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Matthews, Sinéad Marie. "A microfluidic investigation of interfacial reaction kinetics". Thesis, University of Cambridge, 2007. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.613334.
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Unwin, Patrick Robert. "Hydrodynamic electrodes and the study of interfacial reaction mechanisms". Thesis, University of Oxford, 1989. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.236340.
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Ling, Juliette Roseanne. "Enhancement of the interfacial transfer of iodine by chemical reaction". Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1997. http://www.collectionscanada.ca/obj/s4/f2/dsk2/ftp01/MQ29382.pdf.
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Xu, Lei. "Controlling interfacial reaction in aluminium to steel dissimilar metal welding". Thesis, University of Manchester, 2016. https://www.research.manchester.ac.uk/portal/en/theses/controlling-interfacial-reaction-in-aluminium-to-steel-dissimilar-metal-welding(721d3009-de49-434c-bd81-b01ff5973706).html.
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Two different aluminium alloys, AA6111 (Al-Mg-Si) and AA7055 (Al-Mg-Zn), were chosen as the aluminium alloys to be welded with DC04, and two welding methods (USW and FSSW) were selected to prepare the welds. Selected pre-welded joints were then annealed at T=400 - 570oC for different times. Kinetics growth data was collected from the microstructure results, and the growth behaviour of the IMC layer was found to fit the parabolic growth law. A grain growth model was built to predict the grain size as a function of annealing time. A double-IMC phase diffusion model was applied, together with grain growth model, to predict the thickness of each phase as a function of annealing time in the diffusion process during heat treatment. In both material combinations and with both welding processes a similar sequence of IMC phase formation was observed during the solid state welding. η-Fe2Al5 was found to be the first IMC phase to nucleate. The IMC islands then spread to form a continuous layer in both material combinations. With longer welding times a second IMC phase, θ-FeAl3, was seen to develop on the aluminium side of the joints. Higher fracture energy was received in the DC04-AA6111 joints than in the DC04-AA7055 joints. Two reasons were claimed according to the microstructure in the two joints. The thicker IMC layers were observed in the DC04-AA7055 joints either before or after heat treatment, due to the faster growth rate of the θ phase. In addition, pores were left in the aluminium side near the interface as a result of the low melting point of AA7055.The modelling results for both the diffusion model and grain growth model fitted very well with the data from the static heat treatment. Grain growth occurred in both phases in the heat treatment significantly, and was found to affect the calculated activation energy by the grain boundary diffusion. At lower temperatures in the phases with a smaller grain size, the grain boundary diffusion had a more significant influence on the growth rate of the IMC phases. The activation energies for the grain boundary diffusion and lattice diffusion were calculated as 240 kJ/mol and 120 kJ/mol for the η phase, and 220 kJ/mol and 110 kJ/mol for the θ phase, respectively. The model was invalid for the growth of the discontinuous IMC layers in USW process. The diffusion model only worked for 1-Dimensional growth of a continuous layer, which was the growth behaviour of the IMC layer during heat treatment. However, due to the highly transient conditions in USW process, the IMC phases were not continuous and uniform even after a welding time of 2 seconds. Therefore, the growth of the island shaped IMC particles in USW was difficult to be predicted, unless the nucleation stage was taken into consideration.
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Rhamdhani, Muhammad Akbar Brooks Geoffrey. "Reaction kinetics and dynamic interfacial phenomena in liquid metal-slag systems". *McMaster only, 2005.
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Yu, Kyle Kai-Hung. "Interfacial Electrochemistry of Copper and Spectro-Electrochemical Characterization of Oxygen Reduction Reaction". Thesis, University of North Texas, 2011. https://digital.library.unt.edu/ark:/67531/metadc103416/.
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The first part of this dissertation highlights the contents of the electrochemical characterization of Cu and its electroplating on Ru-based substrates. The growth of Ru native oxide does diminish the efficiency of Cu plating on Ru surface. However, the electrochemical formed irreversible Ru hydrate dioxide (RuOxHy) shows better coverage of Cu UPD. The conductive Ru oxides are directly plateable liner materials as potential diffusion barriers for the IC fabrication. The part II of this dissertation demonstrates the development of a new rapid corrosion screening methodology for effective characterization Cu bimetallic corrosion in CMP and post-CMP environments. The corrosion inhibitors and antioxidants were studied in this dissertation. In part III, a new SEC methodology was developed to study the ORR catalysts. This novel SEC cell can offer cheap, rapid optical screening results, which helps the efficient development of a better ORR catalyst. Also, the SEC method is capable for identifying the poisoning of electrocatalysts. Our data show that the RuOxHy processes several outstanding properties of ORR such as high tolerance of sulfation, high kinetic current limitation and low percentage of hydrogen peroxide.
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Baig, Fakhir U. "Effects of interfacial reaction on oil displacement in a Hele-Shaw cell". Thesis, University of Ottawa (Canada), 1993. http://hdl.handle.net/10393/7666.
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An experimental study was conducted to examine the behaviour of reactive and non-reactive systems by displacement experiments of light paraffin oil/decane mixtures by water in a range of mobility ratios. Displacement experiments were performed in a Hele-Shaw cell, simulated a quarter of a reversed five-spot pattern. Displacement patterns produced by reactive and non-reactive systems were compared. It showed that the displacement patterns in the case of the reactive system were completely different from the non-reactive system. The recovery in the reactive system was always higher than in the non-reactive system. The recovery at breakthrough for both the reactive and non-reactive systems increased with the decrease in viscosity of oil. In the non-reactive system, total recovery at one hour after breakthrough increases with the decrease in oil viscosity, while in reactive system total recovery after one hour is nearly constant and independent of oil phase viscosity. Displacement experiments were performed for both favourable and unfavourable mobility ratios. In another series of displacement experiments, a slug of alkaline solution was injected followed by viscous water-glycerine solution. It was found that for all oil solutions, the breakthrough recovery for both reactive and non-reactive systems was lower in the case with a viscous backup. (Abstract shortened by UMI.)
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Kohler, Sven Philipp. "Dynamics of the gas-liquid interfacial reaction of O(³P) atoms with squalane". Thesis, Heriot-Watt University, 2006. http://hdl.handle.net/10399/153.
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Wang, Yin. "A metallurgical approach for controlling interfacial reaction in aluminium to magnesium dissimilar metal welding". Thesis, University of Manchester, 2016. https://www.research.manchester.ac.uk/portal/en/theses/a-metallurgical-approach-for-controlling-interfacial-reaction-in-aluminium-to-magnesium-dissimilar-metal-welding(baf9186c-449e-44f3-9a1e-20dfde48b966).html.
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Dissimilar welding of Al to Mg alloys could potentially find significant application in the automobile industry, if the massive production of brittle intermetallic compounds (IMCs) at the joint interface can be prevented. In order to better understand Al-Mg IMC reactions, a comprehensive investigation of the interfacial region in AA6111 - AZ31 diffusion couples was carried out in this research. Three Al-Mg binary IMCs, namely the -Al12Mg17, -AlMg and -Al3Mg2 phases, were observed to form in the Al - Mg diffusion couple. In both the Al3Mg2 and Al12Mg17 layers, residual stresses were detected. The stress components normal to the joint interface were found to be positive, which had the effect of promoting the extension of lateral cracks; while the horizontal components were compressive, which could hinder cracking in the vertical direction. As a result, the fracture resistance of the two IMCs were asymmetric with lower values along the interface than in the vertical direction. The higher stress level in the Al3Mg2 layer made it more susceptible to lateral cracking and hence becoming the weak link in the Al - Mg dissimilar joints. A potential metallurgical solution has been explored involving the introduction of Zn into the material system, so that a new intermetallic compound with better properties can be formed to replace the unfavored Al3Mg2 phase. In this research, an Al-Zn coating alloy was proposed for this purpose. To determine the optimum composition for the alloy, a numerical method that combined CALPHAD thermodynamic calculation and diffusion simulations was developed. The modelling results indicated that Al-20 at. % Zn was the optimum composition for completely suppressing the formation of Al3Mg2, and this has been verified by static diffusion and friction stir spot welding (FSSW) experiments. In both cases, the designed coating alloy was effective in changing the Al-Mg reaction path by forming the mechanically superior (Al,Zn)49Mg32 phase as a substitute for Al3Mg2. The FSS welds prepared with the Zn containing coating alloy exhibited a 6 % increase in lap shear strength, compared to the conventional Al-Mg welds. This lower than expected improvement resulted from the Zn addition reducing the liquation temperature of the material system, resulting in the production of a detrimental eutectic mixture which facilitated debonding of the welds. As a potential alternative solution, Al-Si coating material has been proposed to inhibit the growth of Al-Mg IMC layers, in which the Si phase was expected to form a partial interdiffusion barrier between the substrate materials and change the reaction path by preferentially reacting with Mg. Comparison of long-term static diffusion experiments between the Al-Si coated and Al - Mg dissimilar joints showed that the nucleation and growth of Mg2Si could change the reaction path and greatly reduce the thickness of the Al-Mg IMC layer at the joint interface. Although in actual friction stir spot welding (FSSW), Mg2Si was not formed in a detectable amounts, due to the very short reaction time, the Al-Si coating still led to a significant reduction in the IMC thickness by partially blocking the Al-Mg interdiffusion process. With the coating applied, the Al - Mg dissimilar welds exhibited enhanced mechanical performance with both their strength and fracture energy being markedly increased, through a reduction in the IMC layer thickness and the presence of Si particle toughening the reaction layer by causing crack deflection.
