Literatura académica sobre el tema "Opto-mechanical process"

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Artículos de revistas sobre el tema "Opto-mechanical process"

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Lin, Qin Hong y Zheng Shang Da. "Monte Carlo Model of Optomechanical Tolerance for Lens Assembly". Advanced Materials Research 571 (septiembre de 2012): 574–78. http://dx.doi.org/10.4028/www.scientific.net/amr.571.574.

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Research on the opto-mechanical tolerance analysis for lens optical system is presented. Take a traditional "drop-in" assembly for example. How fabrication tolerances transfer to tolerances of optical elements is analysed. Finally, Monte-Carlo model for opto-mechanical tolerances is proposed, which considers both the fabrication and assembly process.
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Yang, Zhen, Xinmin Guo, Songtao Lu, Yong Zhang, Haili Hu, Kaichang Lu y Jianlong Zhang. "Investigation of Stray Radiation Suppression in Infrared Imaging System Using a Novel Broadband and High-Absorption Ceramic Coating". Applied Sciences 11, n.º 11 (27 de mayo de 2021): 4952. http://dx.doi.org/10.3390/app11114952.

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Aiming at addressing the vulnerability of the infrared imaging opto-mechanical system to stray radiation interference caused by an external laser, a new method with a broadband and high-absorptivity ceramic coating on the inner wall of the system is proposed to reduce the stray radiation intensity, which is helpful to improve the imaging quality of the detection image. Based on plasma electrolytic oxidation (PEO) technology, the preparation method and properties of a novel ceramic coating are studied, and a long-wave infrared imaging optical system with high-absorption ceramic coating is designed and developed. It is verified for the first time that the high-absorption ceramic coating can suppress the stray radiation in the infrared opto-mechanical system, and the effect of laser incident power and angle on the stray radiation is investigated. The experimental results show that the ceramic coating can achieve 95.4% high absorption in the wavelength range of 0.2–16 μm, which can obviously suppress the stray radiation in the opto-mechanical system of infrared imaging caused by laser. The calculation of the stray radiation suppression ratio shows that, compared with the case without coating, the stray radiation intensity in the system can be reduced by 70% using the ceramic coating.
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Kurcsics, Mark, Luzia Hahn y Peter Eberhard. "Transient Structural, Thermal and Optical Performance (STOP) Analysis with Accelerated Thermomechanical Computation". EPJ Web of Conferences 309 (2024): 03025. http://dx.doi.org/10.1051/epjconf/202430903025.

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Mechanical and thermal disturbances in optical systems are attracting increasing attention as accuracy requirements rise. For this reason, it is necessary to consider these disturbances at an early stage in the design process. This can be done by a holistic multiphysical opto-thermo-mechanical simulation. Such an approach is presented with a focus on efficient thermomechanical computation through a quasi-static approximation.
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Carrasco, Sergio y Miguel Orszag. "Weak Value Amplification of Photons in Optical Nonlinear Medium, Opto-Mechanical, and Spin-Mechanical Systems". Photonics 11, n.º 4 (23 de marzo de 2024): 291. http://dx.doi.org/10.3390/photonics11040291.

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A measurement of an observable A performed on a quantum system that is initially prepared in a state ρi, followed by a probabilistic procedure that leaves the system in a final state ρf, a process often referred as state postselection (or filtering process), can yield, on average, anomalous measurement results, i.e., values that may exceed the eigenvalue range of the observable being measured or be complex numbers. There is, therefore, an amplification effect of the average measurement result, i.e., the effect of the system on the measurement device is increased. When the coupling between the system and the measurement device satisfies some weakness conditions, the amplification effect occurs due to the weak value of the operator A. In this article, the amplification effect due to the postselection process is reviewed, and theoretical proposals and experiments published in the recent literature on the field are commented on. The emphasis is made on interactions occurring in optical nonlinear media and opto-mechanical and spin-mechanical systems, in which the amplification of number operators takes place.
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Xia, Huang y Zhao. "A New Design of an MOEMS Gyroscope Based on a WGM Microdisk Resonator". Sensors 19, n.º 12 (21 de junio de 2019): 2798. http://dx.doi.org/10.3390/s19122798.

