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Artículos de revistas sobre el tema "Microelectronic engineering"

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Autor: Grafiati
Publicado: 4 de junio de 2021
Última modificación: 20 de febrero de 2023

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1

Volinsky, Alex A., Harley Johnson, Surya Ganti y Pradeep Sharma. "Microelectronic Engineering Special Issue:". Microelectronic Engineering 75, n.º 1 (julio de 2004): 1–2. http://dx.doi.org/10.1016/j.mee.2004.05.001.

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2

Криштоп, В. Г., Д. А. Жевненко, П. В. Дудкин, Е. С. Горнев, В. Г. Попов, С. С. Вергелес y Т. В. Криштоп. "ТЕХНОЛОГИЯ И ПРИМЕНЕНИЕ ЭЛЕКТРОХИМИЧЕСКИХ ПРЕОБРАЗОВАТЕЛЕЙ". NANOINDUSTRY Russia 96, n.º 3s (15 de junio de 2020): 450–55. http://dx.doi.org/10.22184/1993-8578.2020.13.3s.450.455.

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Электрохимические системы очень перспективны для разработки новой элементной базы для микроэлектроники и для использования в широком спектре инженерных задач. Мы разработали новую микроэлектронную технологию для изготовления электрохимических преобразователей (ЭХП) и новые приборы на основе новых электрохимических микроэлектронных чипов. Планарные электрохимические преобразователи могут использоваться в акселерометрах, сейсмических датчиках, датчиках вращения, гидрофонах и датчиках давления. Electrochemical systems are very promising for the development of a new element base for microelectronics, and for use in a wide range of engineering applications. We have developed a new microelectronic technology for manufacturing electrochemical transducers (ECP) and new devices based on new electrochemical microelectronic chips. Planar electrochemical transducers are used in accelerometers, seismic sensors, rotation sensors, hydrophones and pressure sensors.
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3

Rossum, Marc Van. "New editor for Microelectronic Engineering". Microelectronic Engineering 77, n.º 1 (enero de 2005): 1. http://dx.doi.org/10.1016/j.mee.2004.08.002.

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4

Kerns, D. V. "Microelectronic manufacturing engineering curriculum development". IEEE Transactions on Education 32, n.º 1 (1989): 4–11. http://dx.doi.org/10.1109/13.21155.

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5

Chugunov, E. Y., A. I. Pogalov y S. P. Timoshenkov. "Engineering Calculations of Microelectronic Products Parts and Assemblies Using Finite-Element Modeling". Proceedings of Universities. Electronics 26, n.º 3-4 (2021): 255–64. http://dx.doi.org/10.24151/1561-5405-2021-26-3-4-255-264.

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In the context of increasing the electronic components integration level, growing functionality and packaging density, as well as reducing the electronics weight and size, an integrated approach to engineering calculations of parts and assemblies of modern functionally and technically complex microelectronic products is required. Of particular importance are engineering calculations and structural modeling using computer-aided engineering systems, and also assessment of structural, technological and operational factors’ impact on the products reliability and performance. This work presents an approach to engineering calculations and microelectronic products modeling based on the finite-element method providing a comprehensive account of various factors (material properties, external loading, temperature fields, and other parameters) impact on the stress-strain state, mechanical strength, thermal condition, and other characteristics of products. On the example of parts and assemblies of products of microelectronic technology, the approximation of structures was shown and computer finite-element models were developed to study various structural and technological options of products and the effects on them. Engineering calculations and modeling of parts and assemblies were performed, taking into account the impact of material properties, design parameters and external influences on the products’ characteristics. Scientific and technical recommendations for structure optimization and design and technology solutions ensuring the products resistance to diverse effects were developed. It has been shown that an integrated approach to engineering calculations and microelectronic products modeling based on the finite-element method provides for the determination of optimal solutions taking into account structural, technological, and operational factors and allows the development of products with high tactical, technical and operational characteristics.
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6

Grout, Ian y Joseph Walsh. "Microelectronic Circuit Test Engineering Laboratories with Programmable Logic". International Journal of Electrical Engineering & Education 41, n.º 4 (octubre de 2004): 313–27. http://dx.doi.org/10.7227/ijeee.41.4.5.

