Literatura académica sobre el tema "Printed electronic coating"
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Artículos de revistas sobre el tema "Printed electronic coating"
Lu, Taofeng, Gregory Reimonn, Gregory Morose, Evan Yu y Wan-Ting Chen. "Removing Acrylic Conformal Coating with Safer Solvents for Re-Manufacturing Electronics". Polymers 13, n.º 6 (18 de marzo de 2021): 937. http://dx.doi.org/10.3390/polym13060937.
Texto completoRajendran, Mohana y Marto Giftlin. "Novel Development of Corrosion Resistant Paint Using Printed Circuit Board from Modern Electronic Wastes". Trends in Sciences 19, n.º 6 (25 de febrero de 2022): 2901. http://dx.doi.org/10.48048/tis.2022.2901.
Texto completoSzocinski, Michal. "AFM-assisted investigation of conformal coatings in electronics". Anti-Corrosion Methods and Materials 63, n.º 4 (6 de junio de 2016): 289–94. http://dx.doi.org/10.1108/acmm-09-2014-1426.
Texto completoLee, Sang y Sangyoon Lee. "Fabrication and Characterization of Roll-to-Roll Printed Air-Gap Touch Sensors". Polymers 11, n.º 2 (2 de febrero de 2019): 245. http://dx.doi.org/10.3390/polym11020245.
Texto completoPfeiffenberger, Neal T. y Saeid Biria. "Enhanced UVA LED-Cured Conformal Coatings for Printed Circuit Boards". International Symposium on Microelectronics 2021, n.º 1 (1 de octubre de 2021): 000281–85. http://dx.doi.org/10.4071/1085-8024-2021.1.000281.
Texto completoTantrairatn, Suradet, Paphakorn Pitayachaval, Sirisak Rangklang y Jiraphon Srisertpol. "A Comparison of Cover Coat Methods for Electronic Flexible Printed Circuit (E-FPC) Based on Peeling Strength". Advanced Materials Research 421 (diciembre de 2011): 489–92. http://dx.doi.org/10.4028/www.scientific.net/amr.421.489.
Texto completoKellomäki, Tiiti, Johanna Virkki, Sari Merilampi y Leena Ukkonen. "Towards Washable Wearable Antennas: A Comparison of Coating Materials for Screen-Printed Textile-Based UHF RFID Tags". International Journal of Antennas and Propagation 2012 (2012): 1–11. http://dx.doi.org/10.1155/2012/476570.
Texto completoPark, Won-Tae y Yong-Young Noh. "A self-aligned high resolution patterning process for large area printed electronics". Journal of Materials Chemistry C 5, n.º 26 (2017): 6467–70. http://dx.doi.org/10.1039/c7tc01590a.
Texto completoSenophiyah-Mary, J., R. Loganath y T. Meenambal. "A novel method for the removal of epoxy coating from waste printed circuit board". Waste Management & Research: The Journal for a Sustainable Circular Economy 36, n.º 7 (20 de junio de 2018): 645–52. http://dx.doi.org/10.1177/0734242x18782392.
Texto completoNmadu, D., N. C. Eli-Chukwu, U. U. Uma, O. E. Ogah, A. A. Parshuto, M. I. Eheduru, S. I. Ezichi y C. N. Ogbonna-Mba. "Using High Voltage Electrochemical Oxidation (HVEO) to obtain protective coatings, surface finishing on electronic materials". Digest Journal of Nanomaterials and Biostructures 17, n.º 2 (abril de 2022): 569–77. http://dx.doi.org/10.15251/djnb.2022.172.569.
Texto completoTesis sobre el tema "Printed electronic coating"
Mustonen, T. (Tero). "Inkjet printing of carbon nanotubes for electronic applications". Doctoral thesis, University of Oulu, 2009. http://urn.fi/urn:isbn:9789514293092.
Texto completoBent, Westin R. "Evaluating the effect of conformal coatings in reducing the rate of conductive anodic filament". Thesis, Georgia Institute of Technology, 1999. http://hdl.handle.net/1853/20128.
Texto completoÖhlund, Thomas. "Metal Films for Printed Electronics : Ink-substrate Interactions and Sintering". Doctoral thesis, Mittuniversitetet, Avdelningen för naturvetenskap, 2014. http://urn.kb.se/resolve?urn=urn:nbn:se:miun:diva-23420.
Texto completoÅkerfeldt, Maria. "Electrically conductive textile coatings with PEDOT:PSS". Doctoral thesis, Högskolan i Borås, Akademin för textil, teknik och ekonomi, 2015. http://urn.kb.se/resolve?urn=urn:nbn:se:hb:diva-19.
Texto completoLeopold, Diatezo. "Multifunctional materials for intelligent textile : Toward automotive applications". Electronic Thesis or Diss., Lyon, INSA, 2023. http://www.theses.fr/2023ISAL0114.
