Tesis sobre el tema "Wage boards"
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Cockfield, Sandra A. y n/a. "The Interaction of Industrial Tribunals and Workplace Industrial Relations in Australia: the Metal trades, 1900 to 1929". Griffith University. Griffith Business School, 1998. http://www4.gu.edu.au:8080/adt-root/public/adt-QGU20050914.170636.
Texto completoBamiedakis, Nikolaos. "Multimode polymer waveguides for high-speed on-board optical interconnects". Thesis, University of Cambridge, 2009. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.611251.
Texto completoCho, Sang-Yeon. "High speed optical interconnection on electrical boards using embedded OE devices in polymer optical waveguides". Diss., Georgia Institute of Technology, 2003. http://hdl.handle.net/1853/14881.
Texto completoArkeholt, Simon. "Induction in Printed Circuit Boards using Magnetic Near-Field Transmissions". Thesis, Linköpings universitet, Teoretisk Fysik, 2018. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-148788.
Texto completoYousef, Hanna. "High Aspect Ratio Microstructures in Flexible Printed Circuit Boards : Process and Applications". Doctoral thesis, Uppsala University, Department of Engineering Sciences, 2008. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-8565.
Texto completoFlexible printed circuit boards (flex PCBs) are used in a wide range of electronic devices today due to their light weight, bendability, extensive wiring possibilities, and low-cost manufacturing techniques. The general trend in the flex PCB industry is further miniaturization alongside increasing functionality per device and reduced costs. To meet these demands, a new generation of low cost manufacturing technologies is being developed to enable structures with smaller lateral dimensions and higher packing densities.
Wet etching is today the most cost-efficient method for producing a large number of through-foil structures in flex PCBs. However, conventional wet etch techniques do not allow for through-foil structures with aspect ratios over 1 – a fact that either necessitates thin and mechanically weak foils or puts severe limitations on the packing density. The fabrication techniques presented in this thesis allow for through-foil structures with higher aspect ratios and packing densities using wet etching. To achieve high aspect ratios with wet etching, the flex PCB foils are pre-treated with irradiation by swift heavy ions. Each ion that passes through the foil leaves a track of damaged material which can be subsequently etched to form highly vertical pores. By using conventional flex PCB process techniques on the porous foils, high aspect ratio metallized through-foil structures are demonstrated.
The resulting structures consist of multiple sub-micrometer sized wires. These structures are superior to their conventional counterparts when it comes to their higher aspect ratios, higher possible packing densities and low metallic cross-section. Furthermore, metallized through-foil structures with larger areas and more complicated geometries are possible without losing the mechanical stability of the foil. This in turn enables applications that are not possible using conventional techniques and structures. In this thesis, two such applications are demonstrated: flex PCB vertical thermopile sensors and substrate integrated waveguides for use in millimeter wave applications.
Novak, Markus. "Low Cost Ultra-Wideband Millimeter-Wave Phased Arrays". The Ohio State University, 2017. http://rave.ohiolink.edu/etdc/view?acc_num=osu1500574802418502.
Texto completoCheng, Shi. "Integrated Antenna Solutions for Wireless Sensor and Millimeter-Wave Systems". Doctoral thesis, Uppsala universitet, Mikrovågs- och terahertzteknik, 2009. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-111197.
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Granger, Amy. "Reproductive Freedom in the United States and Louisiana: An Assessment of the Last Decade, a Review of the Current Climate, And a Scenario for the Future". ScholarWorks@UNO, 2009. http://scholarworks.uno.edu/td/1086.
Texto completoMin, Byung-Young. "A physics based investigation of gurney flaps for enhancement of rotorcraft flight characteristics". Diss., Georgia Institute of Technology, 2010. http://hdl.handle.net/1853/33851.
Texto completoCamilo, Edson 1959. "Propostas de design de layout da PCI para redução de curto circuito de solda a onda, para processo de montagem de placa eletrônica = PCB layout design techniques for shortcircuit (bridging) reduction due to wave soldering in electronic board assembly". [s.n.], 2015. http://repositorio.unicamp.br/jspui/handle/REPOSIP/260044.
