Tesis sobre el tema "Microelectronic engineering"
Crea una cita precisa en los estilos APA, MLA, Chicago, Harvard y otros
Consulte los 50 mejores tesis para su investigación sobre el tema "Microelectronic engineering".
Junto a cada fuente en la lista de referencias hay un botón "Agregar a la bibliografía". Pulsa este botón, y generaremos automáticamente la referencia bibliográfica para la obra elegida en el estilo de cita que necesites: APA, MLA, Harvard, Vancouver, Chicago, etc.
También puede descargar el texto completo de la publicación académica en formato pdf y leer en línea su resumen siempre que esté disponible en los metadatos.
Explore tesis sobre una amplia variedad de disciplinas y organice su bibliografía correctamente.
Brodie, Alan David. "An electron optical line source for microelectronic engineering". Thesis, University of Cambridge, 1990. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.357743.
Texto completoGoodson, Kenneth E. (Kenneth Eugene). "Thermal conduction in microelectronic circuits". Thesis, Massachusetts Institute of Technology, 1993. http://hdl.handle.net/1721.1/12615.
Texto completoBalla, Tobias. "Modelling of microelectronic processes and materials". Thesis, University of Southampton, 2011. https://eprints.soton.ac.uk/348865/.
Texto completoMaseeh, Fariborz. "Characterization of mechanical properties of microelectronic thin films". Thesis, Massachusetts Institute of Technology, 1990. http://hdl.handle.net/1721.1/14081.
Texto completoTsuk, Michael James. "Propagation and interference in lossy microelectronic integrated circuits". Thesis, Massachusetts Institute of Technology, 1990. http://hdl.handle.net/1721.1/14024.
Texto completoKulkarni, Milind Sudhakar. "Tribochemical investigation of microelectronic materials". Thesis, [College Station, Tex. : Texas A&M University, 2006. http://hdl.handle.net/1969.1/ETD-TAMU-1831.
Texto completoLaval, Stuart S. (Stuart Sean) 1980. "A microelectronic design for low-cost disposable chemical sensors". Thesis, Massachusetts Institute of Technology, 2004. http://hdl.handle.net/1721.1/28424.
Texto completoIncludes bibliographical references (p. 57).
This thesis demonstrates the novel concept and design of integrated microelectronics for a low-cost disposable chemical sensor. The critical aspects of this chemical sensor are the performance of the microelectronic chip and how this chip integrates and interfaces with the resistive sensors that detect chemicals. The design, simulation, and implementation of a low-power CMOS microelectronic analog measurement system and integration with the resistive chemical sensors is described. The overall goal is to produce a microelectronic design that can be fabricated, tested, and manufactured by an outside semiconductor vendor.
by Stuart S. Laval.
M.Eng.
Hou, Chih-Sheng Johnson. "An integrated microelectronic device for biomolecular amplification and detection". Thesis, Massachusetts Institute of Technology, 2007. http://hdl.handle.net/1721.1/38676.
Texto completoIncludes bibliographical references (p. 133-154).
The extraordinarily high sensitivity, large dynamic range and reproducibility of polymerase chain reaction (PCR) have made it one of the most widely used techniques for analyzing nucleic acids. As a result, considerable effort has been directed towards developing miniaturized systems for PCR, but most rely on off-chip optical detection modules that are difficult to miniaturize into a compact analytical system and fluorescent product markers that can require extensive effort to optimize. This thesis presents a robust and simple method for direct label-free PCR product quantification using a microelectronic sensor. The thesis covers the design, fabrication, and characterization of the sensing technique and its integration with PCR microfluidics into a monolithic detection platform. The sensor used in this thesis study is an electrolyte-insulator-silicon (EIS) device fabricated on planar silicon substrates. Based on electronic detection of layer-by-layer assembly of polyelectrolytes, the sensing technique can specifically quantify double-stranded DNA product in unprocessed samples and monitor the product concentration at various stages of PCR to generate readout analogous to that of a real-time fluorescent measurement.
