Artículos de revistas sobre el tema "Sn rich solders"
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Wang, Yao, Yuanxing Li, Dengquan Han, Sifu Qiu y Hui Chen. "Microstructure evolution and mechanical properties of 6N01S-T5 aluminum alloy joints with semi-solid solders by ultrasonic soldering". International Journal of Modern Physics B 33, n.º 01n03 (30 de enero de 2019): 1940027. http://dx.doi.org/10.1142/s0217979219400277.
Texto completoCanyook, Rungsinee y Kittichai Fakpan. "Effect of Cu and Ni Addition on Microstructure and Wettability of Sn-Zn Solders". Key Engineering Materials 728 (enero de 2017): 9–14. http://dx.doi.org/10.4028/www.scientific.net/kem.728.9.
Texto completoDu, Chang Hua, Yi Luo, Jian Su, Li Meng Yin, Zhen Kang Li y Bin Liu. "Microstructure and Mechanical Property of (Sn-9Zn0.05Ce)xBi Solder". Advanced Materials Research 189-193 (febrero de 2011): 3326–30. http://dx.doi.org/10.4028/www.scientific.net/amr.189-193.3326.
Texto completoHan, Dengquan, Yuanxing Li, Yongpan He, Sifu Qiu y Hui Chen. "Microstructure evolution and mechanical properties of 5083 aluminum alloy joints by ultrasonic soldering". International Journal of Modern Physics B 31, n.º 16-19 (26 de julio de 2017): 1744040. http://dx.doi.org/10.1142/s0217979217440404.
Texto completoCheng, Shou Chang y Kwang Lung Lin. "Interfacial evolution between Cu and Pb–free Sn–Zn–Ag–Al solders upon aging at 150 °C". Journal of Materials Research 18, n.º 8 (agosto de 2003): 1795–803. http://dx.doi.org/10.1557/jmr.2003.0249.
Texto completoMladenovic, Srba, Desimir Markovic, Ljubica Ivanic, Svetlana Ivanov y Zagorka Acimovic-Pavlovic. "The microstructure and properties of as-cast Sn-Zn-Bi solder alloys". Chemical Industry 66, n.º 4 (2012): 595–600. http://dx.doi.org/10.2298/hemind111219015m.
Texto completoUenishi, Keisuke y Kojiro F. Kobayashi. "Interfacial Reaction between Sn-Ag Based Solders and Au/Ni Alloy Platings". Materials Science Forum 502 (diciembre de 2005): 411–16. http://dx.doi.org/10.4028/www.scientific.net/msf.502.411.
Texto completoChin, L. T., Peter Hing, K. S. Tan y A. O. Olofinjana. "Overview and Functional Characterization of Pb–Free Solders". Defect and Diffusion Forum 297-301 (abril de 2010): 169–79. http://dx.doi.org/10.4028/www.scientific.net/ddf.297-301.169.
Texto completoYoon, Jeong-Won, Jun Hyung Lim, Hoo-Jeong Lee, Jinho Joo, Seung-Boo Jung y Won-Chul Moon. "Interfacial reactions and joint strength of Sn–37Pb and Sn–3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150 °C". Journal of Materials Research 21, n.º 12 (diciembre de 2006): 3196–204. http://dx.doi.org/10.1557/jmr.2006.0390.
Texto completoSong, Jenn-Ming, Yu-Lin Shen y Hsin-Yi Chuang. "Sedimentation of Cu-rich intermetallics in liquid lead-free solders". Journal of Materials Research 22, n.º 12 (diciembre de 2007): 3432–39. http://dx.doi.org/10.1557/jmr.2007.0431.
Texto completoAbd El-Rehim, Alaa F., Ashraf S. Mahmoud y Shereen M. Abdelaziz. "Influence of Sb2O3 Nanoparticles Addition on the Thermal, Microstructural and Creep Properties of Hypoeutectic Sn–Bi Solder Alloy". Science of Advanced Materials 13, n.º 1 (1 de enero de 2021): 20–29. http://dx.doi.org/10.1166/sam.2021.3831.
Texto completoLiu, Xiao Ying, Ming Liang Huang y Ning Zhao. "Interfacial Reactions between Sn-Ag-Cu-Fe Composite Solder and Cu Substrate". Advanced Materials Research 706-708 (junio de 2013): 138–41. http://dx.doi.org/10.4028/www.scientific.net/amr.706-708.138.
Texto completoJiang, Tong, Fubin Song, Chaoran Yang y S. W. Ricky Lee. "Nanoindentation Characterization of Lead-free Solders and Intermetallic Compounds under Thermal Aging". International Symposium on Microelectronics 2010, n.º 1 (1 de enero de 2010): 000314–18. http://dx.doi.org/10.4071/isom-2010-tp4-paper5.
