Artículos de revistas sobre el tema "Power Electronics Reliability"
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Iannuzzo, Francesco y Mauro Ciappa. "Reliability issues in power electronics". Microelectronics Reliability 58 (marzo de 2016): 1–2. http://dx.doi.org/10.1016/j.microrel.2016.01.012.
Texto completoWhite, Robert V. "Advancing Power Electronics Reliability [White Hot]". IEEE Power Electronics Magazine 8, n.º 2 (junio de 2021): 100–99. http://dx.doi.org/10.1109/mpel.2021.3075786.
Texto completoScheuermann, U. "Reliability challenges of automotive power electronics". Microelectronics Reliability 49, n.º 9-11 (septiembre de 2009): 1319–25. http://dx.doi.org/10.1016/j.microrel.2009.06.045.
Texto completoPires, Igor Amariz, Rafael Atila Silva, Anderson Vagner Rocha, Matheus Pereira Porto, Thales Alexandre Carvalho Maia y Braz de Jesus Cardoso Filho. "Oil Immersed Power Electronics and Reliability Enhancement". IEEE Transactions on Industry Applications 55, n.º 4 (julio de 2019): 4407–16. http://dx.doi.org/10.1109/tia.2019.2915276.
Texto completoLu, Hua, Chris Bailey y Chunyan Yin. "Design for reliability of power electronics modules". Microelectronics Reliability 49, n.º 9-11 (septiembre de 2009): 1250–55. http://dx.doi.org/10.1016/j.microrel.2009.07.055.
Texto completoJiao, Chaoqun, Juan Zhang, Zhibin Zhao, Zuoming Zhang y Yuanliang Fan. "Research on Small Square PCB Rogowski Coil Measuring Transient Current in the Power Electronics Devices". Sensors 19, n.º 19 (26 de septiembre de 2019): 4176. http://dx.doi.org/10.3390/s19194176.
Texto completoZeng, Jia Si, Yi Bo Gao, Feng Yang, Xi Dong Xu, Peng Qiu, Yi Lu y Xiao Ming Huang. "Reliability Evaluation of Mid-Voltage DC Distribution Network with Multiple Topologies". Applied Mechanics and Materials 666 (octubre de 2014): 112–18. http://dx.doi.org/10.4028/www.scientific.net/amm.666.112.
Texto completoZacharias, Peter. "Design and Applications of Controllable Magnetic Devices in Power Electronic Circuits and Power Systems". Journal of Electronics and Advanced Electrical Engineering 1, n.º 2 (3 de mayo de 2021): 6–14. http://dx.doi.org/10.47890/jeaee/2020/peterzacharias/11120007.
Texto completoHozoji, Hiroshi, Fumiki Kato, So Tanaka, Jiro Shinkai y Hiroshi Sato. "Power Electronics Packaging Materials for High Heat Reliability". Journal of The Japan Institute of Electronics Packaging 24, n.º 3 (1 de mayo de 2021): 233–40. http://dx.doi.org/10.5104/jiep.24.233.
Texto completoGurav, Abhijit, John Bultitude, John McConnell y Reggie Phillips. "Robust Reliability of Ceramic Capacitors for Power Electronics". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2018, HiTEC (1 de mayo de 2018): 000138–42. http://dx.doi.org/10.4071/2380-4491-2018-hiten-000138.
Texto completoMestha, Soumya Rani y Pinto Pius A.J. "Investigation of reliability assessement in power electronics circuits using machine learning". International Journal of Power Electronics and Drive Systems (IJPEDS) 12, n.º 1 (1 de marzo de 2021): 558. http://dx.doi.org/10.11591/ijpeds.v12.i1.pp558-566.
Texto completoBrewer, Roger. "High Reliability Electronics for Demanding Aircraft Applications – An Overview". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, HiTEC (1 de enero de 2016): 000011–17. http://dx.doi.org/10.4071/2016-hitec-11.
Texto completoCalleja, Hugo y Freddy Chan. "Reliability: A Neglected Topic in the Power Electronics Curricula". Journal of Power Electronics 10, n.º 6 (20 de noviembre de 2010): 660–66. http://dx.doi.org/10.6113/jpe.2010.10.6.660.
