Bibliografías temáticas / Smat Power IC

Literatura académica sobre el tema "Smat Power IC"

Autor: Grafiati
Publicado: 14 de marzo de 2023

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Artículos de revistas sobre el tema "Smat Power IC"

1

Wong, King-Yuen, Wanjun Chen, Xiaosen Liu, Chunhua Zhou y Kevin J. Chen. "GaN smart power IC technology". physica status solidi (b) 247, n.º 7 (23 de junio de 2010): 1732–34. http://dx.doi.org/10.1002/pssb.200983453.

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Xu, H., H. J. Kim, H. Kim y W. S. Chung. "Small signal modelling of Smart power IC". Electronics Letters 43, n.º 21 (2007): 1142. http://dx.doi.org/10.1049/el:20071848.

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3

Petrosyants, Konstantin O., Igor A. Kharitonov y Nikita I. Ryabov. "Electro-Thermal Design of Smart Power Devices and Integrated Circuits". Advanced Materials Research 918 (abril de 2014): 191–94. http://dx.doi.org/10.4028/www.scientific.net/amr.918.191.

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An efficient methodology of electro-thermal design of smart power semiconductor devices and ICs, based on the combined use of SPICE circuit analysis tool and software tools for 2D/3D thermal simulation of IC chip construction, is presented. The features of low, medium and high power elements, temperature sensors, IC chips simulation are considered.
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4

Floros, George y Athanasios Tziouvaras. "Special Issue “Smart IC Design and Sensing Technologies”". Chips 1, n.º 3 (20 de octubre de 2022): 172–74. http://dx.doi.org/10.3390/chips1030011.

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Smart sensing technologies and their inherent data-processing techniques have drawn considerable research and industrial attention in recent years. Recent developments in nanometer CMOS technologies have shown great potential to deal with the increasing demand of processing power that arises in these sensing technologies, from IoT applications to complicated medical devices. Moreover, circuit implementation, which could be based on a full analog or digital approach or, in most cases, on a mixed-signal approach, possesses a fundamental role in exploiting the full capabilities of sensing technologies. In addition, all circuit design methodologies include the optimization of several performance metrics, such as low power, low cost, small area, and high throughput, which impose critical challenges in the field of sensor design. This Special Issue aims to highlight advances in the development, modeling, simulation, and implementation of integrated circuits for sensing technologies, from the component level to complete sensing systems.
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5

Ng, Wai Tung, Florin Udrea, Ichiro Omura, Jan Vobecky y Don Disney. "Guest Editorial Special Issue on Power Semiconductor Devices and Smart Power IC Technologies". IEEE Transactions on Electron Devices 64, n.º 3 (marzo de 2017): 654–58. http://dx.doi.org/10.1109/ted.2017.2661578.

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Chan, Chi-Hang, Lin Cheng, Wei Deng, Peng Feng, Li Geng, Mo Huang, Haikun Jia et al. "Trending IC design directions in 2022". Journal of Semiconductors 43, n.º 7 (1 de julio de 2022): 071401. http://dx.doi.org/10.1088/1674-4926/43/7/071401.

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Abstract For the non-stop demands for a better and smarter society, the number of electronic devices keeps increasing exponentially; and the computation power, communication data rate, smart sensing capability and intelligence are always not enough. Hardware supports software, while the integrated circuit (IC) is the core of hardware. In this long review paper, we summarize and discuss recent trending IC design directions and challenges, and try to give the readers big/cool pictures on each selected small/hot topics. We divide the trends into the following six categories, namely, 1) machine learning and artificial intelligence (AI) chips, 2) communication ICs, 3) data converters, 4) power converters, 5) imagers and range sensors, 6) emerging directions. Hope you find this paper useful for your future research and works.
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7

Gleim, G., L. Bertolini y F. Heizmann. "Combined smart power IC for VCR with PWM controlled motor voltage". IEEE Transactions on Consumer Electronics 40, n.º 3 (1994): 377–86. http://dx.doi.org/10.1109/30.320818.

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8

Hai Xu, Hee-Jun Kim y Hoon Kim. "A Direct Measurement Method of Frequency Responses of the Smart Power IC". IEEE Transactions on Instrumentation and Measurement 59, n.º 3 (marzo de 2010): 682–86. http://dx.doi.org/10.1109/tim.2009.2025985.

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9

Sankin, Igor, V. Bondarenko, Robin L. Kelley y Jeff B. Casady. "SiC Smart Power JFET Technology for High-Temperature Applications". Materials Science Forum 527-529 (octubre de 2006): 1207–10. http://dx.doi.org/10.4028/www.scientific.net/msf.527-529.1207.