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De, Oliveira Cruz Mendes Tatsis Maria Alcina. "Marangoni instabilities under microgravity and in liquid-liquid systems with an interfacial chemical reaction". Thesis, Imperial College London, 1990. http://hdl.handle.net/10044/1/46279.
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Davis, Gwen Marie. "Interfacial Reaction of an Olefin-Terminated Self-Assembled Monolayer Exposed to Nitrogen Dioxide: An Investigation Into the Reaction Rate and Mechanism". Thesis, Virginia Tech, 2003. http://hdl.handle.net/10919/34927.
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Reactions of strongly oxidizing pollutants with unsaturated hydrocarbon surfaces are important to many areas of scientific interest. For example, reactions of unsaturated hydrocarbons on the surface of tropospheric aerosols could have a great effect on the oxidizing capacity of the troposphere while the reaction products could be involved in the formation of clouds and smog. These reactions are also important in understanding the toxic effect inhalation of these pollutants have on the pulmonary surfactant of the lung, the only amicable air-water interface of the body. The fatty acids of this surfactant are as much as 30% unsaturated, and exposure to oxidizing pollutant is known to alter both the composition and function of the surfactant. Understanding the reaction mechanism will further the knowledge of how this toxicity occurs.
While the reactions of strongly oxidizing pollutants, such as ozone and nitrogen dioxide, with alkenes in the gas and solution phases are well known, the interfacial reaction mechanisms of these species is not fully understood. The goal of this study is to determine the reaction mechanism when an unsaturated hydrocarbon monolayer at the gas-surface interface is exposed to gas phase nitrogen dioxide.
An olefin-terminated thiol was synthesized and a self-assembled monolayer on Au(111) made and characterized using Reflection-Absorption Infrared Spectroscopy (RAIRS). This unsaturated surface was then exposed to NO2 at a pressure of 1x10-4 mbar in a UHV (Ultrahigh Vacuum) chamber. Time-resolved RAIRS was preformed in situ to monitor the reaction during exposure. X-ray Photoelectron Spectroscopy and RAIRS determined the surface reaction product as an aldehyde. While the mechanism can not be precisely determined, two mechanisms involving either the hydrogen abstraction or radical addition of the NO2 to yield an aldehyde are proposed.Master of Science
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Lyu, Ying, Mark L. Brusseau, Ouni Asma El, Juliana B. Araujo y Xiaosi Su. "The Gas-Absorption/Chemical-Reaction Method for Measuring Air-Water Interfacial Area in Natural Porous Media". AMER GEOPHYSICAL UNION, 2017. http://hdl.handle.net/10150/626480.
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The gas-absorption/chemical-reaction (GACR) method used in chemical engineering to quantify gas-liquid interfacial area in reactor systems is adapted for the first time to measure the effective air-water interfacial area of natural porous media. Experiments were conducted with the GACR method, and two standard methods (X-ray microtomographic imaging and interfacial partitioning tracer tests) for comparison, using model glass beads and a natural sand. The results of a series of experiments conducted under identical conditions demonstrated that the GACR method exhibited excellent repeatability for measurement of interfacial area (A(ia)). Coefficients of variation for A(ia) were 3.5% for the glass beads and 11% for the sand. Extrapolated maximum interfacial areas (A(m)) obtained with the GACR method were statistically identical to independent measures of the specific solid surface areas of the media. For example, the A(m) for the glass beads is 29 (1) cm(-1), compared to 32 (3), 30 (2), and 31 (2) cm(-1) determined from geometric calculation, N2/BET measurement, and microtomographic measurement, respectively. This indicates that the method produced accurate measures of interfacial area. Interfacial areas determined with the GACR method were similar to those obtained with the standard methods. For example, A(ia)s of 47 and 44 cm(-1) were measured with the GACR and XMT methods, respectively, for the sand at a water saturation of 0.57. The results of the study indicate that the GACR method is a viable alternative for measuring air-water interfacial areas. The method is relatively quick, inexpensive, and requires no specialized instrumentation compared to the standard methods.
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Dulnee, Siriwan. "Sorption and Interfacial Reaction of SnII onto Magnetite (FeIIFeIII2O4), Goethite (α-FeIIIOOH), and Mackinawite (FeIIS)". Doctoral thesis, Saechsische Landesbibliothek- Staats- und Universitaetsbibliothek Dresden, 2015. http://nbn-resolving.de/urn:nbn:de:bsz:14-qucosa-175316.
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The long-lived fission product 126Sn (105 years) (Weast (1972)) is of substantial interest in the context of nuclear waste disposal in deep underground repositories. However, the prevalent redox state, the aqueous speciation as well as the reactions at the mineral-water interface under the expected anoxic conditions are a matter of debate. Therefore, in this PhD thesis I present work on the reactions of SnII with three Fe-bearing minerals as a function of pH, time, and SnII loading under anoxic condition with O2 level < 2 ppmv. The first mineral, goethite, contains only trivalent Fe (FeIIIOOH), the second, magnetite, contains both FeII and FeIII (FeIIFeIII2O4), and the third, mackinawite (FeIIS), contains only divalent Fe.
The uptake behavior of the three mineral surfaces was investigated by batch sorption studies. Tin redox state was investigated by Sn-K X-ray absorption near-edge structure (XANES) spectroscopy, and the local, molecular structure of the expected Sn surface complexes and precipitates was studied by extended X-ray absorption fine-structure (EXAFS) spectroscopy. Selected samples were also investigated by transmission electron microscopy (TEM) to elucidate the existence and nature of secondary, Fe- and /or Sn containing solids, and by Mössbauer spectroscopy to study FeII and FeIII in the minerals. Based on the such-obtained molecular-level information, surface complexation models (SCM) were fitted to the batch sorption data to derive surface complexation constants.
In the presence of the FeIII-bearing minerals magnetite and goethite, I observed a rapid uptake and oxidation of SnII to SnIV. The local structure determined by EXAFS showed two Sn-Fe distances of about 3.15 and 3.60 Å in line with edge and corner sharing arrangements between octahedrally coordinated SnIV and the Fe(O,OH)6 octahedra at the magnetite and goethite surfaces. While the respective coordination numbers suggested formation of tetradentate inner-sphere complexes between pH 3 and 9 for magnetite, bidentate inner-sphere complexes (single edge-sharing (1E) and corner-sharing (2C)) prevail at the goethite surface at pH > 3, with the relative amount of 2C increasing with Sn loading.
The interfacial electron transfer between sorbed SnII and structural FeIII potentially leads to dissolution of FeII and transformation to secondary FeII/FeIII oxide minerals. There is no clear evidence to confirm the reductive dissolution in the Sn/ magnetite system, Rietveld refinement of XRD patterns, however, indicates an increase of FeII/FeIII ratio in the magnetite structure. For the Sn/goethite system, dissolved FeII increased with SnII loading at the lowest pH investigated, indicative of reductive dissolution. At pH >5, spherical and cubic particles of magnetite were observed by TEM, and their number increased with SnII loading. Based on previous finding, this secondary mineral transformation of goethite should proceed via dissolution and recrystallization.
The molecular structure and oxidation state of sorbed Sn were then used to fit the batch sorption data of magnetite and goethite with SCM. The sorption data on magnetite were fit with the diffuse double layer model (DLM) employing two different complexes, the first ( = -14.97±0.35) prevailing from pH 2 to 9, and the second ( = -17.72±0.50), which forms at pH > 9 by co-adsorption of FeII, thereby increasing sorption at this high pH. The sorption data on goethite were fitted with the charge distribution–multisite complexation model (CD-MUSIC). Based on the EXAFS-derived presence of two different bidentate inner-sphere complexes ((≡FeOH)(≡Fe3O)Sn(OH)3 (1E) and (≡FeOH)2Sn(OH)3) (2C)), sorption affinity constants of 15.5 ±1.4 for the 1E complex and of 19.2 ±0.6 for the 2C complex were obtained. The model is not only able to predict sorption across the observed pH range, but also the transition from a roughly 50/50 distribution of the two complexes at 12.5 µmol/g Sn loading, to the prevalence of the 2C complex at higher loading, in line with the EXAFS data.
The retention mechanism of SnII by mackinawite is significantly dependent on the solution pH, reflecting the transient changes of the mackinawite surface in the sorption process. At pH <7, SnII is retained in its original oxidation state. It forms a surface complex, which is characterized by two short (2.38 Å) Sn-S bonds, which can be interpreted as the bonds towards the S-terminated surface of mackinawite, and two longer Sn-S bonds (2.59 Å), which point most likely towards the solution phase, completing the tetragonal SnS4 innersphere sorption complex. Precipitation of SnS or formation of a solid solution with mackinawite could be excluded. At pH > 9, SnII is completely oxidized by an FeII/FeIII (hydr)oxide, most likely green rust, forming on the surface of mackinawite. Six O atoms at 2.04 Å and 6 Fe atoms at 3.29 Å demonstrate a structural incorporation by green rust, where SnIV substitutes for Fe in the crystal structure. The transition between SnII and SnIV and between sulfur and oxygen coordination takes place between pH 7 and 8, in accordance with the transition from the mackinawite stability field to more oxidized Fe-bearing minerals. The uptake processes of SnII by mackinawite are largely in line with the uptake processes of divalent cations of other soft Lewis-acid metals like Cd, Hg and Pb.
Very different Sn retention mechanisms were hence active, including oxidation to SnIV and formation of tetradentate and bidentate surface complexes of the SnIV hydroxo moieties on goethite and magnetite, and in the case of mackinawite a SnII sulfide species forming a bidentate surface complex at low pH, and structural incorporation of SnIV by an oxidation product, green rust, at high pH. In all three mineral systems and largely independent on the retention mechanisms, inorganic SnII was strongly retained, with Rd values always exceeding 5, across the relatively wide pH range relevant for the near and far-field of nuclear waste respositories. For the goethite and magnetite systems, the retention could be well modeled with surface complexation models based on the molecular structural data. This is an important contribution to the safety case for future nuclear waste repositories, since such SCMs provide reliable means for predicting the radioactive dose released by 126Sn from nuclear waste into the biosphere across a wide range of physicochemical conditions typical for the engineered as well as natural barriers.