Texto completoDababneh, Amer B., Ben Goerdt, Timothy Marler y Ibrahim T. Ozbolat. "A Virtual Prognostic Tool for Nuclear Power Electronics Reliability". Computer-Aided Design and Applications 11, n.º 2 (30 de octubre de 2013): 228–38. http://dx.doi.org/10.1080/16864360.2014.846097.
Texto completoPersons, Ryan y Paul Gundel. "Print Copper on Ceramic for High Reliability Electronics". International Symposium on Microelectronics 2015, n.º 1 (1 de octubre de 2015): 000330–35. http://dx.doi.org/10.4071/isom-2015-wp12.
Texto completoBlaabjerg, Frede y Michael M. Pecht. "Special Issue on Robust Design and Reliability of Power Electronics, IEEE Transactions on Power Electronics, May 2015". IEEE Transactions on Power Electronics 30, n.º 5 (mayo de 2015): 2373–74. http://dx.doi.org/10.1109/tpel.2014.2376271.
Texto completoOKABE, Nagatoshi, Mitsuyoshi TSUTSUMI y Xia ZHU. "Testing Method and Reliability Design of Reliability Estimation in Mounting Power Electronics Semiconductor". Proceedings of the 1992 Annual Meeting of JSME/MMD 2002 (2002): 253–54. http://dx.doi.org/10.1299/jsmezairiki.2002.0_253.
Texto completoDrobnik, Joe y Praveen Jain. "Electric and Hybrid Vehicle Power Electronics Efficiency, Testing and Reliability". World Electric Vehicle Journal 6, n.º 3 (27 de septiembre de 2013): 719–30. http://dx.doi.org/10.3390/wevj6030719.
Texto completoKhazaka, R., L. Mendizabal, D. Henry y R. Hanna. "Survey of High-Temperature Reliability of Power Electronics Packaging Components". IEEE Transactions on Power Electronics 30, n.º 5 (mayo de 2015): 2456–64. http://dx.doi.org/10.1109/tpel.2014.2357836.
Texto completoTeixeira, Tiago M. L. y Juan Bevan. "Product Development of High Power Electronics for High Reliability Applications". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2017, HiTEN (1 de julio de 2017): 000213–17. http://dx.doi.org/10.4071/2380-4491.2017.hiten.213.
Texto completoBayerer, Reinhold. "Advanced packaging yields higher performance and reliability in power electronics". Microelectronics Reliability 50, n.º 9-11 (septiembre de 2010): 1715–19. http://dx.doi.org/10.1016/j.microrel.2010.07.016.
Texto completoIshizaki, T., A. Kuno, A. Tane, M. Yanase, F. Osawa, T. Satoh y Y. Yamada. "Reliability of Cu nanoparticle joint for high temperature power electronics". Microelectronics Reliability 54, n.º 9-10 (septiembre de 2014): 1867–71. http://dx.doi.org/10.1016/j.microrel.2014.07.113.
Texto completoArifujjaman, Md, M. T. Iqbal y J. E. Quaicoe. "Reliability analysis of grid connected small wind turbine power electronics". Applied Energy 86, n.º 9 (septiembre de 2009): 1617–23. http://dx.doi.org/10.1016/j.apenergy.2009.01.009.
Texto completoPang, Y., E. Scott, J. D. van Wyk y Z. Liang. "Assessment of Some Integrated Cooling Mechanisms for an Active Integrated Power Electronics Module". Journal of Electronic Packaging 129, n.º 1 (16 de abril de 2006): 1–8. http://dx.doi.org/10.1115/1.2429703.
Texto completoNovak, M., A. Sangwongwanich y F. Blaabjerg. "Monte Carlo-Based Reliability Estimation Methods for Power Devices in Power Electronics Systems". IEEE Open Journal of Power Electronics 2 (2021): 523–34. http://dx.doi.org/10.1109/ojpel.2021.3116070.
Texto completoWassick, Thomas A. "Electromigration in Lead – Free Solder: A Power IC Perspective". International Symposium on Microelectronics 2013, n.º 1 (1 de enero de 2013): 000753–57. http://dx.doi.org/10.4071/isom-2013-wp61.
