Literatura académica sobre el tema "Sn rich solders"
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Artículos de revistas sobre el tema "Sn rich solders"
Wang, Yao, Yuanxing Li, Dengquan Han, Sifu Qiu y Hui Chen. "Microstructure evolution and mechanical properties of 6N01S-T5 aluminum alloy joints with semi-solid solders by ultrasonic soldering". International Journal of Modern Physics B 33, n.º 01n03 (30 de enero de 2019): 1940027. http://dx.doi.org/10.1142/s0217979219400277.
Texto completoCanyook, Rungsinee y Kittichai Fakpan. "Effect of Cu and Ni Addition on Microstructure and Wettability of Sn-Zn Solders". Key Engineering Materials 728 (enero de 2017): 9–14. http://dx.doi.org/10.4028/www.scientific.net/kem.728.9.
Texto completoDu, Chang Hua, Yi Luo, Jian Su, Li Meng Yin, Zhen Kang Li y Bin Liu. "Microstructure and Mechanical Property of (Sn-9Zn0.05Ce)xBi Solder". Advanced Materials Research 189-193 (febrero de 2011): 3326–30. http://dx.doi.org/10.4028/www.scientific.net/amr.189-193.3326.
Texto completoHan, Dengquan, Yuanxing Li, Yongpan He, Sifu Qiu y Hui Chen. "Microstructure evolution and mechanical properties of 5083 aluminum alloy joints by ultrasonic soldering". International Journal of Modern Physics B 31, n.º 16-19 (26 de julio de 2017): 1744040. http://dx.doi.org/10.1142/s0217979217440404.
Texto completoCheng, Shou Chang y Kwang Lung Lin. "Interfacial evolution between Cu and Pb–free Sn–Zn–Ag–Al solders upon aging at 150 °C". Journal of Materials Research 18, n.º 8 (agosto de 2003): 1795–803. http://dx.doi.org/10.1557/jmr.2003.0249.
Texto completoMladenovic, Srba, Desimir Markovic, Ljubica Ivanic, Svetlana Ivanov y Zagorka Acimovic-Pavlovic. "The microstructure and properties of as-cast Sn-Zn-Bi solder alloys". Chemical Industry 66, n.º 4 (2012): 595–600. http://dx.doi.org/10.2298/hemind111219015m.
Texto completoUenishi, Keisuke y Kojiro F. Kobayashi. "Interfacial Reaction between Sn-Ag Based Solders and Au/Ni Alloy Platings". Materials Science Forum 502 (diciembre de 2005): 411–16. http://dx.doi.org/10.4028/www.scientific.net/msf.502.411.
Texto completoChin, L. T., Peter Hing, K. S. Tan y A. O. Olofinjana. "Overview and Functional Characterization of Pb–Free Solders". Defect and Diffusion Forum 297-301 (abril de 2010): 169–79. http://dx.doi.org/10.4028/www.scientific.net/ddf.297-301.169.
Texto completoYoon, Jeong-Won, Jun Hyung Lim, Hoo-Jeong Lee, Jinho Joo, Seung-Boo Jung y Won-Chul Moon. "Interfacial reactions and joint strength of Sn–37Pb and Sn–3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150 °C". Journal of Materials Research 21, n.º 12 (diciembre de 2006): 3196–204. http://dx.doi.org/10.1557/jmr.2006.0390.
Texto completoSong, Jenn-Ming, Yu-Lin Shen y Hsin-Yi Chuang. "Sedimentation of Cu-rich intermetallics in liquid lead-free solders". Journal of Materials Research 22, n.º 12 (diciembre de 2007): 3432–39. http://dx.doi.org/10.1557/jmr.2007.0431.
Texto completoTesis sobre el tema "Sn rich solders"
Kanjilal, Anwesha. "Effect of Length Scale on High Temperature Mechanical Behavior of Sn-Cu Joints: A Mechanics and Material Science Based Treatment". Thesis, 2022. https://etd.iisc.ac.in/handle/2005/5755.
