Bibliografías temáticas / Smart Disassembly

Literatura académica sobre el tema "Smart Disassembly"

Autor: Grafiati
Publicado: 1 de abril de 2023

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Artículos de revistas sobre el tema "Smart Disassembly"

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Hu, Youxi, Chao Liu, Ming Zhang, Yu Jia y Yuchun Xu. "A Novel Simulated Annealing-Based Hyper-Heuristic Algorithm for Stochastic Parallel Disassembly Line Balancing in Smart Remanufacturing". Sensors 23, n.º 3 (2 de febrero de 2023): 1652. http://dx.doi.org/10.3390/s23031652.

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Remanufacturing prolongs the life cycle and increases the residual value of various end-of-life (EoL) products. As an inevitable process in remanufacturing, disassembly plays an essential role in retrieving the high-value and useable components of EoL products. To disassemble massive quantities and multi-types of EoL products, disassembly lines are introduced to improve the cost-effectiveness and efficiency of the disassembly processes. In this context, disassembly line balancing problem (DLBP) becomes a critical challenge that determines the overall performance of disassembly lines. Currently, the DLBP is mostly studied in straight disassembly lines using single-objective optimization methods, which cannot represent the actual disassembly environment. Therefore, in this paper, we extend the mathematical model of the basic DLBP to stochastic parallel complete disassembly line balancing problem (DLBP-SP). A novel simulated annealing-based hyper-heuristic algorithm (HH) is proposed for multi-objective optimization of the DLBP-SP, considering the number of workstations, working load index, and profits. The feasibility, superiority, stability, and robustness of the proposed HH algorithm are validated through computational experiments, including a set of comparison experiments and a case study of gearboxes disassembly. To the best of our knowledge, this research is the first to introduce gearboxes as a case study in DLBP which enriches the research on disassembly of industrial equipment.
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Liu, Zhi Feng, Liu Xian Zhao, Xin Yu Li, Hong Chao Zhang y Huan Bo Cheng. "Research on Multi-Step Active Disassembly Method of Products Based on ADSM". Advanced Materials Research 139-141 (octubre de 2010): 1428–32. http://dx.doi.org/10.4028/www.scientific.net/amr.139-141.1428.

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The electronic products continue to upgrade at present, how to recycle the discarded electronic products is one of the key research of green design. The method of active disassembly using smart material (ADSM) has acquired widespread concerns. For some products, there is a long distance between the internal active disassembly structure and shell, it needs a long time to reach to the stimulation temperature of internal active disassembly structure, and therefore, it is difficult to completely disassemble these discarded electric products by one step. Moreover, it is not conducive to recycling the material if the components and parts of the disassembly products are mixed together, and the efficiency of disassembly is very low. This paper puts forward multi-step active disassembly method of products, it gives specific procedures of classifying steps according to the principle of division, and it proves the feasibility and superiority of the multi-step active disassembly method of products by referring to mobile model.
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3

Chiodo, Joseph y Nick Jones. "Smart materials use in active disassembly". Assembly Automation 32, n.º 1 (17 de febrero de 2012): 8–24. http://dx.doi.org/10.1108/01445151211198683.

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Naskar, Sourenjit, Chumki Dalal y Pradyut Ghosh. "Ion-pair coordination driven stimuli-responsive one-dimensional supramolecular helicate". Chemical Communications 53, n.º 16 (2017): 2487–90. http://dx.doi.org/10.1039/c7cc00262a.

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A new self-assembled ion-pair coordination driven one-dimensional (1D) smart supramolecular helical assembly is reported. Moreover, thermo- and chemo-responsive transformation/disassembly/reassembly of the helical superstructure was also demonstrated.
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5

Liu, Ma Bao, Xian Hui Wang, Qi Da Liu y Hong Gao. "Application of Smart Coating Sensor in Crack Detection for Aircraft". Applied Mechanics and Materials 152-154 (enero de 2012): 554–59. http://dx.doi.org/10.4028/www.scientific.net/amm.152-154.554.

