Literatura académica sobre el tema "Wage boards"
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Artículos de revistas sobre el tema "Wage boards"
Seltzer, Andrew J. y Jeff Borland. "The Impact of the 1896 Factory and Shops Act on the Labor Market of Victoria, Australia". Journal of Economic History 78, n.º 3 (septiembre de 2018): 785–821. http://dx.doi.org/10.1017/s0022050718000359.
Texto completoBell, David N. F. y Robert E. Wright. "The Impact of Minimum Wages on the Wages of the Low Paid: Evidence from the Wage Boards and Councils". Economic Journal 106, n.º 436 (mayo de 1996): 650. http://dx.doi.org/10.2307/2235572.
Texto completoK. J., Sophy. "Liberalisation and Abolition of Wage Boards: Supreme Court Defies the Tilt". Journal of National Law University Delhi 3, n.º 1 (agosto de 2015): 143–61. http://dx.doi.org/10.1177/2277401720150109.
Texto completoLyon, Vaughan. "Swedish Wage Earner Funds: A Glimpse of Our Future?" Canadian Journal of Political Science 19, n.º 3 (septiembre de 1986): 573–83. http://dx.doi.org/10.1017/s0008423900054597.
Texto completoBlackburn, Sheila. "The problem of riches: from trade boards to a national minimum wage". Industrial Relations Journal 19, n.º 2 (junio de 1988): 124–38. http://dx.doi.org/10.1111/j.1468-2338.1988.tb00023.x.
Texto completoWalmsley, P. Y. y M. Ohtsu. "Teacher’s Salary Differentials and the Quality of Educational Services : Recent Developments in Saskatchewan". Relations industrielles 30, n.º 4 (12 de abril de 2005): 585–611. http://dx.doi.org/10.7202/028653ar.
Texto completoBlackburn, Sheila. "Working-Class Attitudes to Social Reform: Black Country Chainmakers and Anti-Sweating Legislation, 1880–1930". International Review of Social History 33, n.º 1 (abril de 1988): 42–69. http://dx.doi.org/10.1017/s0020859000008634.
Texto completoTreble, John G. "Interpreting the Record of Wage Negotiations Under an Arbitral Regime: A Game Theoretic Approach to the Coal Industry Conciliation Boards, 1893–1914". Business History 31, n.º 3 (julio de 1989): 61–80. http://dx.doi.org/10.1080/00076798900000065.
Texto completoSCHEFFER, MÁRIO CÉSAR, ALINE GIL ALVES GUILLOUX, MARIO ROBERTO DAL POZ y LILIA BLIMA SCHRAIBER. "Reasons for choosing the profession and profile of newly qualified physicians in Brazil". Revista da Associação Médica Brasileira 62, n.º 9 (diciembre de 2016): 853–61. http://dx.doi.org/10.1590/1806-9282.62.09.853.
Texto completoMichał Igielski. "Training and remuneration systems as motivational incentives based on the example of company x - case study". Współczesna Gospodarka 10, n.º 2 (33) (30 de junio de 2019): 41–54. http://dx.doi.org/10.26881/wg.2019.2.05.
Texto completoTesis sobre el tema "Wage boards"
Cockfield, Sandra A. y n/a. "The Interaction of Industrial Tribunals and Workplace Industrial Relations in Australia: the Metal trades, 1900 to 1929". Griffith University. Griffith Business School, 1998. http://www4.gu.edu.au:8080/adt-root/public/adt-QGU20050914.170636.
Texto completoBamiedakis, Nikolaos. "Multimode polymer waveguides for high-speed on-board optical interconnects". Thesis, University of Cambridge, 2009. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.611251.
Texto completoCho, Sang-Yeon. "High speed optical interconnection on electrical boards using embedded OE devices in polymer optical waveguides". Diss., Georgia Institute of Technology, 2003. http://hdl.handle.net/1853/14881.
Texto completoArkeholt, Simon. "Induction in Printed Circuit Boards using Magnetic Near-Field Transmissions". Thesis, Linköpings universitet, Teoretisk Fysik, 2018. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-148788.
