Literatura académica sobre el tema "Nano/Micro integration"
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Artículos de revistas sobre el tema "Nano/Micro integration"
Gheorghe, Ion Gheorghe, Liliana Laura Badita, Adriana Cirstoiu, Simona Istriteanu, Veronica Despa y Stergios Ganatsios. ""Mechatronics Galaxy" a New Concept for Developing Education in Engineering". Applied Mechanics and Materials 371 (agosto de 2013): 754–58. http://dx.doi.org/10.4028/www.scientific.net/amm.371.754.
Texto completoOgawa, T., L. Saruwatari, K. Takeuchi, H. Aita y N. Ohno. "Ti Nano-nodular Structuring for Bone Integration and Regeneration". Journal of Dental Research 87, n.º 8 (agosto de 2008): 751–56. http://dx.doi.org/10.1177/154405910808700809.
Texto completoLi, Jin. "Micro-/Nano-Fiber Sensors and Optical Integration Devices". Sensors 22, n.º 19 (10 de octubre de 2022): 7673. http://dx.doi.org/10.3390/s22197673.
Texto completoYOKOKAWA, Ryuji. "W221002 Integration of Micro/Nano Fabrications and Biophysics". Proceedings of Mechanical Engineering Congress, Japan 2015 (2015): _W221002–1—_W221002–2. http://dx.doi.org/10.1299/jsmemecj.2015._w221002-1.
Texto completoLi, G. P. y Mark Bachman. "Materials for Devices in Life Science Applications". Solid State Phenomena 124-126 (junio de 2007): 1157–60. http://dx.doi.org/10.4028/www.scientific.net/ssp.124-126.1157.
Texto completoLi, G. P. y Mark Bachman. "Materials for Devices Applications in Life Sciences". Materials Science Forum 510-511 (marzo de 2006): 1066–69. http://dx.doi.org/10.4028/www.scientific.net/msf.510-511.1066.
Texto completoLee, El-Hang, S. G. Lee, B. H. O, S. G. Park, M. Y. Chung, K. H. Kim y S. H. Song. "Fabrication and integration of VLSI micro/nano-photonic circuit board". Microelectronic Engineering 83, n.º 4-9 (abril de 2006): 1767–72. http://dx.doi.org/10.1016/j.mee.2005.12.010.
Texto completoSong, Xue, Guang Cheng Yang y Fu De Nie. "A Micro Fuse Realized by Integrating Al/CuO-Based Nanoenergetic Materials on a Micro Wire". Materials Science Forum 694 (julio de 2011): 249–55. http://dx.doi.org/10.4028/www.scientific.net/msf.694.249.
Texto completoPinto, Vânia, Paulo Sousa y Graça Minas. "Special Issue on Novel Technology and Applications of Micro/Nano Devices and System". Applied Sciences 13, n.º 3 (31 de enero de 2023): 1856. http://dx.doi.org/10.3390/app13031856.
Texto completoCho, Joon Hyong, David Cayll, Dipankar Behera y Michael Cullinan. "Towards Repeatable, Scalable Graphene Integrated Micro-Nano Electromechanical Systems (MEMS/NEMS)". Micromachines 13, n.º 1 (26 de diciembre de 2021): 27. http://dx.doi.org/10.3390/mi13010027.
Texto completoTesis sobre el tema "Nano/Micro integration"
Hartmann, Daniel M. "Self-assembled pick and place methods for heterogeneous integration of micro and nano-scale structures /". Diss., Connect to a 24 p. preview or request complete full text in PDF format. Access restricted to UC campuses, 2001. http://wwwlib.umi.com/cr/ucsd/fullcit?p3022234.
Texto completoBONANNO, ALBERTO. "Micro-for-Nano: A Low-Power Platform for Nanomaterial Integration and Nanosensors Interface on 0.13μm CMOS Technology". Doctoral thesis, Politecnico di Torino, 2014. http://hdl.handle.net/11583/2557562.
Texto completoRiverola, Borreguero Martín. "Micro and Nano-electro-mechanical devices in the CMOS back end and their applications". Doctoral thesis, Universitat Autònoma de Barcelona, 2017. http://hdl.handle.net/10803/458694.
