Artículos de revistas sobre el tema "Thick Copper level"
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Li, Yi Nan, Z. L. Peng y J. C. Yan. "GTA Welding of Copper Thick Plates by Using ERCuTi Welding Materials". Materials Science Forum 697-698 (septiembre de 2011): 409–13. http://dx.doi.org/10.4028/www.scientific.net/msf.697-698.409.
Texto completoHosseini, Vahid A., Kristina Lindgren, Mattias Thuvander, Daniel Gonzalez, James Oliver y Leif Karlsson. "Nanoscale phase separations in as-fabricated thick super duplex stainless steels". Journal of Materials Science 56, n.º 21 (19 de abril de 2021): 12475–85. http://dx.doi.org/10.1007/s10853-021-06056-0.
Texto completoLoquet, Yannick, Cedric Perrot, Pierre Bouillon y Blaise Iteprat. "Chemical-Mechanical Planarization Compatible for Both Copper/Low k Level in a 90 nm Technology and Thick Copper Level in an RF Technology". ECS Transactions 3, n.º 41 (21 de diciembre de 2019): 1–8. http://dx.doi.org/10.1149/1.2819476.
Texto completoRichard, Claire Therese, M. M. Frank, Pascal Besson, E. Serret, N. Hotellier, Alessio Beverina, L. Dumas, Lucile Broussous, F. Kovacs y Thierry Billon. "Barrier and Copper Seedlayer Wet Etching". Solid State Phenomena 103-104 (abril de 2005): 361–64. http://dx.doi.org/10.4028/www.scientific.net/ssp.103-104.361.
Texto completoLee, Suhyun, Chien Wern y Sung Yi. "Novel Fabrication of Silver-Coated Copper Nanowires with Organic Compound Solution". Materials 15, n.º 3 (1 de febrero de 2022): 1135. http://dx.doi.org/10.3390/ma15031135.
Texto completoAoh, Jong Ning, Chih Wei Huang y Wei Ju Cheng. "Fabrication of Al6061-AMC by Adding Copper-Coated SiC Reinforcement by Friction Stir Processing (FSP)". Materials Science Forum 783-786 (mayo de 2014): 1721–28. http://dx.doi.org/10.4028/www.scientific.net/msf.783-786.1721.
Texto completoGorbatyuk, S. M., A. A. Gerasimova y N. N. Belkina. "Applying Thermal Coatings to Narrow Walls of the Continuous-Casting Molds". Materials Science Forum 870 (septiembre de 2016): 564–67. http://dx.doi.org/10.4028/www.scientific.net/msf.870.564.
Texto completoMantatova, N. V., Chuluunbatyn Oyuuntsetseg y S. Ye Sanzhiyeva. "TRACE ELEMENT CONTENT IN BLOOD OF CATTLE WITH ALIMENTARY ANEMIA AND HYPOCUPROSIS, AND IN SOIL SAMPLES OF THE TÖV AIMAG OF MONGOLIAAND THE KYAKHTINSKY DISTRICT OF THE REPUBLIC OF BURYATIA". Vestnik Altajskogo gosudarstvennogo agrarnogo universiteta, n.º 8 (2021): 61–66. http://dx.doi.org/10.53083/1996-4277-2021-202-08-61-66.
Texto completoPrem Kumar, T., V. Muthupriya, A. Antony Christian Rajaa, R. Sasirekab y R. Sumanc. "World Best Level Efficiency from An Engineered Novel SLG/Mo/p-Cu2ZnSn(Al)Se4/n-CdS/i-ZnO/Al:ZnO/Al Compound Semiconductor Hetero-Junction Thin Film Solar Cells". Shanlax International Journal of Arts, Science and Humanities 9, S1-May (14 de mayo de 2022): 41–46. http://dx.doi.org/10.34293/sijash.v9is1-may.5942.
Texto completoSchmidt, Ralf, Jens Palm y Jan M. Knaup. "The Pivotal Role of Uniformity of Electrolytic Deposition Processes to Improve the Reliability of Advanced Packaging". International Symposium on Microelectronics 2021, n.º 1 (1 de octubre de 2021): 000142–48. http://dx.doi.org/10.4071/1085-8024-2021.1.000142.
Texto completoVityaz, S. N. "Phytoremediation Potential of Flowering Plants in Relation to Copper". Bioscience Biotechnology Research Communications 14, n.º 4 (25 de diciembre de 2021): 1786–92. http://dx.doi.org/10.21786/bbrc/14.4.60.
Texto completoRydosz, Artur, Katarzyna Dyndał, Wojciech Andrysiewicz, Dominik Grochala y Konstanty Marszałek. "GLAD Magnetron Sputtered Ultra-Thin Copper Oxide Films for Gas-Sensing Application". Coatings 10, n.º 4 (11 de abril de 2020): 378. http://dx.doi.org/10.3390/coatings10040378.