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7

Kern, Dieter, Francesc Pérez-Murano, Jin-Woo Choi, Christophe Vieu, Massimo Gentili, Mikio Takai, Martin Peckerar y Evangelos Gogolides. "Editorial on the 30th anniversary of Microelectronic Engineering". Microelectronic Engineering 132 (enero de 2015): vii—viii. http://dx.doi.org/10.1016/j.mee.2014.11.016.

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8

Brodie, A. D. y W. C. Nixon. "An electron optical line source for microelectronic engineering". Microelectronic Engineering 6, n.º 1-4 (diciembre de 1987): 111–16. http://dx.doi.org/10.1016/0167-9317(87)90024-4.

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9

Keatch, Robert P. y Brian Lawrenson. "Practical Microelectronics for Electronic Engineering Students". International Journal of Electrical Engineering & Education 35, n.º 2 (abril de 1998): 117–38. http://dx.doi.org/10.1177/002072099803500203.

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This article describes practical microelectronic projects and the facilities at the University of Dundee, where students learn to optimise the various fabrication processes and manufacture custom silicon chips and discrete devices. This subject is potentially very wide, including theory of devices and manufacturing technology, and some fundamental aspects of circuit design.
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10

Brodie, I. y P. R. Schwoebel. "Vacuum microelectronic devices". Proceedings of the IEEE 82, n.º 7 (julio de 1994): 1006–34. http://dx.doi.org/10.1109/5.293159.

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11

Haskard, M. R. "Microelectronic sensor technology". Journal of Physics E: Scientific Instruments 19, n.º 11 (noviembre de 1986): 891–96. http://dx.doi.org/10.1088/0022-3735/19/11/001.

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12

Korotkov, A. S. "Multifunctional microelectronic wireless receivers". Radioelectronics and Communications Systems 50, n.º 6 (junio de 2007): 298–307. http://dx.doi.org/10.3103/s0735272707060027.

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13

Watson, L. D., P. Maynard, D. C. Cullen, R. S. Sethi, J. Brettle y C. R. Lowe. "A microelectronic conductimetric biosensor". Biosensors 3, n.º 2 (enero de 1987): 101–15. http://dx.doi.org/10.1016/s0265-928x(87)80003-2.

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14

Zhu, Huabo, Xu Han y Yourui Tao. "Efficient stitching method of tiled scanned microelectronic images". Measurement Science and Technology 33, n.º 7 (15 de abril de 2022): 075404. http://dx.doi.org/10.1088/1361-6501/ac632a.

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Abstract Sparse features and repetitive textures are frequently presented in microelectronic microscopic images. Therefore, it is challenging for image stitching to meet the requirements of high-speed precision manufacturing. A novel image stitching method for tiled images is proposed to generate panoramic images of microelectronics quickly and accurately. According to the preset scan trajectory, grids were established between adjacent images for feature matching. The clustering algorithm was used to screen reasonable and multiple sets of registrations. Then, all registrations were used as connecting edges, and images were used as nodes, to create a multigraph. The unique registration in multigraph was solved by a non-linear minimization problem with linear constraints. Finally, image transformations were computed in global optimization for rendering panoramic images via image warping. The experimental results show that the proposed method improves the stability and efficiency of image stitching, furthermore, it maintains an equivalent level of precision as the Fiji and microscopy image stitching tool methods.
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15

Ravindra, N. M. y A. Kumar. "Advances in microelectronic processing". JOM 53, n.º 6 (junio de 2001): 42. http://dx.doi.org/10.1007/s11837-001-0102-z.

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16

Székely, Vladimir. "Thermal monitoring of microelectronic structures". Microelectronics Journal 25, n.º 3 (mayo de 1994): 157–70. http://dx.doi.org/10.1016/0026-2692(94)90008-6.

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17

O'Connor, Patrick D. T., Michael G. Head y Malcolm Joy. "Reliability prediction for microelectronic systems". Reliability Engineering 10, n.º 3 (enero de 1985): 129–40. http://dx.doi.org/10.1016/0143-8174(85)90016-2.

