Literatura académica sobre el tema "SiC power device"
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Artículos de revistas sobre el tema "SiC power device"
Harris, C. I., A. O. Konstantinov, C. Hallin y E. Janzén. "SiC power device passivation using porous SiC". Applied Physics Letters 66, n.º 12 (20 de marzo de 1995): 1501–2. http://dx.doi.org/10.1063/1.113668.
Texto completoLichtenwalner, Daniel J., Brett Hull, Vipindas Pala, Edward Van Brunt, Sei-Hyung Ryu, Joe J. Sumakeris, Michael J. O’Loughlin, Albert A. Burk, Scott T. Allen y John W. Palmour. "Performance and Reliability of SiC Power MOSFETs". MRS Advances 1, n.º 2 (2016): 81–89. http://dx.doi.org/10.1557/adv.2015.57.
Texto completoChow, T. Paul. "SiC Bipolar Power Devices". MRS Bulletin 30, n.º 4 (abril de 2005): 299–304. http://dx.doi.org/10.1557/mrs2005.77.
Texto completovan Zeghbroeck, Bart y Hamid Fardi. "Comparison of 3C-SiC and 4H-SiC Power MOSFETs". Materials Science Forum 924 (junio de 2018): 774–77. http://dx.doi.org/10.4028/www.scientific.net/msf.924.774.
Texto completoFriedrichs, Peter. "SiC Power Devices as Enabler for High Power Density - Aspects and Prospects". Materials Science Forum 778-780 (febrero de 2014): 1104–9. http://dx.doi.org/10.4028/www.scientific.net/msf.778-780.1104.
Texto completoPalmer, Michael J., R. Wayne Johnson, Tracy Autry, Rizal Aguirre, Victor Lee y James D. Scofield. "SiC Power Switch Module". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, HITEC (1 de enero de 2010): 000316–24. http://dx.doi.org/10.4071/hitec-rwjohnson-wp26.
Texto completoSoelkner, Gerald, Winfried Kaindl, Michael Treu y Dethard Peters. "Reliability of SiC Power Devices Against Cosmic Radiation-Induced Failure". Materials Science Forum 556-557 (septiembre de 2007): 851–56. http://dx.doi.org/10.4028/www.scientific.net/msf.556-557.851.
Texto completoAl-bayati, Ali Mahmoud Salman. "Behavior, Switching Losses, and Efficiency Enhancement Potentials of 1200 V SiC Power Devices for Hard-Switched Power Converters". CPSS Transactions on Power Electronics and Applications 7, n.º 2 (30 de junio de 2022): 113–29. http://dx.doi.org/10.24295/cpsstpea.2022.00011.
Texto completoWalden, Ginger G., Ty McNutt, Marc Sherwin, Stephen Van Campen, Ranbir Singh y Rob Howell. "Comparison of 10 kV 4H-SiC Power MOSFETs and IGBTs for High Frequency Power Conversion". Materials Science Forum 600-603 (septiembre de 2008): 1139–42. http://dx.doi.org/10.4028/www.scientific.net/msf.600-603.1139.
Texto completoChowdhury, Sauvik, Zachary Stum, Zhong Da Li, Katsunori Ueno y T. Paul Chow. "Comparison of 600V Si, SiC and GaN Power Devices". Materials Science Forum 778-780 (febrero de 2014): 971–74. http://dx.doi.org/10.4028/www.scientific.net/msf.778-780.971.
Texto completoTesis sobre el tema "SiC power device"
Yang, Nanying. "Characterization and modeling of silicon and silicon carbide power devices". Diss., Virginia Tech, 2010. http://hdl.handle.net/10919/29643.
Texto completoPh. D.
Chen, Zheng. "Electrical Integration of SiC Power Devices for High-Power-Density Applications". Diss., Virginia Tech, 2013. http://hdl.handle.net/10919/23923.
Texto completoPh. D.
Phankong, Nathabhat. "Characterization of SiC Power Transistors for Power Conversion Circuits Based on C-V Measurement". 京都大学 (Kyoto University), 2010. http://hdl.handle.net/2433/126807.
Texto completoBertilsson, Kent. "Simulation and Optimization of SiC Field Effect Transistors". Doctoral thesis, KTH, Microelectronics and Information Technology, IMIT, 2004. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-81.