Texto completoMironovs, Viktors, Alexey Tatarinov, Ervins Blumbergs y Irina Boiko. "Investigation of Properties of Coated Hollow Mini-Spheres". Key Engineering Materials 799 (abril de 2019): 26–30. http://dx.doi.org/10.4028/www.scientific.net/kem.799.26.
Texto completoLee, Seong Hee, Seung Zeon Han y Cha Yong Lim. "Nano-Structured High Purity Copper Processed by Accumulative Roll-Bonding". Key Engineering Materials 317-318 (agosto de 2006): 239–42. http://dx.doi.org/10.4028/www.scientific.net/kem.317-318.239.
Texto completoVanstreels, K., S. H. Brongersma, Zs Tokei, L. Carbonell, W. De Ceuninck, J. D’Haen y M. D’Olieslaeger. "Increasing the mean grain size in copper films and features". Journal of Materials Research 23, n.º 3 (marzo de 2008): 642–62. http://dx.doi.org/10.1557/jmr.2008.0080.
Texto completoTivol, W. F. y J. R. Fryer. "Electron diffraction of copper perfluorophthalocyanine on the HVEM". Proceedings, annual meeting, Electron Microscopy Society of America 53 (13 de agosto de 1995): 158–59. http://dx.doi.org/10.1017/s0424820100137161.
Texto completoSong, Jian, Songsong Yao, Quan Li, Jiamiao Ni, Zhuoxin Yan, Kunming Yang, Guisen Liu, Yue Liu y Jian Wang. "Reorientation Mechanisms of Graphene Coated Copper {001} Surfaces". Metals 13, n.º 5 (8 de mayo de 2023): 910. http://dx.doi.org/10.3390/met13050910.
Texto completoSkrynnikov, Alexander A., Anastasia I. Fedoseeva, Natalia B. Morozova, Alexey I. Dontsov, Aleksander V. Vvedenskii y Oleg A. Kozaderov. "Pd–Pb nanoscale films as surface modifiers of Pd,Cu alloy membranes used for hydrogen ultrapurification". Kondensirovannye sredy i mezhfaznye granitsy = Condensed Matter and Interphases 23, n.º 4 (24 de noviembre de 2021): 561–69. http://dx.doi.org/10.17308/kcmf.2021.23/3675.
Texto completoAnderson, Ron, John Benedict y Stanley J. Klepeis. "TEM microstructure of laser-trimmed Si-Cr devices". Proceedings, annual meeting, Electron Microscopy Society of America 47 (6 de agosto de 1989): 470–71. http://dx.doi.org/10.1017/s0424820100154329.
Texto completoLakhera, Nishant, Emmanuel Labroye, Catherine Pronga, Florence Molinie y Samuel Lesnakowski. "Reliability of Heavy Gage Aluminum Wire-bonds under High Temperature Aging". International Symposium on Microelectronics 2016, n.º 1 (1 de octubre de 2016): 000234–39. http://dx.doi.org/10.4071/isom-2016-wa54.
Texto completoGernhardt, Robert, Friedrich Müller, Markus Woehrmann, Habib Hichri, Karin Hauck, Michael Toepper, Markus Arendt y Klaus-Dieter Lang. "Ultra-fine Line Multi-Redistribution Layers with 10 μm Pitch Micro-Vias for Wafer Level and Panel Level Packaging realized by an innovative Excimer Laser Dual Damascene Process". International Symposium on Microelectronics 2017, n.º 1 (1 de octubre de 2017): 000120–25. http://dx.doi.org/10.4071/isom-2017-tp45_130.
Texto completoFukunaka, Yasuhiro. "(Invited) Gravitational Level Effects on Electrochemical Interfacial Phenomena". ECS Meeting Abstracts MA2023-02, n.º 66 (22 de diciembre de 2023): 3196. http://dx.doi.org/10.1149/ma2023-02663196mtgabs.
Texto completoBoettcher, Lars, D. Manessis, S. Karaszkiewicz, A. Ostmann y H. Reichl. "Next Generation System in a Package Manufacturing by Embedded Chip Technologies". Journal of Microelectronics and Electronic Packaging 7, n.º 3 (1 de julio de 2010): 131–37. http://dx.doi.org/10.4071/imaps.261.
Texto completoLevson, Victor M. "Quaternary geology of the Babine porphyry copper district: implications for geochemical exploration". Canadian Journal of Earth Sciences 38, n.º 4 (1 de abril de 2001): 733–49. http://dx.doi.org/10.1139/e00-102.
