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Artículos de revistas sobre el tema "Thermal Arrest Memory Effect"

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Publicado: 6 de septiembre de 2023

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1

Madangopal, K., S. Banerjee y S. Lele. "Thermal arrest memory effect". Acta Metallurgica et Materialia 42, n.º 6 (junio de 1994): 1875–85. http://dx.doi.org/10.1016/0956-7151(94)90012-4.

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2

Rudajevova, A. "Thermal Arrest Memory Effect in Ni-Mn-Ga Alloys". Advances in Materials Science and Engineering 2008 (2008): 1–5. http://dx.doi.org/10.1155/2008/659145.

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Dilatation characteristics were measured to investigate the thermal arrest memory effect inNi53.6Mn27.1Ga19.3andNi54.2Mn29.4Ga16.4alloys. Interruption of the martensite-austenite phase transformation is connected with the reduction of the sample length after thermal cycle. If a total phase transformation took place in the complete thermal cycle following the interruption, then the sample length would return to its original length. Analysis of these results has shown that the thermal arrest memory effect is a consequence of a stress-focusing effect and shape memory effect. The stress-focusing effect occurs when the phase transformation propagates radially in a cylindrical sample from the surface, inward to the center. Evolution and release of the thermoelastic deformations in both alloys during heating and cooling are analyzed.
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3

Krishnan, Madangopal. "New observations on the thermal arrest memory effect in Ni–Ti alloys". Scripta Materialia 53, n.º 7 (octubre de 2005): 875–79. http://dx.doi.org/10.1016/j.scriptamat.2005.05.031.

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4

Wada, Kiyohide y Yong Liu. "Two-Way Memory Effect in NiTi Shape Memory Alloys". Advances in Science and Technology 59 (septiembre de 2008): 77–85. http://dx.doi.org/10.4028/www.scientific.net/ast.59.77.

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In general, the development mechanisms of TWME have long been understood as the nucleation and growth of preferentially oriented martensite guided by the internal stress. This work extends the study by investigating the effects of martensite deformation, constrained stress and retained martensite via partial reverse transformation through thermal arrest during heating on the stress-assisted two-way memory effect (SATWME) and TWME. It was observed that the generation of maximum SATWME was caused by the development of optimum internal stress. The increase of internal stress was accompanied by the increase of martensitic strain resulting from constrained cooling. When the martensitic strain exceeded the initial pre-strain, it directly influenced on the magnitudes of SATWME and TWME. The accommodation process of stress-assisted and detwinned martensite variants as a result of partial reverse transformation caused the formation of internal forward and back stresses. TWME was promoted by the dominant internal forward stress formation, while the dominance of internal back stress decreased the TWME by decreasing the martensitic strain.
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5

Jiang, J., L. S. Cui, Y. J. Zheng, D. Q. Jiang, Z. Y. Liu y K. Zhao. "Negative thermal expansion arrest point memory effect in TiNi shape memory alloy and NbTi/TiNi composite". Materials Science and Engineering: A 549 (julio de 2012): 114–17. http://dx.doi.org/10.1016/j.msea.2012.04.013.

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6

Meng, Qinglin, Hong Yang, Yinong Liu, Tae-hyun Nam y F. Chen. "Thermal arrest analysis of thermoelastic martensitic transformations in shape memory alloys". Journal of Materials Research 26, n.º 10 (19 de mayo de 2011): 1243–52. http://dx.doi.org/10.1557/jmr.2011.54.

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7

Arizmendi, C. M. y Fereydoon Family. "Memory correlation effect on thermal ratchets". Physica A: Statistical Mechanics and its Applications 251, n.º 3-4 (marzo de 1998): 368–81. http://dx.doi.org/10.1016/s0378-4371(97)00662-6.

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8

Gorina, I. I., S. S. Yakovenko y M. Yu Baranovich. "New Thermal Memory Effect in CLC". Molecular Crystals and Liquid Crystals Incorporating Nonlinear Optics 192, n.º 1 (1 de enero de 1990): 263–71. http://dx.doi.org/10.1080/00268949008035639.