(cont.) Amplification is achieved with integrated metal resistive heaters, temperature sensors, and microfluidic valves. Direct electronic quantification of the product on-chip yields analog surface potential signals that can be converted to a digital true/false readout. A silicon field-effect sensor for direct detection of heparin by its intrinsic negative charge has also been developed. Detection of heparin and heparin-based drugs in buffer and serum has been studied, and a study demonstrating strong correlation between electronic heparin sensing measurements and those from a colorimetric assay for heparin-mediated anti-Xa activity has been performed.
by Chih-Sheng Johnson Hou.
Ph.D.
Guzek, John S. (John Stephen). "Fatigue crack propagation along polymer-metal interfaces in microelectronic packages". Thesis, Massachusetts Institute of Technology, 1996. http://hdl.handle.net/1721.1/41401.
Texto completoSolis, Adrian (Adrian Orbita). "MIT Device Simulation WebLab : an online simulator for microelectronic devices". Thesis, Massachusetts Institute of Technology, 2004. http://hdl.handle.net/1721.1/33364.
Texto completoIncludes bibliographical references (p. 149-157).
In the field of microelectronics, a device simulator is an important engineering tool with tremendous educational value. With a device simulator, a student can examine the characteristics of a microelectronic device described by a particular model. This makes it easier to develop an intuition for the general behavior of that device and examine the impact of particular device parameters on device characteristics. In this thesis, we designed and implemented the MIT Device Simulation WebLab ("WeblabSim"), an online simulator for exploring the behavior of microelectronic devices. WeblabSim makes a device simulator readily available to users on the web anywhere, and at any time. Through a Java applet interface, a user connected to the Internet specifies and submits a simulation to the system. A program performs the simulation on a computer that can be located anywhere else on the Internet. The results are then sent back to the user's applet for graphing and further analysis. The WeblabSim system uses a three-tier design based on the iLab Batched Experiment Architecture. It consists of a client applet that lets users configure simulations, a laboratory server that runs them, and a generic service broker that mediates between the two through SOAP-based web services. We have implemented a graphical client applet, based on the client used by the MIT Microelectronics WebLab.
(cont.) Our laboratory server has a distributed, modular design consisting of a data store, several worker servers that run simulations, and a master server that acts as a coordinator. On this system, we have successfully deployed WinSpice, a circuit simulator based on Berkeley Spice3F4. Our initial experiences with WeblabSim indicate that it is feature-complete, reliable and efficient. We are satisfied that it is ready for beta deployment in a classroom setting, which we hope to do in Fall 2004.
by Adrian Solis.
M.Eng.
Akerson, Jerome Jeffrey 1961. "Numerical techniques for electromagnetic applications in microelectronic and radar imaging systems". Thesis, Massachusetts Institute of Technology, 1998. http://hdl.handle.net/1721.1/46116.
Texto completoIncludes bibliographical references (p. 227-242).
by Jerome J. Akerson.
Ph.D.
How, Yew Seng. "Modeling of impression testing to obtain mechanical properties of lead-free solders microelectronic interconnects". Thesis, Monterey, Calif. : Springfield, Va. : Naval Postgraduate School ; Available from National Technical Information Service, 2005. http://library.nps.navy.mil/uhtbin/hyperion/05Dec%5FHow.pdf.
Texto completoThesis Advisor(s): Indranath Dutta. Includes bibliographical references (p. 79-80). Also available online.
Randrianandrasana, Michel F. "Finding structures in information networks using the affinity network". Thesis, Aston University, 2011. http://publications.aston.ac.uk/15684/.
Texto completoVargheese, K. Deenamma. "ECR Assisted Deposition of Tin And Si3N4 Thin Films For Microelectronic Applications". Thesis, Indian Institute of Science, 2000. http://hdl.handle.net/2005/202.
Texto completoXue, Hao. "Hardware Security and VLSI Design Optimization". Wright State University / OhioLINK, 2018. http://rave.ohiolink.edu/etdc/view?acc_num=wright1546466777397815.
Texto completoLi, Kecheng. "Direct Liquid Evaporation Chemical Vapor Deposition(DLE-CVD) of Nickel, Manganese and Copper-Based Thin Films for Interconnects in Three-Dimensional Microelectronic Systems". Thesis, Harvard University, 2016. http://nrs.harvard.edu/urn-3:HUL.InstRepos:33493366.