Texto completoLee, Chang-Chun y Jing-Yan He. "Interactive Field Effect of Atomic Bonding Forces on the Equivalent Elastic Modulus Estimation of Micro-Level Single-Crystal Copper by Utilizing Atomistic-Continuum Finite Element Simulation". Molecules 25, n.º 21 (3 de noviembre de 2020): 5107. http://dx.doi.org/10.3390/molecules25215107.
Texto completoBoettcher, Lars, S. Karaszkiewicz, D. Manessis y A. Ostmann. "Development of Embedded High Power Electronics Modules for Automotive Applications". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, DPC (1 de enero de 2013): 001717–43. http://dx.doi.org/10.4071/2013dpc-wp35.
Texto completoSergeev, N. N., A. N. Sergeev, S. N. Kutepov, A. E. Gvozdev, E. V. Ageev y D. S. Klement'yev. "APPLICATION OF TECHNOLOGY IN THE PRODUCTION OF «CORTICAL» METHOD OF FORMING INSERTS FOR DIE CASTING COPPER ALLOYS". Proceedings of the Southwest State University 22, n.º 3 (28 de junio de 2018): 67–83. http://dx.doi.org/10.21869/2223-1560-2018-22-3-67-83.
Texto completoBoettcher, Lars, A. Ostmann, D. Manessis, S. Karaszkiewicz y H. Reichl. "Next Generation System in a Package Manufacturing by Embedded Chip Technologies". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, DPC (1 de enero de 2010): 002075–103. http://dx.doi.org/10.4071/2010dpc-tha13.
Texto completoZhai, Yu, Ding Xu y Yan Zhang. "Ka-Band Lightweight High-Efficiency Wideband 3D Printed Reflector Antenna". International Journal of Antennas and Propagation 2017 (2017): 1–7. http://dx.doi.org/10.1155/2017/7360329.
Texto completoKotliarenko, Alisa, Oscar Azzolini, Giorgio Keppel, Cristian Pira y Juan Esposito. "Investigation of a Possible Material-Saving Approach of Sputtering Techniques for Radiopharmaceutical Target Production". Applied Sciences 11, n.º 19 (3 de octubre de 2021): 9219. http://dx.doi.org/10.3390/app11199219.
Texto completoEmon, Sharmin Zaman, Anowara Begum, Md Latiful Bari y K. Siddique e. Rabbani. "In-vitro inactivation of Escherichia coli of surface water using metals". Bangladesh Journal of Microbiology 39, n.º 2 (17 de mayo de 2023): 54–59. http://dx.doi.org/10.3329/bjm.v39i2.66265.
Texto completoWelker, T., S. Günschmann, N. Gutzeit y J. Müller. "Integration of Silver Heat Spreaders in LTCC utilizing Thick Silver Tape in the Co-fire Process". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, CICMT (1 de septiembre de 2015): 000062–66. http://dx.doi.org/10.4071/cicmt-tp13.
Texto completoMOURIER, Thierry, Stephane Minoret, Sabrina Fadloun, Larissa Djomeni, Sylvain Maitrejean, Steve Burgess, Andy Price, Chris Jones, Anne Roule y Laurent Vandroux. "Low temperature MOCVD TiN barrier deposition for high aspect ratio TSVs : A solution for 3D integration". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, DPC (1 de enero de 2013): 001322–42. http://dx.doi.org/10.4071/2013dpc-wp12.
Texto completoHofmann, Christian, Maulik Satwara, Martin Kroll, Sushant Panhale, Patrick Rochala, Maik Wiemer, Karla Hiller y Harald Kuhn. "Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized Coils". Micromachines 13, n.º 8 (12 de agosto de 2022): 1307. http://dx.doi.org/10.3390/mi13081307.
Texto completoBirsan, D. C. y G. Simion. "Numerical Modelling of Thermo-Mechanical Effects Developed in Resistance Spot Welding of E304 Steel with Copper Interlayer". Annals of Dunarea de Jos University of Galati. Fascicle XII, Welding Equipment and Technology 33 (15 de diciembre de 2022): 89–94. http://dx.doi.org/10.35219/awet.2022.07.
Texto completoWentlent, Luke A., James Wilcox y Mohammed Genanu. "Applicability of Selective Laser Reflow for Thin Die Stacking". International Symposium on Microelectronics 2018, n.º 1 (1 de octubre de 2018): 000741–47. http://dx.doi.org/10.4071/2380-4505-2018.1.000741.
Texto completoChen, Scott, Simon Wang, Coltrane Lee y John Hunt. "Low Cost Chip Last Fanout Package using Coreless Substrate". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, DPC (1 de enero de 2015): 000272–300. http://dx.doi.org/10.4071/2015dpc-ta24.