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18

Padmadinata, F. Z., J. J. Veerhoek, G. J. A. van Dijk y J. H. Huijsing. "Microelectronic skin electrode". Sensors and Actuators B: Chemical 1, n.º 1-6 (enero de 1990): 491–94. http://dx.doi.org/10.1016/0925-4005(90)80257-z.

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19

Mobbs, D. J. y D. Summerhayes. "Optical/microelectronic sensor patents reviewed". Sensor Review 9, n.º 2 (febrero de 1989): 95–104. http://dx.doi.org/10.1108/eb007794.

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20

Hagen, Cornelis W. y Paul F. A. Alkemade. "Special Issue of Microelectronic Engineering on Micro- and Nanopatterning 2015". Microelectronic Engineering 155 (abril de 2016): A1. http://dx.doi.org/10.1016/j.mee.2016.05.020.

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21

Arora, V. K. y G. S. Samudra. "Computer aided engineering in microelectronic processes and design in Singapore". IEEE Transactions on Education 36, n.º 1 (1993): 148–52. http://dx.doi.org/10.1109/13.204835.

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22

Mathias, Jean-Denis, Pierre-Marie Geffroy y Jean-François Silvain. "Architectural optimization for microelectronic packaging". Applied Thermal Engineering 29, n.º 11-12 (agosto de 2009): 2391–95. http://dx.doi.org/10.1016/j.applthermaleng.2008.12.037.

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23

Karnaushenko, Daniil, Tong Kang, Vineeth K. Bandari, Feng Zhu y Oliver G. Schmidt. "3D Microelectronics: 3D Self‐Assembled Microelectronic Devices: Concepts, Materials, Applications (Adv. Mater. 15/2020)". Advanced Materials 32, n.º 15 (abril de 2020): 2070120. http://dx.doi.org/10.1002/adma.202070120.

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24

Smith, Kenneth. "The story behind microelectronic circuits". IEEE Solid-State Circuits Magazine 1, n.º 4 (2009): 8–17. http://dx.doi.org/10.1109/mssc.2009.934597.

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25

Rodger, D. C. y Yu-Chong Tai. "Microelectronic packaging for retinal prostheses". IEEE Engineering in Medicine and Biology Magazine 24, n.º 5 (septiembre de 2005): 52–57. http://dx.doi.org/10.1109/memb.2005.1511500.

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26

Wentai Liu, M. Sivaprakasam, Guoxing Wang, Mingcui Zhou, J. Granacki, J. Lacoss y J. Wills. "Implantable biomimetic microelectronic systems design". IEEE Engineering in Medicine and Biology Magazine 24, n.º 5 (septiembre de 2005): 66–74. http://dx.doi.org/10.1109/memb.2005.1511502.

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27

Hsu, S. H., W. P. Kang, J. L. Davidson, J. H. Huang y D. V. Kerns. "Vacuum microelectronic integrated differential amplifier". Electronics Letters 48, n.º 19 (2012): 1219. http://dx.doi.org/10.1049/el.2012.1245.

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28

Dormidoshina, D. A., Yu V. Rubtsov y M. L. Savin. "The Application of ICMH in the Collection, Processing and Analysis of Information on the Reliability of Microelectronic Products". Nano- i Mikrosistemnaya Tehnika 22, n.º 9 (29 de diciembre de 2020): 485–88. http://dx.doi.org/10.17587/nmst.22.485-488.

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he most objective and reliable information for assessing the possibility of using microelectronic products in electronic equipment is provided by the data obtained as a result of their collection, processing and analysis from organizations ordering, designing, developing, manufacturing, testing, supplying, using and operating products. The analysis of such data makes it possible to assess the level of the actual reliability of the product, to identify weak points in design technology, manufacturing, application and operation standards, and to develop specific measures to ensure reliability. Currently, there is a significant increase in the costs of collecting, processing and analyzing information on the reliability of microelectronic products due to the increase in the degree of their miniaturization, the growth of the range of used microelectronic products in radio electronic equipment. At the same time, demands from consumers and customers to optimize the costs of collecting, processing and analyzing information are increasing, which creates contradictions to overcome which various technologies and techniques are used, including ICMH, which is studied in this article in order to ensure the digitalization of information about reliability microelectronic products.
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29

Hudson, Tina A. "Guest Editorial/Microelectronic Systems Education". IEEE Transactions on Education 51, n.º 3 (agosto de 2008): 305. http://dx.doi.org/10.1109/te.2008.921791.