Texto completoSilicon Carbide (SiC) is a wide band-gap semiconductor material with excel-lent material properties for high frequency, high power and high temperature elec-tronics. In this work different SiC field-effect transistors have been studied using theoretical methods, with the focus on both the devices and the methods used. The rapid miniaturization of commercial devices demands better physical models than the drift-diffusion and hydrodynamic models most commonly used at present.
The Monte Carlo method is the most accurate physical methods available and has been used in this work to study the performance in short-channel SiC field-effect devices. The drawback of the Monte-Carlo method is the computational power required and it is thus not well suited for device design where the layout requires to be optimized for best device performance. One approach to reduce the simulation time in the Monte Carlo method is to use a time-domain drift-diffusion model in contact and bulk regions of the device. In this work, a time-domain drift-diffusion model is implemented and verified against commercial tools and would be suitable for inclusion in the Monte-Carlo device simulator framework.
Device optimization is traditionally performed by hand, changing device pa-rameters until sufficient performance is achieved. This is very time consuming work without any guarantee of achieving an optimal layout. In this work a tool is developed, which automatically changes device layout until optimal device per-formance is achieved. Device optimization requires hundreds of device simulations and thus it is essential that computationally efficient methods are used. One impor-tant physical process for RF power devices is self heating. Self heating can be fairly accurately modeled in two dimensions but this will greatly reduce the computa-tional speed. For realistic influence self heating must be studied in three dimensions and a method is developed using a combination of 2D electrical and 3D thermal simulations. The accuracy is much improved by using the proposed method in comparison to a 2D coupled electro/thermal simulation and at the same time offers greater efficiency. Linearity is another very important issue for RF power devices for telecommunication applications. A method to predict the linearity is imple-mented using nonlinear circuit simulation of the active device and neighboring passive elements.
Noborio, Masato. "Fundamental Study on SiC Metal-Insulator-Semiconductor Devices for High-Voltage Power Integrated Circuits". 京都大学 (Kyoto University), 2009. http://hdl.handle.net/2433/78006.
Texto completoLee, Sang Kwon. "Processing and characterization of silicon carbide (6H-SiC and 4H-SiC) contacts for high power and high temperature device applications". Doctoral thesis, KTH, Microelectronics and Information Technology, IMIT, 2002. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-3335.
Texto completoSilicon carbide is a promising wide bandgap semiconductormaterial for high-temperature, high-power, and high-frequencydevice applications. However, there are still a number offactors that are limiting the device performance. Among them,one of the most important and critical factors is the formationof low resistivity Ohmic contacts and high-temperature stableSchottky diodes on silicon carbide.
In this thesis, different metals (TiW, Ti, TiC, Al, and Ni)and different deposition techniques (sputtering andevaporation) were suggested and investigated for this purpose.Both electrical and material characterizations were performedusing various techniques, such as I-V, C-V, RBS, XRD, XPS,LEED, SEM, AFM, and SIMS.
For the Schottky contacts to n- and p-type 4H-SiC, sputteredTiW Schottky contacts had excellent rectifying behavior afterannealing at 500 ºC in vacuum with a thermally stableideality factor of 1.06 and 1.08 for n- and p-type,respectively. It was also observed that the SBH for p-type SiC(ΦBp) strongly depends on the choice the metal with alinear relationship ΦBp= 4.51 - 0.58Φm, indicating no strong Fermi-level pinning.Finally, the behavior of Schottky diodes was investigated byincorporation of size-selected Au nano-particles in Ti Schottkycontacts on silicon carbide. The reduction of the SBH isexplained by using a simple dipole layer approach, withenhanced electric field at the interface due to the small sizeof the circular patch (Au nano-particles) and large differenceof the barrier height between two metals (Ti and Au) on both n-and p-SiC.
For the Ohmic contacts, titanium carbide (TiC) was used ascontacts to both n- and p-type 4H-SiC epilayers as well as onAl implanted layers. The TiC contacts were epitaxiallydeposited using a co-evaporation method with an e-beam Tisource and a Knudsen cell for C60, in a UHV system at low substrate temperature(500 ºC). In addition, we extensively investigatedsputtered TiW (weight ratio 30:70) as well as evaporated NiOhmic contacts on both n- and p-type epilayers of SiC. The bestOhmic contacts to n-type SiC are annealed Ni (>950ºC)with the specific contact resistance of ≈ 8× 10-6Ω cm2with doping concentration of 1.1 × 10-19cm-3while annealed TiW and TiC contacts are thepreferred contacts to p-type SiC. From long-term reliabilitytests at high temperature (500 ºC or 600 ºC) invacuum and oxidizing (20% O2/N2) ambient, TiW contacts with a platinum cappinglayer (Pt/Ti/TiW) had stable specific contact resistances for>300 hours.