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Tsubouchi, Shigetaka. "Study on Interfacial Reaction between Graphite Negative Electrode and Electrolyte Solution in Lithium-Ion Battery". Kyoto University, 2018. http://hdl.handle.net/2433/232047.
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McCarthy, Fiona Materials Science & Engineering Faculty of Science UNSW. "Interfacial phenomena and dissolution of carbon from chars into liquid iron during pulverised coal injection in a blast furnace". Awarded by:University of New South Wales. School of Materials Science and Engineering, 2005. http://handle.unsw.edu.au/1959.4/20797.
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As carbon dissolution rates have been determined for a few chars only, a systematic and comprehensive study was undertaken in this project on the dissolution behaviour of carbon from non-graphitic materials into liquid iron. In addition to measuring the kinetics of carbon dissolution from a number of coal chars into liquid iron as a function of parent coal and coal ash composition, the influence of chemical reactions between solute/solid carbon and ash oxides was also investigated. These studies were supplemented with investigations on one metallurgical coke for the sake of comparison. The wettability of coal chars and coke with liquid iron at 1550 degrees C was measured as a function of time. Being essentially non-wetting, only a marginal improvement in contact angles was observed with time. The accumulation of alumina at the interface was detected for all materials and was seen to increase with time in all cases. Calcium and sulphur also appeared to preferentially accumulate at the interface, concentrating at levels in excess of those expected from the ash composition alone. Despite the high levels of silica in the ash initially, very little silica was detected in the interfacial region, implying ongoing silica reduction reactions. A small amount of silicon was however detected in the iron droplets, indicating silica reduction with solute carbon. It was identified that the reduction reactions can also consume solute carbon in the liquid iron. As this is occurring simultaneously with carbon dissolution into liquid iron, the interdependency of silica reduction and carbon dissolution could potentially limit the observed carbon dissolution rate. A theoretical model was developed for estimating the interfacial contact area between chars and liquid iron. Wettability was found to have a very significant effect on the area of contact. A two-step behaviour was observed in the carbon dissolution of two chars and coke. Slow rates of carbon dissolution in stage II were attributed to very high levels of interfacial blockage by reaction products leading to much reduced areas of contact between carbonaceous material and liquid iron. The first order dissolution rate constants for four chars/coke and the observed trend in first order dissolution rate constants were calculated. These dissolution results compare well with the previously measured dissolution rate constants. The trends in dissolution can be adequately explained on the basis of carbon structure, silica reduction, sulphur concentration in the metal and ash impurities.
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Zhu, Wenbo. "Soldering interconnects through self-propagating reaction process". Thesis, Loughborough University, 2016. https://dspace.lboro.ac.uk/2134/23259.
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This thesis presents a research into the solder interconnects made through the reactive bonding process based on the self-propagating reaction. A numerical study of soldering conditions in the heat affected zone (HAZ) during bonding was initially carried out in order to understand the self-propagating reactive bonding and the related influencing factors. This was subsequently followed by an extensive experimental work to evaluate the feasibility and reliability of the reactive bonding process to enable the optimisation of processing parameters, which had provided a detailed understanding in terms of interfacial characteristics and bonding strengths. In addition, by focusing on the microstructure of the bonds resulted from the self-propagating reactions, the interfacial reactions and microstructural evolution of the bonded structures and effects of high-temperature aging were studied in details and discussed accordingly. To study the soldering conditions, a 3D time-dependent model is established to describe the temperature and stress field induced during self-propagating reactions. The transient temperature and stress distribution at the critical locations are identified. This thus allows the prediction of the melting status of solder alloys and the stress concentration points (weak points) in the bond under certain soldering conditions, e.g. ambient temperature, pressure, dimension and type of solder materials. Experimentally, the characterisation of interconnects bonded using various materials under different technical conditions is carried out. This ultimately assists the understanding of the feasibility, reliability and failure modes of reactive bonding technique, as well as the criteria and optimisation to form robust joints. The formation of phases such as intermetallic compounds (IMCs) and mechanism of interfacial reactions during reactive bonding and subsequent aging are elaborated. The composition, dimension, distribution of phases have been examined through cross-sectional observations. The underlying temperature and stress profile determining the diffusion, crystallization and growth of phases are defined by numerical predictions. XXI Through the comparative analysis of the experimental and numerical results, the unique phases developed in the self-propagating joints are attributed to the solid-liquid-convective diffusion, directional solidification and non-equilibrium crystallization. The recrystallization and growth of phases during aging are revealed to be resulted from the solid-state diffusion and equilibration induced by the high-temperature heating. In conclusion, the interfacial reactions and microstructural evolution of interconnect developed through self-propagating reactive bonding are studied and correlated with the related influencing factors that has been obtained from these predictions and experiments. The results and findings enable the extensive uses of self-propagating reactive bonding technology for new design and assembly capable of various applications in electronic packaging. It also greatly contributes to the fundamentals of the crystallization and soldering mechanism of materials under the non-equilibrium conditions.
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Perrodin, Marion. "Modélisation et simulation numérique du couplage entre hydrodynamique et réactions chimiques dans du verre fondu peuplé en microbulles". Thesis, Toulouse, INPT, 2011. http://www.theses.fr/2011INPT0108/document.
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Lors de la fusion du verre, de nombreuses petites bulles de gaz sont produites. L’affinage du verre a pour objectif de faire disparaitre ces bulles par l’ajout d’espèces réactives contribuant à la résorption des bulles ou à une augmentation de leur taille. La modélisation de l’hydrodynamique et des transferts nécessite l’étude des couplages entre convection, diffusion et réaction. Une approche locale à l’échelle de la bulle (simulation directe du transfert réactif et de l’écoulement) est utilisée pour déterminer le transfert interfacial. Des mesures de la propagation de fronts d’oxydation dans la fonte ont permis de préciser certaines propriétés physiques des espèces réactives. L’ensemble de cette analyse multi-échelles a contribué à l’élaboration d’un modèle de simulation d’un nuage de bullesMany bubbles are generated during glass production. Due to the high viscosity of molten glass, their rising velocity is extremely low. The refining step consists in adding reactive agents to improve the glass quality. Bubble release is enhanced by chemical reaction (iron and sulfate oxidation-reduction) which will favor shrinkage or growth of bubbles through interfacial mass transfer. Better understanding of bubble cloud behavior in molten glass requires studying the interplay between convection, diffusion and chemical reactions. The direct numerical simulation of the flow and reactive mass transfer provided new insights on modeling interfacial bubble gas fluxes. The acceleration factor has been determined for simple reversible reactions in order to validate the simulation tool. Different Péclet and Damkhöler numbers have been tested to map all the different regimes (diffusion, convection and reaction). Together with those simulations, we have carried out series of experiments in molten glass : propagation of oxidation fronts. At different temperatures and for various glass compositions, we have determined physical properties of reactive species. A theoretical model of reactive transport for instantaneous reactions has been proposed to interpret experimental data. The core of this multi-scale analysis contributed to elaborating an Euler- Lagrange model to simulate bubble clouds in reactive media. This model has been applied to specific processes related to glass industry and can easily be extended to any reactive bubbly flows
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Payyapilly, Jairaj Joseph. "Formation And Growth Mechanisms of a High Temperature Interfacial Layer Between Al and TiO2". Diss., Virginia Tech, 2008. http://hdl.handle.net/10919/29733.
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The product of interaction between Al and TiO2 at elevated temperature has a wide range of applications in refractory, structural and electronics industries (refractory tiles, tank armor, fuel cells, and microelectronic devices). This research attempts to understand the extent of interaction between Al and TiO2 when the reactant surfaces are in contact at elevated temperature and normal atmospheric pressure. The interfacial region between the reactant compounds is examined using analytical techniques; and the formation of TiAl as the interfacial compound is described. The thermodynamics of the Al â Ti â O system is explained as it relates to the particular conditions for the Al â TiO2 reaction research. Thermodynamic principles have been used to demonstrate that the formation of TiAl is favored instead of other TixAly compounds for the set of conditions outlined in this thesis. A study of the mechanism of interactions in the interfacial region can help towards being able to determine the reaction kinetics that lead to the control of microstructure and thus an improvement in the material performance. An appropriate model that describes the formation of TiAl at the interface is described in this study. The formation of TiAl at the interface is a result of the reduction reaction between TiO2 and Al. The O released during the reduction of TiO2 has been investigated and demonstrated to partly remain dissolved in TiAl at the interfacial region. Some O reacts with Al as well to form crystalline Al2O3 in the interfacial layer.Ph. D.
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Chen, Yi-Ling y 陳俋菱. "Interfacial Reaction of Ag/In". Thesis, 1998. http://ndltd.ncl.edu.tw/handle/50691047714701086600.
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Chang, Jer-Min y 張哲銘. "Interfacial reaction between NiCu alloyand Sn3Ag solder". Thesis, 2005. http://ndltd.ncl.edu.tw/handle/31941990208634325126.