Texto completoSun, Jia, Huaxin Liang, Shaofu Sun, Juntao Hu, Chunyu Teng, Lingyan Zhao y Hailong Bai. "Pattern Formation by Spinodal Decomposition in Ternary Lead-Free Sn-Ag-Cu Solder Alloy". Metals 12, n.º 10 (29 de septiembre de 2022): 1640. http://dx.doi.org/10.3390/met12101640.
Texto completoChen, Kang I., Shou Chang Cheng y Chin Hsiang Cheng. "The Effects of Small Additions Ga and Al on the Microstructure and Tensile Properties of Sn-Zn Based Lead-Free Solders". Advanced Materials Research 800 (septiembre de 2013): 265–70. http://dx.doi.org/10.4028/www.scientific.net/amr.800.265.
Texto completoJang, Jin-Wook, Ananda P. De Silva, Jong-Kai Lin y Darrel R. Frear. "Tensile fracture behaviors of solid-state-annealed eutectic SnPb and lead-free solder flip chip bumps". Journal of Materials Research 19, n.º 6 (junio de 2004): 1826–34. http://dx.doi.org/10.1557/jmr.2004.0235.
Texto completoLi, Chia-Ying y Jenq-Gong Duh. "Phase Equilibria in the Sn-Rich Corner of the Sn–Cu–Ni Ternary Alloy System at 240 °C". Journal of Materials Research 20, n.º 11 (noviembre de 2005): 3118–24. http://dx.doi.org/10.1557/jmr.2005.0391.
Texto completoSummers, T. S. E. y J. W. Morris. "Isothermal Fatigue Behavior of Sn-Pb Solder Joints". Journal of Electronic Packaging 112, n.º 2 (1 de junio de 1990): 94–99. http://dx.doi.org/10.1115/1.2904364.
Texto completoIslam, M. N., Y. C. Chan y A. Sharif. "Interfacial reactions of Sn–Cu and Sn–Pb–Ag solder with Au/Ni during extended time reflow in ball grid array packages". Journal of Materials Research 19, n.º 10 (1 de octubre de 2004): 2897–904. http://dx.doi.org/10.1557/jmr.2004.0399.
Texto completoChoi, Hyeokgi, Chang-Lae Kim y Yoonchul Sohn. "Diffusion Barrier Properties of the Intermetallic Compound Layers Formed in the Pt Nanoparticles Alloyed Sn-58Bi Solder Joints Reacted with ENIG and ENEPIG Surface Finishes". Materials 15, n.º 23 (26 de noviembre de 2022): 8419. http://dx.doi.org/10.3390/ma15238419.
Texto completoAthichalinthorn, Panaaek, Jidsucha Darayen, Wachira Puttichaem, Ratchatee Techapiesancharoenkij y Boonrat Lohwongwatana. "The Thermal-Aging Effect on the Microstructure Evolution and Shear Strength of the Sn-Rich Au-Sn Soldering between Altic and Si Substrate in Microelectronics". Key Engineering Materials 751 (agosto de 2017): 3–8. http://dx.doi.org/10.4028/www.scientific.net/kem.751.3.
Texto completoRerek, T., L. Skowronski, M. Kobierski, M. K. Naparty y B. Derkowska-Zielinska. "Microstructure and opto-electronic properties of Sn-rich Au-Sn diffusive solders". Applied Surface Science 451 (septiembre de 2018): 32–39. http://dx.doi.org/10.1016/j.apsusc.2018.04.209.
Texto completoTang, Wenming, Anqiang He, Qi Liu y Douglas G. Ivey. "Fabrication and Microstructures of Sequentially Electroplated Sn-Rich Au-Sn Alloy Solders". Journal of Electronic Materials 37, n.º 6 (27 de febrero de 2008): 837–44. http://dx.doi.org/10.1007/s11664-008-0401-z.
Texto completoChuang, C. M., T. S. Lui y L. H. Chen. "Effect of lead content on vibration fracture behavior of Pb–Sn eutectic solder". Journal of Materials Research 16, n.º 9 (septiembre de 2001): 2644–52. http://dx.doi.org/10.1557/jmr.2001.0363.
Texto completoZhang, Hongwen, Samuel Lytwynec, Huaguang Wang, Jie Geng, Francis Mutuku y Ning-Cheng Lee. "A Novel Design of High-Temperature Lead-Free Solders for Die-Attachment in Power Discrete Applications". International Symposium on Microelectronics 2021, n.º 1 (1 de octubre de 2021): 000356–61. http://dx.doi.org/10.4071/1085-8024-2021.1.000356.
