Artículos de revistas sobre el tema "MICRO-BONDING"
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Kim, Joo-Han y Chul-Ku Lee. "Laser Micro Bonding Technology". Journal of the Korean Welding and Joining Society 25, n.º 2 (30 de abril de 2007): 1–2. http://dx.doi.org/10.5781/kwjs.2007.25.2.001.
Texto completoGu, Yao Xin y Hong Chao Qiao. "Study on the Manufacturing Process of Polymer Microfluidic Chip with Integrated Cu Micro Array Electrode". Applied Mechanics and Materials 723 (enero de 2015): 884–87. http://dx.doi.org/10.4028/www.scientific.net/amm.723.884.
Texto completoShoda, Koki, Minori Tanaka, Kensuke Mino y Yutaka Kazoe. "A Simple Low-Temperature Glass Bonding Process with Surface Activation by Oxygen Plasma for Micro/Nanofluidic Devices". Micromachines 11, n.º 9 (25 de agosto de 2020): 804. http://dx.doi.org/10.3390/mi11090804.
Texto completoOhashi, Osamu, Miho Narui, Kensaku Aihara, Kazutoshi Harada, Masaki Hosaka, Hajime Inagaki y Osamu Tsuya. "Ancient Micro Bonding of Gold; Granulation". Materia Japan 55, n.º 10 (2016): 468–74. http://dx.doi.org/10.2320/materia.55.468.
Texto completoYang Mengsheng, 杨蒙生, 邢丕峰 Xing Pifeng, 郑凤成 Zheng Fengcheng, 谢军 Xie Jun, 刘学 Liu Xue, 马小军 Ma Xiaojun y 易泰民 Yi Taimin. "Precise bonding of Cu micro-sphere". High Power Laser and Particle Beams 26, n.º 5 (2014): 52008. http://dx.doi.org/10.3788/hplpb20142605.52008.
Texto completoSHI Ya-li, 史亚莉, 张文生 ZHANG Wen-sheng, 徐德 XU De, 张正涛 ZHANG Zheng-tao y 张娟 ZHANG Juan. "Time/pressure pL micro-bonding technology". Optics and Precision Engineering 19, n.º 11 (2011): 2724–30. http://dx.doi.org/10.3788/ope.20111911.2724.
Texto completoMehlmann, Benjamin, Elmar Gehlen, Alexander Olowinsky y Arnold Gillner. "Laser Micro Welding for Ribbon Bonding". Physics Procedia 56 (2014): 776–81. http://dx.doi.org/10.1016/j.phpro.2014.08.085.
Texto completoBöhm, S., K. Dilger, J. Hesselbach, J. Wrege, S. Rathmann, W. Ma, E. Stammen y G. Hemken. "Micro bonding with non-viscous adhesives". Microsystem Technologies 12, n.º 7 (7 de febrero de 2006): 676–79. http://dx.doi.org/10.1007/s00542-006-0101-7.
Texto completoWang, Chun Yu, Qing Wang, Han Zhu Li, Xiao Zhi Ji y Zhi Long Kang. "Optimized Wire Bonding Process on Micro-Connection Pad with Ni/CeO2 Coatings". Applied Mechanics and Materials 275-277 (enero de 2013): 1925–28. http://dx.doi.org/10.4028/www.scientific.net/amm.275-277.1925.
Texto completoYang, Jun Ru, Kun Guo, Yu Rong Chi, Xue Cheng Chen y Hai Tao Feng. "Molecular Dynamics Simulation of the Propagation Property of the Interface Micro Crack in Ternary Boride Hard Cladding Material". Materials Science Forum 861 (julio de 2016): 264–69. http://dx.doi.org/10.4028/www.scientific.net/msf.861.264.
Texto completoKim, Joo Han, Hyang Tae Kim y Chul Ku Lee. "UV Laser Bonding of Optical Devices on Polymers". Materials Science Forum 580-582 (junio de 2008): 459–62. http://dx.doi.org/10.4028/www.scientific.net/msf.580-582.459.
Texto completoZhang, Zong Bo, Qing Qiang He y Cao Qing Yan. "Non-Melt Ultrasonic Bonding Method for Polymer MEMS Devices". Applied Mechanics and Materials 607 (julio de 2014): 133–38. http://dx.doi.org/10.4028/www.scientific.net/amm.607.133.