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碩士國立中央大學
化學工程與材料工程研究所
93
ABSTRACT Diffusion barrier plays an important role in soldering, it can prevent fast reaction between tin and copper. Beside nickel and platinum, nickel-copper alloy is a possible diffusion barrier in the future. In the past, our labortoary investigated liquid/solid reaction between SnAgCu solder and nickel, it found that little copper added in solder can reduce consumption of nickel. Additionally, intermetallic compound at interface can also changed with copper added in solder. In the experiment, we electroplated nickel-copper alloy on copper and investigated reaction between Sn3Ag solder and different concentration nickel-copper alloy. Beside liquid/solid reaction, we also investigated solid/solid reaction. According to the result, change of concentration in nickel-copper alloy will affect intermetallic compound phase and consumption. Beside copper and nickel,we also electroplated Ni-15 at.%Cu,Ni-40 at.%Cu and Ni-54 at.%Cu. After 120 sec liquid/solid reaction, intermetallic compound between tin and Ni-15 at.%Cu is (Ni1-xCux)3Sn4；intermetallic compound between tin and Ni-40 at.%Cu is (Ni1-xCux)3Sn4；intermetallic compound between tin and Ni-54 at.%Cu is (Ni1-xCux)3Sn4 and (Cu1-xNix)6Sn5.After solid/solid reaction, intermetallic compound between tin and Ni-15 at.%Cu is (Ni1-xCux)3Sn4；intermetallic compound between tin and Ni-40 at.%Cu is (Ni1-xCux)3Sn4 and (Cu1-xNix)6Sn5；main intermetallic compound between tin and Ni-54 at.%Cu is (Cu1-xNix)6Sn5. After 120 sec liquid/solid reaction, consumption of nickel-copper alloy will increase with copper concentration in alloy.Surprisingly, consumption of Ni-54 at.%Cu is faster than copper after 300 sec liquid-state reaction. After solid/solid reaction, consumption of Ni-40 at.%Cu and Ni-54 at.%Cu is even faster than copper. In the research, we found that a little sulfur copper added in electrolyte will great affect copper concentration in nickel-copper alloy, intermetallic compound phase and consumption.
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Yang, Ching-feng y 楊青峰. "Surface Finish and Interfacial Reaction in Flexible Electronics". Thesis, 2010. http://ndltd.ncl.edu.tw/handle/93582417365170636672.
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博士國立清華大學
化學工程學系
98
Flexible electronics have recently attracted very intensive studies because they are thinner, lighter, and more flexible. Similar to other electronic products, flexible electronics products comprise numerous devices and modules. The interconnection technologies of these devices and modules to the flexible substrates are crucial for manufacturing. Two metallic interconnection technologies, Au-Sn bonding and soldering, are frequently used in flexible electronic packaging. Thus, interfacial reactions in the two interconnections with different surface finishes are investigated in this study. Au bumps are formed on the chip side, and the Cu tracks on flexible substrates protected by the Sn surface finish are attached to the Au bumps. Consequently, a three-layer Au/Sn/Cu structure is frequently encountered in flexible electronic products. The reaction progression of the Au/Sn/Cu interfacial reactions was determined. Initially, the reaction path in the Au/Sn/Cu specimen is Au/AuSn/ AuSn2/AuSn4/Sn/Cu6Sn5/Cu3Sn/Cu. At longer reaction time, the (Cu,Au)6Sn5 phase was formed on the Au/Sn side interface as well. The Sn phase is completely consumed with even longer reaction time, the (Cu,Au)6Sn5 phases on the two sides would merge together and the reaction path then becomes Au/AuSn/AuSn2/AuSn4/(Cu,Au)6Sn5/Cu3Sn/Cu. The AuSn4 and AuSn2 phases disappeared step by step. The reaction path is then Au/Au5Sn/AuSn/(Cu,Au)6Sn5/Cu3Sn/Cu. The reaction path would continuously evolve until the specimen reaches thermodynamic equilibrium, and the final phases can be predicted from the phase diagrams. Low melting-point Pb-free solders, Sn-Zn and Sn-In based alloys, are selected to investigate in this study. Interfacial reactions between the Sn-8wt.%Zn-3wt.%Bi alloy and the Cu, Ag, and Ni substrates are examined. Two different kinds of substrates, bulk plate and electroplating layer, are used, and the reactions are carried out at 250 and 220oC. Although the Zn content is only 8wt.%, gamma-Cu5Zn8 and epsilon-CuZn5 phases are formed in the Sn-Zn-Bi/Cu couples. In the Sn-Zn-Bi/Ag couples, three Zn-Ag compounds are observed. The gamma-Ni5Zn21 phase is formed in the Sn-Zn-Bi/Ni couples. Similar results are found in the couples prepared with an electroplating layer: the reaction phases are the same, but the growth rates are different. Phase equilibria of Sn-Bi-Zn ternary system are determined in this study as well. Addition of Zn in Sn-20wt.%In alloys is effective on reducing undercooling and dissolution rate of Ag and Ni substrates in molten solders. For Sn-In-(Zn)/Ag and Sn-In-(Zn)/Ni interfacial reactions, the Zn dominating reaction products are formed when the Zn concentration is higher. A new kind of Sn-In based Pb-free solders with Zn addition is proposed in this study.
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Chi, Shang-Wei y 紀尚緯. "Interfacial Reaction in Electroplated Cu/Ni/Sn System". Thesis, 2017. http://ndltd.ncl.edu.tw/handle/87495446472521833248.
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碩士國立中興大學
化學工程學系所
105
In this study, the electroplating copper substrate and tin, electroplating copper substrate electroplating nickel and tin two kinds of reaction comparison, and in the copper electroplating solution by adding the additive SPS for further comparison. The experimental results show that Cu / Sn mainly produces IMC as Cu6Sn5 in the reflow soldering reaction, and Ni(Ni, Cu)3Sn4 is formed after electroplating the Ni layer. No holes are present in the interface. The presence of SPS does not affect the results. In the heat treatment at 150°C, Cu / Sn forms Cu3Sn in addition to Cu6Sn5, and many pores are formed in the interface of IMC. The reaction is accelerated at 200 ° C and becomes a layered structure with more pores. Using additive SPS are produced no holes at 150 ° C or 200 ° C after the copper plating solution. Copper substrate after electroplating nickel layer in two kinds of heat treatment are no holes and layered structure, the use of additives SPS in copper plating solution does not affect the results. If extend the heat treatment time, nickel layer reaction will not appear holes immediately in the interface. The experimental results show that electroplating copper substrate electroplating nickel can effectively prevent the hole in IMC interface and can be used with the additive SPS without affecting the results, and elongation the electroplating nickel reaction time, will not be observed holes are produced in the interface.
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Huang, Kuan-Yu y 黃冠育. "Interfacial Reaction of Different Solders in Solar Cell Interconnect". Thesis, 2013. http://ndltd.ncl.edu.tw/handle/19790384386205962684.
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Wang, Yu-Ju y 王郁茹. "The Interfacial Reaction between Silver Electrode and Glass Ceramics". Thesis, 2005. http://ndltd.ncl.edu.tw/handle/09893492969128357985.
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碩士國立臺灣大學
材料科學與工程學研究所
93
In this research, the reaction layers produced from silver electrode cofired with La-Si-B-O-mullite (LSBM) or Mg-Si-B-Al (MSBA) glass ceramic composites in different sintering conditions were analyzed, and the controlled mechanism was investigated. The grown phases were characterized by X-ray diffractometry (XRD), and the microstructures were studied by scanning and transmission electronic microscopy (SEM and TEM). In order to study the phenomenon of Ag diffusion into the LSB glass in air, the D-LSBM/Ag laminated samples was sintered at 760oC-840oC and characterized. The activation energy was 246 kJ/mole and the Ag nano-crystals in the sizes between 10~200nm were found appearing in the reaction zone after sintering. Ag, at first, was oxidized in the sintering process, and diffused into the glass. Then Ag nano-particles grow by over-saturation in the glass when cooling. The glass transition temperature (Tg), onset crystallization temperature (To), and the crystallization peak temperature (Tp) decreased because of the Ag diffusion into the glass. The diffusion also degraded the densification, but increased the amount of crystalline phase in the reaction zone. Ag+-ion diffusion in Si-B-O glass was the main controlled mechanism of the formation of reaction zone. However, if the LSBM/Ag sintered in Ar atmosphere, the Ag signal could not be detected on the glass ceramic layer nearby LSBM/Ag interface, and no obvious reaction zone was produced. On the other hand, when the Ag cofired with MSBA glass ceramic composite, the microstructure of the interface revealed that Ag had diffused into the glass. The reaction of the interface consisted of three zones. Each zone appeared a glass matrix consisting of Ag. But, there was no Ag signal in the crystal phase. The path of the Ag diffusion was gradually blocked by the production of Mg-Al-Si crystalline phase in the zone 1. Because of the Mg content diffused toward electrode, and the slight increase of Al content in zone 2, the Ag concentration in zone 1 and 2 was lower than that in zone 3. The final distribution of Ag concentration didn’t reflect a general diffusion phenomenon.
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Ye, Shan y 葉珊. "Interfacial Reaction Between Solder Tin and Bismuth Telluride Substrate". Thesis, 2014. http://ndltd.ncl.edu.tw/handle/49389177542530061773.
