Artículos de revistas sobre el tema "Semiconductor module"
Crea una cita precisa en los estilos APA, MLA, Chicago, Harvard y otros
Consulte los 50 mejores artículos de revistas para su investigación sobre el tema "Semiconductor module".
Junto a cada fuente en la lista de referencias hay un botón "Agregar a la bibliografía". Pulsa este botón, y generaremos automáticamente la referencia bibliográfica para la obra elegida en el estilo de cita que necesites: APA, MLA, Harvard, Vancouver, Chicago, etc.
También puede descargar el texto completo de la publicación académica en formato pdf y leer en línea su resumen siempre que esté disponible en los metadatos.
Explore artículos de revistas sobre una amplia variedad de disciplinas y organice su bibliografía correctamente.
Resutík, Patrik y Slavomír Kaščák. "Compact 3 × 1 Matrix Converter Module Based on the SiC Devices with Easy Expandability". Applied Sciences 11, n.º 20 (9 de octubre de 2021): 9366. http://dx.doi.org/10.3390/app11209366.
Texto completoSeki, Kyoshiro, Yoshitaka Tsunekawa, Hiroshi Osada, Jun-Ichi Shida y Koichi Murakami. "Multisensor module using magnetic semiconductor ferrite". Electronics and Communications in Japan (Part II: Electronics) 73, n.º 4 (1990): 46–53. http://dx.doi.org/10.1002/ecjb.4420730406.
Texto completoYau, Chin Horng, Wen Ren Jong y H. H. Wang. "Design and Analysis of SCARA Substrate Transfer Robot for Semiconductor and FPD Processing Cluster Tools". Materials Science Forum 505-507 (enero de 2006): 331–36. http://dx.doi.org/10.4028/www.scientific.net/msf.505-507.331.
Texto completoWang, Yangang, Yibo Wu, Xiaoping Dai, Steve Jones y Guoyou Liu. "Investigation of Automotive Power Semiconductor Module Operates at Elevated Cooling Temperature". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, HiTEN (1 de enero de 2015): 000154–60. http://dx.doi.org/10.4071/hiten-session5-paper5_1.
Texto completoMorgan, Adam, Ankan De, Haotao Ke, Xin Zhao, Kasunaidu Vechalapu, Douglas C. Hopkins y Subhashish Bhattacharya. "A Robust, Composite Packaging Approach for a High Voltage 6.5kV IGBT and Series Diode". International Symposium on Microelectronics 2015, n.º 1 (1 de octubre de 2015): 000359–64. http://dx.doi.org/10.4071/isom-2015-wp17.
Texto completoAnzai, Takeshi, Yoshinori Murakami, Shinji Sato, Hidekazu Tanisawa, Kohei Hiyama, Hiroki Takahashi, Fumiki Kato y Hiroshi Sato. "Warpage Evaluation of High-Temperature Sandwich-Structured Power Module for SiC Power Semiconductor Devices". Journal of Microelectronics and Electronic Packaging 12, n.º 3 (1 de julio de 2015): 153–60. http://dx.doi.org/10.4071/imaps.464.
Texto completoXu Dan, 徐丹, 黄雪松 Huang Xuesong, 姜梦华 Jiang Menghua, 惠勇凌 Hui Yongling, 雷訇 Lei Hong y 李强 Li Qiang. "500 W fiber-coupled semiconductor laser module". Infrared and Laser Engineering 45, n.º 6 (2016): 0606003. http://dx.doi.org/10.3788/irla201645.0606003.
Texto completoAbdesselam, A., P. J. Adkin, P. P. Allport, J. Alonso, L. Andricek, F. Anghinolfi, A. A. Antonov et al. "The ATLAS semiconductor tracker end-cap module". Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment 575, n.º 3 (junio de 2007): 353–89. http://dx.doi.org/10.1016/j.nima.2007.02.019.
Texto completoEl-Awady, K., C. D. Schaper y T. Kailath. "Programmable Thermal Processing Module for Semiconductor Substrates". IEEE Transactions on Control Systems Technology 12, n.º 4 (julio de 2004): 493–509. http://dx.doi.org/10.1109/tcst.2004.824775.
Texto completoParker-Allotey, Nii Adotei, Dean P. Hamilton, Olayiwola Alatise, Michael R. Jennings, Philip A. Mawby, Rob Nash y Rob Magill. "Improved Energy Efficiency Using an IGBT/SiC-Schottky Diode Pair". Materials Science Forum 717-720 (mayo de 2012): 1147–50. http://dx.doi.org/10.4028/www.scientific.net/msf.717-720.1147.
Texto completoTyler, Neil. "Tiny Bluetooth Low Energy Soc and Module". New Electronics 51, n.º 20 (12 de noviembre de 2019): 9. http://dx.doi.org/10.12968/s0047-9624(22)61475-5.