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9

Minakawa, Kazunari, Neisei Hayashi, Yosuke Mizuno y Kentaro Nakamura. "Thermal Memory Effect in Polymer Optical Fibers". IEEE Photonics Technology Letters 27, n.º 13 (1 de julio de 2015): 1394–97. http://dx.doi.org/10.1109/lpt.2015.2421950.

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10

De, K., S. Majumdar y S. Giri. "Memory effect and inverse thermal hysteresis in La0.87Mn0.98Fe0.02Ox". Journal of Applied Physics 101, n.º 10 (15 de mayo de 2007): 103909. http://dx.doi.org/10.1063/1.2714645.

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11

Ren, X. C., S. M. Wang, C. W. Leung, F. Yan y P. K. L. Chan. "Thermal annealing and temperature dependences of memory effect in organic memory transistor". Applied Physics Letters 99, n.º 4 (25 de julio de 2011): 043303. http://dx.doi.org/10.1063/1.3617477.

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12

Glavatska, N., I. Glavatsky, G. Mogilny y V. Gavriljuk. "Magneto-thermal shape memory effect in Ni–Mn–Ga". Applied Physics Letters 80, n.º 19 (13 de mayo de 2002): 3533–35. http://dx.doi.org/10.1063/1.1478130.

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13

Fernández, J., A. Isalgue y R. Franch. "Effect of Thermal Cycling on CuAlAg Shape Memory Alloys". Materials Today: Proceedings 2 (2015): S805—S808. http://dx.doi.org/10.1016/j.matpr.2015.07.404.

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14

Galović, S., Z. Šoškić, M. Popović, D. Čevizović y Z. Stojanović. "Theory of photoacoustic effect in media with thermal memory". Journal of Applied Physics 116, n.º 2 (14 de julio de 2014): 024901. http://dx.doi.org/10.1063/1.4885458.

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15

Li, Jun, Xiao Yang Yi, Wei Hong Gao, Wen Long Song y Xiang Long Meng. "Temperature Memory Effect of Ti-Ni-Hf-Y High Temperature Shape Memory Alloy". Materials Science Forum 898 (junio de 2017): 598–603. http://dx.doi.org/10.4028/www.scientific.net/msf.898.598.

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Temperature memory effect in the solution-treated Ti-Ni-Hf-Y high temperature shape memory alloy (HTSMA) was investigated. The results showed that the temperature memory effect induced by the partial cycling could be detected in the subsequent complete transformation cycling for the solution-treated Ti-Ni-Hf-Y alloy. The temperature memory effect is one-time phenomenon. However, the temperature memory effect could last at least 20 times when the sample was employed 10 times complete thermal cycles. Multiple-steps temperaure memory effect can be observed as the sample undergoes the lower temperature partial thermal cycle in sequence. The mechanisms of the temperature memory effect were discussed in this paper.
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16

Seyidov, MirHasan Yu, Rauf A. Suleymanov y Emin Yakar. "Thermal expansion and memory effect in the ferroelectric-semiconductor TlGaSe2". Journal of Applied Physics 106, n.º 2 (15 de julio de 2009): 023532. http://dx.doi.org/10.1063/1.3182825.

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17

Wang, Lei, Jing Wen y Bangshu Xiong. "Nanoscale thermal cross-talk effect on phase-change probe memory". Nanotechnology 29, n.º 37 (6 de julio de 2018): 375201. http://dx.doi.org/10.1088/1361-6528/aac43f.

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18

Vinnikov, V. A. y V. L. Shkuratnik. "Theoretical model for the thermal emission memory effect in rocks". Journal of Applied Mechanics and Technical Physics 49, n.º 2 (marzo de 2008): 301–5. http://dx.doi.org/10.1007/s10808-008-0041-3.

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19

Baity-Jesi, Marco, Enrico Calore, Andres Cruz, Luis Antonio Fernandez, José Miguel Gil-Narvión, Antonio Gordillo-Guerrero, David Iñiguez et al. "The Mpemba effect in spin glasses is a persistent memory effect". Proceedings of the National Academy of Sciences 116, n.º 31 (16 de julio de 2019): 15350–55. http://dx.doi.org/10.1073/pnas.1819803116.