Texto completoDissertação (mestrado) - Universidade Estadual de Campinas, Faculdade de Engenharia Elétrica e de Computação
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Resumo: Este trabalho de Mestrado tem como objetivo contribuir para a área de placa de circuito impresso no que se refere ao projeto de layout focado não só em satisfazer as conexões das trilhas, mas nas regras de projeto com foco na redução de curto circuito de solda para o processo de solda por onda. Projetos de PCB (Printed Circuit Board) ou PCI (Placa de Circuito Impresso) envolvem uma série de conhecimentos no que se refere ao entendimento das funcionalidades dos circuitos e para tanto é importante que se faça o correto posicionamento dos componentes em grupos de circuitos pela funcionalidade; além disso, é importante que se conheça as regras de capacidade de corrente, de distâncias de isolação em função das tensões aplicadas, características de impedância, áreas de restrição mecânica entre outras. O que será visto neste trabalho está focado na aplicação de conceitos e considerações ligadas ao processo de montagem da placa eletrônica por solda a onda. Muitos dos defeitos que ocorrem num processo de montagem da PCB são atribuídos ao processo de montagem da PCB como, por exemplo, a temperatura da solda, o tempo de solda, quantidade de fluxo aplicado na placa, altura da onda de solda, etc. Recomendações sobre posicionamento de componentes PTH (Pin Through Hole) e SMD (Surface Mounting Devise) em relação ao sentido em que a PCB entra em direção à solda a onda, recursos de aplicação de serigrafia, tipos de laminados, de formato das ilhas de solda, adição de técnica de ladrão de solda e as recomendações da IPC (Association Connecting Electronics Industries) serão descritos neste trabalho. O correto entendimento dos defeitos que ocorrem durante o processo de montagem da PCB reflete na constante melhoria e aperfeiçoamento do projeto do layout da placa, que por sua vez resulta num processo de montagem de placa com menos ocorrência de defeitos de fabricação e consequentemente melhor qualidade do produto. Menos retrabalho nas PCBs significa menos custo de produção que reflete em maior lucro para as empresas. As propostas apresentadas neste trabalho são fruto de resultados práticos vivenciados na indústria e de pesquisa em literatura dos assuntos relacionados a defeitos em PCB e processos de solda por onda. O conjunto destas recomendações e seus resultados estão aqui descritos e ilustrados para servirem de referência aos futuros pesquisadores e leitores
Abstract: This work aims to contribute to the area of the printed circuit board in regard to layout design focused not only on satisfying the connections of the tracks but the design rules focused on reducing short- circuit solder for wave solder process . Projects PCB (Printed Circuit Board) involve a lot of knowledge when it comes to understanding the features of both circuit and is important to make the correct positioning of components into groups of circuits for feature addition is important to know the rules of current capacity, isolation distances depending on the applied voltage, impedance characteristics, areas of mechanical restrictions among others. What will be seen in this work is focused on application of concepts and considerations involved in the process of mounting the electronic board by solder wave. Many of the defects which occur in the process of assembling the PCB are assigned to the PCB assembly process such as the temperature of the solder, weld time , amount of flux applied to the board, solder wave height, etc. Recommendations on positioning components PTH( Pin Through Hole) and SMD( Surface Mounting Devise) relative to the direction in which the PCB goes toward the wave solder , screen printing application features , format type of solder lands , techniques of solder thief and the IPC ( Association Connecting Electronics Industries) recommendations will be described on this work . The correct understanding of the defects that occur during the assembly process of the PCB reflects on constant improvement and refinement of the board layout design, which in turn results in a process of mounting plate with fewer occurrences of defects in workmanship and consequently better quality product. Less rework means less PCBs in production cost which reflects in higher profits for companies. The proposals presented in this paper are the result of practical results experienced in industry and research literature on the subjects related to defects in PCB and wave solder processes. All these recommendations and their results are described and illustrated to better serve as reference for future researchers and readers
Mestrado
Telecomunicações e Telemática
Mestre em Engenharia Elétrica
Hägglund, Eric. "Hogging Wealth : Dental analyses and an interdisciplinary study of the importance of pigs in prehistoric economies". Thesis, Uppsala universitet, Institutionen för arkeologi och antik historia, 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-324728.