Texto completoWang, Xuelei, Mao Ye, Fei Lu, Yunkai Mao, Hao Tian y Jianli Li. "Recent Progress on Micro-Fabricated Alkali Metal Vapor Cells". Biosensors 12, n.º 3 (6 de marzo de 2022): 165. http://dx.doi.org/10.3390/bios12030165.
Texto completoBi, Gui Jun, Sum Huan Ng, Khin Thet May y Cong Zhi Chan. "Micro-Laser Welding of Plastics for the Applications in Micro-Fluidic Devices". Key Engineering Materials 447-448 (septiembre de 2010): 745–49. http://dx.doi.org/10.4028/www.scientific.net/kem.447-448.745.
Texto completoLiu, Hang, Yan Xu, Kai Leung Yung y Chun Lei Kang. "The Interface Behavior of Micro Overmolding". Advanced Materials Research 591-593 (noviembre de 2012): 896–99. http://dx.doi.org/10.4028/www.scientific.net/amr.591-593.896.
Texto completoMIURA, Kazuma y Koii SERIZAWA. "Micro-Metal Bonding Technology for LSI Package". Journal of the Society of Materials Science, Japan 50, n.º 6Appendix (2001): 127–31. http://dx.doi.org/10.2472/jsms.50.6appendix_127.
Texto completoYasuda, Kiyokazu. "Ultrasonic Bonding Technology for Micro System Integration". Journal of The Japan Institute of Electronics Packaging 22, n.º 5 (1 de agosto de 2019): 395–99. http://dx.doi.org/10.5104/jiep.22.395.
Texto completoThomas, S. y H. Berg. "Micro-Corrosion of Al-Cu Bonding Pads". IEEE Transactions on Components, Hybrids, and Manufacturing Technology 10, n.º 2 (junio de 1987): 252–57. http://dx.doi.org/10.1109/tchmt.1987.1134741.
Texto completoMIZUNO, Jun, Katsuyuki SAKUMA, Masatsugu NIMURA, Fumihiro WAKAI y Shuichi SHOJI. "Thermo-compression Micro Bonding Technology Using Au". Journal of the Japan Society for Precision Engineering 79, n.º 8 (2013): 714–18. http://dx.doi.org/10.2493/jjspe.79.714.
Texto completoHofmann, Christian, Maulik Satwara, Martin Kroll, Sushant Panhale, Patrick Rochala, Maik Wiemer, Karla Hiller y Harald Kuhn. "Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized Coils". Micromachines 13, n.º 8 (12 de agosto de 2022): 1307. http://dx.doi.org/10.3390/mi13081307.
Texto completoNaito, Makio, Hiroya Abe y Kazuyoshi Sato. "Nanoparticle Bonding Technology for Composite Materials". Advances in Science and Technology 45 (octubre de 2006): 1704–10. http://dx.doi.org/10.4028/www.scientific.net/ast.45.1704.
Texto completoYoshida, Yoshinori, Takashi Ishikawa y Tomoaki Suganuma. "Mechanism of Forming Joining on Backward Extrusion Forged Bonding Process". Advanced Materials Research 966-967 (junio de 2014): 461–70. http://dx.doi.org/10.4028/www.scientific.net/amr.966-967.461.
Texto completoKim, Uk-Su, Seung-Sik Shin, Ki-Gwon Kim, Ba-Wi Jeong y Jeong-Woo Park. "Bonding properties on diffusion bonding layer for micro PCD-WC tool fabrication". Journal of Mechanical Science and Technology 33, n.º 8 (agosto de 2019): 3749–54. http://dx.doi.org/10.1007/s12206-019-0717-z.
Texto completoYe, Yiyun, Qi Zou, Yinan Xiao, Junke Jiao, Beining Du, Yuezhan Liu y Liyuan Sheng. "Effect of Interface Pretreatment of Al Alloy on Bonding Strength of the Laser Joined Al/CFRTP Butt Joint". Micromachines 12, n.º 2 (11 de febrero de 2021): 179. http://dx.doi.org/10.3390/mi12020179.
Texto completoLong, Zhi Li, Lu Fan Zhang y Jian Guo Zhang. "FEM Design and Experiment of a Micro-Gripper Based on Piezoelectric Material". Advanced Materials Research 479-481 (febrero de 2012): 434–38. http://dx.doi.org/10.4028/www.scientific.net/amr.479-481.434.