Texto completoRecently, several new emerging devices are starting to be explored because the traditional down-scaling approach of the complementary metal-oxide-semiconductor (CMOS) technology (often called “More Moore”) is reaching fundamental limits; mainly due to non-zero transistor off-state leakage. This brand-new domain that goes beyond the boundaries of Moore’s law is commonly named ``More than Moore'' and is driving interest in new devices for information processing and memory, new technologies for heterogeneous integration of multiple functions, and new paradigms for system architecture. One of these new promising technologies for logic and information processing is the micro- and nanoelectromechanical (M/NEM) relay technology, because of its immeasurably low off-state leakage current and super-steep switching behavior. This dissertation proposes to explore the possibilities of leveraging the available layers of the commercial CMOS technology AMS 0.35 µm to implement M/NEM relays. Specifically, two different approaches are explored: in-plane actuated relays defined using solely the via layer, and torsional actuated relays formed with metal and via layers (usually named composite) while supported by vias. Both approaches are supported by the tungsten VIA3 layer, which includes key features such as high hardness, high melting point, low stress and resistance to hydrofluoric (HF) acid, since the mechanical structures are released in a maskless post-CMOS process based on a wet HF enchant. Based on the key structural features that the developed relays showed, MEMS resonators based on the VIA3 platform were also fabricated. In this dissertation, we also present a particular contribution involving the design and characterization of a dual-frequency oscillator that consist of such reliable torsional tungsten resonators and a high gain, low power and ultra-compact transimpedance amplifier (TIA). Finally and parallel to the main thread of this dissertation, RF MEMS switched capacitors are developed as a result of the collaboration with the semiconductor manufacturing enterprise SilTerra Malaysia Sdn. Bhd. These devices have the particularity of being fully integrated into the process flow of a low cost, commercial 180 nm CMOS technology (using the SilTerra MEMS-on-CMOS process platform).
Kuprenaite, Sabina. "Heterogeneous integration of functional thin films for acoustic and optical devices". Thesis, Bourgogne Franche-Comté, 2019. http://www.theses.fr/2019UBFCD039.
Texto completoThe control of microstructure and surface morphology is essential for the thin films to be applied in optical and acoustic devices. Thin films of TiO2, LaNiO3 and ZnO and their heterostructures in this work were obtained by radio frequency (RF) magnetron sputtering and metalorganic chemical vapor deposition (MOCVD) techniques. The optimization of deposition parameters, such as temperature, total chamber pressure, O2 partial pressure and growth rate, led to high structural quality of functional thin films and their heterostructures. The orientation of epitaxial ZnO and TiO2 thin films was tuned not only through lattice matching with various substrates, but as well through deposition conditions. The optical quality of TiO2 films was mostly optimized through elimination of microstructural defects and increasing oxygen non-stoichiometry. It was shown that microstructural and lattice defects in polycrystalline and epitaxial films played a key role in optical propagation losses. Effect of substrate polarity on the structural, optical and acoustic properties of ZnO-based thin films was studied, as well. The sacrificial and/or seed layers were identified for heterogeneous intégration of functional acoustical and optical films with semiconductor substrates
Bleiker, Simon J. "Heterogeneous 3D Integration and Packaging Technologies for Nano-Electromechanical Systems". Doctoral thesis, KTH, Mikro- och nanosystemteknik, 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-207185.
Texto completoTredimensionell (3D) integration av mikro- och nano-elektromekaniska system (MEMS/NEMS) med integrerade kretsar (ICs) är en ny teknik som erbjuder stora fördelar jämfört med konventionell mikroelektronik. MEMS och NEMS används oftast som sensorer och aktuatorer då de möjliggör många funktioner som inte kan uppnås med vanliga ICs.3D-integration av NEMS och ICs bidrar även till mindre dimensioner, ökade prestanda och mindre energiförbrukning av elektriska komponenter. Den nuvarande tekniken för complementary metal-oxide-semicondictor (CMOS) närmar sig de fundamentala gränserna vilket drastiskt begränsar utvecklingsmöjligheten för mikroelektronik och medför slutet på Moores lag. Därför har 3D-integration identifierats som en lovande teknik för att kunna driva vidare utvecklingen för framtidens elektriska komponenter.I denna avhandling framläggs en omfattande fabrikationsmetodik för heterogen 3D-integration av NEMS ovanpå CMOS-kretsar. Heterogen integration betyder att både NEMS- och CMOS-komponenter byggs på separata substrat för att sedan förenas på ett enda substrat. Denna teknik tillåter full processfrihet för tillverkning av NEMS-komponenter och garanterar kompatibilitet med standardiserade CMOS-fabrikationsprocesser.I den första delen av avhandlingen beskrivs en metod för att sammanfoga två halvledarskivor med en extremt tunn adhesiv polymer. Denna metod demonstreras för 3D-integration av NEMS- och CMOS-komponenter. Den andra delen introducerar ett nytt koncept för NEM-switchar och dess användning i NEM-switch-baserade mikrodatorchip. Den tredje delen presenterar två olika inkapslingsmetoder för MEMS och NEMS. Den ena metoden fokuserar på hermetisk vakuuminkapsling medan den andra metoden beskriver en lågkostnadsstrategi för inkapsling av optiska komponenter. Slutligen i den fjärde delen presenteras en ny fabrikationsteknik för så kallade ”through silicon vias” (TSVs) baserad på magnetisk självmontering av nickeltråd på mikrometerskala.