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A novel smart coating sensor, consisted of driving layer, sensing layer and protective layer, has been successfully developed, and it was utilized to detect crack initiation and growth in fatigue tests. The results show that the smart coating sensor can detect cracks above 300μm, corresponding to the increment of the sensing layer’s resistance at the level of 0.05Ω. Subsequently, the development of SCS is of importance significance in the substitution of an existed inspection that requires substantial disassembly and surface preparation, and, thus, can find numerous applications in difficult-to-access locations on commercial and military aircrafts.
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6

Liu, Zhifeng, Liuxian Zhao, Jun Zhong, Xinyu Li y Huanbo Cheng. "Analysis of Mobile Phone Reliability Based on Active Disassembly Using Smart Materials". Journal of Surface Engineered Materials and Advanced Technology 01, n.º 02 (2011): 80–87. http://dx.doi.org/10.4236/jsemat.2011.12012.

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Chiodo, Joseph David y Casper Boks. "Assessment of end-of-life strategies with active disassembly using smart materials". Journal of Sustainable Product Design 2, n.º 1/2 (2002): 69–82. http://dx.doi.org/10.1023/b:jspd.0000016422.01386.7c.

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Liu, Ma Bao, Bin Bin Li, Jiang Tao Li y Yuan Yuan Lian. "Smart Coating Sensor Applied in Crack Detection for Aircraft". Applied Mechanics and Materials 330 (junio de 2013): 383–88. http://dx.doi.org/10.4028/www.scientific.net/amm.330.383.

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Monitoring fatigue cracking of large engineering structures is a costly and time-intensive process. The authors present a low-cost smart coating sensor (SCS) consisted of driving layer, sensing layer and protective layer typically that can detect crack initiation and growth. The results show that the smart coating sensor can detect cracks above 300μm, corresponding to the increment of the sensing layer’s electric resistance at the level of 0.05Ω. Therefore, the development of SCS is of importance significance in the substitution of an existed inspection that requires substantial disassembly and surface preparation, and, thus, can find numerous applications in difficult-to-access locations on aircrafts.
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9

Hickcox, K. S. y A. Smith. "Strategies for achieving circular economy goals in the lighting industry through design for disassembly-based methodologies". IOP Conference Series: Earth and Environmental Science 1099, n.º 1 (1 de noviembre de 2022): 012004. http://dx.doi.org/10.1088/1755-1315/1099/1/012004.

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Abstract The significance of circular economy and its integration into core strategies for smart, sustainable, and inclusive growth, is increasingly being recognized by individuals, organisations, and nations in recent times. The term ‘Design for Disassembly’ may conjure up images about the end-of-life of a product or its disposal. However, design for disassembly connects to numerous circularity and sustainability goals over the lifetime of a product or project and can have a large impact on the carbon footprint of the product. ‘Design for Disassembly’ is a product development methodology which is in line with the vision of a circular economy, and supports increase in material efficiency, extends product lifetimes and improves recycling efficiency. Reduction of the imposed environmental risks and impact on the climate, by utilising circularity approaches such as remanufacturing, are tied to lowering of carbon footprint. This paper describes specific and actionable approaches that can be applied by luminaire manufacturers, specifiers, and other players in the lighting industry. The readers will learn about current tools and methodologies that can be used to improve iterative design, as well as measure, assess, and compare products or materials.
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10

An, Ruibing, Xiaoyang Cheng, Shixuan Wei, Yuxuan Hu, Yidan Sun, Zheng Huang, Hong‐Yuan Chen y Deju Ye. "Smart Magnetic and Fluorogenic Photosensitizer Nanoassemblies Enable Redox‐Driven Disassembly for Photodynamic Therapy". Angewandte Chemie International Edition 59, n.º 46 (2 de septiembre de 2020): 20636–44. http://dx.doi.org/10.1002/anie.202009141.

