designers. In fact, for the digital circuits CMOS scaling-down leads to several benefits: speed improvement, reduced power consumption, high integration and complexity level. The analog circuits, instead, strongly suffers from the ScalTech trend, because the MOS behavior dramatically changes through the different technological nodes and especially for the ultra-scaled ones, where second order effects, previously negligible, become very important and start to be dominant, affecting its performance. For instance, lower intrinsic DC-gain, reduced dynamic range, operating point issues and larger parameter variability are some of the problems due to scaling-down. Analog designers must face this problems at different phases of the design, circuital and layout. Despite that, the design of analog circuit in sub-nm technologies is mandatory in some cases or can be even helpful in others. For example, in mainly mixed-signal systems, the read-out electronic requires high frequency performance, so the choice of deep submicron technology is mandatory, also for the analog part. Other types of applications where using scaled technology is even strategical are the high-energy physics experiments, where read-out circuits are exposed to very high radiation levels with consequent performance degradation and breakdown events. Since radiation damage is proportional to gate oxide volume, smaller devices exhibit lower radiation detriment. It has been demonstrated in fact, that 28nm CMOS technology devices are capable to sustain 1Grad-TID exposure, not possible with previous technologies. In this thesis, the main key challenges in ultra-scaled technologies are analyzed in the first chapter, and then integrated circuits designed in 28nm CMOS technology are presented. The first circuit design, presented in the second chapter and integrated in 28nm CMOS technology, is a Fast-Tracker front-end (FTfe) for charge detection. The read-out system has been developed starting from the main specifications and circuital solutions already adopted for muon detection in ATLAS experiment. The proposed front-end is able to detect an event and soon after to reset the system in order to make the FTfe already available for the following event, avoiding long dead times. The architecture is analyzed in detail, followed by the layout choices and the performance results. The second circuit design presented in the third chapter and always integrated in 28nm CMOS technology, is a Chopper instrumentation amplifier. Instrumentation amplifiers are the key building blocks in sensor and monitoring applications, where they are used to sense and amplify usually very small (sub-mV) and low frequency signals. For this reason it is important to reduce or eliminate the input offset and flicker noise, which cover and disturb the main signal to be detected. The proposed amplifier use a modulation technique, called chopper, in order to meet the low offset and low flicker noise requirements. Moreover it has been modeled to operate in sub-threshold region, in order to address the scaling problems. After the architecture description, layout and results of the integrated prototype are shown.
Lorrain, Vincent. « Etude et conception de circuits innovants exploitant les caractéristiques des nouvelles technologies mémoires résistives ». Thesis, Université Paris-Saclay (ComUE), 2018. http://www.theses.fr/2018SACLS182/document.
Texte intégralIn this thesis, we study the dedicated computational approaches of deep neural networks and more particularly the convolutional neural networks (CNN).We highlight the convolutional neural networks efficiency make them interesting choice for many applications. We study the different implementation possibilities of this type of networks in order to deduce their computational complexity. We show that the computational complexity of this type of structure can quickly become incompatible with embedded resources. To address this issue, we explored differents models of neurons and architectures that could minimize the resources required for the application. In a first step, our approach consisted in exploring the possible gains by changing the model of neurons. We show that the so-called spiking models theoretically reduce the computational complexity while offering interesting dynamic properties but require a complete rethinking of the hardware architecture. We then proposed our spiking approach to the computation of convolutional neural networks with an associated architecture. We have set up a software and hardware simulation chain in order to explore the different paradigms of computation and hardware implementation and evaluate their suitability with embedded environments. This chain allows us to validate the computational aspects but also to evaluate the relevance of our architectural choices. Our theoretical approach has been validated by our chain and our architecture has been simulated in 28 nm FDSOI. Thus we have shown that this approach is relatively efficient with interesting properties of scaling, dynamic precision and computational performance. In the end, the implementation of convolutional neural networks using spiking models seems to be promising for improving the networks efficiency. Moreover, it allows improvements by the addition of a non-supervised learning type STDP, the improvement of the spike coding or the efficient integration of RRAM memory
Torres, Florent. « Power amplifier design for 5G applications in 28nm FD-SOI technology ». Thesis, Bordeaux, 2018. http://www.theses.fr/2018BORD0064/document.