Texto completoLecarpentier, Gilbert y Joeri De Vos. "Die to Die and Die To Wafer Bonding Solution for High Density, Fine Pitch Micro-Bumped Die". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (1 de enero de 2012): 002251–84. http://dx.doi.org/10.4071/2012dpc-tha15.
Texto completoSun, Yibo, Yi Luo y Xiaodong Wang. "Micro energy director array in ultrasonic precise bonding for thermoplastic micro assembly". Journal of Materials Processing Technology 212, n.º 6 (junio de 2012): 1331–37. http://dx.doi.org/10.1016/j.jmatprotec.2012.01.013.
Texto completoZhang, Wei Xiang y Shuang Min Du. "Investigation into Cu-Interlayered Diffusion Bonding Trial of AZ31B Alloy". Advanced Materials Research 631-632 (enero de 2013): 167–71. http://dx.doi.org/10.4028/www.scientific.net/amr.631-632.167.
Texto completoBai, S. L., C. M. L. Wu, Y. W. Mai, H. M. Zeng y R. K. Y. Li. "Failure Mechanisms of Sisal Fibres in Composites". Advanced Composites Letters 8, n.º 1 (enero de 1999): 096369359900800. http://dx.doi.org/10.1177/096369359900800102.
Texto completoMurayama, Kei, Mitsuhiro Aizawa y Mitsutoshi Higashi. "TLP Bonding Technologies for Micro Joining and 3D Packaging". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, DPC (1 de enero de 2010): 001221–52. http://dx.doi.org/10.4071/2010dpc-wa12.
Texto completoLuo, Yi, Sheng Qiang He, Liang Jiang Wang y Zong Bo Zhang. "Study on Ultrasonic Fusion Bonding for Polymer Microfluidic Chips". Key Engineering Materials 483 (junio de 2011): 311–15. http://dx.doi.org/10.4028/www.scientific.net/kem.483.311.
Texto completoSun, Yibo, Yuqi Feng, Pengfei Hu, Xing Zhao, Xinhua Yang y Guoxiong Wu. "Online visual monitoring and ultrasonic feedback detection in the ultrasonic precision bonding of polymers". Advanced Composites Letters 29 (1 de enero de 2020): 2633366X2093258. http://dx.doi.org/10.1177/2633366x20932584.
Texto completoWang, Ying Hao, Xian Sheng Qi, Xian Lin Meng, Wen Bin Li, Chuan Yun Wang, Hong Chao Kou y Jin Shan Li. "The Influence of Initial Microstructures on the Diffusion Bonding Interface of High Nb Containing TiAl Alloy". Advanced Materials Research 753-755 (agosto de 2013): 396–401. http://dx.doi.org/10.4028/www.scientific.net/amr.753-755.396.
Texto completoJang, Woong Ki, Yoo Su Kang, Young Ho Seo y Byeong Hee Kim. "The manufacturing of a surface anchor structure for the electroless plating of a three-dimensional antenna integrated with a mobile device case". Advances in Mechanical Engineering 12, n.º 9 (septiembre de 2020): 168781402095857. http://dx.doi.org/10.1177/1687814020958576.
Texto completoSHI Ya-li, 史亚莉, 李福东 LI Fu-dong, 杨鑫 YANG Xin, 张正涛 ZHANG Zheng-tao y 徐德 XU De. "pL class adhesive dispensing approach for micro bonding". Optics and Precision Engineering 20, n.º 12 (2012): 2744–50. http://dx.doi.org/10.3788/ope.20122012.2744.
Texto completoIto, Takeshi, Kazuharu Sobue y Seishiro Ohya. "Water glass bonding for micro-total analysis system". Sensors and Actuators B: Chemical 81, n.º 2-3 (enero de 2002): 187–95. http://dx.doi.org/10.1016/s0925-4005(01)00951-0.
Texto completoIshii, Takao y Shinji Aoyama. "Novel micro-bump fabrication for flip-chip bonding". Journal of Electronic Materials 33, n.º 11 (noviembre de 2004): L21—L23. http://dx.doi.org/10.1007/s11664-004-0172-0.
Texto completoYin, Zhifu y Helin Zou. "Experimental and Numerical Study on PDMS Collapse for Fabrication of Micro/Nanochannels". Journal of Electrical Engineering 67, n.º 6 (1 de diciembre de 2016): 414–20. http://dx.doi.org/10.1515/jee-2016-0060.
