Literatura académica sobre el tema "Reliability characterization"
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Artículos de revistas sobre el tema "Reliability characterization"
Amirabdollahian, Mahsa y Bithin Datta. "Reliability Evaluation of Groundwater Contamination Source Characterization under Uncertain Flow Field". International Journal of Environmental Science and Development 6, n.º 7 (2015): 512–18. http://dx.doi.org/10.7763/ijesd.2015.v6.647.
Texto completoTsuchiya, Toshiyuki. "Reliability Characterization of MEMS Materials". IEEJ Transactions on Sensors and Micromachines 125, n.º 7 (2005): 289–93. http://dx.doi.org/10.1541/ieejsmas.125.289.
Texto completoSong, William, Saibal Mukhopadhyay y Sudhakar Yalamanchili. "Architectural Reliability: Lifetime Reliability Characterization and Management ofMany-Core Processors". IEEE Computer Architecture Letters 14, n.º 2 (1 de julio de 2015): 103–6. http://dx.doi.org/10.1109/lca.2014.2340873.
Texto completoYang, Q. J., H. L. J. Pang, Z. P. Wang, G. H. Lim, F. F. Yap y R. M. Lin. "Vibration reliability characterization of PBGA assemblies". Microelectronics Reliability 40, n.º 7 (julio de 2000): 1097–107. http://dx.doi.org/10.1016/s0026-2714(00)00036-6.
Texto completoEkwueme, Chukwuma G. y Gary C. Hart. "Structural reliability characterization of precast concrete". Structural Design of Tall Buildings 3, n.º 1 (marzo de 1994): 13–35. http://dx.doi.org/10.1002/tal.4320030103.
Texto completoLee, J. C., Chen Ih-Chin y Hu Chenming. "Modeling and characterization of gate oxide reliability". IEEE Transactions on Electron Devices 35, n.º 12 (1988): 2268–78. http://dx.doi.org/10.1109/16.8802.
Texto completoCheng, Bowen, Dirk De Bruyker, Chris Chua, Kunal Sahasrabuddhe, Ivan Shubin, John E. Cunningham, Ying Luo, Karl F. Bohringer, Ashok V. Krishnamoorthy y Eugene M. Chow. "Microspring Characterization and Flip-Chip Assembly Reliability". IEEE Transactions on Components, Packaging and Manufacturing Technology 3, n.º 2 (febrero de 2013): 187–96. http://dx.doi.org/10.1109/tcpmt.2012.2213250.
Texto completoClaeys, C., E. Simoen, J. M. Rafi, Marcelo A. Pavanello y Joao A. Martino. "Physical Characterization and Reliability Aspects of MuGFETs". ECS Transactions 9, n.º 1 (19 de diciembre de 2019): 281–94. http://dx.doi.org/10.1149/1.2766899.
Texto completoSheikh, A. "A reliability model for fatigue life characterization". International Journal of Fatigue 17, n.º 2 (febrero de 1995): 121–28. http://dx.doi.org/10.1016/0142-1123(95)95891-j.
Texto completoShaddock, David y Liang Yin. "Reliability of High Temperature Laminates". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, HiTEN (1 de enero de 2015): 000100–000110. http://dx.doi.org/10.4071/hiten-session3b-paper3b_1.
Texto completoTesis sobre el tema "Reliability characterization"
Nam, David. "Characterization, Reliability and Packaging for 300 °C MOSFET". Thesis, Virginia Tech, 2020. http://hdl.handle.net/10919/104896.
Texto completoM.S.
Electrical devices that are rated for high temperature applications demand a use of a material that is stable and reliable at the elevated temperatures. Silicon carbide (SiC) is such a material. Devices made from SiC are able to switch faster, have a superior efficiency, and are capable of operating at extreme temperatures much better than the currently widely used silicon (Si) devices. There are limitations on SiC certain structures of SiC devices, such as the metal oxide semiconductor field effect transistor (MOSFET), have inherent reliability issues related to the fabrication of the device. These reliability issues can get worse over higher temperature ranges. Therefore, studies must be made to determine the feasibility of SiC MOSFETs in high temperature applications. To do so, industry standard tests are conducted on newer generation SiC MOSFETs to ascertain their use for said conditions.