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The Mpemba effect occurs when a hot system cools faster than an initially colder one, when both are refrigerated in the same thermal reservoir. Using the custom-built supercomputer Janus II, we study the Mpemba effect in spin glasses and show that it is a nonequilibrium process, governed by the coherence length ξ of the system. The effect occurs when the bath temperature lies in the glassy phase, but it is not necessary for the thermal protocol to cross the critical temperature. In fact, the Mpemba effect follows from a strong relationship between the internal energy and ξ that turns out to be a sure-tell sign of being in the glassy phase. Thus, the Mpemba effect presents itself as an intriguing avenue for the experimental study of the coherence length in supercooled liquids and other glass formers.
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20

Chen, Shaojun, Zhankui Mei, Huanhuan Ren, Haitao Zhuo, Jianhong Liu y Zaochuan Ge. "Pyridine type zwitterionic polyurethane with both multi-shape memory effect and moisture-sensitive shape memory effect for smart biomedical application". Polymer Chemistry 7, n.º 37 (2016): 5773–82. http://dx.doi.org/10.1039/c6py01099g.

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The pyridine type zwitterionic SMPUs have thermal-induced dual-SMEs, triple-SMEs and quadruple-SMEs, and moisture-sensitive SMEs. Zwitterionic segments improve the biocompatibility of pyridine containing SMPUs.
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21

Gandhi, Ashish Chhaganlal, Tai-Yue Li, Jen-Chih Peng, Chin-Wei Wang, Ting Shan Chan, Jauyn Grace Lin y Sheng Yun Wu. "Concomitant Magnetic Memory Effect in CrO2–Cr2O3 Core–Shell Nanorods: Implications for Thermal Memory Devices". ACS Applied Nano Materials 2, n.º 12 (13 de noviembre de 2019): 8027–42. http://dx.doi.org/10.1021/acsanm.9b02084.

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22

Liu, Ning y Lilin Jiang. "Effect of microstructural features on the thermal conducting behavior of carbon nanofiber–reinforced styrene-based shape memory polymer composites". Journal of Intelligent Material Systems and Structures 31, n.º 14 (20 de junio de 2020): 1716–30. http://dx.doi.org/10.1177/1045389x20932216.

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This article presents a novel hierarchical micromechanics approach to carefully investigate the thermal conductivities of styrene-based shape memory polymer composites containing carbon nanofibers. The research is mainly focused on the simulation of carbon nanofiber/shape memory polymer interfacial thermal resistance and carbon nanofiber agglomeration as two critical microstructural features of carbon nanofiber–shape memory polymer composite materials. The computed results are compared with the available experimental measurements. It is found that both of those microstructural factors along with carbon nanofiber non-straight shape significantly affecting the thermal conducting behavior must be incorporated in the analysis to have a more realistic prediction. The thermal conductivity of carbon nanofiber–reinforced shape memory polymer composites reduces significantly due to the effects of carbon nanofiber/shape memory polymer interfacial resistance and carbon nanofiber agglomeration and waviness. It is suggested to uniformly disperse carbon nanofibers into the shape memory polymers and reduce interfacial resistance for improving the carbon nanofiber–styrene composite thermal properties. In addition, the present study reveals that the effective thermal conductivities of the shape memory polymer composites reinforced by aligned carbon nanofibers are greatly enhanced over those of the shape memory polymer composites containing randomly dispersed carbon nanofibers. The effects of percentage, waviness parameters, degree of agglomeration, material properties, length and diameter of carbon nanofibers as well as interfacial thermal resistance value on the thermal behavior of carbon nanofiber–reinforced styrene-based shape memory polymer composites are investigated.
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23

Han, Jun Hyun, Tae Ahn, Hyun Kim y Kwang Koo Jee. "Shape Memory Effect in Fe-Pd Magnetic Shape Memory Alloy Thin Films". Materials Science Forum 654-656 (junio de 2010): 2107–10. http://dx.doi.org/10.4028/www.scientific.net/msf.654-656.2107.