Texto completoStudier i neolitiska zoo-arkeologiska sammanhang är undersökningar av tidig domesticering av djur i förhållande till mänsklighetens övergång till en mer stillasittande art. Forskning och dokumentation är avgörande för att rekonstruera mekanismerna bakom övergången. I denna uppsats har svintänder dokumenterats, analyserats och jämförts osteologiskt och tolkats tvärkulturellt. Studier i aDNA, isotop, pälsfärg och fysiska storleksfaktorer hos däggdjur presenteras också för att kontextualisera denna uppsats. Primära osteologiska metoder är tandslitage i underkäke (MWS), linjär emaljhypoplasi (LEH) och underkäkens tredje molar (M3) mätningar. Dessa metoder kan finna biometriska domesticeringsmarkörer. De analyserade svintänderna kommer ifrån den mellanneolitiska lokalen Ajvide, Eksta socken, Gotland. En samling moderna vildsvin agerar kontrollmaterial. Dessa tänder jämförs i första hand med kända domesticerade stenåldersvin från den Brittiska senneolitiska lokalen Durrington Walls, Wiltshire, Storbritannien. Resultaten indikerar på att den mellanneolitiska gropkeramiska kulturen (GRK), jagade på Gotland under vinterhalvåret och tog tillfånga ett begränsat antal svin som husdjur (totemdjur). Troligen togs svin tillfånga av olika ’hus’ till följd av att svinet var bundet till land och förfäder. En exakt rekonstruktion av GRKs svinhållningspraktik är dock osäkert på grund av att människo-svin relationer är dynamiska. Intensifierad svinjakt, inte tillfångatagandet av enstaka djur bör betraktas som tidig domesticering. Domesticering medför speciella biometriska markörer som är ovanligare i neolitisk tid. De tvärkulturella jämförelserna i traditionell "lågintensiv svinhållning" kan intyga på ett sådant förhållande mellan jägare-samlar grupper och vildsvin. Även om svinet inte var en basföda åt GRK, och därmed inte intensivt jagade, var svinen sällsynta ritualistiska handelsvaror och troligen högt värdesatta. Gropkeramiska "stormän" kan ha varit de drivande bakom denna praktik. Dessa ”stormän” engagerade sig i sociopolitiska aktiviteter, festligheter och begravningar, och därmed hade "hamstrat välstånd", men domesticerade aldrig svinet.
Walker, David Douglas. "Approaches to assessing wage loss duration at the Workers’ Compensation Board of British Columbia". Thesis, 2003. http://hdl.handle.net/2429/14041.
Texto completoKuo, Ming-Chu y 郭銘茱. "Millimeter-Wave Contactless Transition between Chip and Printed-Circuit Board". Thesis, 2014. http://ndltd.ncl.edu.tw/handle/07421952041586291669.
Texto completo國立交通大學
電信工程研究所
102
In this thesis, a new design of the contactless transition in the millimeter wave are proposed. With the theory of the resonator and filter, half-wavelength resonators are designed on the chip and printed circuit broad (PCB), and then the signal on the chip can be transmitted to the PCB via the coupling mechanism, realizing a low loss transition without any solid line connection between RF circuits. The half-wavelength resonators are designed on the chip (CMOS 0.18μm) and PCB (Rogers 5880, 5 mil) respectively, and the signal can be transimitted from the chip to the PCB efficiently through the coupling effect between the resonators. And the proposed transition is operated from 76 GHz to 81 GHz. Besides, the tolerance of the transition will be discussed. Furthermore, the design will take the measuring environment and results in account to improve the proposed transition and the method of measurement.
Liu, Yujie Chen Ray T. "Investigation of polymer waveguides for fully embedded board-level optoelectronic interconnects". 2004. http://repositories.lib.utexas.edu/bitstream/handle/2152/2072/liuyj042.pdf.
Texto completoLiu, Yujie. "Investigation of polymer waveguides for fully embedded board-level optoelectronic interconnects". Thesis, 2004. http://hdl.handle.net/2152/2072.
Texto completoChoi, Jin Ho 1968. "Optoelectronic packaging and reliability of intra- and inter-board level guided-wave optical interconnection". Thesis, 2006. http://hdl.handle.net/2152/21909.
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Liou, Jie-Kang y 劉介剛. "Design and Measurement of Millimeter-Wave Contactless Transition between Active Chip and Printed-Circuit Board". Thesis, 2015. http://ndltd.ncl.edu.tw/handle/a94r78.