Texto completoYousef, Hanna. "High Aspect Ratio Microstructures in Flexible Printed Circuit Boards : Process and Applications". Doctoral thesis, Uppsala University, Department of Engineering Sciences, 2008. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-8565.
Texto completoFlexible printed circuit boards (flex PCBs) are used in a wide range of electronic devices today due to their light weight, bendability, extensive wiring possibilities, and low-cost manufacturing techniques. The general trend in the flex PCB industry is further miniaturization alongside increasing functionality per device and reduced costs. To meet these demands, a new generation of low cost manufacturing technologies is being developed to enable structures with smaller lateral dimensions and higher packing densities.
Wet etching is today the most cost-efficient method for producing a large number of through-foil structures in flex PCBs. However, conventional wet etch techniques do not allow for through-foil structures with aspect ratios over 1 – a fact that either necessitates thin and mechanically weak foils or puts severe limitations on the packing density. The fabrication techniques presented in this thesis allow for through-foil structures with higher aspect ratios and packing densities using wet etching. To achieve high aspect ratios with wet etching, the flex PCB foils are pre-treated with irradiation by swift heavy ions. Each ion that passes through the foil leaves a track of damaged material which can be subsequently etched to form highly vertical pores. By using conventional flex PCB process techniques on the porous foils, high aspect ratio metallized through-foil structures are demonstrated.
The resulting structures consist of multiple sub-micrometer sized wires. These structures are superior to their conventional counterparts when it comes to their higher aspect ratios, higher possible packing densities and low metallic cross-section. Furthermore, metallized through-foil structures with larger areas and more complicated geometries are possible without losing the mechanical stability of the foil. This in turn enables applications that are not possible using conventional techniques and structures. In this thesis, two such applications are demonstrated: flex PCB vertical thermopile sensors and substrate integrated waveguides for use in millimeter wave applications.
Novak, Markus. "Low Cost Ultra-Wideband Millimeter-Wave Phased Arrays". The Ohio State University, 2017. http://rave.ohiolink.edu/etdc/view?acc_num=osu1500574802418502.
Texto completoCheng, Shi. "Integrated Antenna Solutions for Wireless Sensor and Millimeter-Wave Systems". Doctoral thesis, Uppsala universitet, Mikrovågs- och terahertzteknik, 2009. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-111197.
Texto completowisenet
Granger, Amy. "Reproductive Freedom in the United States and Louisiana: An Assessment of the Last Decade, a Review of the Current Climate, And a Scenario for the Future". ScholarWorks@UNO, 2009. http://scholarworks.uno.edu/td/1086.
Texto completoMin, Byung-Young. "A physics based investigation of gurney flaps for enhancement of rotorcraft flight characteristics". Diss., Georgia Institute of Technology, 2010. http://hdl.handle.net/1853/33851.
Texto completoCamilo, Edson 1959. "Propostas de design de layout da PCI para redução de curto circuito de solda a onda, para processo de montagem de placa eletrônica = PCB layout design techniques for shortcircuit (bridging) reduction due to wave soldering in electronic board assembly". [s.n.], 2015. http://repositorio.unicamp.br/jspui/handle/REPOSIP/260044.