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In this paper, we present a new design for a micro-opto-electro-mechanical (MOEMS) gyroscope based on a whispering-gallery mode (WGM) microdisk resonator and MEMS resonator. The mechanical characteristics, frequency split, and quality factor (Q) of the MEMS resonator; the optical characteristics, Q value, and coupling regimes of the WGM resonator; and the coupling between the two resonators were analyzed. Its operation principle—the transformation process from angular velocity to the resonance wavelength of the WGM resonator—is presented at same time. Next, the analysis conclusions were validated with the help of simulations in ANSYS and FDTD (Finite-Difference Time-Domain) Solutions. Afterwards, some key specifications were estimated based on the results of simulations. Lastly, the fabrication process is detailed.
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Smith, J. A., D. Jevtics, B. Guilhabert, M. D. Dawson y M. J. Strain. "Hybrid integration of chipscale photonic devices using accurate transfer printing methods". Applied Physics Reviews 9, n.º 4 (diciembre de 2022): 041317. http://dx.doi.org/10.1063/5.0121567.

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Transfer printing is becoming widely adopted as a back-end process for the hybrid integration of photonic and electronic devices. Integration of membrane components, with micrometer-scale footprints and sub-micron waveguide dimensions, imposes strict performance requirements on the process. In this review, we present an overview of transfer printing for integrated photonics applications, covering materials and fabrication process considerations, methods for efficient optical coupling, and high-accuracy inter-layer alignment. We present state-of-the-art integration demonstrations covering optical sources and detectors, quantum emitters, sensors, and opto-mechanical devices. Finally, we look toward future developments in the technology that will be required for dense multi-materials integration at wafer scales.
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Sokkar, T. Z. N., K. A. El‐Farahaty, M. A. El‐Bakary, M. I. Raslan y F. E. Hanash. "A novel dynamic opto‐thermo‐mechanical stress testing device 2: In situ stretching process of polymeric fibers". Microscopy Research and Technique 81, n.º 11 (8 de octubre de 2018): 1261–67. http://dx.doi.org/10.1002/jemt.23132.

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Chang, Xia, Li Song, Chun Wang y Ai Zhang. "A Control and Simulation Method for Space-based Opto-mechanical Structures Using Uniform Scanning". Journal of Physics: Conference Series 2395, n.º 1 (1 de diciembre de 2022): 012046. http://dx.doi.org/10.1088/1742-6596/2395/1/012046.

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Abstract To achieve high-precision imaging in the calibration area of a sub-satellite point, this paper proposes a method for assessing the scanning accuracy and how it affects the agility of the maneuvering process. In addition, simulations and experimental validation are also conducted using a position-velocity dual-loop control algorithm. The design is based on the control theory and the operating characteristics of the actual flexible scanning mechanism, the control law is designed using the control method based on the permanent magnet synchronous motor model, and the interference is simulated and analyzed. The results show that the design can combine the control performance indexes of practical applications and meet the requirements of in-orbit high-precision scanning, which can provide a reference for the subsequent development of space high-precision scanning control.
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Невлюдов, І. Ш., О. О. Чала, О. І. Филипенко y І. В. Боцман. "Model of simulation of the process of formation of functional surfaces of micro-opto-electro-mechanical systems’ components". Системи озброєння і військова техніка, n.º 2(62), (8 de junio de 2020): 73–82. http://dx.doi.org/10.30748/soivt.2020.62.10.

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The subject of the article is to establish the relationships between the parameters of formation the functional surfaces of the substrates of micro-opto-electro-mechanical systems’ (MOEMS) components and their physical and technological parameters. Objectives: to increase the reliability and reproducibility of the received information, reduce the complexity of the technological process of forming, by modeling the dependences of the ratios of physical and technological parameters of forming the functional surfaces of the substrates of MOEMS components for the forming process. The methods are used: methods of experiment planning and computer processing of experimental data, mathematical models, digital computer modeling of technological processes. The following results were obtained: a mathematical model was proposed, which was used to model the influence of physical and technological parameters of the functional surfaces of the substrates of MOEMS components on their formation, with the receipt of prototypes. The results can be used in the development of technological processes of production, as substrates of functional components of MOEMS, and other functional elements for various technological purposes. A mathematical model is obtained, which allows predicting the degree of influence of physical and technological parameters of the technological process on the parameters of formation of functional surfaces of substrates of MOEMS components. Conclusions. The scientific novelty of the results is as follows: a mathematical model that has found practical implementation for computer digital modeling in the development of technological processes for the production of functional surfaces of substrates of MOEMS components is proposed, in which, unlike the existing ones, it is possible to predict the degree of influence of physical substrates of MOEMS components, which allows to plan the process of formation, increase the reproducibility of results and reduce the complexity of the technological process.
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Bablu K, Ghosh y Ghosh Swapan K. "Optomechanics and Sensing Phenomena: An Analysis in Classical-quantum Relationship". Compendium of Optics and Photonics 1, n.º 1 (28 de agosto de 2024): 006–13. http://dx.doi.org/10.17352/cop.000002.