Texto completoSidhu, R. S. y N. Chawla. "Thermal Fatigue Behavior of Sn-Rich (Pb-Free) Solders". Metallurgical and Materials Transactions A 39, n.º 4 (16 de febrero de 2008): 799–810. http://dx.doi.org/10.1007/s11661-008-9480-y.
Texto completoHirose, Akio, Tomoyuki Hiramori, Mototaka Ito, Yoshiharu Tanii y Kojiro F. Kobayashi. "Interfacial Microstructure and Joint Strength of Sn-Ag and Sn-Ag-Cu Lead Free Solders Reflowed on Cu/Ni-P/Au Metallization". Materials Science Forum 512 (abril de 2006): 355–60. http://dx.doi.org/10.4028/www.scientific.net/msf.512.355.
Texto completoShaik Osman, Shazlin y Mohd Sharif Nurulakmal. "Effect of Alloying Elements on the Microstructure and IMC Formation of SnAgCu Solder on Ni (P) Substrate". Advanced Materials Research 545 (julio de 2012): 251–55. http://dx.doi.org/10.4028/www.scientific.net/amr.545.251.
Texto completoPeng, Yan Zhi, Cai Ju Li, Jiao Jiao Yang, Jia Tao Zhang, Ju Bo Peng, Guang Ji Zhou, Cun Ji Pu y Jian Hong Yi. "Effects of Bismuth on the Microstructure, Properties, and Interfacial Reaction Layers of Sn-9Zn-xBi Solders". Metals 11, n.º 4 (26 de marzo de 2021): 538. http://dx.doi.org/10.3390/met11040538.
Texto completoIslam, M. N., Y. C. Chan, M. O. Alam y A. Sharif. "Comparative Study of the Dissolution Kinetics of Electrolytic Ni and Electroless NiP Layers by Molten Sn3.5Ag Solder Alloy". Journal of Electronic Packaging 127, n.º 4 (22 de diciembre de 2004): 365–69. http://dx.doi.org/10.1115/1.2056567.
Texto completoHe, M., A. Kumar, P. T. Yeo, G. J. Qi y Z. Chen. "Interfacial reaction between Sn-rich solders and Ni-based metallization". Thin Solid Films 462-463 (septiembre de 2004): 387–94. http://dx.doi.org/10.1016/j.tsf.2004.05.062.
Texto completoHuang, M. L., F. F. Huang y Y. C. Yang. "Composition design of Sn-rich Sn–Au–Ag solders using cluster-plus-glue-atom model". Journal of Materials Science: Materials in Electronics 28, n.º 15 (27 de abril de 2017): 11192–201. http://dx.doi.org/10.1007/s10854-017-6907-5.
Texto completoVentura, Tina, Young Hee Cho y Arne K. Dahle. "Solidification Mechanisms in the Sn-Cu-Ni Lead-Free Solder System". Materials Science Forum 654-656 (junio de 2010): 1381–84. http://dx.doi.org/10.4028/www.scientific.net/msf.654-656.1381.
Texto completoHuang, M. L., Y. C. Yang, Y. Chen y C. Dong. "Microstructure and mechanical properties of Sn-rich Au-Sn solders designed using cluster-plus-glue-atom model". Materials Science and Engineering: A 664 (mayo de 2016): 221–26. http://dx.doi.org/10.1016/j.msea.2016.03.123.
Texto completoCheung, Noé, Amauri Garcia y José Eduardo Spinelli. "Microstructure and Mechanical Properties of Directionally Solidified Unmodified and Ni-Modified Sn-0.7wt%Cu Lead-Free Solder Alloy". Defect and Diffusion Forum 333 (enero de 2013): 107–15. http://dx.doi.org/10.4028/www.scientific.net/ddf.333.107.
Texto completoYang, Wenchao, Jun Mao, Yueyuan Ma, Shuyuan Yu, Hongping He, Da Qi y Yongzhong Zhan. "Effects of Yttrium Addition on the Microstructure Evolution and Electrochemical Corrosion of SN-9Zn Lead-Free Solders Alloy". Materials 14, n.º 10 (14 de mayo de 2021): 2549. http://dx.doi.org/10.3390/ma14102549.
Texto completoPietrzak, K., A. Klasik, M. Maj, A. Wojciechowski y N. Sobczak. "Microstructural Aspects of Fatigue Parameters of Lead-Free Sn-Zn Solders with Various Zn Content". Archives of Foundry Engineering 17, n.º 1 (1 de marzo de 2017): 131–36. http://dx.doi.org/10.1515/afe-2017-0024.