Texto completoEngineering and Applied Sciences - Applied Physics
Cheong, Kuan Yew y n/a. "Silicon Carbide as the Nonvolatile-Dynamic-Memory Material". Griffith University. School of Microelectronic Engineering, 2004. http://www4.gu.edu.au:8080/adt-root/public/adt-QGU20050115.101233.
Texto completoCheong, Kuan Yew. "Silicon Carbide as the Nonvolatile-Dynamic-Memory Material". Thesis, Griffith University, 2004. http://hdl.handle.net/10072/367177.
Texto completoThesis (PhD Doctorate)
Doctor of Philosophy (PhD)
School of Microelectronic Engineering
Faculty of Engineering and Information Technology
Full Text
Doppalapudi, Ranjeeth. "Design-for-manufacturability (DFM) for system-in-package (SiP) applications". Thesis, Atlanta, Ga. : Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/26701.
Texto completoCommittee Chair: Dr. Swaminathan, Madhavan; Committee Member: Dr. Chatterjee, Abhijit; Committee Member: Dr. Lim, Sungkyu. Part of the SMARTech Electronic Thesis and Dissertation Collection.
BAMIRO, OLUYINKA OLUGBENGA. "ANALYSIS OF THERMAL STRESS AND PLASTIC STRAIN IN STUDS/VIAS OF MULTILEVEL INTEGRATED CIRCUITS". University of Toledo / OhioLINK, 2004. http://rave.ohiolink.edu/etdc/view?acc_num=toledo1099778888.
Texto completoSuzuki, Takeharu y n/a. "Integrated, Intelligent Sensor Fabrication Strategies for Environmental Monitoring". Griffith University. School of Microelectronic Engineering, 2004. http://www4.gu.edu.au:8080/adt-root/public/adt-QGU20040813.131206.
Texto completoSuzuki, Takeharu. "Integrated, Intelligent Sensor Fabrication Strategies for Environmental Monitoring". Thesis, Griffith University, 2004. http://hdl.handle.net/10072/367295.
Texto completoThesis (PhD Doctorate)
Doctor of Philosophy (PhD)
School of Microelectronic Engineering
Full Text
Zubair, Muhammed 1962. "Aluminoborophosphosilicate glasses for microelectronics packaging". Thesis, The University of Arizona, 1991. http://hdl.handle.net/10150/277898.
Texto completoKarnaushenko, Daniil. "Shapeable microelectronics". Doctoral thesis, Universitätsbibliothek Chemnitz, 2016. http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-205489.
Texto completoHunt-Lowery, Alisa. "STATISTICAL ANALYSIS OF NOVEL DIELECTRIC MATERIALS FOR MICROELECTRONICS". NCSU, 2004. http://www.lib.ncsu.edu/theses/available/etd-09212004-100243/.
Texto completoTumne, Pushkraj Satish. "Investigation of bulk solder and intermetallic failures in PB free BGA by joint level testing". Diss., Online access via UMI:, 2009.
Buscar texto completoIncludes bibliographical references.
Cukalovic, Boris. "MIT integrated microelectronics device experimentation and simulation iLab". Thesis, Massachusetts Institute of Technology, 2006. http://hdl.handle.net/1721.1/36776.
Texto completoIncludes bibliographical references (p. 57-58).
We developed the MIT Integrated Microelectronics Device Experimentation and Simulation iLab, a new online laboratory that combines and significantly upgrades the capabilities of two existing online microelectronics labs: WebLab, a device characterization lab, and WebLabSim, a device simulation lab. The new integrated tool allows users to simultaneously run experiments on actual devices and simulations on the virtual ones, as well as to compare the results of the two. In order to achieve this, we considerably extended the capabilities of the original clients. We added the ability to graph the results of multiple experiments and simulations simultaneously, on top of each other, which allows for much easier comparison. We also added the ability to load, view and graph the results of experiments and simulations that were ran at any point in the past, even when the corresponding lab configurations are no longer available. Our hope is that this new integrated iLab will enrich microelectronics teaching and learning by allowing students to compare real life device behavior with theoretical expectations.
by Boris Cukalovic.
M.Eng.
