Libros sobre el tema "Microelectronic devices"

Yang, Edward S. Microelectronic devices. New York: McGraw-Hill, 1988.

Yang, Edward S. Microelectronic devices. New York: McGraw-Hill, 1988.

Microelectronic devices. 2^a ed. London: Imperial College Press, 1997.

Leaver, K. D. Microelectronic devices. Harlow, Essex, England: Longman Scientific & Technical, 1989.

Fonstad, Clifton G. Microelectronic devices and circuits. New York: McGraw-Hill, 1994.

Microelectronic circuits and devices. 2^a ed. London: Prentice Hall International, 1996.

Fonstad, Clifton. Microelectronic devices and circuits. Maidenhead: McGraw-Hill, 1994.

Microelectronic circuits and devices. 2^a ed. Englewood Cliffs, N.J: Prentice Hall, 1996.

1956-, Tarr N. Garry, ed. Introduction to microelectronic devices. Englewood Cliffs, N.J: Prentice Hall, 1989.

Pulfrey, David L. Introduction to microelectronic devices. Englewood Cliffs, N.J: Prentice-Hall International, 1989.

Horenstein, Mark N. Microelectronic circuits and devices. Englewood Cliffs, N.J: Prentice Hall, 1990.

Arunachalam, V. y K. Sivasankaran, eds. Microelectronic Devices, Circuits and Systems. Singapore: Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-16-5048-2.

Manzione, Louis T. Plastic packaging of microelectronic devices. New York: Van Nostrand Reinhold, 1990.

Arunachalam, V. y K. Sivasankaran, eds. Microelectronic Devices, Circuits and Systems. Cham: Springer Nature Switzerland, 2022. http://dx.doi.org/10.1007/978-3-031-23973-1.

Burrows, Susan Elizabeth. Silicone encapsulants for microelectronic devices. [s.l.]: typescript, 1995.

M, Grasserbauer y Werner H. W, eds. Analysis of Microelectronic Materials and Devices. Chichester: Wiley, 1994.

1945-, Grasserbauer M. y Werner H. W, eds. Analysis of microelectronic materials and devices. Chichester: Wiley, 1991.

Fleetwood, Daniel. Defects in microelectronic materials and devices. Boca Raton, FL: CRC Press, 2008.

C, Ling Hung, Niwa Koichi, Shukla Vishwa N, International Symposium on Materials for Optoelectronic and Microelectronic Packaging (1992 : San Francisco, Calif.) y International Ceramic Science and Technology Congress (3rd : 1992 : San Francisco, Calif.), eds. Materials in microelectronic and optoelectronic packaging. Westerville, Ohio: American Ceramic Society, 1993.

Reliability of electronic packages and semiconductor devices. New York: McGraw-Hill, 1997.

B, Courtois y Centre national de la recherche scientifique (France), eds. Design, test, integration, and packaging of MEMS/MOEMS 2002: 6-8 May, 2002, Cannes, France. Bellingham, Wash: SPIE, 2002.

Qin-Yi, Tong, Goesele Ulrich M, Society of Photo-optical Instrumentation Engineers., Dong nan da xue, China Optics & Optoelectronic Manufacturers Association., Zhongguo dian zi xue hui (Jiangsu Sheng, China) y Laser and Optical Engineering Society (Jiangsu Sheng, China), eds. Advances in microelectronic device technology: 7-9 November 2001, Nanjing, China. Bellingham, Wash: SPIE, 2001.

1939-, Lee S. H., ed. Selected papers on optical interconnects and packaging. Bellingham, Wash: SPIE Optical Engineering Press, 1997.

K, Das Nirod, Bertoni Henry L y International Symposium on Directions for the Next Generation of MMIC Devices and Systems (1996 : Brooklyn, New York, N.Y.), eds. Directions for the next generation of MMIC devices and systems. New York: Plenum Press, 1997.

G, Sabnis Anant y Society of Photo-optical Instrumentation Engineers., eds. Manufacturing process control for microelectronic devices and circuits: 20-21 October 1994, Austin, Texas. Bellingham, Wash: SPIE, 1994.

Fachtagung Schichtsysteme für Zukünftige Bauelemente der Mikro-, Opto-, Bioelektronik und Optik (2nd 1989? Technische Universität Karl-Marx-Stadt). 2. Fachtagung Schichtsysteme für Zukünftige Bauelemente der Mikro-, Opto-, Bioelektronik und Optik. Karl-Marx-Stadt: Technische Universität Karl-Marx-Stadt, 1989.

Wolfram, Scharff y Technische Universität Karl-Marx-Stadt, eds. Schichtsysteme für zukünftige Bauelemente der Mikro-, Opto- und Molekularelektronik: 1. Fachtagung, November 1986. Karl-Marx-Stadt: Technische Universität Karl-Marx-Stadt, 1987.

R, Feldman Michael y Society of Photo-optical Instrumentation Engineers., eds. Optoelectronic interconnects VII ; Photonics packaging and integration II: 24-26 January, 2000, San Jose, California. Bellingham, Washington: SPIE, 2000.

Conference on Optoelectronic and Microelectronic Materials and Devices (2000 Melbourne, Australia). COMMAD 2000: Conference on Optoelectronic and Microelectronic Materials and Devices : proceedings : Melbourne, Australia, 6-8 December, 2000. Editado por Broekman Leonard D, Usher Brian F, Riley John D y Institute of Electrical and Electronics Engineers. Piscataway, N.J: IEEE, 2000.

