Literatura académica sobre el tema "Thin film interconnects"
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Artículos de revistas sobre el tema "Thin film interconnects"
Smy, T., S. K. Dew y M. J. Brett. "Simulation of Microstructure and Surface Profiles of Thin Films for VLSI Metallization". MRS Bulletin 20, n.º 11 (noviembre de 1995): 65–69. http://dx.doi.org/10.1557/s0883769400045619.
Texto completoLacour, Stéphanie P., Joyelle Jones, Sigurd Wagner, Teng Li y Z. Suo. "ELASTOMERIC INTERCONNECTS". International Journal of High Speed Electronics and Systems 16, n.º 01 (marzo de 2006): 397–407. http://dx.doi.org/10.1142/s0129156406003722.
Texto completoCherenack, Kunigunde H., Thomas Kinkeldei, Christoph Zysset y Gerhard Tröster. "Woven Thin-Film Metal Interconnects". IEEE Electron Device Letters 31, n.º 7 (julio de 2010): 740–42. http://dx.doi.org/10.1109/led.2010.2048993.
Texto completoHwang, Byungil, Yurim Han y Paolo Matteini. "BENDING FATIGUE BEHAVIOR OF AG NANOWIRE/CU THIN-FILM HYBRID INTERCONNECTS FOR WEARABLE ELECTRONICS". Facta Universitatis, Series: Mechanical Engineering 20, n.º 3 (30 de noviembre de 2022): 553. http://dx.doi.org/10.22190/fume220730040h.
Texto completoBeers, Kimberly, Andrew E. Hollowell y G. Bahar Basim. "Thin Film Characterization on Cu/SnAg Solder Interface for 3D Packaging Technologies". MRS Advances 5, n.º 37-38 (2020): 1929–35. http://dx.doi.org/10.1557/adv.2020.309.
Texto completoThompson, Carl V. y James R. Lloyd. "Electromigration and IC Interconnects". MRS Bulletin 18, n.º 12 (diciembre de 1993): 19–25. http://dx.doi.org/10.1557/s088376940003904x.
Texto completoVidal, Melissa Mederos, Alexander Flacker y Ricardo Cotrin Teixeira. "Metallization of High Purity Al2O3 Substrate with Autocatalytic NiP Thin Films for Au Interconnections in MCM packaging technology." Journal of Integrated Circuits and Systems 15, n.º 2 (31 de julio de 2020): 1–4. http://dx.doi.org/10.29292/jics.v15i2.145.
Texto completoKononenko, O. V., V. N. Matveev y D. P. Field. "Electromigration properties of multigrain aluminum thin film conductors as influenced by grain boundary structure". Journal of Materials Research 16, n.º 7 (julio de 2001): 2124–29. http://dx.doi.org/10.1557/jmr.2001.0289.
Texto completoReddy, Mareddy Jayanth, Isak Almyren, Jan-Erik Svensson y Jan Froitzheim. "Strategies to Improve the Effectiveness of the Thin Film Coated Interconnects". ECS Transactions 111, n.º 6 (19 de mayo de 2023): 2243–51. http://dx.doi.org/10.1149/11106.2243ecst.
Texto completoSantos, Rúben F., Bruno M. C. Oliveira, Liliane C. G. Savaris, Paulo J. Ferreira y Manuel F. Vieira. "Seedless Cu Electroplating on Ru-W Thin Films for Metallisation of Advanced Interconnects". International Journal of Molecular Sciences 23, n.º 3 (8 de febrero de 2022): 1891. http://dx.doi.org/10.3390/ijms23031891.
Texto completoTesis sobre el tema "Thin film interconnects"
Calhoun, Kenneth Harold. "Thin film compound semiconductor devices for photonic interconnects". Diss., Georgia Institute of Technology, 1993. http://hdl.handle.net/1853/15478.
Texto completoModi, Mitul B. "Fracture in stress engineered, high density, thin film interconnects". Diss., Georgia Institute of Technology, 2003. http://hdl.handle.net/1853/16336.
Texto completoZheng, Jiantao. "Interfacial fracture of micro thin film interconnects under monotonic and cyclic loading". Diss., Atlanta, Ga. : Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/26489.
Texto completoCommittee Chair: Sitaraman, Suresh; Committee Member: Degertekin, Levent; Committee Member: McDowell, David; Committee Member: Tummala, Rao; Committee Member: Vandentop, Gilroy; Committee Member: Wang, Zhong Lin. Part of the SMARTech Electronic Thesis and Dissertation Collection.
Au, Yeung Billy. "Chemical Vapor Deposition of Thin Film Materials for Copper Interconnects in Microelectronics". Thesis, Harvard University, 2012. http://dissertations.umi.com/gsas.harvard:10227.
Texto completoChemistry and Chemical Biology
Seo, Sang-Woo. "Development of thin film photodetectors and their applications multispectral detection and high speed optical interconnections /". Diss., Available online, Georgia Institute of Technology, 2004:, 2003. http://etd.gatech.edu/theses/available/etd-04082004-180408/unrestricted/seo%5fsang-woo%5f200312%5fphd.pdf.