Keywords: silicon carbide, Ohmic and Schottky contacts,co-evaporation, current-voltage, capacitance-voltagemeasurement, power devices, nano-particles, Schottky barrierheight lowering, and TLM structures.
Yue, Naili. "Planar Packaging and Electrical Characterization of High Temperature SiC Power Electronic Devices". Thesis, Virginia Tech, 2008. http://hdl.handle.net/10919/36278.
Texto completoMaster of Science
Sekar, Saalini Valli. "Nonlinear device characterization and second harmonic impedance tuning to achieve peak performance for a SiC power MESFET device at 2GHz". [Ames, Iowa : Iowa State University], 2008.
Buscar texto completoWatt, Grace R. "Impact of Device Parametric Tolerances on Current Sharing Behavior of a SiC Half-Bridge Power Module". Thesis, Virginia Tech, 2020. http://hdl.handle.net/10919/96559.
Texto completoMaster of Science
This paper describes the design, construction, and testing of advanced power devices for use in electric vehicles. Power devices are necessary to supply electricity to different parts of the vehicle; for example, energy is stored in a battery as direct current (DC) power, but the motor requires alternating current (AC) power. Therefore, power electronics can alter the energy to be delivered as DC or AC. In order to carry more power, multiple devices can be used together just as 10 people can carry more weight than 1 person. However, because the devices are not perfect, there can be slight differences in the performance of one device to another. One device may have to carry more current than another device which could cause failure earlier than intended. In this research project, multiple power devices were placed into a package, or "module." In a control module, the devices were selected with similar properties to one another. In an experimental module, the devices were selected with properties very different from one another. It was determined that the when the devices were 17.7% difference, there was 119.9 µJ more energy loss and it was 22.2°C hotter than when the difference was only 0.6%. However, the severity of the difference was dependent on how multiple device characteristics interacted with one another. It may be possible to compensate some of the impact of device differences in one characteristic with opposing differences in another device characteristic.
BHADRI, PRASHANT R. "IMPLEMENTATION OF A SILICON CONTROL CHIP FOR Si/SiC HYBRID OPTICALLY ACTIVATED HIGH POWER SWITCHING DEVICE". University of Cincinnati / OhioLINK, 2002. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1021402169.
Texto completoLibros sobre el tema "SiC power device"
Chuan, Feng Zhe, ed. SiC power materials: Devices and applications. Berlin: Springer, 2004.
Buscar texto completoI, Haddad George, Mains R. K y United States. National Aeronautics and Space Administration, eds. Microwave and millimeter-wave power generation in silicon carbide (SiC) IMPATT devices. [Washington, DC: National Aeronautics and Space Administration, 1989.
Buscar texto completoI, Haddad G., Mains R. K y United States. National Aeronautics and Space Administration., eds. Microwave and millimeter-wave power generation in silicon carbide (SiC) IMPATT devices. [Washington, DC: National Aeronautics and Space Administration, 1989.
Buscar texto completoBarack, Obama y United States. Congress. House. Committee on Foreign Affairs, eds. Certification for an export to the People's Republic of China: Message from the President of the United States transmitting certification that the export of one continuous mixer to be used to manufacture conductive polymer compounds to be further processed to make circuit protection devices, one jet mill to be used for particle size reduction of pigments and other powder products for cosmetic formulations, and one filament winding cell to be used to manufacture fiberglass assembly shelter poles for use in tents and shelters is not detrimental to the U.S. space launch industry and will not measurably improve the missile or space launch capabilities of the People's Republic of China, pursuant to Pub. L. 105-261, sec. 1512. Washington: U.S. G.P.O., 2009.
Buscar texto completoFeng, Zhe C. SiC Power Materials and Devices. Springer, 2004.
Buscar texto completoFeng, Zhe Chuan. SiC Power Materials: Devices and Applications. 2004.
Buscar texto completoFeng, Zhe Chuan. SiC Power Materials: Devices and Applications. Springer Berlin Heidelberg, 2010.
Buscar texto completoMicrowave and millimeter-wave power generation in silicon carbide (SiC) IMPATT devices. [Washington, DC: National Aeronautics and Space Administration, 1989.
Buscar texto completoMicrowave and millimeter-wave power generation in silicon carbide (SiC) IMPATT devices. [Washington, DC: National Aeronautics and Space Administration, 1989.