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Wide bandgap semiconductor materials such as SiC or GaN are very attractive for use in high-power, high-temperature, and/or radiation resistant electronics. Monolithic or hybrid integration of a power transistor and control circuitry in a single or multi-chip wide bandgap power semiconductor module is highly desirable for such applications in order to improve the efficiency and reliability. This paper describes a new monolithic SiC JFET IC technology for high-temperature smart power applications that allows for on-chip integration of control circuitry and normally-off power switch. In order to demonstrate the feasibility of this technology, hybrid logic gates with maximum switching frequency > 20 MHz and normally-off 900 V power switch have been fabricated on alumina substrates using discrete enhanced and depletion mode vertical trench JFETs.
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10

Zhang, Wei Jia, Jingshu Yu, Wen Tao Cui, Yahui Leng, Jingyuan Liang, Yuan-Ta Hsieh, Hann-Huei Tsai, Ying-Zong Juang, Wen-Kuan Yeh y Wai Tung Ng. "A Smart Gate Driver IC for GaN Power HEMTs With Dynamic Ringing Suppression". IEEE Transactions on Power Electronics 36, n.º 12 (diciembre de 2021): 14119–32. http://dx.doi.org/10.1109/tpel.2021.3089679.

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Libros sobre el tema "Smat Power IC"

1

Wicht, Bernhard. Power Management and Smart Power IC Design. Wiley & Sons, Limited, John, 2023.

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2

Taehoon, Kim. Physical modeling of the IGBT and application for smart power IC design. 1995.

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Actas de conferencias sobre el tema "Smat Power IC"

1

Herrmann, H., W. Horchler, S. Schwarz, P. Schroter, F. Klotz, M. Brignone y F. Fiori. "Smart power IC macromodeling for DPI analysis". En 2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo). IEEE, 2015. http://dx.doi.org/10.1109/emccompo.2015.7358365.

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Liew, Madelyn, Nur Izyan Bolhan, Lydia Lim, Poh Ching Sim, Hao Yang y Alexander Holke. "Integrated Zener Diodes for Smart Power IC". En 2019 IEEE 9th International Nanoelectronics Conferences (INEC). IEEE, 2019. http://dx.doi.org/10.1109/inec.2019.8853859.

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Xu, Hai, Heejun Kim y Kefei Zhang. "Small signal modeling for the smart power IC". En 2008 2nd International Conference on Signal Processing and Communication Systems (ICSPCS 2008). IEEE, 2008. http://dx.doi.org/10.1109/icspcs.2008.4813718.

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Ueda, Nobumasa, Makio Iida, Hiroshi Fujimoto, Hirofumi Abe, Katsunori Okura y Shoji Mizuno. "SOI Smart Power IC Technology for Automotive ECUs and Smart Actuators". En SAE 2003 World Congress & Exhibition. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 2003. http://dx.doi.org/10.4271/2003-01-0203.

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5

Simpson, M. C. S. "Smart Power; a smart card electricity payment system". En IEE Colloquium on UK Electricity Prepayment Systems. IEE, 1996. http://dx.doi.org/10.1049/ic:19960288.

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6

Yu, Jingshu, Wei Jia Zhang, Andrew Shorten, Rophina Li y Wai Tung Ng. "A smart gate driver IC for GaN power transistors". En 2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD). IEEE, 2018. http://dx.doi.org/10.1109/ispsd.2018.8393608.

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7

Droinet, Y. "A smart power IC for high side driver applications". En Euro ASIC '91. IEEE Comput. Soc. Press, 1991. http://dx.doi.org/10.1109/euasic.1991.212900.

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8

Cowburn, J. "Smart metering/smart grids standards development". En IET Conference on Power in Unity: a Whole System Approach. Institution of Engineering and Technology, 2013. http://dx.doi.org/10.1049/ic.2013.0146.

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9

Oh, Eun Chu y Paul D. Franzon. "TCAM core design in 3D IC for low matchline capacitance and low power". En Smart Materials, Nano- and Micro-Smart Systems, editado por Said F. Al-Sarawi. SPIE, 2006. http://dx.doi.org/10.1117/12.695915.

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10

Jolhe, S. P., M. D. Karalkar y G. A. Dhomane. "Smart grid and power quality (PQ) issues". En 2016 Online International Conference on Green Engineering and Technologies (IC-GET). IEEE, 2016. http://dx.doi.org/10.1109/get.2016.7916614.

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