Texto completoThis PhD student research project concerns the development and use of printable multifunctional materials, focusing on the trade-offs between material properties and application specification, with a particular emphasis on joule heating and electroluminescence functions. The originality of the work lies in a coupled approach between multifunctional materials and textile integration. The first part of the study concerned the selection of multifunctional materials deemed potentially interesting for the creation of intelligent textiles adapted to TESCA-groupe's target sectors. This involved characterizing the electrical and thermal properties of both the conductive materials and the textile substrate. In addition, analyses using scanning electron microscopy (SEM)/energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD) were carried out to study the microstructure, including adhesion, the thickness of the deposited layers and the chemical composition of the materials. The second aspect focused on an accelerated ageing study on unit specimens of textile substrates coated with conductive ink, in compliance with the specifications required by Tesca. The aim of this approach was to identify the inherent limitations of each material, such as maximum deformation, temperature variations, adhesion, process compatibility, etc., with a view to proposing areas for optimization or taking these limitations into account when designing transducers integrated on textile substrates. This first step enabled us to establish a base of multifunctional materials that could be used for specific applications, such as heating mats, capacitive or resistive switches, transducers, sensors for mechanical quantities, among others. The third aspect of this research consisted in assembling these basic elements to create sub-functions described as "intelligent". In fact, the production of transducers generally involved combining different multifunctional materials to meet the specific requirements of the target application
Libros sobre el tema "Printed electronic coating"
Dunn, Barrie D. Evaluation of conformal coatings for future spacecraft applications. Paris, France: European Space Agency, 1994.
Buscar texto completoCapítulos de libros sobre el tema "Printed electronic coating"
Tan, Loon-Seng. "Poly(amide imide)". En Polymer Data Handbook, 347–55. Oxford University PressNew York, NY, 2009. http://dx.doi.org/10.1093/oso/9780195181012.003.0056.
Texto completoTiancheng Wei, Wei, Yu Sun y Eunkyoung Shim. "Progress of Recycled Polyester in Rheological Performance in Molding, and Economic Analysis of Recycled Fibers in Fashion and Textile Industry". En Next-Generation Textiles [Working Title]. IntechOpen, 2022. http://dx.doi.org/10.5772/intechopen.103864.
Texto completoShelley, Mee Y. y Jennifer L. Braun. "Epoxy Resins". En Polymer Data Handbook, 138–45. Oxford University PressNew York, NY, 2009. http://dx.doi.org/10.1093/oso/9780195181012.003.0023.
Texto completoActas de conferencias sobre el tema "Printed electronic coating"
Gorges, Roger, William Bisgrove, Ryan Curtis, Jeff Carter, James W. George, Jonathan Ritchie, Ingo Wirth, Volker Zoellmer y Tim Rusch. "Integration of Printed Sensors in Plain Engine Bearings". En ASME 2018 Internal Combustion Engine Division Fall Technical Conference. American Society of Mechanical Engineers, 2018. http://dx.doi.org/10.1115/icef2018-9545.
Texto completoGlassmaker, Nicholas, Ye Mi, Mukerrem Cakmak y Ali Shakouri. "Roll to Roll Manufacturing and In-Line Imaging and Characterization of Functional Films". En ASME 2022 17th International Manufacturing Science and Engineering Conference. American Society of Mechanical Engineers, 2022. http://dx.doi.org/10.1115/msec2022-85553.
Texto completoHuang, Mengyu, Lan Li, Chao Yuan, Bin Xie, Xingjian Yu y Xiaobing Luo. "Simulation of stamp-printed coating process in light-emitting diodes packaging by Lattice Boltzmann method". En 2015 16th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2015. http://dx.doi.org/10.1109/icept.2015.7236764.
Texto completoSingh, Prabjit. "Arcing and Spacing Requirements for High Voltage Printed Circuit Boards". En ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2015. http://dx.doi.org/10.1115/ipack2015-48180.
Texto completoFenger, H. S. y T. E. Wong. "COTS BGA Thermal Fatigue Test for Avionics Applications". En ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35017.
Texto completoFuruta, Atsuhiro, Kazuki Honjo y Jun Taniguchi. "Fabrication of Flexible Interposer Using Printing Method". En JSME 2020 Conference on Leading Edge Manufacturing/Materials and Processing. American Society of Mechanical Engineers, 2020. http://dx.doi.org/10.1115/lemp2020-8524.
Texto completoWong, T. E., C. Y. Lau, L. A. Kachatorian, H. S. Fenger y I. C. Chen. "Design of Experiments in Ball Grid Array Thermal Fatigue Life Tests". En ASME 2002 International Mechanical Engineering Congress and Exposition. ASMEDC, 2002. http://dx.doi.org/10.1115/imece2002-32827.
Texto completoCho, Sungdong, Jin-Gul Hyun y Kuyng-Wook Paik. "Epoxy/BaTiO3 Composite Embedded Capacitor Films (ECFs) for Organic Substrate Applications". En ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35149.
Texto completoBeyler Çiğil, Aslı, Hatice Birtane y Okan Esentürk. "Preparation of conductive and flame-retardant PU/GO/DOPO printed films". En 11th International Symposium on Graphic Engineering and Design. University of Novi Sad, Faculty of technical sciences, Department of graphic engineering and design, 2022. http://dx.doi.org/10.24867/grid-2022-p13.
Texto completoLall, Pradeep, Kalyan Dornala, Jeff Suhling y John Deep. "Interfacial Delamination and Fracture Properties of Potting Compounds and PCB/Epoxy Interfaces Under Flexure Loading After Exposure to Multiple Cure Temperatures". En ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems. American Society of Mechanical Engineers, 2017. http://dx.doi.org/10.1115/ipack2017-74322.
Texto completoInformes sobre el tema "Printed electronic coating"
Delwiche, Michael, Boaz Zion, Robert BonDurant, Judith Rishpon, Ephraim Maltz y Miriam Rosenberg. Biosensors for On-Line Measurement of Reproductive Hormones and Milk Proteins to Improve Dairy Herd Management. United States Department of Agriculture, febrero de 2001. http://dx.doi.org/10.32747/2001.7573998.bard.
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