Artículos de revistas sobre el tema "Reliability characterization"
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Amirabdollahian, Mahsa y Bithin Datta. "Reliability Evaluation of Groundwater Contamination Source Characterization under Uncertain Flow Field". International Journal of Environmental Science and Development 6, n.º 7 (2015): 512–18. http://dx.doi.org/10.7763/ijesd.2015.v6.647.
Texto completoTsuchiya, Toshiyuki. "Reliability Characterization of MEMS Materials". IEEJ Transactions on Sensors and Micromachines 125, n.º 7 (2005): 289–93. http://dx.doi.org/10.1541/ieejsmas.125.289.
Texto completoSong, William, Saibal Mukhopadhyay y Sudhakar Yalamanchili. "Architectural Reliability: Lifetime Reliability Characterization and Management ofMany-Core Processors". IEEE Computer Architecture Letters 14, n.º 2 (1 de julio de 2015): 103–6. http://dx.doi.org/10.1109/lca.2014.2340873.
Texto completoYang, Q. J., H. L. J. Pang, Z. P. Wang, G. H. Lim, F. F. Yap y R. M. Lin. "Vibration reliability characterization of PBGA assemblies". Microelectronics Reliability 40, n.º 7 (julio de 2000): 1097–107. http://dx.doi.org/10.1016/s0026-2714(00)00036-6.
Texto completoEkwueme, Chukwuma G. y Gary C. Hart. "Structural reliability characterization of precast concrete". Structural Design of Tall Buildings 3, n.º 1 (marzo de 1994): 13–35. http://dx.doi.org/10.1002/tal.4320030103.
Texto completoLee, J. C., Chen Ih-Chin y Hu Chenming. "Modeling and characterization of gate oxide reliability". IEEE Transactions on Electron Devices 35, n.º 12 (1988): 2268–78. http://dx.doi.org/10.1109/16.8802.
Texto completoCheng, Bowen, Dirk De Bruyker, Chris Chua, Kunal Sahasrabuddhe, Ivan Shubin, John E. Cunningham, Ying Luo, Karl F. Bohringer, Ashok V. Krishnamoorthy y Eugene M. Chow. "Microspring Characterization and Flip-Chip Assembly Reliability". IEEE Transactions on Components, Packaging and Manufacturing Technology 3, n.º 2 (febrero de 2013): 187–96. http://dx.doi.org/10.1109/tcpmt.2012.2213250.
Texto completoClaeys, C., E. Simoen, J. M. Rafi, Marcelo A. Pavanello y Joao A. Martino. "Physical Characterization and Reliability Aspects of MuGFETs". ECS Transactions 9, n.º 1 (19 de diciembre de 2019): 281–94. http://dx.doi.org/10.1149/1.2766899.
Texto completoSheikh, A. "A reliability model for fatigue life characterization". International Journal of Fatigue 17, n.º 2 (febrero de 1995): 121–28. http://dx.doi.org/10.1016/0142-1123(95)95891-j.
Texto completoShaddock, David y Liang Yin. "Reliability of High Temperature Laminates". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, HiTEN (1 de enero de 2015): 000100–000110. http://dx.doi.org/10.4071/hiten-session3b-paper3b_1.
Texto completoNAYAK, AMIYA y NICOLA SANTORO. "ON RELIABILITY ANALYSIS OF CHORDAL RINGS". Journal of Circuits, Systems and Computers 05, n.º 02 (junio de 1995): 199–213. http://dx.doi.org/10.1142/s0218126695000151.
Texto completoW., TAZBIT y MIALHE P. "RELIABILITY OF MICROELECTRONIC DEVICES FROM EMITTERBASE JUNCTION CHARACTERIZATION". International Conference on Applied Mechanics and Mechanical Engineering 13, n.º 13 (1 de mayo de 2008): 29–37. http://dx.doi.org/10.21608/amme.2008.39820.
Texto completoTu, Zhijuan, Zhiping Zhou y Xingjun Wang. "Reliability characterization of silicon-based germanium waveguide photodetectors". Optical Engineering 53, n.º 5 (5 de mayo de 2014): 057103. http://dx.doi.org/10.1117/1.oe.53.5.057103.