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碩士國立中興大學
化學工程學系所
102
Because of no moving parts, small size and noiseless operation, thermoelectric (TE) materials have drawn much attention and be wildly used recently, among which, bismuth Telluride is best known for its great thermoelectric ability of converting heat to electricity at room temperature. Lots of researches are emphasizing on improving the conversion efficiency of TE materials, i.e. figure-of-merit, but only few are on the solder joints reliability of the thermoelectric device. Actually, “reliability” is the key point to prolong the lifetime of a thermoelectric device and so to improve the conversion efficiency due to huge amount of solder joints in the TE device. In this research, we use nano-structured and zone-melted Bi2Te3 substrates to join with SAC405 solder.We found zone-melted p-type Bi2Te3/SAC405 interface formed thicker SnTe than nano-structured p-type Bi2Te3/SAC405 at 120, 150 and 200℃. In n-type Bi2Te3/SAC405 interface, zone-melted samples formed thicker SnTe at 120 and 150℃. But after increasing aging temperature to 200℃, IMC in nano structured n-type Bi2Te3/SAC405 became thicker. It’s because of the BixTey formation between SnTe and n-type Bi2Te3 substrate. Knowing that bismuth telluride is a layered structure compound, we use pure Sn solder to join the zone-melted Bi2Te3 substrate in a direction perpendicular or parallel to its layer direction. The IMC is mainly composed by SnTe, but the IMC thickness and its morphology are quite different. SnTe in parallel joining direction had (220) preferential orientation. After long period of thermal treatment, Sn3Sb2 strips started to appear inside the SnTe layer and their distributions depended on substrate’s orientation. Compare to self-made Bi2Te3/Sn reaction couple, IMCs were not concernd with substrate’s orientation, and IMCs in self-made p-type Bi2Te3/Sn interface were much thinner than those in zone-melted reaction couples.
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KE, SUN-JIAN y 柯孫堅. "Investigation of interfacial reaction between metal silicides and GaAs". Thesis, 1989. http://ndltd.ncl.edu.tw/handle/16799636275077704271.
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Li, Cheng-Chieh y 李澄傑. "Volume Shrinkage Induced by Interfacial Reaction In Micro Joints". Thesis, 2014. http://ndltd.ncl.edu.tw/handle/82765863623943124198.
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博士國立臺灣大學
材料科學與工程學研究所
102
Imminent ending of Moore’s law is the most critical issue threatening the continuing development of semiconductor industry. The strategy of consensus in order to go beyond Moore’s law is through the Three-Dimensional Integrated Circuit (3D IC) architecture. Among many 3D IC integration schemes under development today, solder micro-bumping is a very promising one. Due to the extremely small size of solder joints in 3D IC packages, interfacial reaction features are quite different to that in the conventional solder joints. The space confinement behavior must be considered in the soldering reactions. In this proposal, data analysis and experimental implementation of the volume shrinkage induced by interfacial reaction in micro joints is investigated. Theoretically, there is a 5% shrinkage in volume to produce Cu6Sn5 from the reaction between Cu and Sn. The shrinkages for Cu3Sn and Ni3Sn4 are 7.5% and 11.3%, respectively. Consequently, micro joints would be in highly stressed states and prone to failure. Experimentally, stylus surface profilometer and SEM are carried out to measure the actual volume shrinkages and observe microstructure for Ni/Sn/Ni, Ni/Sn-Ag/Ni, and Cu/Sn/Cu sandwich structures during an isothermal aging at 180℃. The results show that the internal stress and the forming of voids in micro joints during solid state aging might induce potential reliability issues. It is the first time that the reaction induced volume shrinkage is experimentally measured in common solder system. Theoretical analysis and experimental evidence are presented in this proposal to illustrate these issues, and implications based on the findings will be also discussed.
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Yang, Ji-Jyun y 楊吉駿. "The Interfacial Reaction Investigation Between Sn-3.5Ag and Ni Substrate". Thesis, 2010. http://ndltd.ncl.edu.tw/handle/45369287072958447229.
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碩士義守大學
材料科學與工程學系碩士班
98
In order to understand the mechanism of intermetallic compounds (IMCs) formation and growth between Sn3.5Ag solder and Fe-Co-Ni substrate and their effects with reliability, this study would experience multiple reflows and high temperature storage, to observe the growth of IMCs and the mechanism of voids growth, and further explorer the relationship among them. After Sn-3.5Ag solder and Fe-Co-Ni substrate bonding reaction, the Ni3Sn4 IMCs formed at the interface, and the Ni3Sn4 IMCs with a little Co elements of Ni solubility；and the solder in Co、Ni element diffusion into and the formation of (Ni, Co)Sn4, and Ag3Sn particles above the location of a reunion. Experience of 1000 hours aging, the solder observed (Ni, Co)Sn4 and (Ni, Co)Sn2 two phase；while experiencing 7 reflows test its IMC composition is irregular, but close to being rich Sn phase. High temperature storge tests on IMCs layer thickness measurement, the growth rate of Sn3.5Ag/Fe-Co-Ni is much faster than Sn3.5Ag/Ni and Sn3.5Ag/Co. And using XRD analysis of detecting IMCs and decides the IMCs is Ni3Sn4 which the results correspond WDS analysis. And observe the formation of voids and to explorer the reason for its formation, that is attributed the Sn rapid consumed to form IMCs with Ni substrate, and its location is too late to be filled by other atoms and makes voids formation.
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Li, Kuan-Yang y 李冠洋. "A Study of the Interfacial reaction between Ni and Sn". Thesis, 2012. http://ndltd.ncl.edu.tw/handle/18409103019290778774.
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碩士國立中山大學
材料與光電科學學系研究所
100
The orientation relationship and interfaces of Ni3Sn4 and Ni3Sn2 with the Ni (001) and (111) surfaces have been studied with transmission electron microscopy. Ni was evaporated onto the NaCl (001) and (111) surfaces to form epitaxial Ni thin films and Sn was evaporated onto the Ni film and heat treated to form Ni3Sn4 and Ni3Sn2. No orientation relationship between Ni3Sn4 and Ni was found. Two types of orientation relationships between η-Ni3Sn2 and Ni were found: (1) (0002) η-Ni3Sn2//(220)Ni and (01 0) η-Ni3Sn2//(2 0)Ni on the (2 0) η-Ni3Sn2/(001)Ni interface；and (2) (0002) η-Ni3Sn2 //(2 0)Ni and (01 0) η-Ni3Sn2//(22 )Ni on the (2 0) η-Ni3Sn2/(001)Ni interface.
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Fang, Yuang-shing y 方爰心. "A Study of the Interfacial reaction between Pt and Sn". Thesis, 2012. http://ndltd.ncl.edu.tw/handle/77067005506445670841.
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碩士國立中山大學
材料與光電科學學系研究所
100
The orientation relationship and interfaces of PtSn4 and PtSn with the Pt (001) and (111) surfaces have been studied with transmission electron microscopy. Pt was evaporated onto the NaCl (001) and (111) surfaces to form epitaxial Pt thin films and Sn was evaporated onto the Pt films at different temperature to form PtSn4 and PtSn. Pt was evaporated onto the NaCl (001) and (111) surfaces at 350 ℃ to form epitaxial Pt thin films of [001] and [111] zone axes, respectively. Some grains are in random orientation and other as ring pattern. The grain size was at about 10-20 nm. Sn was evaporated onto the Pt surface at 150 ℃ to form PtSn4 and at 200 ℃ to form PtSn. No good orientation relationships were formed on both the PtSn4/ Sn and the PtSn/ Sn interfaces. Heterogeneous nucleation theory, predicts that PtSn should form before PtSn4, but PtSn4 was observed to the first to form. The possible reasons were discussed. Keywords: PtSn4/ Sn interface, PtSn/ Sn interface, orientation relationships, thin films, evaporator, transmission electron microscopy
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Lo, Li-Chen y 羅立晨. "Interfacial Reaction between Diffusion Barrier and Thermoelectric Materials under Current". Thesis, 2012. http://ndltd.ncl.edu.tw/handle/56115317675735653569.
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碩士國立中央大學
化學工程與材料工程研究所
100
This research investigated the interfacial reaction between the diffusion barrier, Ni, and the thermoelectric materials. Ni is a good barrier between Pb-free solder and n-type bismuth telluride (Bi2Te2.7Se0.3) thermoelectric material to prevent the rapid formation of brittle SnTe intermetallic compound (IMC). We use sandwich structure Sn/Ni-P/n-Bi2Te3/Ni-P/Sn to simulate the interfacial reaction under current. The depletion of diffusion barrier and the formation of intermetallic compound (IMC) will be concerned. Different current densities were applied to the system to investigate the electromigration behavior of the systems at various temperatures. The experiment condition was set at current density 100 A/cm2 and heating temperature 150 °C. The results showed that the Ni-P layer crystallized to Ni3P and left lots of Kirkendall void after current stressing. Instead of SnTe, NiTe and Bi4Te5 formed at the interfaces. These IMCs would affect the mechanical and electrical properties of the thermoelectric module. The aging sample at temperature 150 °C is prepared to determine the effect from electromigration. The results showed that the thickness of NiTe and Bi4Te5 at the cathode were thicker than at the anode. Due to the electromigration, Ni atoms diffused into thermoelectric material greatly. The Ni atoms diffused from cathode to anode driven by electrical current.
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Chen, Chun-Wei y 陳駿維. "Interfacial reaction between Sn(Cu) solder and NiCo alloy UBM". Thesis, 2009. http://ndltd.ncl.edu.tw/handle/49636679478494714528.