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30

Hudson, Tina A. "Guest Editorial Microelectronic Systems Education". IEEE Transactions on Education 54, n.º 2 (mayo de 2011): 173. http://dx.doi.org/10.1109/te.2011.2131270.

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31

Chang, Shoou-Jinn, Teen-Hang Meen, Stephen D. Prior, Artde Donald Kin-Tak Lam y Liang-Wen Ji. "Nanostructured Materials for Microelectronic Applications". Advances in Materials Science and Engineering 2014 (2014): 1. http://dx.doi.org/10.1155/2014/383041.

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32

Hallum, L. E., S. L. Cloherty y N. H. Lovell. "Image Analysis for Microelectronic Retinal Prosthesis". IEEE Transactions on Biomedical Engineering 55, n.º 1 (enero de 2008): 344–46. http://dx.doi.org/10.1109/tbme.2007.903713.

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33

Dirks, H. K. "Quasi-stationary fields for microelectronic applications". Electrical Engineering 79, n.º 2 (abril de 1996): 145–55. http://dx.doi.org/10.1007/bf01232924.

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34

Gorham, D. A. "Analysis of microelectronic materials and devices". Microelectronics Journal 24, n.º 5 (agosto de 1993): 594. http://dx.doi.org/10.1016/0026-2692(93)90143-3.

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35

Kelly, R. G. y A. E. Owen. "Microelectronic ion sensors: A critical survey". IEE Proceedings I Solid State and Electron Devices 132, n.º 5 (1985): 227. http://dx.doi.org/10.1049/ip-i-1.1985.0050.

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36

Wang, Zhengdong, Tong Zhang, Jinkai Wang, Ganqiu Yang, Mengli Li y Guanglei Wu. "The Investigation of the Effect of Filler Sizes in 3D-BN Skeletons on Thermal Conductivity of Epoxy-Based Composites". Nanomaterials 12, n.º 3 (28 de enero de 2022): 446. http://dx.doi.org/10.3390/nano12030446.

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Thermally conductive and electrically insulating materials have attracted much attention due to their applications in the field of microelectronics, but through-plane thermal conductivity of materials is still low at present. In this paper, a simple and environmentally friendly strategy is proposed to improve the through-plane thermal conductivity of epoxy composites using a 3D boron nitride (3D-BN) framework. In addition, the effect of filler sizes in 3D-BN skeletons on thermal conductivity was investigated. The epoxy composite with larger BN in lateral size showed a higher through-plane thermal conductivity of 2.01 W/m·K and maintained a low dielectric constant of 3.7 and a dielectric loss of 0.006 at 50 Hz, making it desirable for the application in microelectronic devices.
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37

Monaico, Eduard. "ENGINEERING OF SEMICONDUCTOR COMPOUNDS VIA ELECTROCHEMICAL TECHNOLOGIES FOR NANO-MICROELECTRONIC APPLICATIONS". Journal of Engineering Science 29, n.º 1 (marzo de 2022): 8–16. http://dx.doi.org/10.52326/jes.utm.2022.29(1).01.

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The paper is focused on electrochemical approaches for nanostructuring of semiconductor compounds with further applications in nano - microelectronic devices. A cost-effective technology for nanowires and nanotubes obtaining by pulsed electrochemical deposition is presented. Functionalization of elaborated nanostructures with gold or platinum via electroplating improves the properties of the nanostructures. An optimization of the varicap design to increase the capacitance is proposed and discussed as well as the optimization of pulsed electrochemical deposition of several hundred micrometer long Pt nanotubes is performed. Herein, the elaboration of contacts to GaAs nanowires via different approaches for photoelectrical investigations is reported.
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38

Stoner, Brian R., Jeffrey R. Piascik, Kristin Hedgepath Gilchrist, Charles B. Parker y Jeffrey T. Glass. "A Bipolar Vacuum Microelectronic Device". IEEE Transactions on Electron Devices 58, n.º 9 (septiembre de 2011): 3189–94. http://dx.doi.org/10.1109/ted.2011.2157930.