Texto completoChang, Y. J. y D. Kuhlmann-Wilsdorf. "Effects of Ambient Gases on Friction and Interfacial Resistance". Journal of Tribology 110, n.º 3 (1 de julio de 1988): 508–15. http://dx.doi.org/10.1115/1.3261660.
Texto completoPollard, Kimberly D., Nichelle Gilbert, Don Pfettscher y Spencer Hochstetler. "Proven Cleaning Technology Solutions for Lead-Free Micro-Bumping Processes". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (1 de enero de 2012): 002399–427. http://dx.doi.org/10.4071/2012dpc-tha24.
Texto completoPopov, Petko, Tudor Berza, Alexander Grubic y Dumitru Ioane. "Late Cretaceous Apuseni-Banat-Timok-Srednogorie (ABTS) magmatic and metallogenic belt in the Carpathian-Balkan orogen". Geologica Balcanica 32, n.º 2-4 (30 de diciembre de 2002): 145–63. http://dx.doi.org/10.52321/geolbalc.32.2-4.145.
Texto completoWojcik, Mariusz, Dariusz Witek, Tomasz Klej y Edward Ramotowski. "Embedding components in voltage converter PCB for size reduction and heat management". Circuit World 42, n.º 1 (1 de febrero de 2016): 17–22. http://dx.doi.org/10.1108/cw-10-2015-0048.
Texto completoMathew, Varughese, Sheila Chopin, Oliver Chyan, Nick Ross, Alex Lambert y Muthappan Asokan. "Aluminum bond pad corrosion of wirebond packages". International Symposium on Microelectronics 2016, n.º 1 (1 de octubre de 2016): 000227–33. http://dx.doi.org/10.4071/isom-2016-wa53.
Texto completoWillan, Robert C. R. "Structural setting and timing of hydrothermal veins and breccias on Hurd Peninsula, South Shetland Islands: a possible volcanic-related epithermal system in deformed turbidites". Geological Magazine 131, n.º 4 (julio de 1994): 465–83. http://dx.doi.org/10.1017/s0016756800012103.
Texto completoLanger, Gregor, Markus Leitgeb, Johann Nicolics, Michael Unger, Hans Hoschopf y Franz P. Wenzl. "Advanced Thermal Management Solutions on PCBs for High Power Applications". Journal of Microelectronics and Electronic Packaging 11, n.º 3 (1 de julio de 2014): 104–14. http://dx.doi.org/10.4071/imaps.422.
Texto completoChen, Scott, Simon Wang, Coltrane Lee, Adren Hsieh, John Hunt y William Chen. "Chip Last Fan Out as an Alternative to Chip First". International Symposium on Microelectronics 2015, n.º 1 (1 de octubre de 2015): 000245–50. http://dx.doi.org/10.4071/isom-2015-wa33.
Texto completoPanaskar, Nitin y Ravi Prakash Terkar. "Optimization of friction stir welding process parameters for AA6063-ETP copper using central composite design". World Journal of Engineering 17, n.º 4 (11 de mayo de 2020): 491–507. http://dx.doi.org/10.1108/wje-11-2019-0322.
Texto completoMathew, Varughese y Sheila Chopin. "Corrosion reliability of copper wirebond (CuWB) packages-Impact of voltage and corrosive ions from packaging materials". International Symposium on Microelectronics 2015, n.º 1 (1 de octubre de 2015): 000286–91. http://dx.doi.org/10.4071/isom-2015-wa51.
Texto completoBurrows, David R., Michael Rennison, David Burt y Rod Davies. "The Onto Cu-Au Discovery, Eastern Sumbawa, Indonesia: A Large, Middle Pleistocene Lithocap-Hosted High-Sulfidation Covellite-Pyrite Porphyry Deposit". Economic Geology 115, n.º 7 (1 de noviembre de 2020): 1385–412. http://dx.doi.org/10.5382/econgeo.4766.
Texto completoGupta, Atul, Eric Snyder, Christiane Gottschalke, Kevin Wenzel, James Gunn, Hao Lu, Yuya Suzuki, Venky Sundaram y Rao Tummala. "First Demonstration of Fine Line RDL Yield Enhancement using an Innovative Ozone Treatment Process for Panel Fan-out and Interposers". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2017, DPC (1 de enero de 2017): 1–19. http://dx.doi.org/10.4071/2017dpc-tp1_presentation2.
Texto completoMakkonen, Hannu V. y Pekka Tuisku. "Geology and crystallization conditions of the Särkiniemiintrusion and related nickel-copper ore, central Finland – implications for depth of emplacement of 1.88 Ga nickel-bearing intrusions". Bulletin of the Geological Society of Finland 92, n.º 2 (15 de diciembre de 2020): 111–30. http://dx.doi.org/10.17741/bgsf/92.2.003.
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