Artículos de revistas sobre el tema "Sintering of silver powder"
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Li, Wei, Chunxiu Yu, Yunkai Wang, Yuan Yao, Xianglei Yu, Chuan Zuo y Yang Yu. "Experimental Investigation of Effect of Flake Silver Powder Content on Sintering Structure and Properties of Front Silver Paste of Silicon Solar Cell". Materials 15, n.º 20 (13 de octubre de 2022): 7142. http://dx.doi.org/10.3390/ma15207142.
Texto completoFan, Mao Yan, Guo You Gan, Jian Hong Yi, Ji Kang Yan, Jing Hong Du, Jia Min Zhang, Yi Chun Liu y Xin Xin He. "Effects of Na-Ca System Glass Powder on Properties of Silver Paste". Advanced Materials Research 833 (noviembre de 2013): 295–300. http://dx.doi.org/10.4028/www.scientific.net/amr.833.295.
Texto completoPathak, L. C., S. K. Mishra (Pathak) y S. Srikanth. "Sintering characteristics of Y–Ba–Cu oxide–Agx superconductors under argon atmosphere". Journal of Materials Research 17, n.º 4 (abril de 2002): 895–900. http://dx.doi.org/10.1557/jmr.2002.0130.
Texto completoDurairaj, Rajkumar, M. Das, E. Morris y Satesh Namasivayam. "Investigation on the Morphology of Sintered Silver Nanomaterial for Electronic Packaging Application". Advanced Materials Research 832 (noviembre de 2013): 21–26. http://dx.doi.org/10.4028/www.scientific.net/amr.832.21.
Texto completoBiguereau, E., D. Bouvard, J. M. Chaix y S. Roure. "On the swelling of silver powder during sintering". Powder Metallurgy 59, n.º 5 (19 de octubre de 2016): 394–400. http://dx.doi.org/10.1080/00325899.2016.1250037.
Texto completoHutsch, Thomas, Thomas Schubert, Thomas Weißgärber y Bernd Kieback. "Silver/Diamond Composite Material - Powder Metallurgical Route and Thermo-Physical Properties". Key Engineering Materials 742 (julio de 2017): 151–57. http://dx.doi.org/10.4028/www.scientific.net/kem.742.151.
Texto completoJiao, Ruo Bing, Tao Wu, Bo Ping Zhang y Liang Liang Li. "Firing and Contact Resistivity of Ag2O-Aided Pb-Free Silver Paste for Crystalline Silicon Solar Cells". Materials Science Forum 847 (marzo de 2016): 123–30. http://dx.doi.org/10.4028/www.scientific.net/msf.847.123.
Texto completoDubnika, Arita, Dagnija Loca, Aigars Reinis, Maris Kodols y Liga Berzina-Cimdina. "Impact of sintering temperature on the phase composition and antibacterial properties of silver-doped hydroxyapatite". Pure and Applied Chemistry 85, n.º 2 (12 de enero de 2013): 453–62. http://dx.doi.org/10.1351/pac-con-12-08-12.
Texto completoOkada, Atsuyuki y Takashi Ogihara. "Sintering Behavior of Silver Particles in Electrode for Multilayer Ceramic Substrate". Key Engineering Materials 421-422 (diciembre de 2009): 289–92. http://dx.doi.org/10.4028/www.scientific.net/kem.421-422.289.
Texto completoYan, Fang Chun, Yuan Teng, Ji Kang Yan, Jing Hong Du, Jian Hong Yi, Jian Yang y Guo You Gan. "Effects of Paste Composition and Sintering Process on Performance of Silver Paste for Silicon Solar Cells". Materials Science Forum 849 (marzo de 2016): 852–59. http://dx.doi.org/10.4028/www.scientific.net/msf.849.852.
Texto completoSharipova, A. F., S. G. Psakhie, I. Gotman, M. I. Lerner, A. S. Lozhkomoev y E. Y. Gutmanas. "Cold sintering of Fe-Ag and Fe-Cu by consolidation in high pressure gradient". Izvestiya Vuzov Tsvetnaya Metallurgiya (Proceedings of Higher Schools Nonferrous Metallurgy, n.º 1 (22 de febrero de 2019): 67–74. http://dx.doi.org/10.17073/0021-3438-2019-1-67-74.
Texto completoSarkar, Asok K., I. Maartense y T. L. Peterson. "Limit of superconductivity in silver/superconductor metal-matrix composites prepared with Bi–Pb–Sr–Ca–Cu–O ceramic powders". Journal of Materials Research 7, n.º 7 (julio de 1992): 1672–78. http://dx.doi.org/10.1557/jmr.1992.1672.