Texte intégralThe 5G future mobile network is planned to be deployed from 2020, in a context of exponential mobile market and exchanged data volume evolution. The 5G will leverage revolutionary applications for the advent of the connected world. For this purpose, several network specifications are expected notably low latency, reduced power consumption and high data-rates even if no standard is yet defined. The frequency bands traditionally used for mobile networks will not permit the needed performances and several mmW frequency bands are under study to create a complementary frequency spectrum. However, these mmW frequency bands suffer from large attenuation inbuilding material and in free-space. Therefore, several techniques will be implemented to tackle these limitations indense urban areas like backhauling, FD-MIMO and beamforming phased array. This is leading to a large number of transceivers for base stations and end-user devices. CMOS technology offers undeniable advantages for this mass market while FD-SOI technology offers additional features and performances. The power amplifier is the most critical block to design in a transceiver and is also the most power consuming. To address the 5G challenges, several specifications concerning power consumption, linearity and efficiency are expected. The environment variations inbeamforming phased array and the industrial context drive the need for robust topologies while power amplifier reconfigurability is benefic in a context of adaptive circuits. This thesis addresses these challenges by exploring the conception of a robust and reconfigurable power amplifier targeting 5G applications while integrating specific design techniques and taking advantage of 28nm FD-SOI CMOS technology features for reconfigurability purposes
Arfaoui, Wafa. « Fiabilité Porteurs Chauds (HCI) des transistors FDSOI 28nm High-K grille métal ». Thesis, Aix-Marseille, 2015. http://www.theses.fr/2015AIXM4335.
Texte intégralAs the race towards miniaturization drives the industrial requirements to more performances on less area, MOSFETs reliability has become an increasingly complex topic. To maintain a continuous miniaturization pace, conventional transistors on bulk technologies were replaced by new MOS architectures allowing a better electrostatic integrity such as the FDSOI technology with high-K dielectrics and metal gate. Despite all the architecture innovations, degradation mechanisms remains increasingly pronounced with technological developments. One of the most critical issues of advanced technologies is the hot carrier degradation mechanism (HCI) and Bias Temperature Instability (BTI) effects. To ensure a good performance reliability trade off, it is necessary to characterize and model the different failure mechanisms at device level and the interaction with Bias Temperature Instability (BTI) that represents a strong limitation of scaled CMOS nodes. This work concern hot carrier degradation mechanisms on 28nm transistors of the FDSOI technology. Based on carrier’s energy, the energy driven model proposed in this manuscript can predict HC degradation taking account of substrate bias dependence (VB) including the channel length effects (L), gate oxide thickness (TOX) , back oxide BOX (TBox) and silicon film thickness (TSI ). This thesis opens up new perspectives of the model Integration into a circuit simulator, to anticipate the reliability of future technology nodes and check out circuit before moving on to feature design steps
Bayat, Shahin. « Experiments and simulations on negative/positive bias temperature instability in 28nm CMOS devices ». Thesis, University of British Columbia, 2015. http://hdl.handle.net/2429/55104.
Texte intégralApplied Science, Faculty of
Electrical and Computer Engineering, Department of
Graduate
Fonseca, Alexandre. « Conception et réalisation de circuits de génération de fréquence en technologie FDSOI 28nm ». Thesis, Nice, 2015. http://www.theses.fr/2015NICE4100/document.
Texte intégralThe large-scale deployment of IoT requires the development of more efficient energy radio systems, within which the frequency generation circuit is known to be particularly energy-consuming. The objective of this thesis is firstly to develop a very low consumption frequency synthesis and secondly to demonstrate the performance of the FDSOI technology for analog and RF applications.In the first chapter are the specifications of the chosen standard -the BLE-, the specifications of the FDSOI technology and state of the art of low power radio frequency synthesizers architecture. We have chosen from this comparison the Fractional Phase Divider architecture. The second chapter presents the results of three types of system simulations of the PLL; 1 - the operation of its components and the key points to be respected for its implementation, 2 - the phase noise behavior for the definition of specifications, and 3 - the impact of architecture on the generation of spurious. This study allowed us to set the specifications of VCROs developed in the next chapter. The third chapter is dedicated to the design, implementation and testing of four topologies of VCROs and a test circuit in FDSOI 28nm technology. The first measurement results are encouraging but they need to be complemented by an integrated fractional PLL measurement. Indeed, the sensitivity of the circuits to the supply voltage (pushing of about 5 GHz/V) made measurements of phase noise very delicate. The measured consumption is less than 0.8 mA and the surface of the circuits is of the order of 600 µm².In the fourth and final chapter we present the implementation at circuit-level of a phase synchronization PLL
Souvignet, Thomas. « Contribution to the design of switched-capacitor voltage regulators in 28nm FDSOI CMOS ». Thesis, Lyon, INSA, 2015. http://www.theses.fr/2015ISAL0043/document.