Texto completoGinga, Nicholas J. "On-chip dielectric cohesive fracture characterization and mitigation investigation through off-chip carbon nanotube interconnects". Diss., Georgia Institute of Technology, 2014. http://hdl.handle.net/1853/52225.
Texto completoCrozier, M. L. "Development of a novel series interconnect for thin-film photovoltaics". Thesis, Heriot-Watt University, 2017. http://hdl.handle.net/10399/3228.
Texto completoWeaver, David John. "A study of graphoepitaxially grown Al and Cu interconnects". Thesis, University of York, 1998. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.265566.
Texto completoWikström, Adam. "Modeling of stresses and deformation in thin film and interconnect line structures". Doctoral thesis, KTH, Solid Mechanics, 2001. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-3224.
Texto completoWikström, Adam. "Modeling of stresses and deformation in thin film and interconnect line structures /". Stockholm : Tekniska högsk, 2001. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-3224.
Texto completoLibros sobre el tema "Thin film interconnects"
International Symposium on Thin Film Materials, Processes, and Reliability (2003 Paris, France). Thin film materials, processes, and reliability: Plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium. Editado por Mathad G. S, Electrochemical Society. Dielectric Science and Technology Division., Electrochemical Society Electronics Division y Electrochemical Society Meeting. Pennington, NJ: Electrochemical Society, 2003.
Buscar texto completoRee, Moonhor. Low-k nanoporous interdielectrics: Materials, thin film fabrications, structures and properties. Hauppauge, N.Y: Nova Science Publishers, 2010.
Buscar texto completoS, Ho P., ed. Stress-induced phenomena in metallization: Seventh International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 14-16 June 2004. Melville, N.Y: American Institute of Physics, 2004.
Buscar texto completoR, Besser Paul y Materials Research Society. Meeting Symposium B, eds. Materials, technology and reliability for advanced interconnects--2005: Symposium held March 28-April 1, 2005, San Francisco, California, U.S.A. Warrendale, Pa: Materials Research Society, 2005.
Buscar texto completoT, Chen Ray y Society of Photo-optical Instrumentation Engineers., eds. Optoelectronic interconnects: 18-20 January 1993, Los Angeles, California. Bellingham, Wash., USA: SPIE, 1993.
Buscar texto completo1948-, Carter R. J., Materials Research Society Meeting y Symposim on Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics (2004 : San Francisco, Calif.), eds. Materials, technology, and reliability for advanced interconnects and low-k dielectrics--2004: Symposium held April 13-15, 2004, San Francisco, California, U.S.A. Warrendale, Pa: Materials Research Society, 2004.
Buscar texto completoElectromigration in thin films and electronic devices: Materials and reliability. Oxford: Woodhead Publishing, 2011.
Buscar texto completoGuynes, Sean y Dan Hassler-Forest, eds. Star Wars and the History of Transmedia Storytelling. NL Amsterdam: Amsterdam University Press, 2017. http://dx.doi.org/10.5117/9789462986213.
Texto completo(Editor), Paul S. Ho, Shefford P. Baker (Editor), Tomoji Nakamura (Editor) y Cynthia A. Volkert (Editor), eds. Stress-Induced Phenomena in Metallization: Seventh International Workshop on Stress-Induced Phenomena in Metallization (AIP Conference Proceedings / AIP ... Phenomena Metallizat.). American Institute of Physics, 2004.
Buscar texto completoVLSI and Post-CMOS Electronics: Devices, Circuits and Interconnects. Institution of Engineering & Technology, 2019.
Buscar texto completoCapítulos de libros sobre el tema "Thin film interconnects"
Roggen, J., E. Beyne, C. Truzzi, E. Ringoot y P. Pieters. "On Thin Film MCM-D Interconnects". En Microelectronic Interconnections and Assembly, 141–44. Dordrecht: Springer Netherlands, 1998. http://dx.doi.org/10.1007/978-94-011-5135-1_16.
Texto completoYokhin, Boris. "Thin Film Metrology - X-ray Methods". En Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications, 497–502. New York, NY: Springer New York, 2009. http://dx.doi.org/10.1007/978-0-387-95868-2_33.
Texto completoChen, Ray T. y Chulchae Choi. "Effects of Thermal-Via Structures on Thin Film VCSELs for a Fully Embedded Board-Level Optical Interconnection System". En Optical Interconnects, 75–85. Cham: Springer International Publishing, 2008. http://dx.doi.org/10.1007/978-3-031-02553-2_8.
Texto completoYoshimura, Tetsuzo. "Integrated Optical Interconnects and Optical Switching Systems". En Molecular Layer Deposition for Tailored Organic Thin-Film Materials, 253–74. Boca Raton: CRC Press, 2023. http://dx.doi.org/10.1201/9781003094012-11.
Texto completoIwasaki, Tomio y Hideo Miura. "Molecular Dynamics Analysis of Grain-Boundary Grooving in Thin-Film Interconnects for ULSIs". En Simulation of Semiconductor Processes and Devices 1998, 344–47. Vienna: Springer Vienna, 1998. http://dx.doi.org/10.1007/978-3-7091-6827-1_86.