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39

N.S. Allen, Professor. "Polymeric materials for microelectronic applications". Journal of Photochemistry and Photobiology A: Chemistry 94, n.º 2-3 (marzo de 1996): 264. http://dx.doi.org/10.1016/s1010-6030(96)90031-3.

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40

G.W.A.D. "Introduction to microelectronic fabrication". Microelectronics Reliability 28, n.º 5 (enero de 1988): 823. http://dx.doi.org/10.1016/0026-2714(88)90019-4.

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41

Royce, B. "Differential Thermal Expansion in Microelectronic Systems". IEEE Transactions on Components, Hybrids, and Manufacturing Technology 11, n.º 4 (diciembre de 1988): 454–63. http://dx.doi.org/10.1109/tchmt.1988.1134932.

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42

Petrovsky, V. I., A. S. Sigov y K. A. Vorotilov. "Microelectronic applications of ferroelectric films". Integrated Ferroelectrics 3, n.º 1 (abril de 1993): 59–68. http://dx.doi.org/10.1080/10584589308216700.

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43

Parr, R. A., J. C. Wilson y R. G. Kelly. "A hybrid microelectronic pH sensor". Journal of Physics E: Scientific Instruments 19, n.º 12 (diciembre de 1986): 1070–72. http://dx.doi.org/10.1088/0022-3735/19/12/021.

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44

Reis, Ricardo, Fernando Moraes y Pascal Fouillat. "Table of contents and Foreword". Journal of Integrated Circuits and Systems 1, n.º 2 (17 de noviembre de 2004): 1–4. http://dx.doi.org/10.29292/jics.v1i2.256.

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The Editorial Board has the satisfaction to launch the second edition of the Journal of Integrated Circuits and Systems - JICS. This journal will present state-of-art papers on Integrated Circuits and Systems areas. It is an effort of both Brazilian Microelectronics Society - SBMicro and Brazilian Computer Society - SBC to create a new scientific journal covering the following microelectronic domains: Process and Materials, Device and Characterization, Design, Test and CAD of Integrated Circuits and Systems. This second edition includes a selection of papers from SBMicro symposium. We would like to thanks João Antonio Martino that worked as editor of the papers originated from SBMicro and included in this edition. We ask the researches all around the world to submit good papers to consolidate the journal as an international publication composed by a set of attractive and outstanding papers.The editors
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45

Northrop, D. C. "Book Review: Introduction to Microelectronic Devices". International Journal of Electrical Engineering & Education 27, n.º 1 (enero de 1990): 93. http://dx.doi.org/10.1177/002072099002700139.

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46

Evans, I. y T. York. "Microelectronic Capacitance Transducer for Particle Detection". IEEE Sensors Journal 4, n.º 3 (junio de 2004): 364–72. http://dx.doi.org/10.1109/jsen.2004.826741.

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47

Silva, Fernando. "Electric Drives and Microelectronic Circuits [review of "Microelectronic Circuits: Analysis and Design, 2nd Edition (Rashid, M.H. 2011)]". IEEE Industrial Electronics Magazine 5, n.º 1 (marzo de 2011): 78. http://dx.doi.org/10.1109/mie.2011.940258.

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48

GOGÉ, M., D. BAUZA y G. VELASCO. "LARGE DIFFUSION OXYGEN SENSOR IN MICROELECTRONIC TECHNOLOGY". Le Journal de Physique Colloques 47, n.º C1 (febrero de 1986): C1–795—C1–799. http://dx.doi.org/10.1051/jphyscol:19861121.

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49

Zhang, Lei, A. Q. Gui y W. N. Carr. "Lateral vacuum microelectronic logic gate design". Journal of Micromechanics and Microengineering 1, n.º 2 (1 de junio de 1991): 126–34. http://dx.doi.org/10.1088/0960-1317/1/2/005.

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50

Liechti, K. M. "Residual stresses in plastically encapsulated microelectronic devices". Experimental Mechanics 25, n.º 3 (septiembre de 1985): 226–31. http://dx.doi.org/10.1007/bf02325091.

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