Fukasaku, Kotaro. "Explorative study for stochastic failure analysis of a roughened bi-material interface: implementation of the size sensitivity based perturbation method". Thesis, Georgia Institute of Technology, 2011. http://hdl.handle.net/1853/41114.
Texto completoKornbluth, Yosef S. "Focused atmospheric-pressure microsputterer for additive manufacturing of microelectronics interconnects". Thesis, Massachusetts Institute of Technology, 2018. http://hdl.handle.net/1721.1/118707.
Texto completoCataloged from PDF version of thesis.
Includes bibliographical references (pages 45-49).
The past decade has seen a new manufacturing revolution, in the form of additive manufacturing. While recent additive manufacturing processes can produce structural materials in intricate shapes not previously possible, additive manufacturing of functional materials remains a challenge. In particular, functional electronics must still be made via traditional lithographic and etching processes. This thesis introduces a microsputtering method to directly write metals with high resolution. A wire feed enables continuous, extended use of the system. We motivate, simulate, and test a novel electrostatic focusing system to improve the resolution of the imprints; this focusing scheme combines electrostatic and fluid effects to direct the sputtered material into a strip as narrow as 9 pm. The microstructure of the deposits, which affects their conductivity, is also explored and modified. Using gold as printable feedstock, this technology allows for smooth (55 nm roughness) deposits with ~65X the electrical conductivity of bulk metal.
by Yosef S. Kornbluth.
S.M.
Chiniwalla, Punit Paresh. "Crosslinking of polynorbornene based dielectrics for application in microelectronics". Diss., Georgia Institute of Technology, 2001. http://hdl.handle.net/1853/11313.
Texto completoHeidelberger, Christopher. "GaAsP/InGaP heterojunction bipolar transistors for III-V on Si microelectronics". Thesis, Massachusetts Institute of Technology, 2017. http://hdl.handle.net/1721.1/113927.
Texto completoThis electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections.
Cataloged from student-submitted PDF version of thesis.
Includes bibliographical references (pages 129-140).
GaAs-based transistors are capable of operating at high frequency with low noise, and are produced in large volumes for a wide range of applications including microwave frequency ICs for input/output in mobile devices. However, Si CMOS still holds an advantage for digital logic due to wide market penetration resulting in decades of development and lower cost. Monolithic integration of III-V analog circuity and Si CMOS gives circuit designers the best of both materials. In addition, by substituting GaAsxP₁-x (0.8 < x < 1) for GaAs as an active material, we can take advantage of its higher breakdown voltage and reduced lattice mismatch with Si. In this thesis, we study GaAsP/InGaP heterojunction bipolar transistors (HBTs) grown via MOCVD as a test-bed for III-V microelectronics integration with Si. Epitaxial challenges involving growth of GaAsP/InGaP HBT structures on Si substrates were addressed. Heavy C p-type doping of GaAsP via MOCVD, necessary for the HBT base region, was studied. Growth rate, composition, and hole concentration dependence on C precursor (CBrCl₃) input was investigated, yielding GaAsP films with hole concentrations in excess of 2 x 10¹⁹ cm-³. GaAs₀₈₂₅P was grown on Si substrates via a SiGe graded buffer with a threading dislocation density of 3.7 x 106 cm-2 measured by PV-TEM and EBIC. This density is appropriate for fabrication of minority-carrier devices such as HBTs. GaAsP/InGaP HBTs were fabricated on both GaAs and Si substrates with a range of defect densities to measure the effect on DC performance and prove the feasibility of GaAsP transistor growth on Si. Models for the effect of threading dislocation density and misfit dislocation density (in the active device layers) on current gain were developed. A GaAsP/InGaP HBT grown on Si was demonstrated with a current gain as high as 158. Changes in GaAsxP₁-x composition from 0.825 < x < 1 did not have a significant effect on current gain. Collector current was determined not to be controlled by thermionic emission of electrons from the emitter into the base, contrary to prior reports. In addition, GaAsP was shown to support a higher breakdown voltage than GaAs, consistent with modeling.
by Christopher Heidelberger.
Ph. D.
Ardila, Ricardo. "Optimization of three-dimensional branching networks of microchannels for thermal management of microelectronics". FIU Digital Commons, 2009. http://digitalcommons.fiu.edu/etd/1295.