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The shape memory effect (SME) and magnetic shape memory effect (MSME) Fe-Pd thin film are using the film curvature method. The corresponding residual stress change due to theSME and MSME in Fe-Pd film is measuredduring thermal cycling and magnetic field changing. AFe-Pd thin film with a lateral composition gradient is deposited onto micromachined x7 cantilever beam arraysubstrate,such that each of the cantilever beams is coated with a film of different composition.There is abrupt stress change in only .1 at % Pd as the temperature of the film is cycled, and the corresponding stress change was measured as 0.16 GPa. The film with .4 at % Pd showsthe abrupt stress change at 0.7 Tesla, which means that the composition has the MSME.
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24

Zhang, Yong-Ci, Tsung-Ming Tsai, Wen-Chung Chen, Yung-Fang Tan, Li-Chuan Sun, Chuan-Wei Kuo y Chih-Chih Lin. "Thermal Field Effect in Resistive Random Access Memory With Sidewall Structures of Different Thermal Conductivity". IEEE Transactions on Electron Devices 69, n.º 6 (junio de 2022): 3147–50. http://dx.doi.org/10.1109/ted.2022.3169116.

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25

Samal, Sneha, Jan Tomáštík, Radim Čtvrtlík, Lukáš Václavek, Orsolya Molnárová y Petr Šittner. "Surface Deformation Recovery by Thermal Annealing of Thermal Plasma Sprayed Shape Memory NiTi Alloys". Coatings 13, n.º 2 (15 de febrero de 2023): 433. http://dx.doi.org/10.3390/coatings13020433.

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The shape memory effect is the most important attribute of shape memory alloys where material can recover to its initial shape after deformation by heating above its transformation temperature. In this article, the thermally induced recovery of well-defined microscopic deformation in a NiTi shape memory alloy was investigated. Surface deformation was performed by indenting the plasma sprayed NiTi shape memory alloy in a martensitic phase at room temperature using spherical indenters. In this article, a series of indentations, scratch lines and wear lines were made on the surface of two different NiTi shape memory alloys at the micrometre scale using two spherical indenters with different radii. Three-dimensional imaging of indentation topography using scanning confocal microscopy provided direct evidence of the thermally induced martensitic transformation of these plasma sprayed thick films allowing for partial recovery on the micro-scale. The partial recovery is achieved at various indentation depths and for different scratches and wear volumes.
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26

Zheng, Zhiqiang, Ping Huang y Fei Wang. "Shape memory effect based thermal cycling induced flexoelectricity for energy harvesting". Scripta Materialia 194 (marzo de 2021): 113701. http://dx.doi.org/10.1016/j.scriptamat.2020.113701.

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27

Zheng, Zhiqiang, Ping Huang y Fei Wang. "Shape memory effect based thermal cycling induced flexoelectricity for energy harvesting". Scripta Materialia 194 (marzo de 2021): 113701. http://dx.doi.org/10.1016/j.scriptamat.2020.113701.

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28

Jean, Ren-Der y Jing-Bang Duh. "The thermal cycling effect on Ti-Ni-Cu shape memory alloy". Scripta Metallurgica et Materialia 32, n.º 6 (marzo de 1995): 885–90. http://dx.doi.org/10.1016/0956-716x(95)93219-t.

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29

FLORES ZUNIGA, H., S. BELKAHLA y G. GUÉNIN. "THE THERMAL AGING AND TWO WAY MEMORY EFFECT (TWME) IN Cu-Al-Be SHAPE MEMORY ALLOY". Le Journal de Physique IV 01, n.º C4 (noviembre de 1991): C4–289—C5–294. http://dx.doi.org/10.1051/jp4:1991444.

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30

Min, Changchun, Wenjin Cui, Jianzhong Bei y Shenguo Wang. "Effect of comonomer on thermal/mechanical and shape memory property ofL-lactide-based shape-memory copolymers". Polymers for Advanced Technologies 18, n.º 4 (2007): 299–305. http://dx.doi.org/10.1002/pat.865.