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碩士國立中央大學
化學工程與材料工程研究所
97
In the work, we study soldering reaction between Ni-Co alloy layer and Sn(Cu) Pb-free solders. Different Co concentrations in Ni-Co alloy layer were electroplated on Cu foils. Then, Sn(Cu) solders were reflowed on the Ni-Co alloy layers at 250 ℃ to investigate the growth situation and morphology of IMCs and to discuss the effect of Co concentration and Cu concentration on the reaction between Sn(Cu) and Ni-Co layer. Experimental results show that when the composition of NiCo alloy are Ni, Ni-20at%Co, Ni-63at%Co and Co, the corresponding IMCs formed at the interface are Ni3Sn4, (Ni,Co)Sn2, (Ni,Co)Sn3 and CoSn3. We also observe that the consumption of Ni-63at%Co alloy is more serious than other NiCo alloys and it is due to the loose structure of IMCs. In the case of Ni-20at%Co, after 300 seconds reflowing additional needle-like phase (Ni,Cu)3Sn4 was formed right above the continuous (Ni,Co)Sn2 layer when Cu concentration overs 0.2wt% and Cu addition enhance the growth rate of (Ni,Co)Sn2. In the case of Ni-63at%Co and Co, as Cu addition and increasing of Cu concentration are performed only CoSn3 formed at the interface, but these factors restrain the growth rate of CoSn3.
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Yeh, Yu-ting y 葉昱廷. "Current density effect on the interfacial reaction between Sn5Ag/Cu". Thesis, 2008. http://ndltd.ncl.edu.tw/handle/51684119480342750917.
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碩士國立中央大學
化學工程與材料工程研究所
96
Under 130℃ heat treatment, we concern about the interfacial reaction between Sn5Ag solder and investigate the Cu consumption behavior and the formation of intermetallic compound. We obtain that , the diffusion coefficient under 130℃ is about D=1.48×10-13 (cm2/s). Further, we investigate the interfacial reaction between Sn solder and Cu and also Sn5Ag solder and Cu under different current densities. And explain the Cu consumption behavior and the formation of intermetallic compound by flux. Cu consumption at cathode side is due to Cu atom transported to anode side immediately under current stressing. Under thermal treatment, Cu dissolution flux from Cu to IMC is faster than the diffusion flux in IMC layer. So, the latter one is rate determine step. From experiment results, the Cu consumption of Sn/Cu is much serious than Sn5Ag/Cu, this is because mixed Ag-Sn and Cu-Sn compound layer which formed at the interface can retard the Cu dissolution from IMC layer to solder matrix and also from Cu foil to IMC layer effectively. For Sn5Ag/Cu and Sn/Cu reaction under current stressing, we found that, both Cu consumption and IMC formation increase over time.
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Chang, Chih-Chiang y 張智強. "Dissolution and Interfacial Reaction between Cu and Sn-Ag-Cu Solders". Thesis, 2007. http://ndltd.ncl.edu.tw/handle/28516702026379155360.
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碩士國立中央大學
化學工程與材料工程研究所
95
In electronic packing, the dissolution of thin film under-bump metallizations (UBMs) and surface finishes in molten lead-free solders is one of the most important processing concerns. Due to a higher melting temperatures and richer Sn content, molten lead-free solder such as SnAgCu tend to dissolve the UBMs and surface finishes at faster rates than the eutectic SnPb. The SnAgCu solder are a series of lead-free solders with broad compositions. The OSP/Cu surface finish is the most common and important for solder pad and bumps in industry now. One of the important reasons for using Cu in packaging assemblies is that it provides good electrical conductivity. Therefore, the overall objective is to study in depth the reaction between the SnAgCu solders with various Cu concentrations, solder ball volume and the OSP/Cu. In this study, solder balls of different concentrations Sn3AgxCu (x=0/0.3/0.5/0.7wt.%) and different diameters, 500 μm or 760 μm were employed to study the influence of solder volume as well as the Cu concentration. The solder pad had the OSP/Cu surface finish. The pad opening diameter was 600 μm. The solder balls were placed on pad, and then reflowed for 90–450 sec at peak reflow temperature of 235℃. The microstructureal analyses of samples were obtained using a SEM, and the composition of reaction product was identified by JEOL JXA-87600SX electron microprobe (EPMA). It was found that the Cu concentration and solder ball volume in the SnAgCu ternary solder has very strong effect on the Cu consumption thickness and compound formation in solder joints with the OSP/Cu surface finish. The different Cu concentration in the SnAgCu ternary solder changed the Cu concentration gradient and dissolution driving force between molten-solder and Cu pad. The interfacial IMC layers thickness and grain size increased with increasing number of reflow times. From mass balance of Cu, whatever initial Cu concentration in the SnAgCu ternary solder ball the Cu concentration will reach dissolution equilibrium to maintain constant at various reflow times. The results of this study suggested that a high Cu-content SnAgCu solder should be used to prevent the chip failed due to molten solder dissolved nearly all the Cu from the Cu pad.
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Huo, Cheng-Bang y 霍正邦. "Investigation of Interfacial Reaction Between Various Optical glasses and Mold Materials". Thesis, 2007. http://ndltd.ncl.edu.tw/handle/25299830787160714410.
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碩士淡江大學
機械與機電工程學系碩士班
95
Glass molding process is considered to have great potential of mass producing various spherical/aspherical glass lenses to a higher achievable accuracy and at a lower cost. However, glass molding has its own problems to deal with such as glass stuck on the mold surfaces and chemical interaction between glass and mold materials. During the molding process mold surfaces have to experience cyclic mechanical and thermal loading. This research aimed to investigate the interaction between various optical glass and mold materials at elevated temperature with/without protective coating and protective gas. The results showed that molding in nitrogen gas could always improve the sticking problem. It is also worth noting that the diffusion between mold and glass proceeds more easily when there are more network modifier in the optical glass. The mold coated with Pt/Ir films can effectively reduce the interaction between the mold and optical glass. In the case of glass containing certain network modifiers, such as BaO, it can degenerate the Pt/Ir films and subsequently suppress the anti-stick effect.
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Wu, Jia-rong y 吳佳融. "Effect of applied stress on copper/tin thin film interfacial reaction". Thesis, 2007. http://ndltd.ncl.edu.tw/handle/01014820293746296698.
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碩士中興大學
化學工程學系所
95
With the electronic products becoming small, thin and light, the flip-chip technology is the trend of the package because of its small package size and excellent performance. The interfacial reaction between solder bump and under bump metallization is one of the important subjects in the flip chip reliability concerns. But at the process of microelectronic packaging, the electronic products that could be affected by the environment of the packaging and the property of products’s material could be strain. In this study, effect of applied stresses on the copper/tin thin film interfacial reaction can be dicussed. In the study of reflow, the samples were reflowed at 260 ℃ for durations ranging from 10min to 95 min. We use the 50 min as the ts, before the ts can be solid state reaction and after the ts can be liquid solid raction .After 40min,under without applied stresses , the copper have be reactioned completely, the intermetallic Cu6Sn5 can detected and at 45min ,the intermetallic compound began ripening reaction. And we can found that the intermetallic compound have spallen from the interface. With the time gone, the sizes of the intermetallic compound can grow bigger ontinuously. The morphololgy of the intermetallic compounds is hexagonal and morphology of intermetallic compound spalling from the interface is hexagonal. Based on microstructural analyses, a possible mechanism for the growth, disappearance, and spalling of the intermetallic compounds was proposed. In the study of isothermal solid-state aging, we put the sample in the oven, and solid-state aging at temperatures of 120℃, 150℃ and 170℃. The duration of solid-state aging is from 1day to 40day. Under different of applied stresses,it could product the same intermitallic compound. With time gone, the area of Ta from the interface become more and more. And under the applied stresses, the area of Ta from the interface can more than the area of Ta from the interface without the applied stresses. Based on microstructural analyses, a possible mechanism for the growth, disappearance, and spalling of the intermetallic compounds was proposed.
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Su, Tien-min y 蘇天民. "Core-Shell Nanoparticles Prepared by Interfacial Redox Reaction in SDS Microemulsion". Thesis, 2013. http://ndltd.ncl.edu.tw/handle/19157701671279478257.
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Chiang, Yu-Yen y 江昱彥. "The Interfacial Reaction of SnAgIn Pb-Free Solder on Cu Substrates". Thesis, 2010. http://ndltd.ncl.edu.tw/handle/53580872795950616260.
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碩士國立中央大學
材料科學與工程研究所
99
This thesis investigated the interfacial reaction between Sn-Ag-In lead-free solder and Cu substrates. Two composition of solder, 94Sn-3Ag-3In and 80Sn-3Ag-17In, were employed. the addition of indium decreases the melting point of 94Sn-3Ag-3In and 80Sn-3Ag-17In to 214.7 and 193.3℃, respectivily. When increaseing the amount of indium, the pasty range increases. due to partial melting of solder. The amount of Sn affects the undercooling despite the amount of external additives. The interfacial intermetallic compound are Cu6(Sn,In)5 in Sn-Ag-In system solder and Cu6Sn5 in SnAgBi and SnAgBiIn solder. Because the addition of Bi increase the solubility of In in Sn. The activation energy were 23 and 24.5 KJ/mol in 94Sn-3Ag-3In and 80Sn-3Ag-17In, respectivily. The value is half of that in SnAgBiIn. The Bi could enhance the dissolution of Cu in solder. The white particals that formed inside the bulk solder of 94Sn-3Ag-3In are ζ phase, a solid solution of Ag4Sn and Ag3In, and the particles in 80Sn-3Ag-17In should be Ag2In+ζ phase. In solid state reaction. The activation energy are 64.92 and 219.8 KJ/mol in 94Sn-3Ag-3In and 80Sn-3Ag-17In, respectivily. The white particals inside bulk solder should be Ag3Sn+ζ phase and Ag2In+ζ phase in 94Sn-3Ag-3In and 80Sn-3Ag-17In, respectivily.
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Chen, Jun-Yuan y 陳俊元. "The Research of Lead-Free Solder Interfacial Reaction in UCSP Package". Thesis, 2004. http://ndltd.ncl.edu.tw/handle/66308816564115066870.