Texto completoLin, Yifung 1978. "A collaboration system and a graphical interface for the MIT Microelectronics WebLab". Thesis, Massachusetts Institute of Technology, 2002. http://hdl.handle.net/1721.1/87271.
Texto completoPharr, Matt Mathews. "Diffusion, Deformation, and Damage in Lithium-Ion Batteries and Microelectronics". Thesis, Harvard University, 2014. http://dissertations.umi.com/gsas.harvard:11593.
Texto completoEngineering and Applied Sciences
Williams, Gregory A. (Gregory Alan). "Optimization of kitting operations for an automated microelectronics assembly process". Thesis, Massachusetts Institute of Technology, 2006. http://hdl.handle.net/1721.1/34671.
Texto completoIncludes bibliographical references (p. [73]).
Raytheon's Solid-State Microwave (SSM) manufacturing area produces a low-volume, high mix assortment of Microwave Integrated Circuits (MIC) for airborne radars. The current kitting process for pick-and-place assembly is manually-intensive with significant die handling, resulting in multiple opportunities for damage and loss as well as accidental switching of near-identical components. These defects are difficult to detect and are often not discovered until the completed MICs are tested, by which time significant value has been added. The core of this project was to reduce kitting defects, total process cycle time and overall cost through reduction of "touch" labor and kit screenings. The establishment of customized die packaging requirements will result in the optimization of die packaging before the material is received into the storeroom. These new packaging requirements, in combination with the implementation of a point-of-use store for residual materials on the factory floor, enables in large part the elimination of the kitting process, resulting in significant reduction in handling and correlated reductions in lost or damaged parts and "wrong part" defects.
(cont.) This initiative was piloted on a single MIC line, but the solution was designed to be portable to other areas of SSM/SCM kitting operations. This thesis documents the process by which the new process was developed and piloted at Raytheon, as well as the organizational issues and barriers that made the project implementation challenging. In particular, successful implementation of the new processes will require a major shift in organizational thinking towards Total Cost of Ownership and greater cooperation across the boundary between the Solid-State Microwave and Supply Chain Management organizations.
by Gregory A. Williams.
M.B.A.
S.M.
Volland, Antoine. "Etude des effets d'échelle sur le comportement mécanique de film mince en verre métallique". Phd thesis, Université de Grenoble, 2012. http://tel.archives-ouvertes.fr/tel-00872887.
Texto completoChaube, Anay. "Self assembly of block copolymers : applicability in microelectronics and gains for patterned media". Thesis, Massachusetts Institute of Technology, 2008. http://hdl.handle.net/1721.1/45348.
Texto completoIncludes bibliographical references (leaves 88-93).
As device size decreases, conventional lithographic methods are finding it increasingly hard to keep up. Introduction of newer method such as E-beam, X-ray lithography etc. has demonstrated possibility of scaling to lower dimensions. However most of these methods are too expensive, too complex or too slow. Hence a method is required which can provide high resolutions at low cost, is easy to implement and can be integrated with current processing technologies. Block copolymer self assembly promises to do just that. An immiscible block copolymer will microphase separate into individual domains due to unfavorable mixing enthalpy. These microphase-separated blocks can have domain sizes of very low dimensions, to the order of 15-20 nms. By careful preparation, microphase-separated thin films of immiscible block copolymers can act as nanomasks for a variety of applications in electronic, optoelectronic and storage media fields. One such application is patterned media. With ever increasing areal densities, there is a limit to which the grain size within a bit can be decreased, for a conventional thin film media. Beyond a certain limit, which is dictated by the superparamagnetic effect, these grains will spontaneously reverse, resulting in undesired data loss. Patterned media has been proposed as an alternative to surpass this thermal instability criterion. In patterned media, lithographically defined nano-scale magnetic elements form single bits onto which the data is stored. Due to its unique structure in which each magnetic dots act as a single magnetic domain it can postpone the arrival of superparamagnetic effect beyond densities much higher than 10 Terabits/inch². However, very high resolutions and strict positioning control is required for its fabrication so as to attain a marketable 1Tb/inch² advantage.