Texto completoDoyle, R., B. O'Flynn, W. Lawton, J. Barrett y J. Buckley. "Glob-top reliability characterization: evaluation and analysis methods". IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A 21, n.º 2 (junio de 1998): 292–300. http://dx.doi.org/10.1109/95.705478.
Texto completoRoss, R. G., G. R. Mon, L. Wen, C. C. Gonzalez y R. S. Sugimura. "Measurement and characterization of thin film module reliability". Solar Cells 24, n.º 3-4 (julio de 1988): 271–78. http://dx.doi.org/10.1016/0379-6787(88)90078-6.
Texto completovan Beek, Andries, Peter Borm y Marieke Quant. "Axiomatic Characterizations of a Proportional Influence Measure for Sequential Projects with Imperfect Reliability". Axioms 10, n.º 4 (30 de septiembre de 2021): 247. http://dx.doi.org/10.3390/axioms10040247.
Texto completoLi, Qingshen, Yigang Lin, Shoudong Wang, Shanshan Wang y Xiangou Zhu. "Storage Reliability Assessment Method for Aerospace Electromagnetic Relay Based on Belief Reliability Theory". Applied Sciences 12, n.º 17 (29 de agosto de 2022): 8637. http://dx.doi.org/10.3390/app12178637.
Texto completoDolnicar, Peter, Drago Milosevic, Zoran Jovovic, Vladimir Meglic, Marko Maras y Ana Velimirovic. "Reliability of morphological and molecular characterization of lightsprouts for differentiation of potato accessions". Genetika 48, n.º 2 (2016): 525–32. http://dx.doi.org/10.2298/gensr1602525d.
Texto completoBadger, Lacey L., Nikholas G. Toledo, Derek W. Slottke, John Thomas, Miguel Alamillo, Elliott Gunnarsson, Mark L. Le Rutt y Ilan Tsameret. "Ultra-Fine Pitch Wedge bonding for Device Reliability Characterization". International Symposium on Microelectronics 2018, n.º 1 (1 de octubre de 2018): 000561–65. http://dx.doi.org/10.4071/2380-4505-2018.1.000561.
Texto completoCholda, Piotr, Janos Tapolcai, Tibor Cinkler, Krzysztof Wajda y Andrzej Jajszczyk. "Quality of resilience as a network reliability characterization tool". IEEE Network 23, n.º 2 (marzo de 2009): 11–19. http://dx.doi.org/10.1109/mnet.2009.4804331.
Texto completoLin, Hua Tay y Mattison K. Ferber. "Characterization of Mechanical Reliability of Silicon Nitride Microturbine Rotors". Key Engineering Materials 287 (junio de 2005): 393–403. http://dx.doi.org/10.4028/www.scientific.net/kem.287.393.
Texto completoCastellazzi, Alberto y Mauro Ciappa. "Electrothermal Characterization for Reliability of Modern Low-Voltage PowerMOSFETs". IEEE Transactions on Device and Materials Reliability 7, n.º 4 (diciembre de 2007): 571–80. http://dx.doi.org/10.1109/tdmr.2007.910439.
Texto completoSy, Fatoumata, Quentin Rafhay, Julien Poette, Gregory Grosa, Gaelle Beylier, Philippe Grosse, David Roy y Jean-Emmanuel Broquin. "Reliability Characterization and Modeling of High Speed Ge Photodetectors". IEEE Transactions on Device and Materials Reliability 19, n.º 4 (diciembre de 2019): 688–95. http://dx.doi.org/10.1109/tdmr.2019.2945996.
Texto completoDuong, Q. H., L. Buchaillot, D. Collard, P. Schmitt, X. Lafontan, P. Pons, F. Flourens y F. Pressecq. "Thermal and electrostatic reliability characterization in RF MEMS switches". Microelectronics Reliability 45, n.º 9-11 (septiembre de 2005): 1790–93. http://dx.doi.org/10.1016/j.microrel.2005.07.095.