Texto completo國立交通大學
電信工程研究所
103
In this thesis, two circuits are designed for 77GHz automotive radar system; one is a novel contactless transition of the chip to the printed circuit board and the other is an integration of low noise amplifier (LNA) and resonator in TN90GUTM CMOS technology. LNA is used as the validation of the first transition. The contactless transition of the chip to the printed circuit board is designed. With the theory of the resonator and filter, half-wavelength resonators are designed on the chip and printed circuit broad (PCB), and then the signal on the chip can be transmitted to the PCB via a low loss coupling mechanism. In addition, I consider the high frequency measurement, tolerance, measurement environment and implement results, and then summarize various methods of high-frequency measurement. The other circuit is a low noise amplifier (LNA) integrated with a coupled resonator on the chip. A low noise amplifier is using inductive degeneration architecture in cascade. This architecture provides the high gain, low noise figure and good isolation.
Lin, Lei Chen Ray T. "Integration of thin film GaAs MSM photodetector in fully embedded board-level optoelectronic interconnects". 2004. http://repositories.lib.utexas.edu/bitstream/handle/2152/2070/linl042.pdf.
Texto completoLin, Lei. "Integration of thin film GaAs MSM photodetector in fully embedded board-level optoelectronic interconnects". Thesis, 2004. http://hdl.handle.net/2152/2070.
Texto completoChen, Yen-Tso y 陳彥佐. "A Low-Cost and Low-Power Integrated Millimeter-Wave Transceiver in CMOS with On-Board Antenna Assembly". Thesis, 2009. http://ndltd.ncl.edu.tw/handle/63685838827776309796.
Texto completo國立臺灣大學
電子工程學研究所
97
This thesis focuses on design of 60-GHz integrated circuits and antennas, which must be used for high-speed wireless transmission. Although such high frequency circuits only implemented in III-V compound semiconductor in the past, nowadays, gaining the advantage of Moore''s law sustained, CMOS transistors with cut-off frequencies above 100 GHz turn out to be the best candidate for mm-Wave integrated circuits, for its familiar with digital circuits and integrated systems. Design considerations for 60-GHz wireless transmission would be discussed first. Describe many challenges in design of mm-Wave circuits in silicon and interface. And then we would present a fully-integrated 60-GHz transceiver system with on-board antenna assembly. Incorporating on-off keying (OOK) modulation and low-cost antenna design, this prototype provides a low-power solution for several Gb/s wireless communications. The enhanced OOK modulator/demodulator obviates baseband and interface circuitry, revealing a compact solution. Two antenna structures, folded dipole and patch array, are employed to fully examine the performance. Connecting to chip with bond wires, we use some techniques to alleviate the impedance issues. This design is fabricated in digital 90-nm CMOS technology; the transmitter and the receiver consume 183 and 103 mW and occupy 0.43 and 0.68 mm^2, respectively. With folded dipole antenna, the transceiver demonstrates error-free operation (BER < 10−12) for 2^31 − 1 PRBS of 1.5 Gb/s over a distance of 6 cm. With 4 × 3 patch antenna arrays, the transceiver achieves error-free operation (BER < 10^−12) for 2^31 − 1 PRBS of 1 Gb/s over a distance of 61 cm. Finally, we also design the antenna on board suitable for flip-chip interconnections, which is convinced of more compact solution.
Fillion, Eric. "The Cinema of the Quiet Revolution: Quebec’s Second Wave of Fiction Films and the National Film Board of Canada, 1963-1967". Thesis, 2012. http://spectrum.library.concordia.ca/973697/1/Eric%2DFillion%2DMA%2DThesis.pdf.
Texto completoMcLeod, Ian. "On-board data reduction for the Envisat Advanced Synthetic Aperture Radar : evaluation of the impact on interferometric and wave mode applications". Thesis, 1995. http://hdl.handle.net/2429/4390.
Texto completoKumar, Vijay. "Installation and Operation of Air-Sea Flux Measuring System on Board Indian Research Ships". Thesis, 2017. http://etd.iisc.ernet.in/2005/3778.
Texto completoUlrich, Neil. "Disclosure of executive remuneration as a corporate governance control measures in South African listed companies". Thesis, 2010. http://hdl.handle.net/10500/4789.
Texto completoBusiness Leadership
Ph.D. (Business Leadership)
Baczynskyj, Anastasia. "Learning How to Be Ukrainian: Ukrainian Schools in Toronto and the Formation of Identity, 1947-2009". Thesis, 2009. http://hdl.handle.net/1807/18089.
Texto completoStasko, Carly. "A Pedagogy of Holistic Media Literacy: Reflections on Culture Jamming as Transformative Learning and Healing". Thesis, 2009. http://hdl.handle.net/1807/18109.
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