Texto completoWu, Yi Bo, Guo You Liu, Ning Hua Xu y Ze Chun Dou. "Thermal Resistance Analysis and Simulation of IGBT Module with High Power Density". Applied Mechanics and Materials 303-306 (febrero de 2013): 1902–7. http://dx.doi.org/10.4028/www.scientific.net/amm.303-306.1902.
Texto completoWang, Fengzhe. "A Fast Drying Machine Based On Semiconductor Heat Pump". E3S Web of Conferences 252 (2021): 02024. http://dx.doi.org/10.1051/e3sconf/202125202024.
Texto completoDutta, Atanu y Simon S. Ang. "Design of a Low Inductance Power Module Based on Low Temperature Co-fired Ceramic". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, CICMT (1 de mayo de 2016): 000032–38. http://dx.doi.org/10.4071/2016cicmt-tp2a1.
Texto completoŠtěpánek, Jan, Luboš Streit y Tomáš Komrska. "Comparison of Si and SiC based Power Converter Module of 150 kVA for Power System Applications". TRANSACTIONS ON ELECTRICAL ENGINEERING 7, n.º 1 (30 de marzo de 2020): 10–13. http://dx.doi.org/10.14311/tee.2018.1.010.
Texto completoZhuravleva, O. V., A. V. Ivanov, V. D. Kurnosov, K. V. Kurnosov, V. I. Romantsevich y R. V. Chernov. "Reliability estimate for semiconductor laser module ILPN-134". Semiconductors 44, n.º 3 (marzo de 2010): 359–65. http://dx.doi.org/10.1134/s1063782610030152.
Texto completoMoed, Shulamit. "EndCap module production of the ATLAS Semiconductor Tracker". Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment 560, n.º 1 (mayo de 2006): 75–78. http://dx.doi.org/10.1016/j.nima.2005.11.237.
Texto completoUshifusa, Nobuyuki, Hiroich Shinohara, Kousei Nagayama, Satoru Ogihara y Tasao Soga. "4821142 Ceramic multilayer circuit board and semiconductor module". Microelectronics Reliability 29, n.º 6 (enero de 1989): iii. http://dx.doi.org/10.1016/0026-2714(89)90151-0.
Texto completoRodrigues, Ema G., Robert F. Herrick, James Stewart, Helena Palacios, Francine Laden, William Clark y Elizabeth Delzell. "Case–control study of brain and other central nervous system cancer among workers at semiconductor and storage device manufacturing facilities". Occupational and Environmental Medicine 77, n.º 4 (4 de febrero de 2020): 238–48. http://dx.doi.org/10.1136/oemed-2019-106120.
Texto completoKrismadinata, Rudi Mulya y Monica Danni Juwita. "E-learning Courseware Development for Power Electronics Course". International Journal of Interactive Mobile Technologies (iJIM) 16, n.º 03 (10 de febrero de 2022): 66–81. http://dx.doi.org/10.3991/ijim.v16i03.27723.
Texto completoChen, Zheng, Yiying Yao, Wenli Zhang, Dushan Boroyevich, Khai Ngo, Paolo Mattavelli y Rolando Burgos. "Development of an SiC Multichip Phase-Leg Module for High-Temperature and High-Frequency Applications". Journal of Microelectronics and Electronic Packaging 13, n.º 2 (1 de abril de 2016): 39–50. http://dx.doi.org/10.4071/imaps.503.
Texto completoPapanu, Victor. "Comparative Test Data for TIM Materials for LED Applications". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (1 de enero de 2012): 000655–83. http://dx.doi.org/10.4071/2012dpc-ta41.
Texto completoFu, Shancan, Guoliang Wang y Feng Xiao. "Degradation Behavior of High Power Semiconductor Modules by Low-Temperature Sintering Technology". Journal of Physics: Conference Series 2370, n.º 1 (1 de noviembre de 2022): 012012. http://dx.doi.org/10.1088/1742-6596/2370/1/012012.
Texto completoHunt, Bob. "The Development and Qualification of a DC-DC Converter for 225°C (437°F) Operating Temperature". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, HITEC (1 de enero de 2010): 000214–21. http://dx.doi.org/10.4071/hitec-bhunt-wa22.
Texto completoFlores, David, Salvador Hidalgo y Jesús Urresti. "New generation of 3.3kV IGBTs with monolitically integrated voltage and current sensors". Facta universitatis - series: Electronics and Energetics 28, n.º 2 (2015): 213–21. http://dx.doi.org/10.2298/fuee1502213f.