Texto completoAl-Rawy, Wehad A. y Emad S. Al-Hassani. "Effect of Adding Silver Element and Zirconia Ceramic on Corrosion Behavior and Mechanical Properties of Pure Titanium". Engineering and Technology Journal 39, n.º 5A (25 de mayo de 2021): 674–94. http://dx.doi.org/10.30684/etj.v39i5a.1087.
Texto completoJia, Dongming, Junbing Ma, Xueping Gan, Jingmei Tao, Ming Xie, Jianhong Yi y Yichun Liu. "A Comparison Study of Ag Composites Prepared by Spark Plasma Sintering and Hot Pressing with Silver-Coated CNTs as the Reinforcements". Materials 12, n.º 12 (17 de junio de 2019): 1949. http://dx.doi.org/10.3390/ma12121949.
Texto completoZhang, Bao Lin y Shun Hua Wu. "Low-Temperature Sintering Lead-Free Barium Titanate-Based X7P Ceramics with Bi2O3 Dopant and ZnO–B2O3 Flux Agent". Advanced Materials Research 560-561 (agosto de 2012): 886–91. http://dx.doi.org/10.4028/www.scientific.net/amr.560-561.886.
Texto completoZhu, Chunli, Xiaofen Fu, Xing Gao y Haotian Kan. "Preparation of 3D printed silver nanocomposites and their antibacterial properties". E3S Web of Conferences 267 (2021): 02003. http://dx.doi.org/10.1051/e3sconf/202126702003.
Texto completoMosialek, M., M. Tatko, M. Dudek, E. Bielańska y G. Mordarski. "Composite Ag-La0.6Sr0.4Co0.8Fe0.2O3-δ Cathode Material for Solid Oxide Fuel Cells, Preparation and Characteristic". Archives of Metallurgy and Materials 58, n.º 4 (1 de diciembre de 2013): 1341–45. http://dx.doi.org/10.2478/amm-2013-0171.
Texto completoLeżański, Jan y Marcin Madej. "The Influence of Production Process Parameters on the Properties W-Ag, Mo-Ag Composites". Materials Science Forum 534-536 (enero de 2007): 1513–16. http://dx.doi.org/10.4028/www.scientific.net/msf.534-536.1513.
Texto completoPatelka, Maciej, Nicholas Krasco, Sho Ikeda, Toshiyuki Sato, Miguel Goni, Elbara Ziade y Aaron J. Schmidt. "Conductive Fusion Technology Advanced Die Attach Materials for High Power Applications". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2018, HiTEC (1 de mayo de 2018): 000051–55. http://dx.doi.org/10.4071/2380-4491-2018-hiten-000051.
Texto completoJin, Howard (Hwail), Kewei Xu, Loreto Naungayan y Jose Quinones. "High Thermal Conductive Die Attach Paste Using Polymer and Micron Size Silver for Power Semiconductor Package". International Symposium on Microelectronics 2016, n.º 1 (1 de octubre de 2016): 000326–31. http://dx.doi.org/10.4071/isom-2016-wp41.
Texto completoPan, Z. J., L. J. Wei, M. W. Zheng, J. T. Liang, M. G. Zhao y Y. J. Liu. "A research on silver powder sinters for dilution refrigerator heat exchangers". IOP Conference Series: Materials Science and Engineering 1240, n.º 1 (1 de mayo de 2022): 012050. http://dx.doi.org/10.1088/1757-899x/1240/1/012050.
Texto completoMansourirad, Nima, Mohammad Ardestani y Reza Afshar. "Synthesis and characterization of Ag-8 %wt Cr2O3 composites prepared by different densification processes". Science of Sintering 50, n.º 3 (2018): 323–35. http://dx.doi.org/10.2298/sos1803323m.
Texto completoDudina, Dina, Alexander Matvienko, Anatoly Sidelnikov, Mikhail Legan, Vyacheslav Mali, Maksim Esikov, Alexander Anisimov, Pavel Gribov y Vladimir Boldyrev. "Electric Current-Assisted Joining of Copper Plates Using Silver Formed by In-Situ Decomposition of Ag2C2O4". Metals 8, n.º 7 (12 de julio de 2018): 538. http://dx.doi.org/10.3390/met8070538.
Texto completoMüller, Jonas, Sebastian A. Letz, Flaviu-Bogdan Simon, Christoph F. Bayer, Andreas Schletz, Jens Görlich y Takatoshi Nishimura. "Silver Sintering of Packaged GaN-Devices on Printed Circuit Board". Journal of Microelectronics and Electronic Packaging 19, n.º 1 (1 de enero de 2022): 18–24. http://dx.doi.org/10.4071/imaps.1675410.
Texto completoButtay, Cyril, Amandine Masson, Jianfeng Li, Mark Johnson, Mihai Lazar, Christophe Raynaud y Hervé Morel. "Die Attach of Power Devices Using Silver Sintering – Bonding Process Optimisation and Characterization". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, HITEN (1 de enero de 2011): 000084–90. http://dx.doi.org/10.4071/hiten-paper7-cbuttay.
