Artículos de revistas sobre el tema "Long-term electrical reliability"
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Xie, Jingsong, Ming Sun, Michael Pecht y David F. Barbe. "Why Gold Flash Can Be Detrimental to Long-Term Reliability". Journal of Electronic Packaging 126, n.º 1 (1 de marzo de 2004): 37–40. http://dx.doi.org/10.1115/1.1646425.
Texto completoLenner, Miklos, Andreas Frank, Lin Yang, Tomas Mikael Roininen y Klaus Bohnert. "Long-Term Reliability of Fiber-Optic Current Sensors". IEEE Sensors Journal 20, n.º 2 (15 de enero de 2020): 823–32. http://dx.doi.org/10.1109/jsen.2019.2944346.
Texto completoPeterson, D. K., M. L. Nochomovitz, T. A. Stellato y J. T. Mortimer. "Long-term intramuscular electrical activation of the phrenic nerve: safety and reliability". IEEE Transactions on Biomedical Engineering 41, n.º 12 (1994): 1115–26. http://dx.doi.org/10.1109/10.335860.
Texto completoMiyake, Takuma, Yoshihiro Arata, Tatsuya Sakoda, Masahisa Otsubo, Yasufumi Sonoda y Hiroshi Yamaguchi. "Assessing Long-term Reliability of Polymeric Housing Materials". IEEJ Transactions on Power and Energy 131, n.º 6 (2011): 530–31. http://dx.doi.org/10.1541/ieejpes.131.530.
Texto completoPlumbridge, W. J. "Long term mechanical reliability with lead‐free solders". Soldering & Surface Mount Technology 16, n.º 2 (agosto de 2004): 13–20. http://dx.doi.org/10.1108/09540910410537291.
Texto completoKim, Bal-Ho H. "A Study on Reliability Differentiated Pricing of Long-Term Transactions". Journal of Electrical Engineering and Technology 6, n.º 1 (1 de enero de 2011): 8–13. http://dx.doi.org/10.5370/jeet.2011.6.1.008.
Texto completoGolovanov, Igor', Pavel Maslihov, Uulu Turatbek y Natal'ya Bel'dyagina. "STUDY OF THE RELIABILITY OF ELECTRICAL EQUIPMENT OF THE ELECTRICAL POWER SUPPLY SYSTEM, HAVING A LARGE PERIOD OF WORKING". Bulletin of the Angarsk State Technical University 1, n.º 12 (18 de diciembre de 2018): 29–31. http://dx.doi.org/10.36629/2686-777x-2018-1-12-29-31.
Texto completoPecht, Judy, Michael Pecht y Anthony J. Rafanelli. "Long-Term Non-Operating Reliability of Electronic Products". Journal of Electronic Packaging 119, n.º 2 (1 de junio de 1997): 145–46. http://dx.doi.org/10.1115/1.2792222.
Texto completoMatsumoto, Michito, Tadashi Haibara, Yutaka Katsuyama, Masamitsu Tokuda, Tadatoshi Tanifuji, Regular Members y Mitsuru Miyauchi, Regular Member. "Long-term reliability assurance for arc-fusion spliced fiber". Electronics and Communications in Japan (Part I: Communications) 68, n.º 2 (febrero de 1985): 73–81. http://dx.doi.org/10.1002/ecja.4410680210.
Texto completoKaga, T. y T. Hagiwara. "Short- and long-term reliability of nitrided oxide MISFETs". IEEE Transactions on Electron Devices 35, n.º 7 (julio de 1988): 929–34. http://dx.doi.org/10.1109/16.3347.
Texto completoHSU, YEN-TSENG y CHEN-FA HSU. "Evaluation of reliability and safety of long-term unmaintained computer systems". International Journal of Electronics 70, n.º 2 (febrero de 1991): 389–405. http://dx.doi.org/10.1080/00207219108921287.
Texto completoBamba, Satoshi, Kuniaki Yabe, Tomomichi Seki y Tetsuji Shibaya. "An Investment Level Decision Method to Secure Long-term Reliability". IEEJ Transactions on Power and Energy 128, n.º 1 (2008): 329–34. http://dx.doi.org/10.1541/ieejpes.128.329.
Texto completoEngelmaier, W. "Surface Mount Solder Joint Long‐term Reliability: Design, Testing, Prediction". Soldering & Surface Mount Technology 1, n.º 1 (enero de 1989): 14–22. http://dx.doi.org/10.1108/eb037660.