Texto completoWang, Wei, Long Qing Zou, Hua Xu, You Wei An, Pei Fa Jia, Bo Li y Yuan Luo. "A Design Method of Multiple Protocols Communication Module in Semiconductor Equipment Simulation Platform". Advanced Materials Research 462 (febrero de 2012): 516–23. http://dx.doi.org/10.4028/www.scientific.net/amr.462.516.
Texto completoSeal, Sayan, Michael D. Glover y H. Alan Mantooth. "The Design and Evaluation of an Integrated Wire-Bondless Power Module (IWPM) using Low Temperature Co-fired Ceramic Interposer". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, CICMT (1 de mayo de 2016): 000065–72. http://dx.doi.org/10.4071/2016cicmt-tp2b1.
Texto completoZhao, Ge, Yu Zhang, Yue Yang Liu, Jia Jie Che, Wen Yu Gao, Rui Jin y Kun Shan Yu. "A Simulation Method of Pressure-Stress Affects Power Press Pack FRD Chip Forward Voltage". Applied Mechanics and Materials 433-435 (octubre de 2013): 2121–24. http://dx.doi.org/10.4028/www.scientific.net/amm.433-435.2121.
Texto completoANZAI, Takeshi, Yoshinori MURAKAMI, Shinji SATO, Hidekazu TANISAWA, Kohei HIYAMA, Hiroki TAKAHASHI, Fumiki KATO y Hiroshi SATO. "Sandwich Structured Power Module for High Temperature SiC Power Semiconductor Devices". International Symposium on Microelectronics 2014, n.º 1 (1 de octubre de 2014): 000757–62. http://dx.doi.org/10.4071/isom-wp54.
Texto completoKosenko, Roman, Liisa Liivik, Andrii Chub y Oleksandr Velihorskyi. "Comparative Analysis of Semiconductor Power Losses of Galvanically Isolated Quasi-Z-Source and Full-Bridge Boost DC-DC Converters". Electrical, Control and Communication Engineering 8, n.º 1 (1 de julio de 2015): 5–12. http://dx.doi.org/10.1515/ecce-2015-0001.
Texto completoFukuchi, Tomonori, Youichi Arai, Fusao Watanabe, Shinji Motomura, Shin'ichiro Takeda, Yousuke Kanayama, Hiromitsu Haba, Yasuyoshi Watanabe y Shuichi Enomoto. "A Digital Signal Processing Module for Ge Semiconductor Detectors". IEEE Transactions on Nuclear Science 58, n.º 2 (abril de 2011): 461–67. http://dx.doi.org/10.1109/tns.2011.2109968.
Texto completoYang, Gui Lin. "Design of the Thermoelectric Generator". Advanced Materials Research 143-144 (octubre de 2010): 543–46. http://dx.doi.org/10.4028/www.scientific.net/amr.143-144.543.
Texto completoSun, Wanjun, Lijiao Yang, Jianan Xie, Xiaxia Zhang, Yang Sha, Shuai Mi y Tao Lin. "Thermal analysis and package optimization for the multi-wavelength laser bar module". Journal of Physics: Conference Series 2370, n.º 1 (1 de noviembre de 2022): 012006. http://dx.doi.org/10.1088/1742-6596/2370/1/012006.
Texto completoЧэн, Чаншань y Антон Александрович Голянин. "Designing a Cooler With Natural Cold for A 100 kW Semiconductor Power Converter". Bulletin of Science and Practice, n.º 8 (15 de agosto de 2022): 317–24. http://dx.doi.org/10.33619/2414-2948/81/34.
Texto completoSun, Shou Lei, Gui Tang Wang, Ying Ge Li y Zheng Li. "Research on Testing Technology of CMOS Camera Module". Applied Mechanics and Materials 378 (agosto de 2013): 408–12. http://dx.doi.org/10.4028/www.scientific.net/amm.378.408.
Texto completoHan, Yi Lun, Zong Bing Zhang y Xue Lei Wen. "Visual Intelligent Vehicle Control System’s Design Based on PC9S12XS128 MCU". Advanced Materials Research 562-564 (agosto de 2012): 1571–74. http://dx.doi.org/10.4028/www.scientific.net/amr.562-564.1571.
Texto completoNing, Puqi, Fred Wang y Khai D. T. Ngo. "High Temperature SiC Power Module Electrical Evaluation Procedure". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, HITEC (1 de enero de 2010): 000336–42. http://dx.doi.org/10.4071/hitec-pning-tha13.
Texto completoSeal, Sayan, Michael D. Glover y H. Alan Mantooth. "The Design and Evaluation of an Integrated Wire Bond-less Power Module using a Low Temperature Co-fired Ceramic Interposer". Journal of Microelectronics and Electronic Packaging 13, n.º 4 (1 de octubre de 2016): 169–75. http://dx.doi.org/10.4071/imaps.514.