Texto completoDissertação (mestrado) - Universidade Estadual de Campinas, Faculdade de Engenharia Elétrica e de Computação
Made available in DSpace on 2018-08-27T18:51:43Z (GMT). No. of bitstreams: 1 Camilo_Edson_M.pdf: 3518346 bytes, checksum: 0264cd60aaed512cef0dacda58a43540 (MD5) Previous issue date: 2015
Resumo: Este trabalho de Mestrado tem como objetivo contribuir para a área de placa de circuito impresso no que se refere ao projeto de layout focado não só em satisfazer as conexões das trilhas, mas nas regras de projeto com foco na redução de curto circuito de solda para o processo de solda por onda. Projetos de PCB (Printed Circuit Board) ou PCI (Placa de Circuito Impresso) envolvem uma série de conhecimentos no que se refere ao entendimento das funcionalidades dos circuitos e para tanto é importante que se faça o correto posicionamento dos componentes em grupos de circuitos pela funcionalidade; além disso, é importante que se conheça as regras de capacidade de corrente, de distâncias de isolação em função das tensões aplicadas, características de impedância, áreas de restrição mecânica entre outras. O que será visto neste trabalho está focado na aplicação de conceitos e considerações ligadas ao processo de montagem da placa eletrônica por solda a onda. Muitos dos defeitos que ocorrem num processo de montagem da PCB são atribuídos ao processo de montagem da PCB como, por exemplo, a temperatura da solda, o tempo de solda, quantidade de fluxo aplicado na placa, altura da onda de solda, etc. Recomendações sobre posicionamento de componentes PTH (Pin Through Hole) e SMD (Surface Mounting Devise) em relação ao sentido em que a PCB entra em direção à solda a onda, recursos de aplicação de serigrafia, tipos de laminados, de formato das ilhas de solda, adição de técnica de ladrão de solda e as recomendações da IPC (Association Connecting Electronics Industries) serão descritos neste trabalho. O correto entendimento dos defeitos que ocorrem durante o processo de montagem da PCB reflete na constante melhoria e aperfeiçoamento do projeto do layout da placa, que por sua vez resulta num processo de montagem de placa com menos ocorrência de defeitos de fabricação e consequentemente melhor qualidade do produto. Menos retrabalho nas PCBs significa menos custo de produção que reflete em maior lucro para as empresas. As propostas apresentadas neste trabalho são fruto de resultados práticos vivenciados na indústria e de pesquisa em literatura dos assuntos relacionados a defeitos em PCB e processos de solda por onda. O conjunto destas recomendações e seus resultados estão aqui descritos e ilustrados para servirem de referência aos futuros pesquisadores e leitores
Abstract: This work aims to contribute to the area of the printed circuit board in regard to layout design focused not only on satisfying the connections of the tracks but the design rules focused on reducing short- circuit solder for wave solder process . Projects PCB (Printed Circuit Board) involve a lot of knowledge when it comes to understanding the features of both circuit and is important to make the correct positioning of components into groups of circuits for feature addition is important to know the rules of current capacity, isolation distances depending on the applied voltage, impedance characteristics, areas of mechanical restrictions among others. What will be seen in this work is focused on application of concepts and considerations involved in the process of mounting the electronic board by solder wave. Many of the defects which occur in the process of assembling the PCB are assigned to the PCB assembly process such as the temperature of the solder, weld time , amount of flux applied to the board, solder wave height, etc. Recommendations on positioning components PTH( Pin Through Hole) and SMD( Surface Mounting Devise) relative to the direction in which the PCB goes toward the wave solder , screen printing application features , format type of solder lands , techniques of solder thief and the IPC ( Association Connecting Electronics Industries) recommendations will be described on this work . The correct understanding of the defects that occur during the assembly process of the PCB reflects on constant improvement and refinement of the board layout design, which in turn results in a process of mounting plate with fewer occurrences of defects in workmanship and consequently better quality product. Less rework means less PCBs in production cost which reflects in higher profits for companies. The proposals presented in this paper are the result of practical results experienced in industry and research literature on the subjects related to defects in PCB and wave solder processes. All these recommendations and their results are described and illustrated to better serve as reference for future researchers and readers
Mestrado
Telecomunicações e Telemática
Mestre em Engenharia Elétrica
Libros sobre el tema "Wage boards"
Division, Sri Lanka Kamkaru Depārtamēntuva Labour Standards. Wages boards-minimum wages, 2010. Colombo: Labour Standards Division, Dept. of Labour, 2010.
Buscar texto completoRevised minimum rates of wages under the wages boards (2013). Colombo: The Employers' Federation of Ceylon, 2013.