Texto completoLee, Dong Nyung. "Annealing Textures of Thin Films and Copper Interconnects". En Materials Science Forum, 1–8. Stafa: Trans Tech Publications Ltd., 2005. http://dx.doi.org/10.4028/0-87849-960-1.1.
Texto completoGhosh, Kerenza. "Chapter 4. Exploring animality and childhood in stop-motion animation Prokofiev’s Peter & the Wolf". En Children’s Literature, Culture, and Cognition, 52–70. Amsterdam: John Benjamins Publishing Company, 2023. http://dx.doi.org/10.1075/clcc.16.04gho.
Texto completoNémeth, Károly. "Volcanic Geoheritage in the Light of Volcano Geology". En Geoheritage, Geoparks and Geotourism, 1–24. Cham: Springer International Publishing, 2022. http://dx.doi.org/10.1007/978-3-031-07289-5_1.
Texto completoGambino, Jeff. "Process Technology for Copper Interconnects". En Handbook of Thin Film Deposition, 147–94. Elsevier, 2018. http://dx.doi.org/10.1016/b978-0-12-812311-9.00006-2.
Texto completoGambino, Jeffrey. "Process Technology for Copper Interconnects". En Handbook of Thin Film Deposition, 221–69. Elsevier, 2012. http://dx.doi.org/10.1016/b978-1-4377-7873-1.00008-5.
Texto completoActas de conferencias sobre el tema "Thin film interconnects"
Ahmed, Abu Naim R., Shouyuan Shi, Sean Nelan, Andrew J. Mercante, Peng Yao y Dennis W. Prather. "Low-voltage modulators using thin-film lithium niobate". En Optical Interconnects XX, editado por Henning Schröder y Ray T. Chen. SPIE, 2020. http://dx.doi.org/10.1117/12.2542458.
Texto completoTu, K. N. "Electromigration in VLSI of thin film interconnects". En SPIE Proceedings, editado por Junhao Chu, Zongsheng Lai, Lianwei Wang y Shaohui Xu. SPIE, 2004. http://dx.doi.org/10.1117/12.607263.
Texto completoLiu, M., C. K. Hwangbo, L. Friedrich y G. I. Stegeman. "Preparation and Characterization of Single Crystal PTS Waveguide Film". En Organic Thin Films for Photonic Applications. Washington, D.C.: Optica Publishing Group, 1997. http://dx.doi.org/10.1364/otfa.1997.wc.2.
Texto completoGurrum, Siva P., William P. King, Yogendra K. Joshi y Koneru Ramakrishna. "Joule Heating and Thermal Conductivity Determination of Nanoscale Metallic Thin Films and Interconnects". En ASME 2005 International Mechanical Engineering Congress and Exposition. ASMEDC, 2005. http://dx.doi.org/10.1115/imece2005-82909.
Texto completoSimmons-Potter, K., B. G. Potter, M. B. Sinclair y D. C. Meister. "Photosensitive thin film materials and devices". En Bragg Gratings, Photosensitivity, and Poling in Glass Fibers and Waveguides. Washington, D.C.: Optica Publishing Group, 1997. http://dx.doi.org/10.1364/bgppf.1997.jsue.16.
Texto completoHsu, Yung-Yu, Kylie Lucas, Dan Davis, Rooz Ghaffari, Brian Elolampi, Mitul Dalal, John Work, Stephen Lee, Conor Rafferty y Kevin Dowling. "Design for reliability of multi-layer thin film stretchable interconnects". En 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC). IEEE, 2013. http://dx.doi.org/10.1109/ectc.2013.6575638.
Texto completoPriymak, A. N. "Novel Microdoped Al Alloys for Highly Reliable Thin Film Interconnects". En 1992 International Conference on Solid State Devices and Materials. The Japan Society of Applied Physics, 1992. http://dx.doi.org/10.7567/ssdm.1992.pa4-2.
Texto completoRobinson, M. J. "Thin film RF module design for high volume applications". En IEE Seminar on Packaging and Interconnects at Microwave and MM-Wave Frequencies. IEE, 2000. http://dx.doi.org/10.1049/ic:20000420.
Texto completoHuang, R., J. Liang, J. H. Pre´vost y Z. Suo. "Fracture of Thin Film Structures With Creeping Underlayer". En ASME 2003 International Mechanical Engineering Congress and Exposition. ASMEDC, 2003. http://dx.doi.org/10.1115/imece2003-42989.
Texto completoUra, Shogo, Kouji Shinoda, Chikara Ito, Daisuke Nii, Kenzo Nishio, Yasuhiro Awatsuji y Kenji Kintaka. "Signal Transmission from VCSEL in Thin-Film-Waveguide WDM Optical Interconnects Board". En Integrated Photonics and Nanophotonics Research and Applications. Washington, D.C.: OSA, 2007. http://dx.doi.org/10.1364/ipnra.2007.iwc4.
Texto completoInformes sobre el tema "Thin film interconnects"
Garcia, Lyan, James Rowland y Jeb Tingle. Evaluation of geocell-reinforced backfill for airfield pavement repair. Engineer Research and Development Center (U.S.), diciembre de 2021. http://dx.doi.org/10.21079/11681/42550.
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