(cont.) Block Copolymer self assembly holds great promise in fabrication of such devices requiring periodic, high resolution pattern generation. If issues such as long range order, pattern uniformity and placement accuracy of magnetic dots can be effectively resolved, block copolymer self assembly enabled lithography can quickly become the main stay of the multimillion dollar hard disk industry.
by Anay Chaube.
M.Eng.
Arora, Samarth. "Low Power Hybrid CMOS-NEMS for Microelectronics: Implementation in Implantable Pacemaker". Case Western Reserve University School of Graduate Studies / OhioLINK, 2011. http://rave.ohiolink.edu/etdc/view?acc_num=case1310676370.
Texto completoSmarra, Devin A. "Low Temperature Co-Fired Ceramic (LTCC) Substrate for High Temperature Microelectronics". University of Dayton / OhioLINK, 2017. http://rave.ohiolink.edu/etdc/view?acc_num=dayton1493386231571894.
Texto completoTavernier, Aurélien. "Développement d'un procédé innovant pour le remplissage des tranchées d'isolation entre transistors des technologies CMOS avancées". Phd thesis, Université de Grenoble, 2014. http://tel.archives-ouvertes.fr/tel-00987019.
Texto completoRivers, Norman. "An Investigation of BGA Electronic Packaging Moiré Interferometry". Scholar Commons, 2003. https://scholarcommons.usf.edu/etd/1459.
Texto completoTunuguntla, Sri Priyanka. "Numerical Study of Thermal Performance of Two-Layered Microchannel Heat Sink with Nanofluids For Cooling of Microelectronics". University of Cincinnati / OhioLINK, 2011. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1307442807.
Texto completoBaudry, Ingwild. "Caractérisation des process de fabrication microélectroniques pour l'éco-conception des futures technologies". Phd thesis, Université de Grenoble, 2013. http://tel.archives-ouvertes.fr/tel-00957329.
Texto completoHartzell, Brittany M. "DNA manipulation and characterization for nanoscale electronics". Ohio : Ohio University, 2004. http://www.ohiolink.edu/etd/view.cgi?ohiou1108051644.
Texto completoPye, Nathan. "Microfluidic control systems in deep etch optical lithography". Thesis, De Montfort University, 1999. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.391693.
Texto completoThornell, Mark E. "Sample fabrication and experimental design for studying interfacial creep at thin film/silicon interfaces". Thesis, Monterey, Calif. : Springfield, Va. : Naval Postgraduate School ; Available from National Technical Information Service, 2004. http://library.nps.navy.mil/uhtbin/hyperion/04Mar%5FThornell.pdf.
Texto completoSong, Ingu. "Role of carbon dioxide in gas expanded liquids for removal of photoresist and etch residue". Diss., Atlanta, Ga. : Georgia Institute of Technology, 2007. http://hdl.handle.net/1853/26473.
Texto completoCommittee Chair: Hess, Dennis; Committee Member: Eckert, Charles; Committee Member: Frazier, Bruno; Committee Member: Henderson, Clifford; Committee Member: Liotta, Charles. Part of the SMARTech Electronic Thesis and Dissertation Collection.
Peng, Der Liang y 彭德亮. "Computer Aided Concurrent Engineering: Microelectronic Product Application". Thesis, 1995. http://ndltd.ncl.edu.tw/handle/96841123349977660570.
Texto completo國立清華大學
工業工程研究所
83
Concurrent product and process development is a fundamental determinant with which the technology-based companies bring the product successfully to market and gain the sustaining competitive advantages. The actual adaptation and regular practice of such a development process, however, has been sparse despite the wide recognition of the need. Since one of the key function of the tool is to provide the ability to recast the sequential process to a concurrent process in a life cycle framework, which enable the planning , managing, and controlling the impact of upstream and downstream constraints; the generative models need to have the following features: descriptive, prescriptive, and executable.
Mohtar, Aaron. "A remote laboratory for testing microelectronic circuits on silicon wafers". 2009. http://arrow.unisa.edu.au/vital/access/manager/Repository/unisa:38670.
Texto completoPhDElectronicEngineering
Lum, Ivan. "Effects of Ultrasound in Microelectronic Ultrasonic Wire Bonding". Thesis, 2007. http://hdl.handle.net/10012/3439.
Texto completo