Literatura académica sobre el tema "RF Microelectronics"
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Artículos de revistas sobre el tema "RF Microelectronics"
Krstić, D. "RF microelectronics". Microelectronics Journal 29, n.º 12 (diciembre de 1998): 1041–42. http://dx.doi.org/10.1016/s0026-2692(98)00059-7.
Texto completoFrear, D. R. y S. Thomas. "Emerging Materials Challenges in Microelectronics Packaging". MRS Bulletin 28, n.º 1 (enero de 2003): 68–74. http://dx.doi.org/10.1557/mrs2003.20.
Texto completoSpringer, A. y R. Weigel. "RF microelectronics for W-CDMA mobile communication systems". Electronics & Communication Engineering Journal 14, n.º 3 (1 de junio de 2002): 92–100. http://dx.doi.org/10.1049/ecej:20020301.
Texto completoPutman, Carol, Rachel Cramm Horn, J. Ambrose Wolf y Daniel Krueger. "Thermodynamic Analysis of Physical Vapor Deposited Inorganic Thin Films on Low Temperature Cofired Ceramic". Journal of Microelectronics and Electronic Packaging 13, n.º 3 (1 de julio de 2016): 95–101. http://dx.doi.org/10.4071/imaps.518.
Texto completoPutman, Carol, Rachel Cramm Horn, Ambrose Wolf y Daniel Krueger. "Thermodynamic Analysis of Physical Vapor Deposition (PVD) Inorganic Thin Films on Low Temperature Cofired Ceramic (LTCC)". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, CICMT (1 de mayo de 2016): 000175–82. http://dx.doi.org/10.4071/2016cicmt-tha13.
Texto completoSettaouti, Lahouaria y Abderrahmane Settaouti. "A Monte Carlo Method for Low Pressure Radio Frequency Discharges". Sultan Qaboos University Journal for Science [SQUJS] 8, n.º 1 (1 de junio de 2003): 47. http://dx.doi.org/10.24200/squjs.vol8iss1pp47-54.
Texto completoShorey, Aric, Shelby Nelson, David Levy y Paul Ballentine. "Thin Glass Handling Solutions for Microelectronics Packaging". International Symposium on Microelectronics 2020, n.º 1 (1 de septiembre de 2020): 000192–96. http://dx.doi.org/10.4071/2380-4505-2020.1.000192.
Texto completoYoung, Nathan, Jay Johnson y Kevin G. Ewsuk. "Microelectronics Package Design Using Experimentally-Validated Modeling and Simulation". Key Engineering Materials 484 (julio de 2011): 192–203. http://dx.doi.org/10.4028/www.scientific.net/kem.484.192.
Texto completoTomikawa, Masao, Hitoshi Araki, Yohei Kiuchi y Akira Shimada. "Photosensitive Polyimide having low loss tangent for RF application". International Symposium on Microelectronics 2018, n.º 1 (1 de octubre de 2018): 000476–82. http://dx.doi.org/10.4071/2380-4505-2018.1.000476.
Texto completoGropp, S., M. Fischer, A. Frank, C. Schäffel, J. Müller y M. Hoffmann. "Fabrication of an RF-MEMS-Switch on a hybrid Si-Ceramic substrate". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, CICMT (1 de mayo de 2016): 000118–21. http://dx.doi.org/10.4071/2016cicmt-wa24.
Texto completoTesis sobre el tema "RF Microelectronics"
Maris, Ferreira Pietro. "Méthodologie de conception AMS/RF pour la fiabilité : conception d'un frontal RF fiabilisé". Phd thesis, Télécom ParisTech, 2011. http://pastel.archives-ouvertes.fr/pastel-00628802.
Texto completoCao, Guangjun. "Physics and technology of silicon RF power devices". Thesis, De Montfort University, 2000. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.391785.
Texto completoAriaudo, Myriam. "Dirty RF pour les Systèmes de Communication". Habilitation à diriger des recherches, Université de Cergy Pontoise, 2010. http://tel.archives-ouvertes.fr/tel-00555445.
Texto completoTirunelveli, Kanthi Saravanan. "Analysis and; design of successive approximation ADC and 3.5 GHz RF transmitter in 90nm CMOS". Thesis, Georgia Institute of Technology, 2010. http://hdl.handle.net/1853/33884.