Texto completoTazibt, W., P. Mialhe, J. P. Charles y M. A. Belkhir. "A junction characterization for microelectronic devices quality and reliability". Microelectronics Reliability 48, n.º 3 (marzo de 2008): 348–53. http://dx.doi.org/10.1016/j.microrel.2007.06.002.
Texto completoMatmat, Mohamed, Fabio Coccetti, Antoine Marty, Robert Plana, Christophe Escriba, Jean-Yves Fourniols y Daniel Esteve. "Capacitive RF MEMS analytical predictive reliability and lifetime characterization". Microelectronics Reliability 49, n.º 9-11 (septiembre de 2009): 1304–8. http://dx.doi.org/10.1016/j.microrel.2009.06.049.
Texto completoBernal, S., F. J. Botana, R. García, F. Ramírez y J. M. Rodríguez-Izquierdo. "Characterization of an experimental TPD-MS system. Reliability problems". Thermochimica Acta 98 (febrero de 1986): 319–26. http://dx.doi.org/10.1016/0040-6031(86)87102-7.
Texto completoDubey, Vaibhav y Deepak Khushalani. "Reliability characterization of MEMS switch using MIM test structures". Journal of Electrical Systems and Information Technology 1, n.º 3 (diciembre de 2014): 187–97. http://dx.doi.org/10.1016/j.jesit.2014.12.002.
Texto completoMartin, Andreas. "Review on the reliability characterization of plasma-induced damage". Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 27, n.º 1 (2009): 426. http://dx.doi.org/10.1116/1.3054356.
Texto completoSuehle, J. S. "Ultrathin gate oxide reliability: physical models, statistics, and characterization". IEEE Transactions on Electron Devices 49, n.º 6 (junio de 2002): 958–71. http://dx.doi.org/10.1109/ted.2002.1003712.
Texto completoLiu, Hongxia y Yue Hao. "A new method of thin gate SiO2 reliability characterization". Surface and Interface Analysis 34, n.º 1 (2002): 437–40. http://dx.doi.org/10.1002/sia.1333.
Texto completoLall, Pradeep, Michael Pecht y Edward B. Hakim. "Characterization of functional relationship between temperature and microelectronic reliability". Microelectronics Reliability 35, n.º 3 (marzo de 1995): 377–402. http://dx.doi.org/10.1016/0026-2714(95)93067-k.
Texto completoDugan, M. Patrick. "Reliability characterization of a 3-mum cmos/sos process". Quality and Reliability Engineering International 3, n.º 2 (abril de 1987): 99–105. http://dx.doi.org/10.1002/qre.4680030207.
Texto completoSundresh, Tippure S. "Macroscopic characterization of software and its relationship to reliability". Bell Labs Technical Journal 10, n.º 1 (5 de mayo de 2005): 169–74. http://dx.doi.org/10.1002/bltj.20086.
Texto completoCalò, C., A. Lay-Ekuakille, P. Vergallo, C. Chiffi, A. Trotta, A. Fasanella y A. M. Fasanella. "Measurements and Characterization of Photovoltaic Modules for Tolerance Verification". International Journal of Measurement Technologies and Instrumentation Engineering 1, n.º 2 (abril de 2011): 73–83. http://dx.doi.org/10.4018/ijmtie.2011040106.
Texto completoRushdi, Ali Muhammad Ali y Fares Ahmad Muhammad Ghaleb. "Reliability Characterization of Binary-Imaged Multi-State Coherent Threshold Systems". International Journal of Mathematical, Engineering and Management Sciences 6, n.º 1 (29 de octubre de 2020): 309–21. http://dx.doi.org/10.33889/ijmems.2021.6.1.020.
Texto completoResch-Genger, Ute y Paul C. DeRose. "Characterization of photoluminescence measuring systems (IUPAC Technical Report)". Pure and Applied Chemistry 84, n.º 8 (4 de junio de 2012): 1815–35. http://dx.doi.org/10.1351/pac-rep-10-07-07.
Texto completoZaghloul, Usama, George J. Papaioannou, Bharat Bhushan, Fabio Coccetti, Patrick Pons y Robert Plana. "New insights into reliability of electrostatic capacitive RF MEMS switches". International Journal of Microwave and Wireless Technologies 3, n.º 5 (1 de septiembre de 2011): 571–86. http://dx.doi.org/10.1017/s1759078711000766.