Texto completoSeltzer, C. P., R. Studd, M. J. Harlow, P. C. Spurdens y S. D. Perrin. "Long-term reliability of strain-compensated InGaAs(P)/InP MQW BH lasers". Electronics Letters 30, n.º 3 (3 de febrero de 1994): 227–29. http://dx.doi.org/10.1049/el:19940150.
Texto completoKoyano, Yasushi, Motoki Kakui, Tomonori Kashiwada, Masashi Onishi, Masayuki Shigematsu, Hiroo Kanamori y Masayuki Nishimura. "Long-term reliability of Er-doped fibers in hydrogen environments". Electronics and Communications in Japan (Part II: Electronics) 79, n.º 1 (1996): 33–42. http://dx.doi.org/10.1002/ecjb.4420790104.
Texto completoWasif, Rukhshinda, Mohammad Osman Tokhi, John Rudlin, Gholamhossein Shirkoohi y Fang Duan. "Reliability Improvement of Magnetic Corrosion Monitor for Long-Term Applications". Sensors 23, n.º 4 (16 de febrero de 2023): 2212. http://dx.doi.org/10.3390/s23042212.
Texto completoDong, Xian Ping, Bo Zhang y Jian Sheng Wu. "Optical-Electrical Properties and Corrosion Behavior of Tantalum-Doped Indium Tin Oxide Films Deposited by Magnetron Sputtering". Materials Science Forum 638-642 (enero de 2010): 2897–902. http://dx.doi.org/10.4028/www.scientific.net/msf.638-642.2897.
Texto completoAhn, Jeong y Kim. "Emerging Encapsulation Technologies for Long-Term Reliability of Microfabricated Implantable Devices". Micromachines 10, n.º 8 (31 de julio de 2019): 508. http://dx.doi.org/10.3390/mi10080508.
Texto completoOleinikova, I., Z. Krishans y A. Mutule. "Basic Principles of Electrical Network Reliability Optimization in Liberalised Electricity Market". Latvian Journal of Physics and Technical Sciences 45, n.º 4 (1 de enero de 2008): 3–13. http://dx.doi.org/10.2478/v10047-008-0015-5.
Texto completoFlicker, Jack, Govindasamy Tamizhmani, Mathan Kumar Moorthy, Ramanathan Thiagarajan y Raja Ayyanar. "Accelerated Testing of Module-Level Power Electronics for Long-Term Reliability". IEEE Journal of Photovoltaics 7, n.º 1 (enero de 2017): 259–67. http://dx.doi.org/10.1109/jphotov.2016.2621339.
Texto completoFischer, Th, A. Olbrich, G. Georgakos, B. Lemaitre y D. Schmitt-Landsiedel. "Impact of process variations and long term degradation on 6T-SRAM cells". Advances in Radio Science 5 (13 de junio de 2007): 321–25. http://dx.doi.org/10.5194/ars-5-321-2007.
Texto completoPatil, Nishad, Diganta Das, Estelle Scanff y Michael Pecht. "Long term storage reliability of antifuse field programmable gate arrays". Microelectronics Reliability 53, n.º 12 (diciembre de 2013): 2052–56. http://dx.doi.org/10.1016/j.microrel.2013.06.016.
Texto completoWu, Chenyang, Junqiang Wang, Xiaofei Liu, Mengwei Li, Zehua Zhu y Yue Qi. "Au Wire Ball Welding and Its Reliability Test for High-Temperature Environment". Micromachines 13, n.º 10 (27 de septiembre de 2022): 1603. http://dx.doi.org/10.3390/mi13101603.
Texto completoAraki, Noritoshi, Motoki Eto, Takumi Ohkabe, Teruo Haibara, Takashi Yamada, Tetsuya Oyamada y Tomohiro Uno. "High bond reliability of newly developed silver alloy bonding wire". International Symposium on Microelectronics 2019, n.º 1 (1 de octubre de 2019): 000524–29. http://dx.doi.org/10.4071/2380-4505-2019.1.000524.
Texto completoKumar, Rakesh. "A High Temperature and UV Stable Vapor Phase Polymer for Electronics Applications". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, HITEN (1 de enero de 2011): 000207–14. http://dx.doi.org/10.4071/hiten-paper3-rkumar.