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碩士義守大學
材料科學與工程學系
92
In this research, the basic properties、microstructures and the aging effects of Sn-0.7Cu、Sn-2.6Ag-0.6Cu、Sn-4.0Ag-0.5Cu lead-free solder balls and conventional Sn-Pb solder ball are investigated. In addition, commercial Ultra CSP 98L device with above mentimed solder balls and Sn-Pb、Sn-3.0Ag-0.5Cu、Sn-7Zn-Al（30-40ppm）paste are placed on OSP and NiAu PCB. After reflow, samples are gone through TCT and HTS reliability tests. DSC、SEM/EDX、EPMA/WDX are then utilized to study the mechanism of the IMC formation on the interface of the solder joints and the relations among the microstructures solder joint strength and the reliability. The results show that Sn-Pb solder ball consists of Sn-rich β phase and Pb-rich α phase solid solutions and both grains grown after long time aging. On the other hand, lead-free solder balls consist of Sn-rich β phase and eutectic IMC phases. Both sizes of β grains and IMC particles increase with aging time. The roundness of the solder balls after reflow decreases with increasing melting point of the solder materials. Due to the cyclying expansion and contraction of the TCT test, cracks are initiated on the interface of the solder ball and chip after 500 cycles and failed after 1000 cycles. Due to the thickness growth of the IMC on the OSP surface finished substrate, the joint strength decreases with increasing aging time of the HTS reliability test. For NiAu substrate, Ni layer acts as a barrier layer which in turn reduces the growth of the interfacial IMC. However, the gold embrittlement may occur which reduces the mechanical strength of the solder joint.
40
Tsai, Jung-Ting y 蔡榮庭. "Interfacial reaction and electrical performances between silver paste and silicon substrate". Thesis, 2012. http://ndltd.ncl.edu.tw/handle/b2j5hk.
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碩士國立臺灣科技大學
機械工程系
100
Since the silver paste plays a major role in the mass production of silicon solar cells, this research has studied its physical characteristics. This research has succeeded in optimizing the silver paste in 80 wt%~85 wt% and controlling its particle size in 1~1.5 μm spherical powder. As the firing temperature is increased, the growth trend of silver grain is improved. The result has showed that the lowest sheet resistance is 4 mΩ/sq during the 860°C sintering process. The SEM observation has showed that the formation of silver oxide is formed during the melting process of glass and triggered redox reaction of Ag crystallites to grow on the interface. It has proven that a thin layer of silicon oxide (50 nm~75 nm) was formed. The separate layer in the interface was determined successfully as: (1) Ag crystallites direct contact with silver layer (2) Ag crystallites in glass layer (3) glass layer (4) spherical nano silver particle in the glass layer; therefore the research has proposed a new model of silver and silicon interface. The special contact resistance is the lowest value of 1.92x10-4 (Ω?|cm2) in 830℃ and the highest value of 6.3x10-4 (Ω?|cm2) in 890℃; As to the single Ag crystallites is the lowest value of 2.9x10-8 (Ω?|cm2) and the highest value of 2.2x10-7 (Ω?|cm2). This research has concluded that the increase of the firing temperature will cause the excessive growth of Ag crystallites and also cause leakage current to occur. This research has also concluded that he glass transition temperature and glass additive play an important role in contact surfaces between the silicon and silver in the experiment. The difference of glass transition temperature used in the silver paste has confirmed: (1) the ability of redox reaction of silicon nitride layer (2) the control of Ag recrytallites size and (3) the solubility amount of silver in glass. The TEM results has also confirmed that the precipitation of Ag recystallites is followed from the interface glass layer, and the continuous of interface glass layer is controlled by the amount of glass addition. By means of EDS and SIMS, the measurement of the glass layer are 2~4 μm in thickness and 0.2~0.8 μm in the thinness. Due to the Ag crystallites, the formation of oxide layer occurs which is caused by the Ag diffusion. The experiment has detected 3μm length of diffusion and the activation energy is 35 kJ/mole in the general diffusive tendency. Finally, the research has also concluded that two facts of glass addition when sintering: (1) the speed of redox reaction of silicon nitride layer and (2) the thickness of glass between silver and silicon.
41
Wei-ShiuanWu y 吳維軒. "Investigation of interfacial reaction and microstructure of high temperature solder joint". Thesis, 2015. http://ndltd.ncl.edu.tw/handle/7cx8w6.
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碩士國立成功大學
機械工程學系
103
This research is to discuss the 95Pb-5Sn microstructure and solid/solid interfacial microstructure variation of 95Pb-5Sn solder combining with Ni/Cu UBM. Diffusion barrier Ni layer was coating on copper rods by electroless plating. Using the solders to join two rods whose diameter is 1.5mm. Those solder joints are stored isothermally at 200℃for up to 400 h and evaluate different thickness (2μm、1μm、0.5μm) of diffusion barrier prevent reaction between tin and copper ability and the tensile strength of solder joint. Experimental results show that the β-Sn precipitates with lamella in the α-Pb due to the slower cooling rate during high temperature stored end of experiment. After 95Pb-5Sn solder are combined with Ni/Cu, Sn atoms react with Ni atoms to form Ni and Sn intermetallic compound. Thus remainder P atoms are exhausted toward electroless Ni layer to produce dark P-rich layer. The thickness of interfacial intermetallic compound and P-rich layer raised with high temperature storage time increasing. After aged at 200℃ for 400h, the 2μm、1μm thickness diffusion barrier remains ability. However after aged at 200℃ for 200h, the 0.5μm diffusion barrier loses function that prevent reaction between tin and copper. The strength of joint result show that the tensile strength of the joint decrease distinctly after 200℃ thermal storage. The fracture position of solder joints at as-soldered occurred at the inside of solder. However, the fracture position tended to occur at the interfacial intermetallic compound surface with high temperature storage time increase.
42
Chen, Zhao-Ming y 陳昭銘. "The study of interfacial reaction between SnBi solder and Au substrate". Thesis, 2008. http://ndltd.ncl.edu.tw/handle/mbjuaq.
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碩士國立臺北科技大學
化學工程研究所
96
The interfacial reaction between Sn-Bi solder and Au substrate grows Sn-Au intermetallic compound (IMC) mainly. The constituent of IMC depends on the composition (wt%) of Bi in the solder. When the weight percent of Bi is more than eutectic composition (57wt%), AuSn and AuSn2 would be found at interface. When the composition of Bi is 50wt%, a Sn-Au-Bi ternary metastable compound was formed and after longtime aging or the reaction temperature was increased, the ternary compound will become AuSn4. That means AuSn、AuSn2 and AuSn4, three different Sn-Au IMC will be co-existing at the interface. After longtime aging there are some Bi-rich segregation in the intermetallic compound and others which segregate between IMC and solder become a continuous layer. Based on reaction kinetics, we plotted the IMC thickness vs the square root of time and obtained a linear relationship between these two variables by means of linear regression model. The figure shows a straight line, which means that the growth of IMC is controlled by diffusion mechanism. In the figure, we also know that thickness and growth rate constant (k) are increasing with time and temperature for a specific composition of Bi but decreasing with the composition of Bi in the solder under the fixed conditions of temperature and reaction time. Then we substitute the growth rate constant (k) and temperature into Arrhenius equation, we would obtain the reaction activity energy (Q). When the solder is eutectic, the result shows that the reaction activity energy is the lowest and it decreases when the composition of Bi increases.
43
Farner, Budarz Jeffrey Michael. "Lights, Camera, Reaction! The Influence of Interfacial Chemistry on Nanoparticle Photoreactivity". Diss., 2016. http://hdl.handle.net/10161/13369.
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The ability of photocatalytic nanoparticles (NPs) to produce reactive oxygen species (ROS) has inspired research into several new applications and technologies, including water purification, contaminant remediation, and self-cleaning surface coatings. As a result, NPs continue to be incorporated into a wide variety of increasingly complex products. With the increased use of NPs and nano-enabled products and their subsequent disposal, NPs will make their way into the environment. Currently, many unanswered questions remain concerning how changes to the NP surface chemistry that occur in natural waters will impact reactivity. This work seeks to investigate potential influences on photoreactivity – specifically the impact of functionalization, the influence of anions, and interactions with biological objects - so that ROS generation in natural aquatic environments may be better understood.
To this aim, titanium dioxide nanoparticles (TiO2) and fullerene nanoparticles (FNPs) were studied in terms of their reactive endpoints: ROS generation measured through the use of fluorescent or spectroscopic probe compounds, virus and bacterial inactivation, and contaminant degradation. Physical characterization of NPs included light scattering, electron microscopy and electrophoretic mobility. These systematic investigations into the effect of functionalization, sorption, and aggregation on NP aggregate structure, size, and reactivity improve our understanding of trends that impact nanoparticle reactivity.
Engineered functionalization of FNPs was shown to impact NP aggregation, ROS generation, and viral affinity. Fullerene cage derivatization can lead to a greater affinity for the aqueous phase, smaller mean aggregate size, and a more open aggregate structure, favoring greater rates of ROS production. At the same time however, fullerene derivatization also decreases the 1O2 quantum yield and may either increase or decrease the affinity for a biological surface. These results suggest that the biological impact of fullerenes will be influenced by changes in the type of surface functionalization and extent of cage derivatization, potentially increasing the ROS generation rate and facilitating closer association with biological targets.
Investigations into anion sorption onto the surface of TiO2 indicate that reactivity will be strongly influenced by the waters they are introduced into. The type and concentration of anion impacted both aggregate state and reactivity to varying degrees. Specific interactions due to inner sphere ligand exchange with phosphate and carbonate have been shown to stabilize NPs. As a result, waters containing chloride or nitrate may have little impact on inherent reactivity but will reduce NP transport via aggregation, while waters containing even low levels of phosphate and carbonate may decrease “acute” reactivity but stabilize NPs such that their lifetime in the water column is increased.