Texte intégralMobile and multimedia devices offer more innovations and enhancements to satisfy user requirements. Chip manufacturers thus propose high performances SoC to address these needs. Unfortunately the growth in digital resources inevitably increases the power consumption while battery life-time does not rise as fast. Aggressive power management techniques such as dynamic voltage and frequency scaling have been introduced in order to keep competitive and relevant solutions. Nonetheless continuing in this direction involves more disruptive solutions to meet space and cost constraints. Fully integrated power supply is a promising solution. Switched-capacitor DC-DC converters seem to be a suitable candidate to keep compatibility with the manufacturing process of digital SoCs. This thesis focuses on the design of an embedded power supply architecture using switched-capacitor DC-DC converters.Addressing a large range of output power with significant efficiency leads to consider a multi-ratio power stage. With respect to the typical digital SoC, the input voltage is 1.8 V and the converter is specified to deliver an output voltage in the 0.3-1.2 V range. The reference voltage is varying according to typical DVFS requirements. A modular architecture accommodates the digital design flow where the flying capacitors are situated above the digital block to supply and the power switches are located as an external ring. Such an architecture offers high flexibility. Interleaving strategy is considered to mitigate the output voltage ripple. Such a converter admits the switching frequency as a control variable and linear regulation and hysteretic control are analyzed. A prototype has been fabricated in 28nm FDSOI technology by STMicroelectronics. A power density of 310 mW/mm2 is achieved at 72.5% peak efficiency with a silicon area penalty of 11.5% of the digital block area. The successful design methodology has been also applied to the design of a negative SC converter for body-biasing purpose in FDSOI. Simulation results demonstrate a strong interest for low power application
Sivadasan, Ajith. « Conception et simulation des circuits numériques en 28nm FDSOI pour la haute fiabilité ». Thesis, Université Grenoble Alpes (ComUE), 2018. http://www.theses.fr/2018GREAT118.
Texte intégralScaling of classical CMOS technology provides an increase in performance of digital circuits owing to the possibility of incorporation of additional circuit components within the same silicon area. 28nm FDSOI technology from ST Microelectronics is an innovative scaling strategy maintaining a planar transistor structure and thus provide better performance with no increase in silicon chip fabrication costs for low power applications. It is important to ensure that the increased functionality and performance is not at the expense of decreased reliability, which can be ensured by meeting the requirements of international standards like ISO26262 for critical applications in the automotive and industrial settings. Semiconductor companies, to conform to these standards, are thus required to exhibit the capabilities for reliability estimation at the design conception stage most of which, currently, is done only after a digital circuit has been taped out. This work concentrates on Aging of standard cells and digital circuits with time under the influence of NBTI degradation mechanism for a wide range of Process, Voltage and Temperature (PVT) variations and aging compensation using backbiasing. One of the principal aims of this thesis is the establishment of a reliability analysis infrastructure consisting of software tools and gate level aging model in an industrial framework for failure rate estimation of digital circuits at the design conception stage for circuits developed using ST 28nm FDSOI technology
Rahhal, Lama. « Analyse et modélisation des phénomènes de mismatch des transistors MOSFET avancées ». Thesis, Grenoble, 2014. http://www.theses.fr/2014GRENT061/document.
Texte intégralFor correct operation, certain analog and digital circuits, such as current mirrors or SRAM, require pairs of MOS transistors that are electrically identical. Real devices, however, suffer from random local variations in the electrical parameters, a problem referred to as mismatch. The aim of this thesis is to understand the physical causes of mismatch, to quantify this phenomenon, and to propose solutions that enable to reduce its effects. In this context, four major areas are treated. The first one focuses on the optimization of mismatch measurement methodologies. A new technique for the measurement of Vt and β mismatch and an ID mismatch model are proposed, analyzed and applied to experimental data for 28 nm Bulk and FD SOI technologies. The second area focuses on the characterization of different configurations of MOS transistors in order to propose design architectures that are optimized for certain applications. Specifically, the possibility of replacing LDEMOS with transistors in cascode configuration is analyzed. The third area focuses on the analysis and modeling of mismatch phenomena in advanced Bulk and SOI transistors. Three aspects are analyzed: 1) the impact of the introduction of germanium in P channel of 28nm BULK transistors; 2) the elimination of the metal gate contribution to Vt mismatch by using 20nm Gate-last Bulk technology; 3) a descriptive study of the principal contributions to Vt, β and ID mismatch in 28 and 14 nm FD SOI technologies. The last area treats the mismatch trends with transistor aging. NBTI stress tests were applied to PMOS 28nm FD SOI transistors. Models of the Vt and β mismatch trends as a function of the induced interface traps and fixed charges at the Si/SiO2 interface and in the oxide were developed and discussed
Livres sur le sujet "28nm"
Batalov, Vyacheslav. Loyal Alliance. Musketeers & Reiters : 28mm Paper Soldiers. Independently Published, 2019.