Texto completoJones, Jason Patrick. "Electro-thermo-mechanical characterization of stress development in AlGaN/GaN HEMTs under RF operating conditions". Thesis, Georgia Institute of Technology, 2015. http://hdl.handle.net/1853/53528.
Texto completoAndersson, Stefan. "Multiband LNA Design and RF-Sampling Front-Ends for Flexible Wireless Receivers". Doctoral thesis, Linköping : Electronic Devices, Department of Electrical Engineering, Linköping University, 2006. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-7582.
Texto completoCesari, Albert. "Implémentation de techniques de linéarisation et d'amélioration du rendement pour les amplificateurs de puissance RF". Phd thesis, Université Paul Sabatier - Toulouse III, 2008. http://tel.archives-ouvertes.fr/tel-00538808.
Texto completoPennec, Fabienne. "Modélisationdu contact métal-métal: application aux micro-commutateurs MEMS RF". Phd thesis, Université Paul Sabatier - Toulouse III, 2009. http://tel.archives-ouvertes.fr/tel-00420496.
Texto completoBusquere, Jean-Pierre. "Développement et intégration de MEMS RF dans les architectures d'amplificateur faible bruit reconfigurables". Phd thesis, INSA de Toulouse, 2005. http://tel.archives-ouvertes.fr/tel-00446353.
Texto completoJeangeorges, Mickaël. "Conception d'antennes miniatures intégrées pour solutions RF SiP". Phd thesis, Université de Nice Sophia-Antipolis, 2010. http://tel.archives-ouvertes.fr/tel-00544576.
Texto completoLibros sobre el tema "RF Microelectronics"
Razavi, Behzad. RF microelectronics. 2a ed. Upper Saddle River, NJ: Prentice Hall, 2012.
Buscar texto completoRF microelectronics. Upper Saddle River, NJ: Prentice Hall, 1998.
Buscar texto completoKuang, Ken, Franklin Kim y Sean S. Cahill, eds. RF and Microwave Microelectronics Packaging. Boston, MA: Springer US, 2010. http://dx.doi.org/10.1007/978-1-4419-0984-8.
Texto completoKuang, Ken. RF and microwave microelectronics packaging. New York: Springer, 2010.
Buscar texto completoKuang, Ken y Rick Sturdivant, eds. RF and Microwave Microelectronics Packaging II. Cham: Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-51697-4.
Texto completoRF microelectronics: She pin wei dian zi. Beijing: Tsinghua University Press, 2003.
Buscar texto completoV, Lyashenko Alexander, ed. Heteromagnetic microelectronics: Microsystems of active type. New York: Springer, 2010.
Buscar texto completoJoodaki, Mojtaba. Selected Advances in Nanoelectronic Devices: Logic, Memory and RF. Berlin, Heidelberg: Springer Berlin Heidelberg, 2013.
Buscar texto completoSakian, Pooyan. RF-Frontend Design for Process-Variation-Tolerant Receivers. Boston, MA: Springer US, 2012.
Buscar texto completoElectromagnetics explained: A handbook for wireless/RF, EMC, and high-speed electronics. Amsterdam: Newnes, 2002.
Buscar texto completoCapítulos de libros sobre el tema "RF Microelectronics"
Palankovski, Vassil y Rüdiger Quay. "RF Parameter Extraction for HEMTs and HBTs". En Computational Microelectronics, 141–53. Vienna: Springer Vienna, 2004. http://dx.doi.org/10.1007/978-3-7091-0560-3_4.
Texto completoPalankovski, Vassil y Rüdiger Quay. "State-of-the-Art of Materials, Device Modeling, and RF Devices". En Computational Microelectronics, 4–25. Vienna: Springer Vienna, 2004. http://dx.doi.org/10.1007/978-3-7091-0560-3_2.
Texto completoGuosheng, Jiang, Ken Kuang y Danny Zhu. "High Performance Microelectronics Packaging Heat Sink Materials". En RF and Microwave Microelectronics Packaging, 233–65. Boston, MA: Springer US, 2009. http://dx.doi.org/10.1007/978-1-4419-0984-8_11.