Buscar texto completoBayne, Stephen y Bejoy Pushpakaran. Modeling and Electrothermal Simulation of SiC Power Devices: Using Silvaco© ATLAS. World Scientific Publishing Co Pte Ltd, 2019.
Buscar texto completoCapítulos de libros sobre el tema "SiC power device"
Baliga, B. Jayant. "SiC Planar MOSFET Structures". En Advanced High Voltage Power Device Concepts, 235–92. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4614-0269-5_6.
Texto completoAgarwal, A., S. H. Ryu y J. Palmour. "Power MOSFETs in 4H-SiC: Device Design and Technology". En Silicon Carbide, 785–811. Berlin, Heidelberg: Springer Berlin Heidelberg, 2004. http://dx.doi.org/10.1007/978-3-642-18870-1_33.
Texto completoZhang, Jie, Esteban Romano, Janice Mazzola, Swapna G. Sunkari, Carl Hoff, Igor Sankin y Michael S. Mazzola. "High Quality Uniform SiC Epitaxy for Power Device Applications". En Materials Science Forum, 101–4. Stafa: Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-442-1.101.
Texto completoJennings, M. R., C. A. Fisher, S. M. Thomas, Y. Sharma, D. Walker, A. Sanchez, A. Pérez-Tomás et al. "Physical and Electrical Characterisation of 3C-SiC and 4H-SiC for Power Semiconductor Device Applications". En Physics of Semiconductor Devices, 929–32. Cham: Springer International Publishing, 2014. http://dx.doi.org/10.1007/978-3-319-03002-9_240.
Texto completoJohnson, R. Wayne y John R. Williams. "SiC Power Device Packaging Technologies for 300 to 350°C Applications". En Materials Science Forum, 785–90. Stafa: Trans Tech Publications Ltd., 2005. http://dx.doi.org/10.4028/0-87849-963-6.785.
Texto completoSui, Yang, Ginger G. Walden, Xiao Kun Wang y James A. Cooper. "Device Options and Design Considerations for High-Voltage (10-20 kV) SiC Power Switching Devices". En Silicon Carbide and Related Materials 2005, 1449–52. Stafa: Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/0-87849-425-1.1449.
Texto completoZekentes, Konstantinos, Victor Veliadis, Sei-Hyung Ryu, Konstantin Vasilevskiy, Spyridon Pavlidis, Arash Salemi y Yuhao Zhang. "SiC and GaN Power Devices". En More-than-Moore Devices and Integration for Semiconductors, 47–104. Cham: Springer International Publishing, 2023. http://dx.doi.org/10.1007/978-3-031-21610-7_2.
Texto completoLuo, Z., T. Chen, D. C. Sheridan y J. D. Cressler. "4H-SiC Power-Switching Devices for Extreme-Environment Applications". En SiC Power Materials, 375–409. Berlin, Heidelberg: Springer Berlin Heidelberg, 2004. http://dx.doi.org/10.1007/978-3-662-09877-6_10.
Texto completoBaliga, B. J. "Impact of SiC on Power Devices". En Springer Proceedings in Physics, 305–13. Berlin, Heidelberg: Springer Berlin Heidelberg, 1992. http://dx.doi.org/10.1007/978-3-642-84804-9_44.
Texto completoTournier, Dominique, Miquel Vellvehi, Phillippe Godignon, Josep Montserrat, Dominique Planson y F. Sarrus. "Current Sensing for SiC Power Devices". En Silicon Carbide and Related Materials 2005, 1215–18. Stafa: Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/0-87849-425-1.1215.
Texto completoActas de conferencias sobre el tema "SiC power device"
Gajewski, Donald A., Brett Hull, Daniel J. Lichtenwalner, Sei-Hyung Ryu, Eric Bonelli, Habib Mustain, Gangyao Wang, Scott T. Allen y John W. Palmour. "SiC power device reliability". En 2016 IEEE International Integrated Reliability Workshop (IIRW). IEEE, 2016. http://dx.doi.org/10.1109/iirw.2016.7904895.
Texto completoFunaki, Tsuyoshi. "Packaging for SiC power device". En 2014 International Power Electronics Conference (IPEC-Hiroshima 2014 ECCE-ASIA). IEEE, 2014. http://dx.doi.org/10.1109/ipec.2014.6869849.
Texto completoVeliadis, V. "SiC Power Device Mass Commercialization". En ESSDERC 2022 - IEEE 52nd European Solid-State Device Research Conference (ESSDERC). IEEE, 2022. http://dx.doi.org/10.1109/essderc55479.2022.9947113.