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As a multi-approach sensing field optomechanics is primarily related to the interaction between optical and mechanical modes interaction. Light-matters dealings in linear to non-linear routes are trails of precision and Quantum Sensing (QS). Light is a wave-matter quantum entity from the classical Electromagnetic (EM) field in which matter is entangled with waves in space-time dimension. The interaction of electromagnetic radiation with the motion of objects and the gravity action is an energy perturbation and complex phenomenon. The energy-mass relation is like wave matter in which a possible link between classical and quantum mechanics is imperative for advanced opto-mechanical sensing. The quantization of mechanical energy and its interaction with light is a process that can be used for diverse sensing purposes. In this study light and gravity-related electromagnetic and mechanical system linkage has been elucidated systematically at macro and micro levels for optomechanical sensing system further development.
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Tesis sobre el tema "Opto-mechanical process"

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Vernier, Charles. "Étude de nanocristaux métalliques anisotropes par spectroscopies optique et vibrationnelle". Electronic Thesis or Diss., Sorbonne université, 2024. https://theses.hal.science/tel-04829448.

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Cette thèse s'intéresse à la caractérisation spectroscopique (optique et vibrationnelle) et par microscopie électronique de nanoparticules métalliques. Tout d'abord, des populations de nanoparticules à faible distribution de taille sont fabriquées par voie chimique selon l'état de l'art. Ces nanoparticules (nanocubes d'argent, nanobâtonnets d'or, nanobâtonnets cœur-coquille or-argent) sont caractérisées par TEM et HRTEM. Les propriétés optiques des nanoparticules sont étudiées par spectroscopie d'absorption UV-visible-NIR et les paramètres structuraux (taille, forme, composition) influençant leur résonance de plasmon de surface localisé sont modélisés par des calculs numériques effectués avec l'approximation des dipôles discrets. L'effet d'élargissement spectral du plasmon de surface localisé longitudinal avec la distribution de rapport d'aspect d'une population de nanobâtonnets d'or est prouvé. La taille finie des nanoparticules a aussi pour conséquence le confinement d'ondes acoustiques. Cet effet est étudié par spectroscopie Raman basse fréquence. Les ondes acoustiques confinés dans les nanoparticules s'avèrent dépendre de la forme des nanoparticules, de leur taille et surtout de leur structure cristalline. Les spectres Raman basse fréquence d'objets de taille et de forme similaires mais de structure cristalline différente (nanobâtonnets d'or monocristallins et nanobâtonnets d'or polycristallins) s'avèrent radicalement différents : le mode quadrupolaire isotrope des polycristaux est scindé en deux modes pour les monocristaux. Enfin, cette thèse apporte des données expérimentales précieuses aux groupes qui tentent de calculer les spectres Raman basse fréquence de nanoparticules métalliques anisotropes en prenant en compte le couplage acousto-plasmonique
We use both electronic microscopy and spectroscopic methods (optical and vibrationnal) to caracterize metallic nanoparticles. Nanoparticules with a narrow size dispersion were synthesized according to state of the art protocols. These nanoaprticles (silver nanocubes, gold nanorods, gold-core silver-shell nanoarods) were first caracterized by TEM and HRTEM. The optical properties of these nanoparticles were studied by UV-visible-NIR absorption spectroscopy and the parameters influencing their localized surface plasmon resonance (size, shape, composition) were studied and compared with numerical calculations by discrete dipole approximation. The broadening of the longitudinal localized surface plasmon of gold nanorods due to the aspect ratio distribution is shown. Nanoparticules also confine acoustic waves. This effect is studdied by low frequency Raman scattering. Confined acoustic waves depend on the size, the shape and most importantly on the cristallinity of the nanoparticules. Low frequency Raman spectra of nanoparticles of similar size and shape but of varying cristallinity (monocristalline gold nanorods and polycristalline gold nanorods) are completely different : the quadrupolar mode of the polycristals is split into two modes for the monocrystals. Finally, this work brings experimental data to groups who try to model low frequency Raman spectra of anisotropic nanoparticles and take into account acousto-plasmonic coupling
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Libros sobre el tema "Opto-mechanical process"