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Vella, P. C., S. S. Dimov, E. Brousseau, Cristina-Luminita Tuinea-Bobe, C. Grant y Benjamin R. Whiteside. "A new process chain for producing bulk metallic glass replication masters with micro- and nano-scale features". The International Journal of Advanced Manufacturing Technology, 2014. http://hdl.handle.net/10454/18307.
Texto completoA novel process chain for serial production of polymer-based devices incorporating both micro- and nano-scale features is proposed. The process chain is enabled by the use of Zr-based bulk metallic glasses (BMG) to achieve the necessary level of compatibility and complementarity between its component technologies. It integrates two different technologies, namely laser ablation and focused ion beam (FIB) milling for micro-structuring and sub-micron patterning, respectively, thus to fabricate inserts incorporating different length scale functional features. Two alternative laser sources, namely nano-second (NS) and pico-second (PS) lasers, were considered as potential candidates for the first step in this master-making process chain. The capabilities of the component technologies together with some issues associated with their integration were studied. To validate the replication performance of the produced masters, a Zr-based BMG insert was used to produce a small batch of micro-fluidic devices by micro-injection moulding. Furthermore, an experimental study was also carried out to determine whether it would be possible by NS laser ablation to structure the Zr-based BMG workpieces with a high surface integrity whilst retaining the BMG’s non-crystalline morphology. Collectively, it was demonstrated that the proposed process chain could be a viable fabrication route for mass production of polymer devices incorporating different length scale features.
Djuric, Bojan. "Contribution à l'interconnexion de composants actifs intégrés dans des substrats laminés : apport des interfaces micro ou nano-structurées". Thesis, Toulouse 3, 2020. http://www.theses.fr/2020TOU30070.
Texto completoThe power converters hold a central position in electrical engineering. The power ratings are increasing and the converters have to meet these needs in compact systems. For example, the current power density of commercialized power converters of 2 kW for photovoltaic application is around 1 kW.l-1, whereas in the "Little Box Challenge" organized by Google and IEEE reached 12 kW.l-1. This improvement is mainly explained by using wide band-gap (WBG) semiconductor devices based on silicon carbide (SiC) and gallium nitride (GaN) materials that permit significantly higher switching frequencies. However, the associated shorter switching times are only possible when all stray elements in the package are minimized in order to take all the benefit of these new components. The parasitic elements, and the package stray inductances in particular, are source of losses which reduce the efficiency and also cause less reliable operation and EMI noise. This is fundamentally difficult to achieve with the popular packages using wire-bonded interconnections. In some application, the WBG devices are expected to be able to work at higher temperature than silicon (Si) components. The junction temperature (Tj) of SiC components can be higher than 200°C in comparison of Si switches around 125°C. The package must endure high temperature and resist the ensuing large temperature transitions as well. The PCB technology has the advantage of being a cost efficient and well-established process. There is a possibility of massive parallel manufacturing, fine pitch, thick copper for heat and current transport, repeatable multilayer structures, etc. The embedding of power dies in PCB recently has solicited great interest. There are several kinds of proposed interconnections. The greatest advantage of the technology for power device packaging is the strip-line approach of distributing current, bringing down the stray inductance close to the theoretical minimum. The trend in PCB-embedding technology is to interconnect the components by using laser micro-vias. The thermal conductivity of the PCB core is less than 1 W.m-1.K-1 for the polyimide material such a kapton against 170 W.m-1.K-1 for aluminum nitride (AlN) for direct bonded copper (DBC) substrate. The micro-via approach suffers from the manufacturing limits imposed on their density, resulting in current and heat flux limitations. This variation of the conveyed power through the converter is a source of temperature variations in the power assembly. Temperature gradient is present along the interconnections which, combined with different thermal expansion coefficient of each material, leads to crack at micro-via/die interface and delaminates over time. These interconnection defects are affecting strongly the reliability of the converter, attributed to the applied cyclical stresses. The proposed solution combines advanced PCB technologies and " not rigid " innovative interconnection, based on electrolytic deposition of macro and nano structured interfaces, followed by thermo-compression. The assembly may thus be an elementary block for the design of power converters with high level of integration and reliability by means of a full copper and flexible interconnection allowing double-sided cooling. It is expected that the nano wires used as thermal and electrical die interface will be also more resistant to cyclical stresses
Coste, Marie. "Intégration hétérogène de GaAs sur Si à partir de nano-germes : étude de la nucléation et de la croissance de micro-cristaux sur substrats Si (001) et (111)". Thesis, Université Paris-Saclay (ComUE), 2018. http://www.theses.fr/2018SACLS578/document.