Texto completoCapítulos de libros sobre el tema "Sn rich solders"
Zhu, Q. S., H. Y. Liu, L. Zhang, Q. L. Zeng, Z. G. Wang y J. K. Shang. "Electromechanical Coupling in Sn-Rich Solder Interconnects". En Lead-Free Solders: Materials Reliability for Electronics, 251–71. Chichester, UK: John Wiley & Sons, Ltd, 2012. http://dx.doi.org/10.1002/9781119966203.ch10.
Texto completoActas de conferencias sobre el tema "Sn rich solders"
He, A. y D. G. Ivey. "Electrodeposition of Au-Sn alloys for lead-free solders: Au-rich eutectic and Sn-rich eutectic compositions". En 2013 IEEE 15th International Symposium and Exhibition on Advanced Packaging Materials (APM 2013). IEEE, 2013. http://dx.doi.org/10.1109/isapm.2013.6510388.
Texto completoWang, Pin J., Jong S. Kim, Dongwook Kim y Chin C. Lee. "Fluxless Bonding of Silicon to Molybdenum Using Sn-rich Solders". En 2007 Proceedings 57th Electronic Components and Technology Conference. IEEE, 2007. http://dx.doi.org/10.1109/ectc.2007.374005.
Texto completoLakhkar, Nikhil, Mohammad M. Hossain, Puligandla Viswanadham y Dereje Agonafer. "Mechanical Characterization of Sn-Ag-Cu Solder With Gold Addition Under Tensile Loading". En ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/ipack2007-33543.
Texto completoPark, Seungbae, Ramji Dhakal, Lawrence Lehman y Eric Cotts. "Grain Formation and Intergrain Stresses in a Sn-Ag-Cu Solder Ball". En ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. ASMEDC, 2005. http://dx.doi.org/10.1115/ipack2005-73058.
Texto completoBunis, Carl B. "Characterization of Gold Embrittlement in Solder Joints". En ISTFA 1999. ASM International, 1999. http://dx.doi.org/10.31399/asm.cp.istfa1999p0305.
Texto completoSchoeller, Harry, Shubhra Bansal, Aaron Knobloch, David Shaddock y Junghyun Cho. "Effects of Microstructure Evolution on High-Temperature Mechanical Deformation of 95Sn-5Sb". En ASME 2008 International Mechanical Engineering Congress and Exposition. ASMEDC, 2008. http://dx.doi.org/10.1115/imece2008-68952.
Texto completoSong, Fubin y S. W. Ricky Lee. "Experimental Investigation of the Effect of Reflow Cooling Rate on the IMC Growth of SAC Lead-Free Solder Alloy". En ASME 2005 International Mechanical Engineering Congress and Exposition. ASMEDC, 2005. http://dx.doi.org/10.1115/imece2005-82095.
Texto completoKang, Sung K., Moon Gi Cho, Da-Yuan Shih, Sun-Kyoung Seo y Hyuck Mo Lee. "Controlling the interfacial reactions in Pb-free interconnections by adding minor alloying elements to Sn-rich solders". En 2008 58th Electronic Components and Technology Conference (ECTC 2008). IEEE, 2008. http://dx.doi.org/10.1109/ectc.2008.4550015.
Texto completoYao, Yao, Jared Fry, Morris Fine y Leon Keer. "Numerical Analysis to Lead Free Solder/Intermetallic Interconnect With Application of Wiedemann-Franz-Lorenz Relation". En ASME 2012 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2012. http://dx.doi.org/10.1115/imece2012-88634.
Texto completoKong, Ming, Sungeun Jeon, Chiwon Hwang y Y. C. Lee. "Effects of Solder Wetting on Self-Alignment Accuracy and Modeling for Optoelectronics Assembly". En ASME 2010 International Mechanical Engineering Congress and Exposition. ASMEDC, 2010. http://dx.doi.org/10.1115/imece2010-37181.
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