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Vukobratovich, Daniel y Paul Yoder. Opto-Mechanical Systems Design, Two Volume Set. Taylor & Francis Group, 2018.

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Vukobratovich, Daniel y Paul Yoder. Opto-Mechanical Systems Design, Two Volume Set. Taylor & Francis Group, 2018.

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Vukobratovich, Daniel y Paul Yoder. Opto-Mechanical Systems Design, Two Volume Set. Taylor & Francis Group, 2018.

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Opto-Mechanical Systems Design, Two Volume Set. Taylor & Francis Group, 2018.

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Capítulos de libros sobre el tema "Opto-mechanical process"

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"Opto-Mechanical Design Process". En Opto-Mechanical Systems Design, Two Volume Set, 24–69. CRC Press, 2018. http://dx.doi.org/10.1201/9781315217635-8.

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Yoder, Paul, David Stubbs, Kevin Sawyer y David Aikens. "Opto-Mechanical Design Process". En Opto-Mechanical Systems Design, Fourth Edition, Volume 1, 1–46. CRC Press, 2015. http://dx.doi.org/10.1201/b18147-2.

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"The Opto-Mechanical Design Process". En Opto-Mechanical Systems Design, 31–66. CRC Press, 2005. http://dx.doi.org/10.1201/9781420027235-5.

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"The Opto-Mechanical Design Process". En Optical Science and Engineering, 1–36. CRC Press, 2005. http://dx.doi.org/10.1201/9781420027235.ch1.

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Song, Hai-Zhi, Qiang Zhou, Guangwei Deng, Qian Dai, Zichang Zhang y You Wang. "Optoelectronic Devices for Quantum Information Processing". En Optoelectronics - Recent Advances [Working Title]. IntechOpen, 2023. http://dx.doi.org/10.5772/intechopen.1002676.

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The recent developments of optoelectronics do promote the progress in many other fields. For quantum information processing, we made efforts in manufacturing quantum devices by using optoelectronic techniques. We designed quantum dot embedded nanocavities to serve as efficient quantum emitters; using spectral multiplexing technique, we fabricated a heralded single-photon source, emitting highly pure and speedy single photons; and defects in GaN were observed serving as room temperature quantum random number generators. An entangled photon emitter with visibility of 97% was developed using cascaded second-order nonlinear optical process in PPLN waveguides; and Si3N4 microrings were effectively applied to establish photon entanglers. Readout circuits were optimized to fabricate specific single-photon avalanche detectors, and telecomm-band single-photon avalanche detectors have been improved to 128 × 32 arrays for quantum imaging. A multiplexed quantum memory was explored to simultaneously store 1650 single photons. Opto-electro-mechanical devices were studied or fabricated in order to measure minor quantities in quantum level. These works may shed light on quantum information technology for the future.
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Actas de conferencias sobre el tema "Opto-mechanical process"

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Kryger, Graham y Anika McCarter. "Opto Mechanical Package Development". En ASME 2007 International Mechanical Engineering Congress and Exposition. ASMEDC, 2007. http://dx.doi.org/10.1115/imece2007-43600.