Texto completoSturdivant, Rick. "Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies". En RF and Microwave Microelectronics Packaging, 1–23. Boston, MA: Springer US, 2009. http://dx.doi.org/10.1007/978-1-4419-0984-8_1.
Texto completoSepulveda, Juan L. y Lee J. Vandermark. "High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging". En RF and Microwave Microelectronics Packaging, 207–32. Boston, MA: Springer US, 2009. http://dx.doi.org/10.1007/978-1-4419-0984-8_10.
Texto completoHao, Zhang, Cui Song y Liu Junyong. "Technology Research on AlN 3D MCM". En RF and Microwave Microelectronics Packaging, 267–79. Boston, MA: Springer US, 2009. http://dx.doi.org/10.1007/978-1-4419-0984-8_12.
Texto completoSanjuan, Eric A. y Sean S. Cahill. "Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages". En RF and Microwave Microelectronics Packaging, 25–42. Boston, MA: Springer US, 2009. http://dx.doi.org/10.1007/978-1-4419-0984-8_2.
Texto completoFuh, Yiin-Kuen, Firas Sammoura, Yingqi Jiang y Liwei Lin. "Polymeric Microelectromechanical Millimeter Wave Systems". En RF and Microwave Microelectronics Packaging, 43–68. Boston, MA: Springer US, 2009. http://dx.doi.org/10.1007/978-1-4419-0984-8_3.
Texto completoStoneham, Edward B. "Millimeter-Wave Chip-on-Board Integration and Packaging". En RF and Microwave Microelectronics Packaging, 69–90. Boston, MA: Springer US, 2009. http://dx.doi.org/10.1007/978-1-4419-0984-8_4.
Texto completoMcGrath, Mark P., Kunia Aihara, Morgan J. Chen, Cheng Chen y Anh-Vu Pham. "Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules". En RF and Microwave Microelectronics Packaging, 91–113. Boston, MA: Springer US, 2009. http://dx.doi.org/10.1007/978-1-4419-0984-8_5.
Texto completoActas de conferencias sobre el tema "RF Microelectronics"
Deen, M. Jamal, Chih-hung Chen, S. Naseh, Yuhua Cheng y M. Matloubian. "RF modeling of MOSFETs". En International Symposium on Microelectronics and Assembly, editado por Bernard Courtois, Serge N. Demidenko y Lee Y. Lau. SPIE, 2000. http://dx.doi.org/10.1117/12.405405.
Texto completoIwai, Hiroshi, Tatsuya Ohguro, Eiji Morifuji, Takashi Yoshitomi, Hideki Kimijima, Hisayo S. Momose, Kazumi Inoh, Hideaki Nii y Yasuhiro Katsumata. "Advanced rf CMOS technology". En Asia Pacific Symposium on Microelectronics and MEMS, editado por Neil W. Bergmann, Olaf Reinhold y Norman C. Tien. SPIE, 1999. http://dx.doi.org/10.1117/12.364461.
Texto completoLoke, Yee C., Kim M. Liew, Q. Zou y Ai Q. Liu. "Frequency tunable micromachined rf oscillators". En International Symposium on Microelectronics and Assembly, editado por Kevin H. Chau, M. Parameswaran y Francis E. Tay. SPIE, 2000. http://dx.doi.org/10.1117/12.404898.
Texto completoPark, Heung-Woo, Yun-Kwon Park, Duck-Jung Lee y Byeong-Kwon Ju. "Packaging of the rf MEMS switch". En International Symposium on Microelectronics and MEMS, editado por Paul D. Franzon, Ajay P. Malshe y Francis E. Tay. SPIE, 2001. http://dx.doi.org/10.1117/12.448864.
Texto completoVaradan, Vijay K., Vasundara V. Varadan y K. A. Jose. "Semiconductor-polymer-based rf MEMS". En Asia Pacific Symposium on Microelectronics and MEMS, editado por Neil W. Bergmann, Olaf Reinhold y Norman C. Tien. SPIE, 1999. http://dx.doi.org/10.1117/12.364448.