Texto completoYang, Wendong, Felix Hermerschmidt, Florian Mathies y Emil J. W. List-Kratochvil. "Comparing low-temperature thermal and plasma sintering processes of a tailored silver particle-free ink". Journal of Materials Science: Materials in Electronics 32, n.º 5 (5 de febrero de 2021): 6312–22. http://dx.doi.org/10.1007/s10854-021-05347-1.
Texto completoLis, M., A. Wrona, J. Mazur, C. Dupont, M. Kamińska, D. Kopyto y M. Kwarciński. "Fabrication And Properties Of Silver Based Multiwall Carbon Nanotube Composite Prepared By Spark Plasma Sintering Method". Archives of Metallurgy and Materials 60, n.º 2 (1 de junio de 2015): 1351–55. http://dx.doi.org/10.1515/amm-2015-0129.
Texto completoHan, Zhaohui, Lei Xu, Shenghui Guo, Qingtian Wu, Libo Zhang y Jianhua Liu. "Study on the microwave sintering characteristics of spherical tin-silver alloy powder". Materials Research Express 6, n.º 12 (20 de marzo de 2020): 1265k7. http://dx.doi.org/10.1088/2053-1591/ab5e58.
Texto completoHascoët, Stanislas, Cyril Buttay, Dominique Planson, Rodica Chiriac y Amandine Masson. "Pressureless Silver Sintering Die-Attach for SiC Power Devices". Materials Science Forum 740-742 (enero de 2013): 851–54. http://dx.doi.org/10.4028/www.scientific.net/msf.740-742.851.
Texto completoHeuck, Nicolas, G. Palm, T. Sauerberg, A. Stranz, A. Waag y Andrey Bakin. "SiC-Die-Attachment for High Temperature Applications". Materials Science Forum 645-648 (abril de 2010): 741–44. http://dx.doi.org/10.4028/www.scientific.net/msf.645-648.741.
Texto completoEberstein, Markus, Marco Wenzel, Claudia Feller, Thomas Seuthe y Frieder Gora. "Silver processing in thick film technology for power electronics". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, CICMT (1 de septiembre de 2012): 000018–24. http://dx.doi.org/10.4071/cicmt-2012-ta13.
Texto completoShen, Zhenzhen, Aleksey Reiderman y Casey Anude. "Pressure-less AgNP Sintering for High-power MCM Assembly for Extreme Environment Applications". International Symposium on Microelectronics 2015, n.º 1 (1 de octubre de 2015): 000342–48. http://dx.doi.org/10.4071/isom-2015-wp14.
Texto completoRape, A., X. Liu, A. Kulkarni y J. Singh. "Effect of Liquid Phase Additions on Microstructure and Thermal Properties in Copper and Copper-Diamond Composites". Advances in Materials Science and Engineering 2014 (2014): 1–8. http://dx.doi.org/10.1155/2014/832308.
Texto completoLo, Ming, Seyed Amir Paknejad, Harry Borrill, Wan K. Kong, Addo Addo-Kwabena, Mohamed Saidoune, Chris Powley, Naim Kapadia, Yang Zuo y Samjid H. Mannan. "Comparative study of how additives affect sintered silver microstructure in die-attach applications". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2019, HiTen (1 de julio de 2019): 000061–65. http://dx.doi.org/10.4071/2380-4491.2019.hiten.000061.
Texto completoFujino, Masahisa, Hirozumi Narusawa, Yuzuru Kuramochi, Eiji Higurashi, Tadatomo Suga, Toshiyuki Shiratori y Masataka Mizukoshi. "Transient liquid-phase sintering using silver and tin powder mixture for die bonding". Japanese Journal of Applied Physics 55, n.º 4S (24 de marzo de 2016): 04EC14. http://dx.doi.org/10.7567/jjap.55.04ec14.
Texto completoLarismaa, Juha, Outi Söderberg, Jesse Syrén, Eero Haimi y Simo Pekka Hannula. "Processing and Characterization of Porous Silica-Ag-Nanoparticle Composites Produced by Pulsed Electric Current Sintering". Key Engineering Materials 527 (noviembre de 2012): 38–43. http://dx.doi.org/10.4028/www.scientific.net/kem.527.38.
Texto completoHussain, Arif, Hee-Lak Lee, Yoon-Jae Moon, Heuiseok Kang, Seung-Jae Moon y Jun-Young Hwang. "Temperature Estimation during Pulsed Laser Sintering of Silver Nanoparticles". Applied Sciences 12, n.º 7 (29 de marzo de 2022): 3467. http://dx.doi.org/10.3390/app12073467.