Ali, Richard A. "Reliability and characterization of high voltage power capacitors". Thesis, Monterey, California: Naval Postgraduate School, 2014. http://hdl.handle.net/10945/41346.
Texto completoAlternative energy products are an increasingly common sight on military bases in the United States. Energy product reliability affects the sustainability and cost-effectiveness of these systems, which must be tested by outside entities to ensure quality. The purpose of this thesis is to perform component level reliability testing on a high voltage power capacitor used in an electrical vehicle solar charging system. A component level characterization was performed to better understand the physical attributes of these capacitors. This investigation identified the expected component lifetime and conditions in which this component will become less reliable. Results are compared to those published by the manufacturer.
Tallarico, Andrea Natale <1988>. "Characterization and Modeling of Semiconductor Power Devices Reliability". Doctoral thesis, Alma Mater Studiorum - Università di Bologna, 2017. http://amsdottorato.unibo.it/7990/1/Tallarico_PhD_Thesis.pdf.
Texto completoXiao, Di. "On Modern IGBT Modules: Characterization, Reliability and Failure Mechanisms". Thesis, Norwegian University of Science and Technology, Department of Electrical Power Engineering, 2010. http://urn.kb.se/resolve?urn=urn:nbn:no:ntnu:diva-10932.
Texto completoThe increased demand of offshore power conversion systems is driven by newly initiated offshore projects for wind farms and oil production. Because of long distances to shore and inaccessibility of the equipment long repair times must be expected. At the same time the offshore environment is extremely harsh. Thus, high reliability is required for the converters and it is important to have good knowledge of the switching devices. This thesis investigates switching characteristics and losses of commercially available IGBT modules to be used for this application. It focuses on switching time and switching energy losses depending on gate resistance, current and voltage levels, operation temperatures, and show differences between several devices of the same type. Some test show how device characteristics and losses when the device has been exposed to stress over a certain period.
Zheng, Hanguang. "Die-Attachment on Copper by Nanosilver Sintering: Processing, Characterization and Reliability". Diss., Virginia Tech, 2015. http://hdl.handle.net/10919/73312.
Texto completoPh. D.
Luo, Wen. "Reliability characterization and prediction of high k dielectric thin film". Texas A&M University, 2004. http://hdl.handle.net/1969.1/3225.
Texto completoZAMBELLI, Cristian. "ELECTRICAL CHARACTERIZATION, PHYSICS, MODELING AND RELIABILITY OF INNOVATIVE NON-VOLATILE MEMORIES". Doctoral thesis, Università degli studi di Ferrara, 2012. http://hdl.handle.net/11392/2389431.
Texto completoRieske, Ralf. "Characterization of attenuation and reliability of PCB integrated optical waveguides". Templin Detert, 2006. http://deposit.d-nb.de/cgi-bin/dokserv?id=3017300&prov=M&dok_var=1&dok_ext=htm.
Texto completoLe, Huy X. P. "Characterization of hot-carrier reliability in analog sub-circuit design". Thesis, Massachusetts Institute of Technology, 1996. http://hdl.handle.net/1721.1/41379.
Texto completoIncludes bibliographical references (leaves 52-54).
by Huy X.P. Le.
M.Eng.
Engelbert, Carl Robert. "Statistical characterization of graphite fiber for prediction of composite structure reliability". Thesis, Monterey, California : Naval Postgraduate School, 1990. http://handle.dtic.mil/100.2/ADA238020.