Conference on Optoelectronic and Microelectronic Materials and Devices (1998 Perth, Australia). 1998 Conference on Optoelectronic and Microelectronic Materials and Devices: Proceedings, 14-16 December 1998, Microelectronics Research Group, Department of Electrical and Electronic Engineering, The University of Western Australia, Perth, Western Australia. Editado por Faraone Lorenzo y Institute of Electrical and Electronics Engineers. [New York]: Institute of Electrical and Electronic Engineers, 1999.

Conference on Optoelectronic and Microelectronic Materials and Devices (1996 Canberra, Australia). 1996 Conference on Optoelectronic and Microelectronic Materials and Devices: Proceedings, 8-11 December 1996, Australian National University, Canberra, Australia. Editado por Jagadish C y Institute of Electrical and Electronics Engineers. New York: Institute of Electrical and Electronic Engineers, 1996.

MEMS/MOEMS packaging: Concepts, designs, metarials, and processes. New York: McGraw-Hill, 2005.

Keren, Bergman, Centre national de la recherche scientifique (France) y Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (5th : 2003 : Cannes, France), eds. Design, test, integration and packaging of MEMS/MOEMS 2003: DTIP 2003 : 5-7 May, 2003, Cannes, France. Piscataway, N.J: IEEE, 2003.

B, Courtois y Centre national de la recherche scientifique (France), eds. Design, test, integration and packaging of MEMS/MOEMS 2001: 25-27 April 2001, Cannes, France. Bellingham, Washington: SPIE, 2001.

E, Bailey Wayne, Motamedi M. Edward, Luo Fang-Chen, Semiconductor Equipment and Materials International., National Institute of Standards and Technology (U.S.) y Society of Photo-optical Instrumentation Engineers., eds. Microelectronic structures and microelectromechanical devices for optical processing and multimedia applications: 24 October, 1995, Austin, Texas. Bellingham, Wash: SPIE, 1995.

I, Baturone, ed. Microelectronic design of fuzzy logic-based systems. Boca Raton: CRC, 2000.

1950-, Mickelson Alan Rolf, Basavanhally N. R y Lee Yung-Cheng, eds. Optoelectronic packaging. New York: Wiley, 1997.

Wei mi na mi qi jian feng zhuang ji shu: Micro-Nanometer Devices Packaging Technology. Beijing: Guo fang gong ye chu ban she, 2012.

S, Mathad G., Nguyen Du B, Electrochemical Society. Dielectric Science and Technology Division. y Electrochemical Society Electronics Division, eds. Proceedings of the symposia on reliability of semiconductor devices/interconnections and dielectric breakdown, and laser process for microelectronic applications. Pennington, NJ: Electrochemical Society, 1992.

Xuping, Zhang, Zhongguo yi qi yi biao xue hui y SPIE (Society), eds. Microelectronic and optoelectronic devices and integration: 2008 International Conference on Optical Instruments and Technology : 16-19 November 2008, Beijing, China. Bellingham, Wash: SPIE, 2009.

R, Feldman Michael, Grote James Gerard 1955-, Hibbs-Brenner Mary K, Society of Photo-optical Instrumentation Engineers. y United States. Defense Advanced Research Projects Agency., eds. Optoelectronic integrated circuits and packaging III: 28-29 January, 1999, San Jose, California. Bellingham, Washington: SPIE, 1999.

T, Chen Ray, Hinton H. Scott y Society of Photo-optical Instrumentation Engineers., eds. Optoelectronic interconnects III: 8-9 February 1995, San Jose, California. Bellingham, Wash., USA: SPIE, 1995.

T, Chen Ray, Guilfoyle Peter S, Society of Photo-optical Instrumentation Engineers. y United States. Defense Advanced Research Projects Agency., eds. Optoelectronic interconnects and packaging IV: 12-14 February, 1997, San Jose, California. Bellingham, Washington: SPIE, 1997.

J, Dubowski J. y Society of Photo-optical Instrumentation Engineers., eds. Laser applications in microelectronic and optoelectronic manufacturing II: 10-12 February, 1997, San Jose, California. Bellingham, Washington: SPIE, 1997.

Pham, Anh-Vu H., Morgan J. Chen y Kunia Aihara. LCP for microwave packages and modules. Cambridge: Cambridge University Press, 2012.

Glebov, A. L. Photonics packaging, integration, and interconnects IX: 26-28 January 2009, San Jose, California, United States. Editado por SPIE (Society). Bellingham, Wash: SPIE, 2009.

Glebov, Alexei L. Photonics packaging, integration, and interconnects VIII: 22-24 January 2008, San Jose, California, USA. Editado por Society of Photo-optical Instrumentation Engineers. Bellingham, Wash: SPIE, 2008.

Leaver, Keith. Microelectronic Devices. PUBLISHED BY IMPERIAL COLLEGE PRESS AND DISTRIBUTED BY WORLD SCIENTIFIC PUBLISHING CO., 1997. http://dx.doi.org/10.1142/p011.

Nagchoudhuri, D. Microelectronic Devices. Prentice-Hall, 2002.

Leaver, Keith. Microelectronic Devices. Allied Publishers Pvt. Ltd., 2003.