Texto completoStahbush, R. E. y N. A. Mahadik. "Defects affecting SiC power device reliability". En 2018 IEEE International Reliability Physics Symposium (IRPS). IEEE, 2018. http://dx.doi.org/10.1109/irps.2018.8353546.
Texto completoMatocha, Kevin. "Challenges in SiC power MOSFET design". En 2007 International Semiconductor Device Research Symposium. IEEE, 2007. http://dx.doi.org/10.1109/isdrs.2007.4422412.
Texto completoRowden, Brian, Alan Mantooth, Simon Ang, Alex Lostetter, Jared Hornberger y Brice McPherson. "High Temperature SiC Power Module Packaging". En ASME 2009 International Mechanical Engineering Congress and Exposition. ASMEDC, 2009. http://dx.doi.org/10.1115/imece2009-12883.
Texto completoHull, Brett A., Fatima Husna, Anant Agarwal, Aivars Lelis, Bruce Geil, Charles Scozzie, Mrinal K. Das et al. "Status of 1200V 4H-SiC Power DMOSFETs". En International Semiconductor Device Research Symposium. IEEE, 2007. http://dx.doi.org/10.1109/isdrs.2007.4422413.
Texto completoAgarwal, Anant. "Technical challenges in commercial SiC power MOSFETs". En 2007 International Semiconductor Device Research Symposium. IEEE, 2007. http://dx.doi.org/10.1109/isdrs.2007.4422481.
Texto completoLauenstein, Jean-Marie, Megan C. Casey, Ray L. Ladbury, Hak S. Kim, Anthony M. Phan y Alyson D. Topper. "Space Radiation Effects on SiC Power Device Reliability". En 2021 IEEE International Reliability Physics Symposium (IRPS). IEEE, 2021. http://dx.doi.org/10.1109/irps46558.2021.9405180.
Texto completoXu, Jiale, Lei Gu, Zhechi Ye, Saleh Kargarrazi y Juan Rivas-Davila. "Cascode GaN/SiC Power Device for MHz Switching". En 2019 IEEE Applied Power Electronics Conference and Exposition (APEC). IEEE, 2019. http://dx.doi.org/10.1109/apec.2019.8721931.
Texto completoInformes sobre el tema "SiC power device"
Sung, YunMo y Michael S. Mazzola. Development of High-Temperature, High-Power, High-Efficiency, High-Voltage Converters Using Silicon Carbide (SiC) Delivery Order Delivery Order 0002: Critical Analysis of SiC VJFET Design and Performance Based Upon Material and Device Properties. Fort Belvoir, VA: Defense Technical Information Center, agosto de 2005. http://dx.doi.org/10.21236/ada443645.
Texto completoBaliga, B. J., B. Vijay, P. M. Shenoy, R. F. Davis y H. S. Tomozawa. SiC Discrete Power Devices. Fort Belvoir, VA: Defense Technical Information Center, enero de 1997. http://dx.doi.org/10.21236/ada319706.
Texto completoBaliga, B. J., R. K. Chilukuri, P. M. Shenoy, B. Vijay y R. F. Davis. SiC Discrete Power Devices. Fort Belvoir, VA: Defense Technical Information Center, enero de 1999. http://dx.doi.org/10.21236/ada358651.
Texto completoChilukuri, Ravi K. y B. J. Baliga. SiC Discrete Power Devices. Fort Belvoir, VA: Defense Technical Information Center, enero de 2001. http://dx.doi.org/10.21236/ada389252.
Texto completoCooper, James A., Michael A. Capano, Leonard C. Feldman, Marek Skowronski y John R. Williams. Development of Process Technologies for High-Performance MOS-Based SiC Power Switching Devices. Fort Belvoir, VA: Defense Technical Information Center, agosto de 2007. http://dx.doi.org/10.21236/ada473280.
Texto completoBaker, Bryant. A 3.6 GHz Doherty Power Amplifier with a 40 dBm Saturated Output Power using GaN on SiC HEMT Devices. Portland State University Library, enero de 2000. http://dx.doi.org/10.15760/etd.1780.
Texto completoWeinschenk, Craig, Daniel Madrzykowski y Paul Courtney. Impact of Flashover Fire Conditions on Exposed Energized Electrical Cords and Cables. UL Firefighter Safety Research Institute, octubre de 2019. http://dx.doi.org/10.54206/102376/hdmn5904.
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