Texto completoShaddock, David, Liang Yin, Zhenzhen Shen, Zhangming Zhou y R. Wayne Johnson. "DIP Test Socket Characterization for 300°C". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, HITEN (1 de enero de 2013): 000213–19. http://dx.doi.org/10.4071/hiten-wa12.
Texto completoPark, Heejin. "Reliability Evaluation Through Moisture Sorption Characterization of Electronic Packaging Materials". Transactions of the Korean Society of Mechanical Engineers A 37, n.º 9 (1 de septiembre de 2013): 1151–58. http://dx.doi.org/10.3795/ksme-a.2013.37.9.1151.
Texto completoBruinsma, Wendy E., Thierry G. Guitton, Jon JP Warner y David Ring. "Interobserver Reliability of Classification and Characterization of Proximal Humeral Fractures". Journal of Bone and Joint Surgery-American Volume 95, n.º 17 (septiembre de 2013): 1600–1604. http://dx.doi.org/10.2106/jbjs.l.00586.
Texto completoAMAGAI, Masazumi. "Chip Scale Package Solder Joint Reliability Modeling and Material Characterization." Journal of Japan Institute of Electronics Packaging 3, n.º 1 (2000): 45–56. http://dx.doi.org/10.5104/jiep.3.45.
Texto completoMathew, Varughese y Tu Anh Tran. "Characterization of Over Pad Metallization (OPM) for High Temperature Reliability". International Symposium on Microelectronics 2012, n.º 1 (1 de enero de 2012): 001097–104. http://dx.doi.org/10.4071/isom-2012-thp32.
Texto completoDas, H., S. Sunkari, M. Domeij, A. Konstantinov, F. Allerstam y T. Neyer. "(Invited) Enabling SiC Yield and Reliability through Epitaxy and Characterization". ECS Transactions 69, n.º 11 (2 de octubre de 2015): 29–32. http://dx.doi.org/10.1149/06911.0029ecst.
Texto completoYoung, C. D., K. Akarvardar, K. Matthews, M. O. Baykan, J. Pater, I. Ok, T. Ngai et al. "(Invited) Electrical Characterization and Reliability Assessment of Double-Gate FinFETs". ECS Transactions 50, n.º 4 (15 de marzo de 2013): 201–6. http://dx.doi.org/10.1149/05004.0201ecst.
Texto completoCheng, Y. L., W. Y. Chang, B. J. Wei, F. H. Lu y Y. L. Wang. "Electrical and Reliability Characterization of Ti/TiN Thin Film Resistor". ECS Transactions 45, n.º 6 (27 de abril de 2012): 81–90. http://dx.doi.org/10.1149/1.3700941.
Texto completoTardibuono, Mark J. "Characterization of PCB plated‐through‐hole reliability using statistical analysis". Circuit World 31, n.º 1 (marzo de 2005): 8–15. http://dx.doi.org/10.1108/03056120510553176.
Texto completoManzini, Stefano y Mattia Rossetti. "Electrical Characterization and Reliability of Split-Gate High-Voltage Transistors". IEEE Transactions on Device and Materials Reliability 18, n.º 2 (junio de 2018): 279–83. http://dx.doi.org/10.1109/tdmr.2018.2828985.
Texto completoKerber, Andreas, Tanya Nigam, Peter Paliwoda y Fernando Guarin. "Reliability Characterization of Ring Oscillator Circuits for Advanced CMOS Technologies". IEEE Transactions on Device and Materials Reliability 20, n.º 2 (junio de 2020): 230–41. http://dx.doi.org/10.1109/tdmr.2020.2981010.
Texto completoHong, Sung-Jei, Jong-Woong Kim y Seung-Boo Jung. "Characterization of Reliability of Printed Indium Tin Oxide Thin Films". Journal of Nanoscience and Nanotechnology 13, n.º 11 (1 de noviembre de 2013): 7770–73. http://dx.doi.org/10.1166/jnn.2013.7813.
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