Texto completoGaAs on Si integration is one of the major challenges of the last 40 years as it would allow to combine Si advantages, like its low cost, with GaAs high mobility and direct bandgap. Multi-junction photovoltaic cells based on III-V materials have the highest photovoltaic conversion efficiencies. However, their high manufacturing cost is a limiting aspect of their use. This is why we have made a preliminary study aiming at realizing their integration on Si substrate. In fine, the objective will be the realization of tandem solar cells made of GaAs/Si and GaAs/Ge on Si substrate. However, GaAs and Ge integrations on Si lead to dislocations and cracks formations because of their respective differences of lattices parameters and thermal expansion coefficients. Moreover, because of the difference of polarity between GaAs and Si, this integration also leads to anti-phase domain formation. We present in this study an integration process allowing both these defects elimination and current passage between the epitaxial material and Si. This process is based on the use of nanoscale openings in a thin silica, which allows us to carry out GaAs crystals growth on Si by lateral epitaxy from GaAs or Ge nano-seeds. To do this, we use chemical beam epitaxy which is a growth technique allowing good selectivity. Firstly, the growth will be studied inside randomly dispersed openings, which are easily made in situ under ultra-high vacuum, and then inside localized openings with fixed sizes. These are obtained after a long and complex procedure including chemical cleaning, resist spin-coating, electronic lithography, development and reactive ion etching. We will present GaAs crystals direct growth inside openings on Si (001) and (111), and also from Ge nano-seeds. This integration process allowed the elimination of the three types of defects previously mentioned, and we have obtained very good results especially for the integration inside localized openings on Si (111). We will see that Ge nano-seeds morphology can however be problematic during the GaAs lateral epitaxy. In addition, the current passage by tunnel effect through the thin silica will be verified and the GaAs crystals doping with Si will also be presented
Greiner, Felix [Verfasser] y Helmut F. [Akademischer Betreuer] Schlaak. "Mikro-Nano-Integration für metallische Mikrosysteme mit vertikal integrierten Federelementen / Felix Greiner. Betreuer: Helmut F. Schlaak". Darmstadt : Universitäts- und Landesbibliothek Darmstadt, 2013. http://d-nb.info/1107772052/34.
Texto completoCao, Hong Ha. "The fabrication process of microfluidic devices integrating microcoils for trapping magnetic nano particles for biological applications". Thesis, Paris 11, 2015. http://www.theses.fr/2015PA112150/document.
Texto completoIn this study, a concept of microfluidic chip with embedded planar coils is designed and fabricated for the aim of trapping effectively functionalized magnetic nanobeads and immobilizing antibody (IgG type). The planar coils as a heart of microfluidic chip is designed with criterion parameters which are optimized from simulation parameters of the maximum magnetic field, low power consumption and high power efficiency by FE method. The characterization of microcoils such as effectively nanobeads (300 nm) at low temperature (<37oC) is performed and confirmed. The channel network in PDMS material is designed for matching with entire process (including mixing and trapping beads) in microfluidic chip. A process of PDMS’s surface modification is also carried out in the assemble step of chip in order to limit the non-specific adsorption of many bio substances on PDMS surface. The microfluidic chip assemble is performed by using some developed techniques of reversible packaging PDMS microfluidic chip (such as stamping technique, using non-adhesive layer, oxygen plasma combining with solvent treatment). These packaging methods are important to reused microchip (specially the bottom substrate) in many times. The immobilization of antibody IgG-type is performed inside microfluidic chip following the standard protocol of bead-based ELISA in micro test tube. The result showed that IgG antibodies are well grafted on the surface of carboxyl-beads (comparing to result of standard protocol); these grafted antibodies are confirmed by coupling them with labeled second antibody (Fab-FITC conjugation)
Libros sobre el tema "Nano/Micro integration"
Li, Jin, ed. Micro-/Nano-Fiber Sensors and Optical Integration Devices. MDPI, 2022. http://dx.doi.org/10.3390/books978-3-0365-5629-1.