Trouver le texte intégralAlexandrovich, Batalov, et Batalov Nicolaevich. Rebels. Pirates 1680-1730 : 28mm Paper Soldiers. Independently Published, 2019.
Trouver le texte intégralAlexandrovich, Batalov, et Batalov Nicolaevich. Rebels. Highlanders 1680-1730 : 28mm Paper Soldiers. Independently Published, 2019.
Trouver le texte intégralBatalov, Vyacheslav. Loyal Alliance. Royalists 1640-1660 : 28mm Paper Soldiers. Independently Published, 2019.
Trouver le texte intégralBatalov, Vyacheslav. Protest League. Cavalry 1600-1650 : 28mm Paper Soldiers. Independently Published, 2019.
Trouver le texte intégralAlexandrovich, Batalov, et Batalov Nicolaevich. Flaming Spear. Seratkulu 1680-1730 : 28mm Paper Soldiers. Independently Published, 2019.
Trouver le texte intégralBatalov, Vyacheslav. Protest League. Ironsides 1640-1660 : 28mm Paper Soldiers. Independently Published, 2019.
Trouver le texte intégralAlexandrovich, Batalov, et Batalov Nicolaevich. Flaming Spear. Kapykulu 1680-1730 : 28mm Paper Soldiers. Independently Published, 2019.
Trouver le texte intégralAlexandrovich, Batalov, et Batalov Nicolaevich. Snow Star. Cavalry 1680-1730 : 28mm Paper Soldiers. Independently Published, 2019.
Trouver le texte intégralAlexandrovich, Batalov, et Batalov Nicolaevich. Forest Fury. Infantry 1680 - 1730 : 28mm Paper Soldiers. Independently Published, 2019.
Trouver le texte intégralChapitres de livres sur le sujet "28nm"
Nemoianu, Virgil. « 2. Romantic Irony and Biedermeier Tragicomedy ». Dans Comparative History of Literatures in European Languages, 399. Amsterdam : John Benjamins Publishing Company, 1993. http://dx.doi.org/10.1075/chlel.ix.28nem.
Texte intégralMetcalfe, N., T. Shanks, N. Roche et R. Fong. « Galaxy Number-Counts to B = 28m ». Dans Astronomy from Wide-Field Imaging, 645–48. Dordrecht : Springer Netherlands, 1994. http://dx.doi.org/10.1007/978-94-011-1146-1_137.
Texte intégralYoshikawa, Takamasa, Tadashi Inaba, Kenta Ida et Shinya Mizutani. « Experimental Study of Critical Stresses of Fe-28Mn-6Si-5Cr SMA Under Various Temperature Conditions ». Dans Advances in Shape Memory Materials, 221–29. Cham : Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-53306-3_17.
Texte intégralMeloni, Chantal. « Modes of Responsibility (Article 28N), Individual Criminal Responsibility (Article 46B) and Corporate Criminal Liability (Article 46C) ». Dans International Criminal Justice Series, 139–55. The Hague : T.M.C. Asser Press, 2016. http://dx.doi.org/10.1007/978-94-6265-150-0_9.
Texte intégralAmbos, Kai. « Genocide (Article 28B), Crimes Against Humanity (Article 28C), War Crimes (Article 28D) and the Crime of Aggression (Article 28M) ». Dans International Criminal Justice Series, 31–55. The Hague : T.M.C. Asser Press, 2016. http://dx.doi.org/10.1007/978-94-6265-150-0_3.
Texte intégralMorgenstern, Frank, et Stephan Huck. « Der Passionspunkt »Erinnern und Mahnen über die Grenzen hinweg« gefeiert auf dem Vorplatz des Marinemuseums in Wilhelmshaven in der Karwoche 2016 zum Thema : 28cm ». Dans Ausgezeichnete Gottesdienste, 143–50. Göttingen : Vandenhoeck & Ruprecht, 2017. http://dx.doi.org/10.13109/9783788732110.143.
Texte intégralXU, PANPAN, LAN PENG, JIAN LIU, WENWEN YIN et SHUAI ZHOU. « Nickel (28Ni) ». Dans Handbook of Synthetic Methodologies and Protocols of Nanomaterials, 253–82. World Scientific, 2019. http://dx.doi.org/10.1142/9789813277809_0019.