Texto completoMachado da Silva, Jamir, Renan Eduardo da Silva, José Rui Camargo y Ederaldo Godoy Junior. "Optimization of a Thermoelectric Air Conditioning Systems". Defect and Diffusion Forum 336 (marzo de 2013): 111–20. http://dx.doi.org/10.4028/www.scientific.net/ddf.336.111.
Texto completoSato, Shinya, Hidekazu Tanisawa, Takeshi Anzai, Hiroki Takahashi, Yoshinori Murakami, Fumiki Kato, Kinuyo Watanabe y Hiroshi Sato. "Development of a Wire-Bonding-Less SiC Power Module Operating over a Wide Temperature Range". Materials Science Forum 858 (mayo de 2016): 1066–69. http://dx.doi.org/10.4028/www.scientific.net/msf.858.1066.
Texto completoDonghan Lee, Gwan-Chong Joo, Kwang-Ryong Oh, Hee-Tae Lee, Nam Hwang, Sang-Hwan Lee, Seong-Su Park, Min-Kyu Song y Seung-Goo Kang. "Fabrication of semiconductor optical switch module using laser welding technique". IEEE Transactions on Advanced Packaging 23, n.º 4 (2000): 672–80. http://dx.doi.org/10.1109/6040.883757.
Texto completoRaja, Arslan S., Junqiu Liu, Nicolas Volet, Rui Ning Wang, Jijun He, Erwan Lucas, Romain Bouchandand, Paul Morton, John Bowers y Tobias J. Kippenberg. "Chip-based soliton microcomb module using a hybrid semiconductor laser". Optics Express 28, n.º 3 (21 de enero de 2020): 2714. http://dx.doi.org/10.1364/oe.28.002714.
Texto completoWood-Hi Cheng, Maw-Tyan Sheen, Chih-Pen Chien, Hung-Lun Chang y Jao-Hwa Kuang. "Reduction of fiber alignment shifts in semiconductor laser module packaging". Journal of Lightwave Technology 18, n.º 6 (junio de 2000): 842–48. http://dx.doi.org/10.1109/50.848395.
Texto completoVertiy, A. A., I. V. Ivanchenko, N. A. Popenko, S. I. Tarapov y V. P. Shestopalov. "High frequency module and semiconductor research in low-temperature range". International Journal of Infrared and Millimeter Waves 12, n.º 10 (octubre de 1991): 1195–203. http://dx.doi.org/10.1007/bf01008562.
Texto completoMatsumori, Tadayoshi, Atsushi Kawamoto y Tsuguo Kondoh. "Topology optimization for thermal stress reduction in power semiconductor module". Structural and Multidisciplinary Optimization 60, n.º 6 (2 de agosto de 2019): 2615–20. http://dx.doi.org/10.1007/s00158-019-02341-4.
Texto completoGiaretto, Valter y Elena Campagnoli. "The Elusive Thomson Effect in Thermoelectric Devices. Experimental Investigation from 363 K to 213 K on Various Peltier Modules". Metals 10, n.º 2 (23 de febrero de 2020): 291. http://dx.doi.org/10.3390/met10020291.
Texto completoOSONE, Yasuo, Norio NAKAZATO, Yasunari UMEMOTO y Mikio NEGISHI. "Thermal Design of Power Semiconductor Modules for Mobile Communication System (Numerical Estimation of Module Thermal Resistance)". Transactions of the Japan Society of Mechanical Engineers Series B 71, n.º 708 (2005): 2139–46. http://dx.doi.org/10.1299/kikaib.71.2139.
Texto completoShin, Woo, Suk Ko, Hyung Song, Young Ju, Hye Hwang y Gi Kang. "Origin of Bypass Diode Fault in c-Si Photovoltaic Modules: Leakage Current under High Surrounding Temperature". Energies 11, n.º 9 (12 de septiembre de 2018): 2416. http://dx.doi.org/10.3390/en11092416.
Texto completoGadzhieva, S. M., T. A. Chelushkina, D. S. Gadzhiev, P. S. Magomedova y I. M. Kurbanov. "Precision thermoelectric semiconductor sensor". Herald of Dagestan State Technical University. Technical Sciences 48, n.º 4 (9 de febrero de 2022): 6–15. http://dx.doi.org/10.21822/2073-6185-2021-48-4-6-15.
Texto completoAlizadeh, Rana, Kaoru Uema Porter, Tom Cannon y Simon S. Ang. "Fabrication of Ceramic Interposers for Module Packaging". Journal of Microelectronics and Electronic Packaging 17, n.º 2 (1 de abril de 2020): 67–72. http://dx.doi.org/10.4071/imaps.1114553.
Texto completo