Texto completoRahman, Hamood Ur, Jafar Babaei y Rodica Ramer. "RF MEMS switches: design and performance in wireless applications". En Microelectronics, MEMS, and Nanotechnology, editado por Hark Hoe Tan, Jung-Chih Chiao, Lorenzo Faraone, Chennupati Jagadish, Jim Williams y Alan R. Wilson. SPIE, 2007. http://dx.doi.org/10.1117/12.769359.
Texto completoZheng, Rong, Kamal Alameh y Zhenglin Wang. "Reconfigurable photonic RF filter based on opto-VLSI processing". En Microelectronics, MEMS, and Nanotechnology, editado por Derek Abbott, Yuri S. Kivshar, Halina H. Rubinsztein-Dunlop y Shanhui Fan. SPIE, 2005. http://dx.doi.org/10.1117/12.638210.
Texto completoChetibi, M., M. Gares, M. Masmoudi, H. Maanane, J. Marcon, K. Mourgues y Ph Eudeline. "RF power LDMOSFET characterization and modeling for reliability issues: DC and RF performances". En 2008 26th International Conference on Microelectronics (MIEL 2008). IEEE, 2008. http://dx.doi.org/10.1109/icmel.2008.4559250.
Texto completoDittmer, Jan, Rolf Judaschke y Stephanus Büttgenbach. "Specialized hybrid batch fabrication process for MEMS RF voltage sensors". En Microelectronics, MEMS, and Nanotechnology, editado por Hark Hoe Tan, Jung-Chih Chiao, Lorenzo Faraone, Chennupati Jagadish, Jim Williams y Alan R. Wilson. SPIE, 2007. http://dx.doi.org/10.1117/12.759425.
Texto completoMcCarthy, Aaron J., David V. Thiel y Peter Lisner. "Integrated CMOS RF building blocks for 433-MHz sensor systems". En Microelectronics, MEMS, and Nanotechnology, editado por Derek Abbott, Kamran Eshraghian, Charles A. Musca, Dimitris Pavlidis y Neil Weste. SPIE, 2004. http://dx.doi.org/10.1117/12.522760.
Texto completoInformes sobre el tema "RF Microelectronics"
RAYTHEON CO LEXINGTON MA RESEARCH DIV. RF Vacuum Microelectronics. Fort Belvoir, VA: Defense Technical Information Center, abril de 1994. http://dx.doi.org/10.21236/ada278734.
Texto completoPalevsky, Alan. RF Vacuum Microelectronics. Fort Belvoir, VA: Defense Technical Information Center, julio de 1994. http://dx.doi.org/10.21236/ada283123.
Texto completoArch, D. K. RF Vacuum Microelectronics. Fort Belvoir, VA: Defense Technical Information Center, julio de 1992. http://dx.doi.org/10.21236/ada253488.
Texto completoAkinwande, A. I., P. Bauhahn, T. Ohnstein, J. Holmen y B. Speldrich. RF Vacuum Microelectronics. Fort Belvoir, VA: Defense Technical Information Center, julio de 1992. http://dx.doi.org/10.21236/ada253527.
Texto completoRAYTHEON CO LEXINGTON MA. RF Vacuum Microelectronics. Fort Belvoir, VA: Defense Technical Information Center, julio de 1992. http://dx.doi.org/10.21236/ada253910.
Texto completoArch, David K. RF Vacuum Microelectronics. Fort Belvoir, VA: Defense Technical Information Center, febrero de 1993. http://dx.doi.org/10.21236/ada260192.
Texto completoAkinwande, A. I. y D. K. Arch. RF Vacuum Microelectronics. Fort Belvoir, VA: Defense Technical Information Center, mayo de 1993. http://dx.doi.org/10.21236/ada264528.
Texto completoRAYTHEON CO LEXINGTON MA RESEARCH DIV. RF Vacuum Microelectronics. Fort Belvoir, VA: Defense Technical Information Center, julio de 1993. http://dx.doi.org/10.21236/ada266569.
Texto completoAkinwande, A. I. y D. K. Arch. RF Vacuum Microelectronics. Fort Belvoir, VA: Defense Technical Information Center, agosto de 1993. http://dx.doi.org/10.21236/ada268317.
Texto completoKomm, David S. RF Vacuum Microelectronics. Fort Belvoir, VA: Defense Technical Information Center, junio de 1993. http://dx.doi.org/10.21236/ada269454.
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