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31

Gu, J., M. Emerman y S. Sandmeyer. "Small heat shock protein suppression of Vpr-induced cytoskeletal defects in budding yeast." Molecular and Cellular Biology 17, n.º 7 (julio de 1997): 4033–42. http://dx.doi.org/10.1128/mcb.17.7.4033.

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Expression of the auxiliary human immunodeficiency virus type 1 (HIV-1) protein Vpr causes arrest of primate host cells in G2. Expression of this protein in budding yeast has been previously reported to cause growth arrest and a large-cell phenotype. Investigation of the effect of Vpr expression in budding yeast, reported here, showed that it causes disruption of the actin cytoskeleton. Expression of HSP42, the gene for a small heat shock protein (sHSP), from a high-copy-number plasmid reversed this effect. The sHSPs are induced by exposure of cells to thermal, osmotic, and oxidative stresses and to mitogens. In animal cells, overexpression of sHSPs causes increased resistance to stress and stabilization of actin stress fibers. Yeast cells subjected to mild stress, such as shifting from 23 to 39 degrees C, arrest growth and then resume cell division. Growth arrest is accompanied by transient disorganization of the cytoskeleton. Yeast in which the HSP42 gene was disrupted and which was subjected to moderate thermal stress reorganized the actin cytoskeleton more slowly than did wild-type control cells. These results demonstrate that in yeast, as in metazoan cells, sHSPs promote maintenance of the actin cytoskeleton.
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32

Sundara Raman, R. "Shape Memory Alloys and their Thermal Characteristics". Asian Review of Mechanical Engineering 8, n.º 1 (5 de mayo de 2019): 39–43. http://dx.doi.org/10.51983/arme-2019.8.1.2461.

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The smart structures are sometimes called “intelligent” or “adaptive” structures, being a class of advanced structures having highly distributed actuators and sensors combined with structural functionality, distributed control functions and even computing architectures. The structures are able to vary their geometric configurations as well as their physical characteristics subject to control laws. These include piezoelectric, electrostrictives, magnetostrictives, ionic polymers, Shape Memory Alloys (SMA), and magnetic shape memory alloys (MSMAs). Development of smart structures involves the integration of active and passive material systems, often including the coupling of relevant mechanical, electrical, magnetic, thermal, or other physical properties. This can subject the active materials to large stress levels, cyclic loads, thermal loads, or environmental loads that result in non-linear responses and large variations in material properties. Smart materials are not only singular materials; rather, they are also hybrid composites or integrated systems of materials. Shape memory alloys (SMAs) are one of the major elements of smart hybrid composites because of their unique properties, such as shape memory effect, pseudo elasticity and high damping capacity. These properties in smart hybrid composites provide tremendous potential for creating new paradigms for material – structural interactions and demonstrate various successes in many engineering applications, such as vibration control, actuators in MEMS, and a variety of others.
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33

Hattori, Yuki, Takahiro Taguchi, Hee Kim y Shuichi Miyazaki. "Effect of Stoichiometry on Shape Memory Properties and Functional Stability of Ti–Ni–Pd Alloys". Materials 12, n.º 5 (8 de marzo de 2019): 798. http://dx.doi.org/10.3390/ma12050798.

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Ti–Ni–Pd shape memory alloys are promising candidates for high-temperature actuators operating at above 373 K. One of the key issues in developing high-temperature shape memory alloys is the degradation of shape memory properties and dimensional stabilities because plastic deformation becomes more pronounced at higher working temperature ranges. In this study, the effect of the Ti:(Ni + Pd) atomic ratio in TixNi70−xPd30 alloys with Ti content in the range from 49 at.% to 52 at.% on the martensitic transformation temperatures, microstructures and shape memory properties during thermal cycling under constant stresses were investigated. The martensitic transformation temperatures decreased with increasing or decreasing Ti content from the stoichiometric composition. In both Ti-rich and Ti-lean alloys, the transformation temperatures decreased during thermal cycling and the degree of decrease in the transformation temperatures became more pronounced as the composition of the alloy departed from the stoichiometric composition. Ti2Pd and P phases were formed during thermal cycling in Ti-rich and Ti-lean alloys, respectively. Both Ti-rich and Ti-lean alloys exhibited superior dimensional stabilities and excellent shape memory properties with higher recovery ratio and larger work output during thermal cycling under constant stresses when compared with the alloys with near-stoichiometric composition.
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34