Texto completoHwang, Yeong-Maw, Cheng-Tang Pan, Bo-Syun Chen y Sheng-Rui Jian. "Numerical Analysis of the Welding Behaviors in Micro-Copper Bumps". Metals 11, n.º 3 (11 de marzo de 2021): 460. http://dx.doi.org/10.3390/met11030460.
Texto completoZhang, Lu, Wendong Zhang, Shougang Zhang y Shubin Yan. "Micro-fabrication and hermeticity measurement of alkali-atom vapor cells based on anodic bonding". Chinese Optics Letters 17, n.º 10 (2019): 100201. http://dx.doi.org/10.3788/col201917.100201.
Texto completoZhu, Fu Dong y Bi Yun Zhu. "Research on Laser-Hybrid Cladding of Ni-Cr Alloy on Copper". Key Engineering Materials 744 (julio de 2017): 270–74. http://dx.doi.org/10.4028/www.scientific.net/kem.744.270.
Texto completoSun, Yi Bo, Yi Luo, Xiao Dong Wang y Yu Qi Feng. "Molecular Dynamics Simulation of Diffusion Behavior for Thermalplastic Fusion Bonding". Advanced Materials Research 217-218 (marzo de 2011): 45–50. http://dx.doi.org/10.4028/www.scientific.net/amr.217-218.45.
Texto completoZhang, Chen, Dongbin Zhang, Can Luo, Weiping Peng y Xusheng Zang. "Nanosecond-Pulse Laser Assisted Cold Spraying of Al–Cu Aluminum Alloy". Coatings 11, n.º 3 (25 de febrero de 2021): 267. http://dx.doi.org/10.3390/coatings11030267.
Texto completoKUMAGAI, Koichi, Akira KABESHITA y Osamu YAMAZAKI. "Micro-Interconnection Technology. Production Engineering of Micro Connections in Stud-Bump-Bonding Packaging." Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits 10, n.º 6 (1995): 368–72. http://dx.doi.org/10.5104/jiep1995.10.368.
Texto completoKageyama, Syotaro, Yuichi Nakazato y Sugiya satou. "317 Study on Manipulation in Micro Region and Micro-bonding Under Vacuum Enviroment". Proceedings of the JSME annual meeting 2008.8 (2008): 33–34. http://dx.doi.org/10.1299/jsmemecjo.2008.8.0_33.
Texto completoChandrappa, Kasigavi y Joel Hemanth. "Optimization of Process Parameters of Diffusing Bonding of Titanium with Titanium and Titanium with Copper". Advanced Materials Research 856 (diciembre de 2013): 153–58. http://dx.doi.org/10.4028/www.scientific.net/amr.856.153.
Texto completoJiang, Zheng Yi, Mahadi Hasam, Hamidreza Kamali, Fang Hui Jia y Hai Bo Xie. "Micromanufacturing Technology and its Practice". Solid State Phenomena 311 (octubre de 2020): 12–20. http://dx.doi.org/10.4028/www.scientific.net/ssp.311.12.
Texto completoWANG, Tao, Jian CAI, Qian WANG, Hao ZHANG y Zheyao WANG. "Design and Fabrication of WLP Compatible Miniaturized Pressure Sensor System with Through Silicon Via (TSV) Interconnects". International Symposium on Microelectronics 2011, n.º 1 (1 de enero de 2011): 000033–43. http://dx.doi.org/10.4071/isom-2011-ta1-paper5.
Texto completoZhang, Qingdong, Shuo Li, Rui Li y Boyang Zhang. "Multiscale Comparison Study of Void Closure Law and Mechanism in the Bimetal Roll-Bonding Process". Metals 9, n.º 3 (18 de marzo de 2019): 343. http://dx.doi.org/10.3390/met9030343.
Texto completoStoleriu, Simona, Sorin Andrian, Irina Nica, Andrei Victor Sandu, Galina Pancu, Alice Murariu y Gianina Iovan. "Evaluation of Adhesive Capacity of Universal Bonding Agents Used in Direct Composite Resins Repair". Materiale Plastice 54, n.º 3 (30 de septiembre de 2017): 574–77. http://dx.doi.org/10.37358/mp.17.3.4899.
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