Buscar texto completoIndia. Wage Board for Working Journalists. Report of the Wage Boards for Working Journalists and Non-Journalist Newspaper & News Agency Employees: Manisana Wage Board. New Delhi: Govt. of India, Ministry of Labour, 2001.
Buscar texto completoIndia. Wage Board for Working Journalists. Report of the Wage Boards for Working Journalists and Non-journalist Newspaper Employees. New Delhi: Govt. of India, Ministry of Labour, 1989.
Buscar texto completoProgram, North Carolina Land Records Management. North Carolina registers of deeds salary study and recommendations: A report to the boards of county commissioners and registers of deeds of North Carolina. Raleigh, N.C: The Program, 1990.
Buscar texto completoTreble, John. Interpreting the record of wage negotiations under an arbitral regime: A game theoretic approach to the coal industry conciliation boards, 1893-1914. Hull: University of Hull, Department of Economics and Commerce, Labour Economics Unit, 1988.
Buscar texto completoDebbie, Budlender, Young Gordon y South Africa Wage Board, eds. Wage determinations in South Africa: An analysis of the wage rates set by the Wage Board. Cape Town: SALDRU, 1985.
Buscar texto completoScottish Executive. Rural Affairs Department. Agricultural wages in Scotland: The Scottish Agricultural Wages Board. Edinburgh: The Scottish Executive, 1998.
Buscar texto completoArtists, Disney Storybook y Disney Enterprises (1996-), eds. Wake up, Croc! New York, NY: LB Kids, 2014.
Buscar texto completoReport of the Third Central Wage Board for Sugar Industry. New Delhi: Govt. of India, Ministry of Labour, 1989.
Buscar texto completoCapítulos de libros sobre el tema "Wage boards"
Kiang, Jean-Fu y Ching-I. Cho. "Dielectric Resonator Antennas on Printed Circuit Boards". En Novel Technologies for Microwave and Millimeter — Wave Applications, 303–28. Boston, MA: Springer US, 2004. http://dx.doi.org/10.1007/978-1-4757-4156-8_14.
Texto completoStoneham, Edward B. "Millimeter-Wave Chip-on-Board Integration and Packaging". En RF and Microwave Microelectronics Packaging, 69–90. Boston, MA: Springer US, 2009. http://dx.doi.org/10.1007/978-1-4419-0984-8_4.
Texto completoDobson, John, Nicolette Gorospe y Seung-yeon Sunny Jeong. "Third Wave Feminism, Ethics of Care, and Corporate Governance: The Case of Gender Quotas on Corporate Boards". En Handbook of Virtue Ethics in Business and Management, 1–14. Dordrecht: Springer Netherlands, 2015. http://dx.doi.org/10.1007/978-94-007-6729-4_66-1.
Texto completoDobson, John, Nicolette Gorospe y Seung-yeon Sunny Jeong. "Third Wave Feminism, Ethics of Care, and Corporate Governance: The Case of Gender Quotas on Corporate Boards". En International Handbooks in Business Ethics, 283–96. Dordrecht: Springer Netherlands, 2017. http://dx.doi.org/10.1007/978-94-007-6510-8_66.
Texto completoWitting, M. y T. Pröpper. "Simulation of Electromagnetic Wave Propagation on a Printed Circuit Board with Linear and Nonlinear Discrete Loads". En Signal Propagation on Interconnects, 103–16. Boston, MA: Springer US, 1998. http://dx.doi.org/10.1007/978-1-4757-6512-0_9.
Texto completoMarshall, Shelley. "Displacement of Traditional Labour Laws". En Living Wage, 51–72. Oxford University Press, 2019. http://dx.doi.org/10.1093/oso/9780198830351.003.0004.
Texto completoMarshall, Shelley. "Complementary or Functional Rival? Labour Regulation of Garment Industry Workers in Cambodia by Better Factories Cambodia". En Living Wage, 122–42. Oxford University Press, 2019. http://dx.doi.org/10.1093/oso/9780198830351.003.0007.