Texto completoThesis Advisor(s): Wu, Edward M. "June 1990." Description based on signature page as viewed on October 21, 2009. DTIC Identifier(s): Graphite fiber strength testing, graphite fiber statistical evaluation. Author(s) subject terms: Graphite fiber strength testing, graphite fiber statistical evaluation, composite reliability predictions. Includes bibliographical references (p. 78-79). Also available in print.
Libros sobre el tema "Reliability characterization"
McCauley, James W. y Volker Weiss, eds. Materials Characterization for Systems Performance and Reliability. Boston, MA: Springer US, 1986. http://dx.doi.org/10.1007/978-1-4613-2119-4.
Texto completoMaterial Characterization for Systems Performance and Reliability (Conference) (1984 Lake Luzerne, N.Y.). Materials characterization for systems performance and reliability. New York: Plenum, 1986.
Buscar texto completoSagamore Army Materials Research Conference (31st 1984 Lake Luzerne, N.Y.). Materials characterization for systems performance and reliability. New York: Plenum Press, 1986.
Buscar texto completoMcCauley, James W. Materials Characterization for Systems Performance and Reliability. Boston, MA: Springer US, 1986.
Buscar texto completoRajeshuni, Ramesham, Society of Photo-optical Instrumentation Engineers. y Semiconductor Equipment and Materials International., eds. Reliability, testing, and characterization of MEMS/MOEMS: 22-24 October 2001, San Francisco, USA. Bellingham, Wash: SPIE, 2001.
Buscar texto completoD, Todd M., U.S. Nuclear Regulatory Commission. Office of Nuclear Regulatory Research. Division of Engineering. y Oak Ridge National Laboratory, eds. A characterization of check valve degradation and failure experience in the nuclear power industry. Washington, DC: Division of Engineering, Office of Nuclear Regulatory Research, U.S. Nuclear Regulatory Commission, 1993.
Buscar texto completoL, Veteran Janice, ed. Silicon materials--processing, characterization and reliability: Symposium held April 1-5, 2002, San Francisco, California, U.S.A. Warrendale, PA: Materials Research Society, 2002.
Buscar texto completo1952-, Tanner Danelle Mary, Ramesham Rajeshuni y Society of Photo-optical Instrumentation Engineers., eds. Reliability, testing, and characterization of MEMS/MOEMS III: 26-28 January, 2004, San Jose, California, USA. Bellingham, Wash: SPIE, 2004.
Buscar texto completoHartzell, Allyson L. Reliability, packaging, testing, and characterization of MEMS/MOEMS VII: 21-22 January 2008, San Jose, California, USA. Bellingham, Wash: SPIE, 2008.
Buscar texto completo1952-, Tanner Danelle Mary, Ramesham Rajeshuni, Society of Photo-optical Instrumentation Engineers., Semiconductor Equipment and Materials International., Solid State Technology (Organization) y Sandia National Laboratories, eds. Reliability, packaging, testing, and characterization of MEMS/MOEMS IV: 24-25 January 2005, San Jose, California, USA. Bellingham, Wash: SPIE, 2005.
Buscar texto completoCapítulos de libros sobre el tema "Reliability characterization"
Varde, Prabhakar V. y Michael G. Pecht. "Risk Characterization". En Springer Series in Reliability Engineering, 15–29. Singapore: Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-13-0090-5_2.
Texto completoKlebanov, Lev y Gabor Szekely. "Characterization of Distributions in Reliability". En Recent Advances in Reliability Theory, 105–15. Boston, MA: Birkhäuser Boston, 2000. http://dx.doi.org/10.1007/978-1-4612-1384-0_7.
Texto completoGreen, Robert E. "Nondestructive Materials Characterization". En Materials Characterization for Systems Performance and Reliability, 31–58. Boston, MA: Springer US, 1986. http://dx.doi.org/10.1007/978-1-4613-2119-4_3.
Texto completoSoares, J. C. "Nuclear Methods in the Characterization of Semiconductor Reliability". En Semiconductor Device Reliability, 291–300. Dordrecht: Springer Netherlands, 1990. http://dx.doi.org/10.1007/978-94-009-2482-6_15.