Texto completoYotto, Habib Conrad Sotiman, Patrice Chetangny, Victor Zogbochi, Jacques Aredjodoun, Sossou Houndedako, Gerald Barbier, Antoine Vianou y Didier Chamagne. "Long-Term Electricity Load Forecasting Using Artificial Neural Network: The Case Study of Benin". Advanced Engineering Forum 48 (10 de enero de 2023): 117–36. http://dx.doi.org/10.4028/p-zq4id8.
Texto completoAbumohsen, Mobarak, Amani Yousef Owda y Majdi Owda. "Electrical Load Forecasting Using LSTM, GRU, and RNN Algorithms". Energies 16, n.º 5 (27 de febrero de 2023): 2283. http://dx.doi.org/10.3390/en16052283.
Texto completoChen, B. L., X. Q. Shi, G. Y. Li, K. H. Ang y Jason P. Pickering. "Rapid Temperature Cycling (RTC) Methodology for Reliability Assessment of Solder Interconnection in Tape Ball Grid Array (TBGA) Assembly". Journal of Electronic Packaging 127, n.º 4 (24 de febrero de 2005): 466–73. http://dx.doi.org/10.1115/1.2056574.
Texto completoJÓŹWIAK, IRENEUSZ, MAKSYMILIAN KOWALCZYK y ANDRZEJ PIOTROWICZ. "REFACTORIZATION'S IMPACT ON SOFTWARE RELIABILITY". International Journal of Reliability, Quality and Safety Engineering 13, n.º 01 (febrero de 2006): 47–60. http://dx.doi.org/10.1142/s0218539306002136.
Texto completoMadrakhimov, Daniyar Bakhtiyarovich, Vera Pavlovna Ivanova y Victoria Vyacheslavovna Tsypkina. "Improving the reliability of cable lines operation in hot climates". E3S Web of Conferences 216 (2020): 01151. http://dx.doi.org/10.1051/e3sconf/202021601151.
Texto completoShenai, Krishna, Philip G. Neudeck, M. Dudley y Robert F. Davis. "Material Defects and Rugged Electrical Power Switching in Semiconductors". Materials Science Forum 717-720 (mayo de 2012): 1077–80. http://dx.doi.org/10.4028/www.scientific.net/msf.717-720.1077.
Texto completoKumar, Rakesh. "Parylene HT®: A High Temperature Vapor Phase Polymer for Electronics Applications". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, HITEC (1 de enero de 2010): 000108–13. http://dx.doi.org/10.4071/hitec-rkumar-tp13.
Texto completoCrosson, A., L. Escotte, M. Bafleur, D. Talbourdet, L. Crétinon, P. Perdu y G. Perez. "Long-term reliability of silicon bipolar transistors subjected to low constraints". Microelectronics Reliability 47, n.º 9-11 (septiembre de 2007): 1590–94. http://dx.doi.org/10.1016/j.microrel.2007.07.057.
Texto completoTanaka, Yo, Shinnosuke Soda, Takahito Fushimi, Tomoki Matsuda, Tomokazu Sano y Akio Hirose. "Study on Improvement of the Initial and Long-Term Reliability in Ultrasonically Bonded Copper Joints". Journal of The Japan Institute of Electronics Packaging 23, n.º 2 (1 de marzo de 2020): 166–72. http://dx.doi.org/10.5104/jiep.23.166.
Texto completoMuneer, Amgad, Rao Faizan Ali, Ahmed Almaghthawi, Shakirah Mohd Taib, Amal Alghamdi y Ebrahim Abdulwasea Abdullah Ghaleb. "Short term residential load forecasting using long short-term memory recurrent neural network". International Journal of Electrical and Computer Engineering (IJECE) 12, n.º 5 (1 de octubre de 2022): 5589. http://dx.doi.org/10.11591/ijece.v12i5.pp5589-5599.
Texto completoGordina, Anastasiya, Aleksandr Gumenyuk, Irina Polyanskikh, Grigorij Yakovlev y Vít Černý. "Effect of Electrochemical Corrosion on the Properties of Modified Concrete". Construction Materials 3, n.º 2 (25 de abril de 2023): 202–16. http://dx.doi.org/10.3390/constrmater3020013.
Texto completoSchumm, Andreas, Madalina Rabung, Gregory Marque y Jary Hamalainen. "Reactor performance, system reliability, instrumentation and control". EPJ Nuclear Sciences & Technologies 6 (2020): 43. http://dx.doi.org/10.1051/epjn/2019017.