Texto completoYang, Hui y Jihui Wu. "Improvement of Sintering Performance of Nanosilver Paste by Tin Doping". Journal of Nanomaterials 2020 (22 de enero de 2020): 1–6. http://dx.doi.org/10.1155/2020/3925276.
Texto completoHe, Xinjun, Yong Wang, Haifei Lu, Dan Ouyang, Zhanfeng Huang y Wallace C. H. Choy. "Realizing the ultimate goal of fully solution-processed organic solar cells: a compatible self-sintering method to achieve silver back electrode". Journal of Materials Chemistry A 8, n.º 12 (2020): 6083–91. http://dx.doi.org/10.1039/d0ta00807a.
Texto completoWATANABE, Shizuharu, Takayuki KODERA y Takashi OGIHARA. "Preparation and sintering of tellurium-doped silver powder for electrodes in silicon solar cells". Journal of the Ceramic Society of Japan 123, n.º 1437 (2015): 345–50. http://dx.doi.org/10.2109/jcersj2.123.345.
Texto completoKim, Minha, Hongsub Jee y Jaehyeong Lee. "Photo-Sintered Silver Thin Films by a High-Power UV-LED Module for Flexible Electronic Applications". Nanomaterials 11, n.º 11 (25 de octubre de 2021): 2840. http://dx.doi.org/10.3390/nano11112840.
Texto completoYahya, Iziana, Noor Asikin Ab Ghani, Mohd Arif Anuar Mohd Salleh, Hamidi Abd Hamid, Zainal Arifin Ahmad y Ramani Mayappan. "Characterization of Sn-3.5Ag-1.0Cu Lead-Free Solder Prepared via Powder Metallurgy Method". Advanced Materials Research 501 (abril de 2012): 160–64. http://dx.doi.org/10.4028/www.scientific.net/amr.501.160.
Texto completoBenabou, Lahouari, Quang Bang Tao, Thien An Nguyen-Van, Xu Dong Wang y Luc Chassagne. "Mechanical and Microstructural Analysis of an Ultra-Flexible Nano-Silver Paste Sintered Joint". Key Engineering Materials 865 (septiembre de 2020): 25–30. http://dx.doi.org/10.4028/www.scientific.net/kem.865.25.
Texto completoEberstein, Markus, Christel Kretzschmar, Thomas Seuthe, Manja Marcinkowski, Martin Ihle, Steffen Ziesche, Uwe Partsch y Frieder Gora. "Towards highly conductive silver pastes for LTCC power electronics". International Symposium on Microelectronics 2011, n.º 1 (1 de enero de 2011): 000553–58. http://dx.doi.org/10.4071/isom-2011-wa3-paper5.
Texto completoCalabretta, Michele, Alessandro Sitta, Salvatore Massimo Oliveri y Gaetano Sequenzia. "Silver Sintering for Silicon Carbide Die Attach: Process Optimization and Structural Modeling". Applied Sciences 11, n.º 15 (29 de julio de 2021): 7012. http://dx.doi.org/10.3390/app11157012.
Texto completoZhang, Ping, Rongzhuan Wei, Jianhua Zeng, Miao Cai, Jing Xiao y Daoguo Yang. "Thermal Properties of Silver Nanoparticle Sintering Bonding Paste for High-Power LED Packaging". Journal of Nanomaterials 2016 (2016): 1–6. http://dx.doi.org/10.1155/2016/8681513.
Texto completoMosiałek, M., M. Przybyła, M. Tatko, P. Nowak, M. Dudek y M. Zimowska. "Composite Ag-La0.8Sr0.2MnO3-σ Cathode for Solid Oxide Fuel Cells". Archives of Metallurgy and Materials 58, n.º 4 (1 de diciembre de 2013): 1337–40. http://dx.doi.org/10.2478/amm-2013-0170.
Texto completoOsadnik, Małgorzata, Marian Czepelak y Małgorzata Kamińska. "Production and Properties of AgW50 Composites Designated for Electric Contacts". Key Engineering Materials 641 (abril de 2015): 93–98. http://dx.doi.org/10.4028/www.scientific.net/kem.641.93.
Texto completoRahimi, Esmaeil, Mohammad Hossein Sheikhi, Zahra Karami Horastani, S. Masoud Sayedi, Sedigheh Zeinali y Abbas Zarifkar. "Ethanol Sensing Properties of Tin Oxide Doped Using Silver Nanoparticles". Advanced Materials Research 829 (noviembre de 2013): 600–604. http://dx.doi.org/10.4028/www.scientific.net/amr.829.600.
Texto completoFalak, Peyman y Iman Ebrahimzadeh. "Fabrication of bulk nanostructured silver by spark plasma sintering from nanostructured silver powders". Materials Research Express 6, n.º 10 (7 de agosto de 2019): 105009. http://dx.doi.org/10.1088/2053-1591/ab34ed.
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