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Capítulos de libros sobre el tema "Smart Disassembly"

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Bentaha, Mohand-Lounes, Nejib Moalla y Yacine Ouzrout. "A Disassembly Line Design Approach for Management of End-of-Life Product Quality". En Product Lifecycle Management Enabling Smart X, 460–72. Cham: Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-62807-9_37.

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Mironov, Dima, Miguel Altamirano, Hasan Zabihifar, Alina Liviniuk, Viktor Liviniuk y Dzmitry Tsetserukou. "Haptics of Screwing and Unscrewing for Its Application in Smart Factories for Disassembly". En Haptics: Science, Technology, and Applications, 428–39. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-319-93399-3_37.

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Baazouzi, Sabri, Max Weeber y Kai Peter Birke. "Disassembly — A Requirement for Efficient Circularity of Battery Systems". En Handbook on Smart Battery Cell Manufacturing, 355–69. WORLD SCIENTIFIC, 2022. http://dx.doi.org/10.1142/9789811245626_0019.

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Actas de conferencias sobre el tema "Smart Disassembly"

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Lambert, Fred J. "Optimum disassembly sequence generation". En Intelligent Systems and Smart Manufacturing, editado por Surendra M. Gupta. SPIE, 2001. http://dx.doi.org/10.1117/12.417249.

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Zeid, Ibrahim y Surendra M. Gupta. "Disassembly knowledge representation via XML". En Intelligent Systems and Smart Manufacturing, editado por Surendra M. Gupta. SPIE, 2001. http://dx.doi.org/10.1117/12.417261.

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Zeid, Ibrahim, Surendra M. Gupta y Li Pan. "Case-based reasoning disassembly system". En Intelligent Systems and Smart Manufacturing, editado por Surendra M. Gupta. SPIE, 2001. http://dx.doi.org/10.1117/12.417262.

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Gungor, Askiner, Surendra M. Gupta, Kishore Pochampally y Sagar V. Kamarthi. "Complications in disassembly line balancing". En Intelligent Systems and Smart Manufacturing, editado por Surendra M. Gupta. SPIE, 2001. http://dx.doi.org/10.1117/12.417274.

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Wu, Shanel y Laura Devendorf. "Unfabricate: Designing Smart Textiles for Disassembly". En CHI '20: CHI Conference on Human Factors in Computing Systems. New York, NY, USA: ACM, 2020. http://dx.doi.org/10.1145/3313831.3376227.

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Caccia, Claudio y Alessandro Pozzetti. "Genetic algorithm for disassembly strategy definition". En Intelligent Systems and Smart Manufacturing, editado por Surendra M. Gupta. SPIE, 2001. http://dx.doi.org/10.1117/12.417250.

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7

Adenso-Diaz, Belarmino, Fernando Moure, Manuel Rendueles y Mario Diaz. "Disassembly problem and the blood-cracking decision process". En Intelligent Systems and Smart Manufacturing, editado por Surendra M. Gupta. SPIE, 2001. http://dx.doi.org/10.1117/12.417285.

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8

Reimer, Bryan y Manbir Sodhi. "Disassembly and material recovery models for end-of-life electronics products". En Intelligent Systems and Smart Manufacturing, editado por Surendra M. Gupta. SPIE, 2001. http://dx.doi.org/10.1117/12.417279.

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9

Kelley, Thomas y Sarah Blankenbaker. "Smart Disassembly: Or, How I Learned to Take Things Apart"". En ACADIA 2012: Synthetic Digital Ecologies. ACADIA, 2012. http://dx.doi.org/10.52842/conf.acadia.2012.277.

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10

Shouxu Song, Dongxu Li, Qingdi Ke y Ziyu Tang. "Research on LCD active disassembly structure reliability based on smart material". En 2012 IEEE International Symposium on Sustainable Systems and Technology (ISSST 2012). IEEE, 2012. http://dx.doi.org/10.1109/issst.2012.6228007.

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