Texto completoBorovikov, S. M., E. N. Shneiderov, A. I. Berasnevich y V. O. Kaziuchyts. "Individual forecasting of reliability of bipolar transistors by using electrical voltage as a simulation factor". Doklady BGUIR 18, n.º 5 (2 de septiembre de 2020): 80–88. http://dx.doi.org/10.35596/1729-7648-2020-18-5-80-88.
Texto completoNASIROV, Shamsi. "Analysis of Innovative Methods for Ensuring Operational Reliability and Safety Used in the Energy Systems of Azerbaijan". Eurasia Proceedings of Science Technology Engineering and Mathematics 20 (21 de diciembre de 2022): 155–60. http://dx.doi.org/10.55549/epstem.1222691.
Texto completoNeumaier, Lukas, Gabriele C. Eder, Yuliya Voronko, Karl A. Berger, Gusztáv Újvári y Karl Knöbl. "Advanced UV-fluorescence image analysis for early detection of PV-power degradation". EPJ Photovoltaics 14 (2023): 9. http://dx.doi.org/10.1051/epjpv/2023001.
Texto completoQiao, Li, Hui Huang Yang y Jian Feng Sheng. "Comparison Study on Friction-Welded Cu-Al Material and Pure Cu/Al". Materials Science Forum 817 (abril de 2015): 374–78. http://dx.doi.org/10.4028/www.scientific.net/msf.817.374.
Texto completoKumar, Rakesh. "A high temperature nano/micro vapor phase conformal coating for electronics applications". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, HiTEN (1 de enero de 2015): 000083–90. http://dx.doi.org/10.4071/hiten-session3a-paper3a_1.
Texto completoAndersson, Johan, Ulf H. Nilsson, Susanne Nilsson, Hedvig Pollak y Nilena Nilsson. "Influence of Field Grading in Setup for Electric Breakdown Testing of Polyethylene Films". Proceedings of the Nordic Insulation Symposium, n.º 26 (8 de agosto de 2019): 47–51. http://dx.doi.org/10.5324/nordis.v0i26.3277.
Texto completoDeng, Yang, Aiqun Li y Dongming Feng. "Fatigue Reliability Assessment for Orthotropic Steel Decks Based on Long-Term Strain Monitoring". Sensors 18, n.º 2 (10 de enero de 2018): 181. http://dx.doi.org/10.3390/s18010181.
Texto completoChoi, B. K., D. M. Fleetwood, R. D. Schrimpf, L. W. Massengill, K. F. Galloway, M. R. Shaneyfelt, T. L. Meisenheimer et al. "Long-term reliability degradation of ultrathin dielectric films due to heavy-ion irradiation". IEEE Transactions on Nuclear Science 49, n.º 6 (diciembre de 2002): 3045–50. http://dx.doi.org/10.1109/tns.2002.805389.
Texto completoSi, Wujun, Yunfei Shao y Wei Wei. "Accelerated Degradation Testing With Long-Term Memory Effects". IEEE Transactions on Reliability 69, n.º 4 (diciembre de 2020): 1254–66. http://dx.doi.org/10.1109/tr.2020.2997404.
Texto completoFukuda, Kenji, Akimasa Kinoshita, Takasumi Ohyanagi, Ryouji Kosugi, T. Sakata, Y. Sakuma, Junji Senzaki et al. "Influence of Processing and of Material Defects on the Electrical Characteristics of SiC-SBDs and SiC-MOSFETs". Materials Science Forum 645-648 (abril de 2010): 655–60. http://dx.doi.org/10.4028/www.scientific.net/msf.645-648.655.
Texto completoAli, Adel Ahmed. "Reliability analysis of millimeter wave propagation based on long term rain data in Riyadh". International Journal of Infrared and Millimeter Waves 7, n.º 3 (marzo de 1986): 339–56. http://dx.doi.org/10.1007/bf01010852.
Texto completoAli, Adel Ahmed. "Reliability analysis of millimeter wave propagation based on long term rain data in Riyadh". International Journal of Infrared and Millimeter Waves 7, n.º 4 (abril de 1986): 599–621. http://dx.doi.org/10.1007/bf01013280.
Texto completoSong, Shihao, Jui Hanamshet, Adarsha Balaji, Anup Das, Jeffrey L. Krichmar, Nikil D. Dutt, Nagarajan Kandasamy y Francky Catthoor. "Dynamic Reliability Management in Neuromorphic Computing". ACM Journal on Emerging Technologies in Computing Systems 17, n.º 4 (19 de julio de 2021): 1–27. http://dx.doi.org/10.1145/3462330.
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