Texto completoElectronic and photonic packaging, Integration and packaging of micro/nano/electronic systems--2005: Presented at 2005 ASME International Mechanical Engineering Congress and Exposition : November 5-11, 2005, Orlando, Florida, USA. New York, N.Y: ASME, 2005.
Buscar texto completoSimmons, Craig A., Yu Sun y Deok-Ho Kim. Integrative Mechanobiology: Micro- and Nano- Techniques in Cell Mechanobiology. Cambridge University Press, 2015.
Buscar texto completoSimmons, Craig A., Yu Sun y Deok-Ho Kim. Integrative Mechanobiology: Micro- and Nano- Techniques in Cell Mechanobiology. Cambridge University Press, 2015.
Buscar texto completoSimmons, Craig A., Yu Sun y Deok-Ho Kim. Integrative Mechanobiology: Micro- and Nano- Techniques in Cell Mechanobiology. Cambridge University Press, 2015.
Buscar texto completoASME. ASME 2015 13th International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro-And Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays. American Society of Mechanical Engineers, The, 2015.
Buscar texto completoASME. ASME 2015 13th International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing, Interconnect and Reliability, Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales. American Society of Mechanical Engineers, The, 2015.
Buscar texto completoCapítulos de libros sobre el tema "Nano/Micro integration"
Kühnholz, J. y G. Lecarpentier. "Cost Savings with Micro/Nano-Replication". En MicroNano Integration, 277–78. Berlin, Heidelberg: Springer Berlin Heidelberg, 2004. http://dx.doi.org/10.1007/978-3-642-18727-8_40.
Texto completoGhodssi, Reza, Peter Dykstra, Mariana Meyer, Stephan Koev, Konstantinos Gerasopoulos, Xiaolong Luo, Gary Rubloff, William Bentley, Gregory Payne y James Culver. "Integration of Diverse Biological Materials in Micro/Nano Devices". En NATO Science for Peace and Security Series B: Physics and Biophysics, 275–85. Dordrecht: Springer Netherlands, 2010. http://dx.doi.org/10.1007/978-90-481-3807-4_22.
Texto completoBüttgenbach, Stephanus. "Mikro-Nano-Integration". En Mikrosystemtechnik, 117–26. Berlin, Heidelberg: Springer Berlin Heidelberg, 2016. http://dx.doi.org/10.1007/978-3-662-49773-9_11.
Texto completoPierce, Erica L. Bradshaw y Aik Choon Tan. "Integrating “Omics” Data for Quantitative and Systems Pharmacology in Translational Oncology". En Micro and Nano Flow Systems for Bioanalysis, 187–206. New York, NY: Springer New York, 2012. http://dx.doi.org/10.1007/978-1-4614-4376-6_12.
Texto completoKurabayashi, Katsuo, Nien-Tsu Huang y Yi-Chung Tung. "Multiscale, Hierarchical Integration of Soft Polymer Micro- and Nanostructures into Optical MEMS". En Optical Nano and Micro Actuator Technology, 491–518. CRC Press, 2012. http://dx.doi.org/10.1201/b13892-21.
Texto completoNiazi, Sana y Farideh Doroodgar. "Fundamentals of Femtosecond Laser and Its Application in Ophthalmology". En Fundamentals and Application of Femtosecond Optics [Working Title]. IntechOpen, 2022. http://dx.doi.org/10.5772/intechopen.106701.
Texto completoGheorghe, Ion Gheorghe, Carmen Adriana Cirstoiu, Simona-Elena Istriteanu y Veronica Despa. "Intelligent Integrative Micro-Nano-Robotics". En DAAAM Proceedings, 0075–76. DAAAM International Vienna, 2011. http://dx.doi.org/10.2507/22nd.daaam.proceedings.038.
Texto completoSun, H. B., S. Shoji, X. M. Duan y S. Kawata. "Chapter 17 Laser micro-nanofabrication for functional photonic crystals". En Nanophotonics - Integrating Photochemistry, Optics and Nano/Bio Materials Studies, Proceedings of the 1st International Nanophotonics Symposium Handai, 275–91. Elsevier, 2004. http://dx.doi.org/10.1016/s1574-0641(04)80022-6.