Texto completoRomero, Paulo y Martins Maciel. "Workload Characterization". En Performance, Reliability, and Availability Evaluation of Computational Systems, Volume 2, 445–526. Boca Raton: Chapman and Hall/CRC, 2023. http://dx.doi.org/10.1201/9781003306030-12.
Texto completoLau, John H. y Ning-Cheng Lee. "Solder Joint Characterization". En Assembly and Reliability of Lead-Free Solder Joints, 299–354. Singapore: Springer Singapore, 2020. http://dx.doi.org/10.1007/978-981-15-3920-6_5.
Texto completoSato, Takashi y Hiromitsu Awano. "On-Chip Characterization of Statistical Device Degradation". En Circuit Design for Reliability, 69–92. New York, NY: Springer New York, 2014. http://dx.doi.org/10.1007/978-1-4614-4078-9_5.
Texto completoWachtman, John B. "Materials Characterization at a University". En Materials Characterization for Systems Performance and Reliability, 475–78. Boston, MA: Springer US, 1986. http://dx.doi.org/10.1007/978-1-4613-2119-4_26.
Texto completoSmyth, D. M. "Compositional Characterization Of Dielectric Oxides". En Materials Characterization for Systems Performance and Reliability, 59–68. Boston, MA: Springer US, 1986. http://dx.doi.org/10.1007/978-1-4613-2119-4_4.
Texto completoHagnauer, Gary L. "Polymers and Polymer Precursor Characterization". En Materials Characterization for Systems Performance and Reliability, 189–243. Boston, MA: Springer US, 1986. http://dx.doi.org/10.1007/978-1-4613-2119-4_9.
Texto completoActas de conferencias sobre el tema "Reliability characterization"
Suehle, J. S. "Reliability characterization of ultra-thin film dielectrics". En CHARACTERIZATION AND METROLOGY FOR ULSI TECHNOLOGY. ASCE, 1998. http://dx.doi.org/10.1063/1.56786.
Texto completoWeide-Zaage, Kirsten, Yuqi Tan y Verena Hein. "Thick AlCu-metal reliability characterization". En 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, 2018. http://dx.doi.org/10.1109/eurosime.2018.8369904.
Texto completoHartzell, Allyson L. y David J. Woodilla. "MEMS reliability, characterization, and test". En Micromachining and Microfabrication, editado por Rajeshuni Ramesham. SPIE, 2001. http://dx.doi.org/10.1117/12.442987.
Texto completo"Poster session: Reliability and characterization". En 2014 IEEE 29th International Conference on Microelectronics (MIEL). IEEE, 2014. http://dx.doi.org/10.1109/miel.2014.6842153.
Texto completoWategaonkar, Dhanashri N. y Vivek S. Deshpande. "Characterization of reliability in WSN". En 2012 World Congress on Information and Communication Technologies (WICT). IEEE, 2012. http://dx.doi.org/10.1109/wict.2012.6409215.
Texto completoReczek, W., F. Bonner y B. Murphy. "Reliability of latchup characterization procedures". En International Conference on Microelectronic Test Structures. IEEE, 1990. http://dx.doi.org/10.1109/icmts.1990.67879.
Texto completoGossner, Harald y Alessandro Paccagnella. "Session 14: Characterization, reliability, and yield - ESD/memory reliability". En 2008 IEEE International Electron Devices Meeting (IEDM). IEEE, 2008. http://dx.doi.org/10.1109/iedm.2008.4796687.
Texto completoDemertzi, Melina, Bardia Zandian, Ricardo Rojas y Murali Annavaram. "Benchmarking ISA reliability to intermittent errors". En 2012 IEEE International Symposium on Workload Characterization (IISWC). IEEE, 2012. http://dx.doi.org/10.1109/iiswc.2012.6402906.