Texte intégral« Fragmenta sine verbis (193–225) et testimonia (226–286M) ». Dans Saffo, testimonianze e frammenti, 299–390. De Gruyter, 2021. http://dx.doi.org/10.1515/9783110735918-013.
Texte intégralSivakumar, K. « Computational Analysis and Characterization of Marfan Syndrome Associated Human Proteins ». Dans Biocomputation and Biomedical Informatics, 143–57. IGI Global, 2010. http://dx.doi.org/10.4018/978-1-60566-768-3.ch009.
Texte intégralOonishi, H., N. Murata, S. Kushitani, S. Wakitani, K. Imoto, Y. Iwaki et N. Kin. « Wear behaviour of polyethylene cup against 28mm alumina ball in total hip prostheses ». Dans Bioceramics, 333–36. Elsevier, 1997. http://dx.doi.org/10.1016/b978-008042692-1/50079-0.
Texte intégralActes de conférences sur le sujet "28nm"
Taylor, Brad, et Ralph Wittig. « 28nm generation programmable families ». Dans 2010 IEEE Hot Chips 22 Symposium (HCS). IEEE, 2010. http://dx.doi.org/10.1109/hotchips.2010.7480077.
Texte intégralNing, Liew Chiun, Lau Kok Heng, Ng Yi Jie, Goh Lay Lay, Lee Chong Haw et Loo Huey Wen. « FBGA 28nm Scan Chain Failure Analysis ». Dans 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA). IEEE, 2018. http://dx.doi.org/10.1109/ipfa.2018.8452562.
Texte intégralKheirallah, Rida, Nadine Azemard et Gilles Ducharme. « Energy study for 28nm FDSOI technology ». Dans 2015 International Workshop on CMOS Variability (VARI). IEEE, 2015. http://dx.doi.org/10.1109/vari.2015.7456558.
Texte intégralParrassin, Thierry, Guillaume Celi, Sylvain Dudit, Michel Vallet, Antoine Reverdy, Philippe Perdu et Dean Lewis. « Laser Voltage Imaging and Its Derivatives—Efficient Techniques to Address Defect on 28 nm Technology ». Dans ISTFA 2013. ASM International, 2013. http://dx.doi.org/10.31399/asm.cp.istfa2013p0306.
Texte intégralShi, Kaijian. « Sleep transistor design in 28nm CMOS technology ». Dans 2013 IEEE 26th International SoC Conference (SOCC). IEEE, 2013. http://dx.doi.org/10.1109/socc.2013.6749701.
Texte intégralKwak, Jin Woong, Andrew Marshall et Harvey Stiegler. « 28nm STT-MRAM Array and Sense Amplifier ». Dans 2019 8th International Conference on Modern Circuits and Systems Technologies (MOCAST). IEEE, 2019. http://dx.doi.org/10.1109/mocast.2019.8741642.
Texte intégralJie Ng, Jack Yi, Liew Chiun Ning et Khoo Khai Ling. « Back-end defect localization for 28nm FPGA ». Dans 2014 IEEE 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA). IEEE, 2014. http://dx.doi.org/10.1109/ipfa.2014.6898156.
Texte intégralZhou, Qingjun, Jing Xing et Yamei Zhang. « Optimization of SRAM in 28nm HPM Technology ». Dans 2018 Joint International Advanced Engineering and Technology Research Conference (JIAET 2018). Paris, France : Atlantis Press, 2018. http://dx.doi.org/10.2991/jiaet-18.2018.51.
Texte intégralPatra, Devyani, Ahmed Kamal Reza, Mohammed Khaled Hassan, Mehdi Katoozi, Ethan H. Cannon, Kaushik Roy et Yu Cao. « Adaptive accelerated aging with 28nm HKMG technology ». Dans 2017 IEEE International Reliability Physics Symposium (IRPS). IEEE, 2017. http://dx.doi.org/10.1109/irps.2017.7936351.
Texte intégralLiyan Zhang, Chenguang Gai, Hongrui Ren, Jun Huang, Xu Zhang, Shugen Pen, Yu Zhang et Qiang Ge. « 28nm Metal Hard Mask etch process development ». Dans 2015 China Semiconductor Technology International Conference (CSTIC). IEEE, 2015. http://dx.doi.org/10.1109/cstic.2015.7153376.
Texte intégralRapports d'organisations sur le sujet "28nm"
Sologub, Dmitry, Emil Babaev et Batdal Batdalov. MI-28N OPTICAL DETECTION AND GUIDANCE SYSTEMS. Science and Innovation Center Publishing House, décembre 2020. http://dx.doi.org/10.12731/detection_and_guidance_systems.
Texte intégral