Texto completoCho, Moon Gi, Hyun You Kim, Sun-Kyoung Seo y Hyuck Mo Lee. "Enhancement of heterogeneous nucleation of β-Sn phases in Sn-rich solders by adding minor alloying elements with hexagonal closed packed structures". Applied Physics Letters 95, n.º 2 (13 de julio de 2009): 021905. http://dx.doi.org/10.1063/1.3177335.
Texto completoCho, Moon Gi, Sun-Kyoung Seo y Hyuck Mo Lee. "Undercooling, Microstructures and Hardness of Sn-Rich Pb-Free Solders on Cu-xZn Alloy Under Bump Metallurgies". MATERIALS TRANSACTIONS 50, n.º 9 (2009): 2291–96. http://dx.doi.org/10.2320/matertrans.m2009127.
Texto completoWentlent, Luke A., James Wilcox y Xuanyi Ding. "Strain Rate Sensitivity of Mixed SAC-SnBi Solder Joints". International Symposium on Microelectronics 2019, n.º 1 (1 de octubre de 2019): 000480–87. http://dx.doi.org/10.4071/2380-4505-2019.1.000480.
Texto completoSaud, N. y A. Jalar. "Sn-rich phase coarsening during isothermal annealing for as-soldered Sn–Ag–Cu solder". Journal of Materials Science: Materials in Electronics 21, n.º 10 (10 de diciembre de 2009): 1083–89. http://dx.doi.org/10.1007/s10854-009-0032-z.
Texto completoShen, Yu-An y John A. Wu. "Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints". Materials 15, n.º 14 (21 de julio de 2022): 5086. http://dx.doi.org/10.3390/ma15145086.
Texto completoScandurra, Antonino, Antonino Licciardello, Alberto Torrisi, Antonio La Mantia y Orazio Puglisi. "Fatigue failure in Pb–Sn–Ag alloy during plastic deformation: A 3D-SIMS imaging study". Journal of Materials Research 7, n.º 9 (septiembre de 1992): 2395–402. http://dx.doi.org/10.1557/jmr.1992.2395.
Texto completoGan, Guisheng, Da-quan Xia, Xin Liu, Cong Liu, Hanlin Cheng, Zhongzhen Ming, Haoyang Gao, Dong-hua Yang y Yi-ping Wu. "Influence of thermal shock cycles on Sn-37Pb solder bumps". Soldering & Surface Mount Technology 31, n.º 2 (1 de abril de 2019): 85–92. http://dx.doi.org/10.1108/ssmt-08-2018-0026.
Texto completoChantaramanee, Suchart, Worawit Sriwittayakul y Phairote Sungkhaphaitoon. "Effects of Antimony and Indium Addition on Wettability and Interfacial Reaction of Sn-3.0Ag-0.5Cu Lead Free Solder on Copper Substrate". Materials Science Forum 928 (agosto de 2018): 188–93. http://dx.doi.org/10.4028/www.scientific.net/msf.928.188.
Texto completoSong, Ho Geon, John W Morris, Jr. y Fay Hua. "Anomalous Creep in Sn-Rich Solder Joints". MATERIALS TRANSACTIONS 43, n.º 8 (2002): 1847–53. http://dx.doi.org/10.2320/matertrans.43.1847.
Texto completoSungkhaphaitoon, Phairote y Thawatchai Plookphol. "Effect of Cooling Rate on the Microstructure and Mechanical Properties of Sn-0.7wt.%Cu Solder Alloy". Key Engineering Materials 675-676 (enero de 2016): 513–16. http://dx.doi.org/10.4028/www.scientific.net/kem.675-676.513.
Texto completoLeong, Wai Keong, Ahmad Azmin Mohamad y Muhammad Firdaus Mohd Nazeri. "Effect of the nickel coated precipitated calcium carbonate addition on microstructure, phase and wettability of Sn-9Zn solder". Journal of Physics: Conference Series 2169, n.º 1 (1 de enero de 2022): 012031. http://dx.doi.org/10.1088/1742-6596/2169/1/012031.
Texto completoLiu, Yeh-Hsiu y Kwang-Lung Lin. "Damages and Microstructural Variation of High-lead and Eutectic SnPb Composite Flip Chip Solder Bumps Induced by Electromigration". Journal of Materials Research 20, n.º 8 (1 de agosto de 2005): 2184–93. http://dx.doi.org/10.1557/jmr.2005.0271.
Texto completoChantaramanee, Suchart, Phairote Sungkhaphaitoon y Thawatchai Plookphol. "Influence of Indium and Antimony Additions on Mechanical Properties and Microstructure of Sn-3.0Ag-0.5Cu Lead Free Solder Alloys". Solid State Phenomena 266 (octubre de 2017): 196–200. http://dx.doi.org/10.4028/www.scientific.net/ssp.266.196.
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