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The focus of this student project was to design and develop a laser diode opto-mechanical package for nLight Photonics Company. This design process involved examining the existing models of the package design and assessing the manufacturing process. Limitations regarding tooling, alignment, and package materials were also taken into account. The package was modeled in SolidWorks, considering these limiting parameters and changing the size and shape of the package from previous models in order to increase spatial efficiency. Analysis of the package was performed to ensure heat would dissipate properly from the diode, and that the diode would operate within the specified temperature range. The thermal analysis was performed using various methods, including a simple spreadsheet analysis and specialized software. This paper will examine each of these design processes in more detail.
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Kvamme, E. Todd, David M. Stubbs y Michael S. Jacoby. "The opto-mechanical design process: from vision to reality". En Optomechanical Engineering 2017, editado por David M. Stubbs y Alson E. Hatheway. SPIE, 2017. http://dx.doi.org/10.1117/12.2275671.

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Ramos Zapata, Gonzalo, Luis Miguel González Fernandez, Antonio Sánchez Rodríguez, Carmen Pastor Santos y Alberto Álvarez-Herrero. "IMaX opto-mechanical integration: the AIV process for a magnetograph". En SPIE Astronomical Telescopes + Instrumentation, editado por Jacobus M. Oschmann, Jr., Mattheus W. M. de Graauw y Howard A. MacEwen. SPIE, 2008. http://dx.doi.org/10.1117/12.790390.

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Bright, Victor M., John H. Comtois, Darren E. Sene, J. Robert Reid, Steven C. Gustafson y Edward A. Watson. "Realizing micro-opto-electro-mechanical devices through a commercial surface-micromachining process". En Photonics West '96, editado por M. Edward Motamedi. SPIE, 1996. http://dx.doi.org/10.1117/12.234634.

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Zollers, Michael W., John M. Tamkin y G. Groot Gregory. "Efficient design process for the evaluation and control of flare in opto-mechanical systems". En SPIE Optical Engineering + Applications, editado por Pantazis Z. Mouroulis, R. Barry Johnson y Virendra N. Mahajan. SPIE, 2009. http://dx.doi.org/10.1117/12.826615.

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Lin, Wei-Cheng, Shenq-Tsong Chang, Chien-Kai Chung, Yu-Chuan Lin y Shih-Feng Tseng. "Process of opto-mechanical design and assembly for reflective mirror subsystem of lithographic projection lens". En SPIE Advanced Lithography, editado por Andreas Erdmann y Jongwook Kye. SPIE, 2017. http://dx.doi.org/10.1117/12.2258205.

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Chaparala, Satish C., Lawrence C. Hughes, Jae Kwak y Seungbae Park. "Thermo-Mechanical Analysis of a Laser Diode Chip in an Opto-Electronic Package". En ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASMEDC, 2009. http://dx.doi.org/10.1115/interpack2009-89108.

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It is a well-known fact that the lasers have wide variety of applications in diverse fields from medicine to communications [1]. Laser packaging involves appropriate materials selection and design to ensure that the laser performance meets the required specifications. In this paper, we present a GaAs based laser diode package design. The package design enables the laser diode chip to withstand the thermo-mechanical strains that are induced during the package assembly process as well as during the operating conditions. Excessive stresses in the chips could causes cracks in the chip. Excessive strains could cause un-desired spectral characteristics in the emitted light [2]. Therefore, the objective is to design a package that is tested and characterized to avoid these failure modes. This study presents numerical and experimental investigation of thermo-mechanical strains induced due to coefficient of thermal expansion (CTE) mismatch between various package components during assembly process. Finite element (FE) analysis is used to predict the displacements, tensile strains and stresses in the chip at various assembly processes. Digital Image Correlation (DIC) technique was used to measure the strains in the laser diode. Earlier, other researchers have used photo-luminescence methods and spectroscopic methods etc to measure packaging induced strains in the laser package [3]–[9]. The authors are not aware of any prior work where the DIC technique is applied on a very small chip for strain measurements Good correlation in displacements and strains was obtained between the model and the measurements, increasing confidence in the model. In addition, experiments were conducted to estimate the fracture strength of the GaAs to predict the chip failure based on the maximum principal stress criterion. The FE model was later used to conduct parametric study to analyze the impact of other factors on the chip stress such as substrate thickness, voids, thermal gradients in the package, surface irregularities in the chip etc. Experiments and model indicated that the designed package was robust enough and does not cause any damage to the chip.
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Chae, Inseok, Amira Meddeb, Zoubeida Ounaies y Seong H. Kim. "Tailoring and Characterization of the Liquid Crystalline Structure of Cellulose Nanocrystals for Opto-Electro-Mechanical Multifunctional Applications". En ASME 2018 Conference on Smart Materials, Adaptive Structures and Intelligent Systems. American Society of Mechanical Engineers, 2018. http://dx.doi.org/10.1115/smasis2018-8016.