Texto completoKeller, R. R., M. C. Strus, A. N. Chiaramonti, Y. L. Kim, Y. J. Jung, D. T. Read, David G. Seiler et al. "Reliability Testing of Advanced Interconnect Materials". En FRONTIERS OF CHARACTERIZATION AND METROLOGY FOR NANOELECTRONICS: 2011. AIP, 2011. http://dx.doi.org/10.1063/1.3657900.
Texto completoLiu, Ji y Huiyang Zhou. "Reliability Modeling of NISQ- Era Quantum Computers". En 2020 IEEE International Symposium on Workload Characterization (IISWC). IEEE, 2020. http://dx.doi.org/10.1109/iiswc50251.2020.00018.
Texto completoInformes sobre el tema "Reliability characterization"
Spratt, Randolph W. STOVL Fighter Propulsion Reliability, Maintainability and Supportability Characterization. Fort Belvoir, VA: Defense Technical Information Center, marzo de 1990. http://dx.doi.org/10.21236/ada224221.
Texto completoYang, Benjamin Bing-Yeh, Jose Luis Cruz-Campa, Gad S. Haase, Paiboon Tangyunyong, Edward Isaac Colr, Murat Okandan y Gregory N. Nielson. Defect localization, characterization and reliability assessment in emerging photovoltaic devices. Office of Scientific and Technical Information (OSTI), abril de 2014. http://dx.doi.org/10.2172/1177042.
Texto completoKramer, K. Status Quo of PVT Characterization. Editado por Korbinian Kramer,. IEA SHC Task 60, septiembre de 2020. http://dx.doi.org/10.18777/ieashc-task60-2020-0004.
Texto completoRobert W Youngblood. Treatment of Passive Component Reliability in Risk-Informed Safety Margin Characterization FY 2010 Report. Office of Scientific and Technical Information (OSTI), septiembre de 2010. http://dx.doi.org/10.2172/1004257.
Texto completoFrench, Roger, Bryan Huey, Alexandra Longacre, Michael Martin, Thomas Moran, Oleg Kolosov, Eric Schneller et al. Reliability and Power Degradation Rates of PERC Modules Using Differentiated Packaging Strategies and Characterization Tools. Office of Scientific and Technical Information (OSTI), junio de 2021. http://dx.doi.org/10.2172/1804123.
Texto completoJohnson, D. R., R. W. McClung, M. A. Janney y W. M. Hanusiak. Needs assessment for nondestructive testing and materials characterization for improved reliability in structural ceramics for heat engines. Office of Scientific and Technical Information (OSTI), agosto de 1987. http://dx.doi.org/10.2172/6185356.
Texto completoBoring, Ronald, Diego Mandelli, Martin Rasmussen, Sarah Herberger, Thomas Ulrich, Katrina Groth y Curtis Smith. Integration of Human Reliability Analysis Models into the Simulation-Based Framework for the Risk-Informed Safety Margin Characterization Toolkit. Office of Scientific and Technical Information (OSTI), junio de 2016. http://dx.doi.org/10.2172/1371517.
Texto completoBoesch, F. T., A. Satyanarayana y C. L. Suffel. Some Alternate Characterizations of Reliability Domination. Fort Belvoir, VA: Defense Technical Information Center, enero de 1990. http://dx.doi.org/10.21236/ada264594.
Texto completoBaral, Aniruddha, Jeffery Roesler y Junryu Fu. Early-age Properties of High-volume Fly Ash Concrete Mixes for Pavement: Volume 2. Illinois Center for Transportation, septiembre de 2021. http://dx.doi.org/10.36501/0197-9191/21-031.
Texto completoWarrick, Arthur, Uri Shani, Dani Or y Muluneh Yitayew. In situ Evaluation of Unsaturated Hydraulic Properties Using Subsurface Points. United States Department of Agriculture, octubre de 1999. http://dx.doi.org/10.32747/1999.7570566.bard.
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