Texto completoRakshit, Jayanta Kumar y Gaurav Kumar Bharti. "All-Optical Switching and Logic-Gates Design Using Mode (Polarization)-Conversion in Micro-Ring Resonator". En Contemporary Developments in High-Frequency Photonic Devices, 277–302. IGI Global, 2019. http://dx.doi.org/10.4018/978-1-5225-8531-2.ch011.
Texto completoActas de conferencias sobre el tema "Nano/Micro integration"
Gessner, Thomas, Martina Vogel, Christian Kaufmann, Karla Hiller, Steffen Kurth, Jorg Nestler y Thomas Otto. "Micro/nano technologies towards smart systems integration". En 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT). IEEE, 2010. http://dx.doi.org/10.1109/icsict.2010.5667615.
Texto completoKumeria, Tushar, Mahaveer Kurkuri, Kerrilyn Diener, Chen Zhang, Luke Parkinson y Dusan Losic. "Reflectometric interference biosensing using nanopores: integration into microfluidics". En Smart Nano-Micro Materials and Devices, editado por Saulius Juodkazis y Min Gu. SPIE, 2011. http://dx.doi.org/10.1117/12.903217.
Texto completoJin, Jian, Si Di y Xianshuai Chen. "Fabrication of a high-integration multi-spectral imaging lens and its application". En Optoelectronics and Micro/nano-optics, editado por Min Qiu, Min Gu, Xiaocong Yuan y Zhiping Zhou. SPIE, 2017. http://dx.doi.org/10.1117/12.2283531.
Texto completoFranzon, Paul D., Steven Lipa, Julie Oh, Thor Thorolfsson y Rhett Davis. "Memory rich applications for 3D integration". En Smart Materials, Nano-and Micro-Smart Systems, editado por Said F. Al-Sarawi, Vijay K. Varadan, Neil Weste y Kourosh Kalantar-Zadeh. SPIE, 2008. http://dx.doi.org/10.1117/12.810061.
Texto completoCsaki, A., A. Wolff, T. Schüler, R. Möller, G. Festag, R. Kretschmer, G. Maubach y W. Fritzsche. "Defined DNA immobilization for a DNA-based micro-nano integration". En DNA-BASED NANOSCALE INTEGRATION: International Symposium on DNA-Based Nanoscale Integration. AIP, 2006. http://dx.doi.org/10.1063/1.2360582.
Texto completoXu, Yan. "Bridging world-to-nanofluidics interfaces through nano-in-nano integration technology". En 2016 International Symposium on Micro-NanoMechatronics and Human Science (MHS). IEEE, 2016. http://dx.doi.org/10.1109/mhs.2016.7824225.
Texto completoBai, Xiao-Dan y Jing Liu. "Bubble Based Micro/Nano Fabrication Method". En 2007 First International Conference on Integration and Commercialization of Micro and Nanosystems. ASMEDC, 2007. http://dx.doi.org/10.1115/mnc2007-21246.
Texto completoHowlader, Matiar M. R. "Micro- and nano-systems integration — The next frontier". En 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). IEEE, 2017. http://dx.doi.org/10.23919/ltb-3d.2017.7947411.
Texto completoWich, Thomas, Christoph Edeler, Christian Stolle y Sergej Fatikow. "Micro-nano-integration based on automated serial assembly". En 2009 IEEE International Conference on Automation Science and Engineering (CASE 2009). IEEE, 2009. http://dx.doi.org/10.1109/coase.2009.5234150.
Texto completoLi, Donghao, Bin Li, Bo Tang, Wenjuan Xiong, Peng Zhang, Yan Yang, Ruonan Liu y Zhihua Li. "CMOS-compatible low stress silicon nitride films for photonic integration". En Nanophotonics and Micro/Nano Optics VI, editado por Zhiping Zhou, Kazumi Wada y Limin Tong. SPIE, 2020. http://dx.doi.org/10.1117/12.2574672.
Texto completoInformes sobre el tema "Nano/Micro integration"
R.W. Carpick y M.E. Plesha. Development and Integration of Single-Asperity Nanotribology Experiments & Nanoscale Interface Finite Element Modeling for Prediction and Control of Friction and Damage in Micro- and Nano-mechnical Systems. Office of Scientific and Technical Information (OSTI), marzo de 2007. http://dx.doi.org/10.2172/922930.
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