Wang, Fei, Jin Sheng Liang, Qing Guo Tang, Na Wang y Li Wei Li. "Preparation and Properties of Thermal Insulation Latex Paint for Exterior Wall Based on Defibred Sepiolite and Hollow Glass Microspheres". Advanced Materials Research 58 (octubre de 2008): 103–8. http://dx.doi.org/10.4028/www.scientific.net/amr.58.103.

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Thermal insulating latex paint for exterior wall was prepared by water as dispersing media, polyacrylic emulsion as basic material, defibered sepiolite and hollow glass microspheres as main functional additives. The thermal insulation effect and mechanism were studied by thermal insulation effect testing device and visible light reflectance tester. The results show that the optimum contents of functional additives are as follows: 8% defibred sepiolite fibers, 6% hollow glass microspheres. The coating could arrest heat transmission and reflect visible light effectively.
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35

Xiao, Yao-Yu, Xiao-Lei Gong, Yang Kang, Zhi-Chao Jiang, Sheng Zhang y Bang-Jing Li. "Light-, pH- and thermal-responsive hydrogels with the triple-shape memory effect". Chem. Commun. 52, n.º 70 (2016): 10609–12. http://dx.doi.org/10.1039/c6cc03587f.

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36

Wang, Tzu-Han, You-Huei Chen, Chun-Wei Chang, Kuan-Ming Li, Jau-Horng Chen y Joseph Staudinger. "On the Thermal Memory Effect Reduction of Power Amplifiers Using Pulse Modulation". IEEE Microwave and Wireless Components Letters 29, n.º 4 (abril de 2019): 285–87. http://dx.doi.org/10.1109/lmwc.2019.2900152.

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37

Sugano, Ryo, Tomoya Tashiro, Tomohito Sekine, Kenjiro Fukuda, Daisuke Kumaki y Shizuo Tokito. "Enhanced memory characteristics in organic ferroelectric field-effect transistors through thermal annealing". AIP Advances 5, n.º 11 (noviembre de 2015): 117106. http://dx.doi.org/10.1063/1.4935342.

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38

Casati, Riccardo, Maurizio Vedani y Ausonio Tuissi. "Thermal cycling of stress-induced martensite for high-performance shape memory effect". Scripta Materialia 80 (junio de 2014): 13–16. http://dx.doi.org/10.1016/j.scriptamat.2014.02.003.

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39

Jiang, Daqiang, Lishan Cui, Yanjun Zheng y Xiaohua Jiang. "Effects of Thermal Cycling on the Temperature Memory Effect of TiNiNb Alloy". Journal of Materials Engineering and Performance 19, n.º 7 (28 de octubre de 2009): 1022–24. http://dx.doi.org/10.1007/s11665-009-9563-y.

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40

Folcia, C. L., M. J. Tello, J. M. Pérez-Mato y J. A. Zubillaga. "Thermal hysteresis and memory effect in the ferroelectric incommensurate tetramethylammonium tetrachloro cobaltate". Solid State Communications 60, n.º 7 (noviembre de 1986): 581–85. http://dx.doi.org/10.1016/0038-1098(86)90274-7.

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41

Aouadi, M. y A. Soufyane. "Decay of the timoshenko beam with thermal effect and memory boundary conditions". Journal of Dynamical and Control Systems 19, n.º 1 (enero de 2013): 33–46. http://dx.doi.org/10.1007/s10883-013-9163-x.

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42

Leonés, Adrián, Agueda Sonseca, Daniel López, Stefano Fiori y Laura Peponi. "Shape memory effect on electrospun PLA-based fibers tailoring their thermal response". European Polymer Journal 117 (agosto de 2019): 217–26. http://dx.doi.org/10.1016/j.eurpolymj.2019.05.014.