Texto completoAdams, Natalie G. y James H. Adams. "Big Bulls in the Local Herd". En Just Trying to Have School, 51–75. University Press of Mississippi, 2018. http://dx.doi.org/10.14325/mississippi/9781496819536.003.0004.
Texto completoMadland, David. "The Plan". En Re-Union, 9–34. Cornell University Press, 2021. http://dx.doi.org/10.7591/cornell/9781501755378.003.0002.
Texto completoTreble, John G. "Interpreting the Record of Wage Negotiations Under an Arbitral Regime: A Game Theoretic Approach to the Coal Industry Conciliation Boards, 1893–1914". En Business History, 61–80. Routledge, 2018. http://dx.doi.org/10.4324/9781315035420-5.
Texto completoActas de conferencias sobre el tema "Wage boards"
Gopakumar, Sunil, Francois Billaut, Eric Fremd y Manthos Economou. "Pb-Free Process Development for a High End Storage Area Network Application". En ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/ipack2007-33857.
Texto completoLu, Albert Chee W., Wei Fan, Lai L. Wai, Toshiro Yamazaki, Jacinto Jun Jarcia y Kim H. Chin. "Design Optimization of Power Distribution Design Networks Using Embedded Passive Technology". En ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35221.
Texto completoArcipreste, Bruno, Delfim Soares, Luis Ribas y José Carlos Teixeira. "Numerical Modeling of Wave Soldering in PCB". En ASME 2014 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2014. http://dx.doi.org/10.1115/imece2014-39051.
Texto completoLing, Tianqing, Yu Zheng y Wenyao Cui. "A Study on Subarray Microwave Boards Interconnected by BGA". En 2020 International Conference on Microwave and Millimeter Wave Technology (ICMMT). IEEE, 2020. http://dx.doi.org/10.1109/icmmt49418.2020.9386408.
Texto completoLi, Song, Liu Ai-jun y Ma Yi-fei. "DiffServ-oriented On-board Switch". En 2007 International Conference on Microwave and Millimeter Wave Technology. IEEE, 2007. http://dx.doi.org/10.1109/icmmt.2007.381415.
Texto completoBoccia, Luigi, Emilio Arnieri y Giandomenico Amendola. "Via-stub effects in millimeter wave printed circuit boards". En 2019 IEEE Asia-Pacific Microwave Conference (APMC). IEEE, 2019. http://dx.doi.org/10.1109/apmc46564.2019.9038438.
Texto completoJie Li y Zhi Liang Wang. "Resonance suppression for power bus in printed circuit boards using EBG structures". En 2008 International Conference on Microwave and Millimeter Wave Technology (ICMMT). IEEE, 2008. http://dx.doi.org/10.1109/icmmt.2008.4540436.
Texto completoChoi, Chulchae, Yujie Liu, Lei Lin y Ray T. Chen. "Board level guided wave optical interconnects". En Integrated Optoelectronics Devices, editado por James G. Grote y Toshikuni Kaino. SPIE, 2003. http://dx.doi.org/10.1117/12.485823.
Texto completoXiong, Taotao, Quan Zhou, Tianyan Jiang, Xuefeng Li y Tianhe Yang. "Breakdown characteristics of printed circuit boards under pulsed square wave". En 2017 International Symposium on Electrical Insulating Materials (ISEIM). IEEE, 2017. http://dx.doi.org/10.23919/iseim.2017.8088743.
Texto completoHan, Xuliang, Gicherl Kim, Hitesh Gupta, G. Jack Lipovski y Ray T. Chen. "System demonstrator for board-to-board-level substrate-guided wave optoelectronic interconnections". En Symposium on Integrated Optics, editado por Suning Tang y Yao Li. SPIE, 2001. http://dx.doi.org/10.1117/12.428023.
Texto completoInformes sobre el tema "Wage boards"
Brodie, Katherine, Brittany Bruder, Richard Slocum y Nicholas Spore. Simultaneous mapping of coastal topography and bathymetry from a lightweight multicamera UAS. Engineer Research and Development Center (U.S.), agosto de 2021. http://dx.doi.org/10.21079/11681/41440.
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