Texto completoPaul, Arun Kumar. "Experimental exploration of functional integrity, functional reliability and reliability of modern power electronics equipments". International Journal of Power Electronics 3, n.º 4 (2011): 374. http://dx.doi.org/10.1504/ijpelec.2011.040803.
Texto completoTan, Yangyang, Jun Liu, Sichang Xu, Peng Zhong, Qi Zhang y Lin Hu. "Operational reliability evaluation of PV inverter considering relative humidity and its application on power system". E3S Web of Conferences 185 (2020): 01050. http://dx.doi.org/10.1051/e3sconf/202018501050.
Texto completoChow, T. Paul. "SiC Bipolar Power Devices". MRS Bulletin 30, n.º 4 (abril de 2005): 299–304. http://dx.doi.org/10.1557/mrs2005.77.
Texto completoFan, Guangyu, Christine Labarbera, Ning-Cheng Lee y Colin Clark. "Shear Strength and Thermomechanical Reliability of Sintered Ag Joints Containing low CTE Non-metal Additives for Die Attach". International Symposium on Microelectronics 2018, n.º 1 (1 de octubre de 2018): 000167–72. http://dx.doi.org/10.4071/2380-4505-2018.1.000167.
Texto completoKaessner, Stefan, Markus G. Scheibel, Stefan Behrendt, Bianca Boettge, Christoph Berthold y Klaus G. Nickel. "Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging". Journal of Microelectronics and Electronic Packaging 15, n.º 3 (1 de julio de 2018): 132–39. http://dx.doi.org/10.4071/imaps.661015.
Texto completoKaessner, S., M. G. Scheibel, S. Behrendt, B. Boettge y K. G. Nickel. "Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging". International Symposium on Microelectronics 2018, n.º 1 (1 de octubre de 2018): 000425–33. http://dx.doi.org/10.4071/2380-4505-2018.1.000425.
Texto completoYang, Yongheng, Ariya Sangwongwanich y Frede Blaabjerg. "Design for Reliability of Power Electronics for Grid-Connected Photovoltaic Systems". CPSS Transactions on Power Electronics and Applications 1, n.º 1 (28 de diciembre de 2016): 92–103. http://dx.doi.org/10.24295/cpsstpea.2016.00009.
Texto completoHansen, Sandra, Frederik Hahn, Helge Krueger, Felix Hoffmann, Markus Andresen, Rainer Rainer Adelung y Marco Liserre. "Reliability of Silicon Battery Technology and Power Electronics Based Energy Conversion". IEEE Power Electronics Magazine 8, n.º 2 (junio de 2021): 60–69. http://dx.doi.org/10.1109/mpel.2021.3075756.
Texto completoFlicker, Jack, Govindasamy Tamizhmani, Mathan Kumar Moorthy, Ramanathan Thiagarajan y Raja Ayyanar. "Accelerated Testing of Module-Level Power Electronics for Long-Term Reliability". IEEE Journal of Photovoltaics 7, n.º 1 (enero de 2017): 259–67. http://dx.doi.org/10.1109/jphotov.2016.2621339.
Texto completoBahman, A. S., F. Iannuzzo, T. Holmgaard, R. Ø. Nielsen y F. Blaabjerg. "Reliability-oriented environmental thermal stress analysis of fuses in power electronics". Microelectronics Reliability 76-77 (septiembre de 2017): 25–30. http://dx.doi.org/10.1016/j.microrel.2017.06.089.
Texto completoSawan, Mohamad, B. Gosselin, J. Coulombe, A. E. Ayoub, A. Chaudhuri y F. Leporé. "Implantable Electronics for the Recovery of Neuromuscular Functions". Advances in Science and Technology 57 (septiembre de 2008): 204–9. http://dx.doi.org/10.4028/www.scientific.net/ast.57.204.
Texto completoShohji, Ikuo. "Large area bonding for power devices by pillar-like IMC effective dispersion control". Impact 2020, n.º 1 (27 de febrero de 2020): 76–78. http://dx.doi.org/10.21820/23987073.2020.1.76.