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43

Kizilaslan, Olcay. "Thermal hysteresis dependent magnetocaloric effect properties of Ni50-xCuxMn38Sn12B3 shape memory ribbons". Intermetallics 109 (junio de 2019): 135–38. http://dx.doi.org/10.1016/j.intermet.2019.03.016.

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44

Besseghini, S., E. Villa y A. Tuissi. "NiTiHf shape memory alloy: effect of aging and thermal cycling". Materials Science and Engineering: A 273-275 (diciembre de 1999): 390–94. http://dx.doi.org/10.1016/s0921-5093(99)00304-4.

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45

Vitel, Gigi, Bogdan Pricop, Marius-Gabriel Suru, Nicoleta Monica Lohan y Leandru-Gheorghe Bujoreanu. "Study of Temperature Memory Effect During the Thermal Cycling in Hydraulic Systems". Journal of Testing and Evaluation 44, n.º 4 (27 de enero de 2015): 20140138. http://dx.doi.org/10.1520/jte20140138.

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46

Kim, Won-Ho, Yoonseuk Choi y Jin-Hyuk Bae. "Thermal-Dependent Nonvolatile Memory Characteristics Based on Organic Ferroelectric Field-Effect Transistor". Journal of Nanoscience and Nanotechnology 13, n.º 10 (1 de octubre de 2013): 7080–82. http://dx.doi.org/10.1166/jnn.2013.7627.

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47

Araújo Mota, C. A., A. S. Cavalcanti Leal, C. J. Araújo, A. G. Barbosa de Lima y K. B. Moura da Silva. "Thermal Behaviour of Polymer Composite Reinforced with NiTi Shape Memory Alloys". Diffusion Foundations 10 (junio de 2017): 39–54. http://dx.doi.org/10.4028/www.scientific.net/df.10.39.

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Shape memory alloys (SMA) are materials with metallic characteristic able to recover a geometric shape previously established under heat effect. This differentiated property, combined with the mechanical characteristic allows its use in many industrial situations. Active composites are produced with the polymeric matrix and wire of shape memory alloy, combining the elastic properties of the composite and characteristics of the phase transformation, martensite and austenite of SMA with memory alloy effect. The phase transformations that occur in the alloy are thermal processes, characterized by an increase in temperature during processing. The heat is transmitted for matrix, resulting in loss of mechanical properties of the composite. In this context, this paper aims to numerically analyze heat transfer in an epoxy resin polymer matrix incorporating Ni-Ti alloy wire with shape memory effect using ANSYS CFX software.
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Lin, Guo Min y Yan Hua Li. "Research on Performance Features of Shape Memory Alloys". Advanced Materials Research 989-994 (julio de 2014): 652–55. http://dx.doi.org/10.4028/www.scientific.net/amr.989-994.652.

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The shape memory effect,the classification and the principle of shape memory alloys are introduced.The performance features such as melting point,density, resistivity,thermal conductivity, thermal expansion coefficient, phase change heattensile strength fatigue limit, grain size, transition temperature,lag size,one-way shape memory, two-way shape memory of Fe-based,Cu-based and Ti-Ni based shape memory alloys are researched in detail.
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49

TAKAHASHI, Y., R. ISHIKAWA y K. HONJO. "Accurate Distortion Prediction for Thermal Memory Effect in Power Amplifier Using Multi-Stage Thermal RC-Ladder Network". IEICE Transactions on Electronics E90-C, n.º 9 (1 de septiembre de 2007): 1658–63. http://dx.doi.org/10.1093/ietele/e90-c.9.1658.

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50

Sampath, V. "Effect of Thermal Processing on Microstructure and Shape-Memory Characteristics of a Copper–Zinc–Aluminum Shape-Memory Alloy". Materials and Manufacturing Processes 22, n.º 1 (enero de 2007): 9–14. http://dx.doi.org/10.1080/10407780601015808.

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