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Liquid crystalline (LC) behaviors of cellulose nanocrystal (CNC), derived from wood, cotton or other cellulose-based biopolymers, have been actively investigated due to their unique optical properties and their superb mechanical properties, which open up potential applications in bioelectronics and biomedical engineering. In particular, many attempts have been made to control phase and orientation of LC-CNCs because they are critical factors deciding optical and mechanical properties, and electromechanical performances. Through the applications of mechanical force, electric field and magnetic field, some degree of success has been achieved; however, realizing homogeneous arrangements of CNCs that can be exploited at the macroscale is still elusive, owing to a variety of intermolecular interactions. The characterizations of the LC phase and orientation of CNCs are also challenging due to their complex biological structures. In this report, we introduce approaches to control the phase and orientation of LC-CNCs through the self-assembly, mechanical force and electric field. The liquid crystalline behaviors of CNCs in polar solvents and at the air/water interface are discussed. Translational and rotational behaviors of CNCs under DC electric field are also investigated as a function of their surface charge and dipole moment. In addition, we introduce a nonlinear optical process, namely, sum frequency generation (SFG) spectroscopy, for the structural characterization of LC-CNCs. Using SFG, we can analyze not only crystal phase and structure, but also polar ordering of CNCs which plays a key role in determining their electromechanical performances. Development of cellulose-based smart materials will expand the spectrum of available functional materials that are lightweight, flexible, mechanically tough, and thermally stable at moderately high temperatures (up to 300°C).
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Lakhkar, Nikhil, Abiodun Fasoro, Amit Patil, Woo Ho Lee, Dan Popa, Dereje Agonafer y Harry Stephanou. "Process Development and Die Shear Testing in MOEMS Packaging". En ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/ipack2007-33986.

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Micro-Opto-electro-Mechanical Systems (MOEMS), which are MEMS integrated with photonics, share the traditional challenges of MEMS packaging with the additional issues of optical interconnects and optical surface contamination. Optoelectronic systems require signals through a package using fiber-optics, coaxial or other interconnection approaches. Precise optical component alignment and accurate thermal management is critical to achieve component and system performance capabilities. As the requirements for higher signal speeds and higher data rates grow, and as operating frequencies move to the higher GHz regions and beyond, the choice of packaging technology becomes critical. Optical MEMS packages not only have to provide electrical connections but also support high precision optics and mechanics, vital for operation of optical MEMS devices. Analogous to MEMS, packaging is also a critical path in reliability and cost of MOEMS devices. One of the commonly observed failures is the de-lamination between the chip (die) and the die attach. The focus of this paper is the development of a reliable fluxless die attachment process suitable for MOEMS assemblies with long operational life time. The reliability assessment was carried out at the Texas Microfactory™ at UT Arlington according to the MIL-STD-883F for die shear reliability.
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Alemohammad, Hamidreza y Ehsan Toyserkani. "Characterization of Spectral Response of a FBG Sensor Embedded in a Metallic Structure Using Laser Solid Freeform Fabrication". En ASME 2006 International Mechanical Engineering Congress and Exposition. ASMEDC, 2006. http://dx.doi.org/10.1115/imece2006-14632.

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This paper focuses on spectral response characterization of fiber Bragg grating (FBG) sensors embedded in metallic structures using laser solid freeform fabrication (LSFF). Fiber Bragg grating sensors are capable of measuring temperature, strain and pressure and can be embedded in metallic structures to monitor thermal and structural loads. Due to the sensitivity of the FBG sensors to high temperatures and stresses, the embedding process using LSFF is a challenging task. In the present work, a finite element model is developed to predict the stress and temperature fields adjacent to the fiber optic sensor embedded the metallic structure. The FE results are transferred to opto-mechanical model of the FBG sensor to predict the change in the spectral response of the sensor. Finally, the finite element model is verified using an existing analytical model which predicts the temperature field and melt pool geometry in LSFF process.
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