Texto completoYuan, Cadmus, René Kregting, Willem van Driel, Sander Gielen, An Xiao y G. Q. (Kouchi) Zhang. "Overview on Thermal and Mechanical Challenges of High Power RF Electronic Packaging". International Symposium on Microelectronics 2011, n.º 1 (1 de enero de 2011): 000418–29. http://dx.doi.org/10.4071/isom-2011-tp6-paper4.
Texto completoPalmer, David W. "Test Structures as a Way to Evaluate Packaging Reliability". MRS Bulletin 18, n.º 12 (diciembre de 1993): 55–58. http://dx.doi.org/10.1557/s0883769400039105.
Texto completoSHENAI, KRISHNA. "THE PERFECT POWER SEMICONDUCTOR SWITCH FOR 21st CENTURY GLOBAL ENERGY ECONOMY". Journal of Circuits, Systems and Computers 22, n.º 10 (diciembre de 2013): 1340020. http://dx.doi.org/10.1142/s0218126613400203.
Texto completoFlicker, Jack, Jay Johnson, Peter Hacke y Ramanathan Thiagarajan. "Automating Component-Level Stress Measurements for Inverter Reliability Estimation". Energies 15, n.º 13 (1 de julio de 2022): 4828. http://dx.doi.org/10.3390/en15134828.
Texto completoTripathi, Rajesh, Sejin Im, Douglas Devoto, Joshua Major, Sreekant Narumanchi, Paul Paret y Xuhui Feng. "Power electronics thermal solutions using thermally conductive polyimide films". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2019, DPC (1 de enero de 2019): 000616–46. http://dx.doi.org/10.4071/2380-4491-2019-dpc-presentation_tp3_042.
Texto completoDu, Xiao, Xiong Du, Jun Zhang y Gaoxian Li. "Numerical junction temperature calculation method for reliability evaluation of power semiconductors in power electronics converters". Journal of Power Electronics 21, n.º 1 (23 de septiembre de 2020): 184–94. http://dx.doi.org/10.1007/s43236-020-00154-z.
Texto completoShashidhar, Nagaraja y Abhijit Rao. "Low thermal resistance packaging for high power electronics". International Symposium on Microelectronics 2019, n.º 1 (1 de octubre de 2019): 000131–38. http://dx.doi.org/10.4071/2380-4505-2019.1.000131.
Texto completoWiewiora, Lee. "Microelectronics/Packagingin the Defense Industry:Importance of SWaP-Cand Other Factors". International Symposium on Microelectronics 2015, S1 (1 de octubre de 2015): S1—S11. http://dx.doi.org/10.4071/isom-2015-slide-1.
Texto completoFaqir, M., J. W. Pomeroy, T. Batten, T. Mrotzek, S. Knippscheer, O. Vendier, S. Rochette et al. "Reliability Assessment of a New Power Electronics Packaging Material: Silver Diamond Composite". Journal of Microelectronics and Electronic Packaging 10, n.º 2 (1 de abril de 2013): 54–58. http://dx.doi.org/10.4071/imaps.371.
Texto completoWang, Huai, Marco Liserre, Frede Blaabjerg, Peter de Place Rimmen, John B. Jacobsen, Thorkild Kvisgaard y Jorn Landkildehus. "Transitioning to Physics-of-Failure as a Reliability Driver in Power Electronics". IEEE Journal of Emerging and Selected Topics in Power Electronics 2, n.º 1 (marzo de 2014): 97–114. http://dx.doi.org/10.1109/jestpe.2013.2290282.
Texto completoArifujjaman, Md, M. T. Iqbal y J. E. Quaicoe. "Power Electronics Reliability Comparison of Grid Connected Small Wind Energy Conversion Systems". Wind Engineering 35, n.º 1 (febrero de 2011): 93–110. http://dx.doi.org/10.1260/0309-524x.35.1.93.
Texto completoSzcześniak, Paweł, Iwona Grobelna, Mateja Novak y Ulrik Nyman. "Overview of Control Algorithm Verification Methods in Power Electronics Systems". Energies 14, n.º 14 (19 de julio de 2021): 4360. http://dx.doi.org/10.3390/en14144360.
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