Finally, ROS delivery in a multicomponent system was studied under the paradigm of pesticide degradation. The presence of bacteria or chlorpyrifos in solution significantly decreased bulk ROS measurements, with almost no OH detected when both were present. However, the presence of bacteria had no observable impact on the rate of chlorpyrifos degradation, nor chlorpyrifos on bacterial inactivation. These results imply that investigating reactivity in simplified systems may significantly over or underestimate photocatalytic efficiency in realistic environments, depending on the surface affinity of a given target.
This dissertation demonstrates that the reactivity of a system is largely determined by NP surface chemistry. Altering the NP surface, either intentionally or incidentally, produces significant changes in reactivity and aggregate characteristics. Additionally, the photocatalytic impact of the ROS generated by a NP depends on the characteristics of potential targets as well as on the characteristics of the NP itself. These are complicating factors, and the myriad potential exposure conditions, endpoints, and environmental systems to be considered for even a single NP highlight the need for functional assays that employ environmentally relevant conditions if risk assessments for engineered NPs are to be made in a timely fashion so as not to be outpaced by, or impede, technological advances.
Dissertation
44
Chen, Wan-Ching y 陳琬菁. "Interfacial reaction of the Ni/Sn-xZn/Cu sandwich structure couples". Thesis, 2013. http://ndltd.ncl.edu.tw/handle/43631592900081581432.
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碩士國立臺灣科技大學
材料科學與工程系
101
In this study, the Sn-Zn alloys were used as the solders because of its low cost and the melting point is closer to the conventional Sn-Pb solder. However, BGA and FC technology are two of the mainstreams applied to the electronic packaging widely, and the Ni/solder/Cu structure is the most common one. Therefore, this study demonstrates interfacial reaction of the Ni/Sn-xZn/Cu sandwich structure couples, the purpose is to investigate whether the Zn content of the Sn-Zn alloy, inter-diffusion between Cu and Ni atoms and the thickness of the solders will effect the formation of IMC phases. The results reveal that the Zn content of the Sn-Zn alloy and the diffusion of Cu atoms will affect the formation of IMC phases. When the Zn content is 1 wt%, the (Ni, Cu)3Sn4 phase was formed on the interface of the Ni side after soldering. Then, the (Ni, Cu)3Sn4 phase changed into the (Cu, Ni, Zn)6Sn5 phase after aging for 40 h. While the Zn content is more than 5 wt%, the Ni5Zn21 phase was formed on the interface of the Ni side, and the Cu5Zn8 phase was formed on the interface of the Cu side. After long-term aging, the Cu5Zn8 phase departed from the interface, and the Sn atoms refilled the vacancies. Then, the (Cu, Zn)6Sn5 phase was formed on the interface between the Cu5Zn8 phase and the Cu substrate. The thickness of the solders were decreased to 0.5 mm to make the Cu atoms diffuse to the Ni side more quickly, then cause the transformation of IMC phase on the Ni side.
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Liu, Pei-Chi y 劉培基. "The interfacial reaction between Sn-Zn series solders and Ag substrate". Thesis, 2004. http://ndltd.ncl.edu.tw/handle/82957039372385593735.
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碩士國立成功大學
材料科學及工程學系碩博士班
92
The drawbacks of Sn-Zn based solders could be improved by alloying modification. This study investigated the effect of various alloying elements, Al, Ag and Ga, on the wetting behavior between the Sn-Zn based solders and Cu/Ag substrates. On the other hand, the interfacial reaction between the Sn-Zn based solders and Ag substrate were rarely studied before. The solid-liquid and solid-solid reactions of Sn-Zn based solders were also investigated, and the intermetallic compounds (IMCs) formed at interface were identified and the growth behaviors were discussed. The microstructure of Sn-Zn-0.5Ag-0.1Al-0.5Ga solder consists of needle Zn-rich phase and AgZn3 distributed in the Sn matrix. This solder performed the best wetting properties (shortest wetting time and largest wetting force) as compared to other solders (Sn, Sn-9Zn, Sn-Zn-0.5Al, Sn-Zn-XGa and Sn-8Zn-3Bi). The solid-liquid reaction at 250℃ gives rise to a Ag-Zn two-layer structure between Ag substrate and Sn-9Zn, Sn-Zn-0.5Al, Sn-Zn-0.5Ga and Sn-8Zn-3Bi. XRD and elemental line-scan results revealed, one layer to be γ-Ag5Zn8 which exists close to the solder and the other layer as ζ-AgZn next to the Ag substrate. The IMC content of Sn was not observed at all. At the interface between Sn-Zn-0.5Ag-0.1Al-0.5Ga solder and Cu, Ag substrate, the γ-Cu5Zn8, ζ-AgZn and γ-Ag5Zn8 were formed respectively during the solid-liquid reaction at 250℃. During the solidification, the ε-AgZn3 was formed at interface due to the reaction between Ag and Zn of the solder. The kinetic values of IMC growth could be calculated by measuring the thickness of IMCs after solid-liquid reaction at different temperature for different time. The results of calculation revealed that the growth of Ag-Zn IMC formed at the interface between Sn-Zn-0.5Ag-0.1Al-0.5Ga solder and Ag was diffusion controlled (n = 0.5), and the activation energy of growth was 126.3 KJ/mol. On the other hand, the growth of Cu5Zn8 formed at Cu substrate was reaction controlled (n = 1), and the activation energy was 24.3 KJ/mol. After 150℃ aging treatment, the interfacial morphologies between Ag substrate and Sn-Zn based solders (Sn-9Zn, Sn-Zn-0.5Al and Sn-Zn-0.5Ag-0.1Al-0.5Ga) were similar. The reaction layers were transformed from scallop-like to continuous. With increasing aging time, the growth of Ag3Sn increases and it moves forward and very close to the substrate. The mixture structures of Ag3Sn and Ag-Zn layer were eventually formed at the interface.
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Tsai, Yu-Cheng y 蔡育成. "A study of the interfacial reaction in a Ta2N/Si(100) system". Thesis, 2004. http://ndltd.ncl.edu.tw/handle/52641978658800739493.
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碩士國立臺灣科技大學
機械工程系
92
We studied the thin film structure and interfacial reaction of tantalum nitride deposited on a Si(100) wafer with a diameter of 12 inches. The tantalum nitride film was obtained by a sputtering method. The thickness of the film was about 30 nm. After the tantalum nitride film was formed, annealing processes were carried out in a tube furnace with a vacuum level of 5 × 10-5 torr. The samples were annealed at temperatures ranging from 500, 600, 800, 900, and 1000oC for one hour in the vacuum furnace and cooled by furnace cooling. We studied the properties of the tantalum nitride film after the annealing processes through XRD, AES, HRTEM, SEM, and AFM analyses. We found that the film of tantalum nitride was amorphous in the as-deposited condition, and turned into HCP crystal structure as the annealing temperature increased. In the TEM study for the sample in the plane-view condition, we found that the grain size of the Ta2N increased as the annealing temperature increased. In the cross-sectional TEM study, we observed there was an amorphous layer in the interface between the tantalum nitride and Si wafer. However, the thickness of the amorphous layer remained the same in various annealing temperatures. The Ta2N film did not react with the silicon substrate. Therefore, it is a good barrier film for the IC processes. In the annealing process at 1000oC, we observed the precipitation of a silicide with rectangular shape residing in the silicon wafer along the interface between Ta2N and Si substrate. From the EDX analysis, we found the silicide contained the signal of Cr which indicated the Si wafer was contaminated during the annealing process in the tube furnace. However, the silicide with unknown selected area diffraction patterns could be a new silicide since it could not match with any of the known data.
47
Zheng-XueTsai y 蔡政學. "The Interfacial Reaction on Pd-Coated Cu Wire Bonds Under Current Stressing". Thesis, 2012. http://ndltd.ncl.edu.tw/handle/87407535661362624100.
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碩士國立成功大學
材料科學及工程學系碩博士班
100
The influence of palladium in the interfacial reactions of copper wire bonding under current stressing is reported in this study. At the as-bonded step, Pd dissolved into a Cu ball bond and then gathered at the edge of the Cu ball, forming an anti-oxidation layer. The growth rate of IMCs under current stressing depends on the type of wire bonds and the direction of the current. The interfacial reaction at the anode, where electrons flow from Cu wire bonds to the Al pad, is faster than that of the cathode, where electrons flow from the Al pad to Cu wire bonds. This is probably because the dominate diffusion species in Cu-Al IMCs is copper. Results show that the existence of Pd restrained the growth rate of IMCs due to the formation of the Pd-enriched layer near the interface at the anode which acted as a diffusion barrier; however, a notch was formed at the cathode and the effect on the IMC growth rate could be neglected there. This may be the reason why Pd-coated copper wires show better bonding reliability than pure copper wires in the wire bonding process.
48
Hsu, Andrew Chia-Ming y 許家銘. "A generalized phenomenological model for the effect of electromigration on interfacial reaction". Thesis, 2008. http://ndltd.ncl.edu.tw/handle/16171356103196698710.
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Chiang, Jeng-Yu y 江政諭. "Interfacial reaction and joint strength of In-Bi solder on Cu substrate". Thesis, 2018. http://ndltd.ncl.edu.tw/handle/ykkepa.
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碩士國立中央大學
化學工程與材料工程學系
106
This study investigates the interfacial reaction of 50In-50Bi/Cu and In/Cu. The interfacial reaction is classified into liquid-state reaction and solid-state reaction. The reaction evolution was analyzed by scanning electron microscopy to observe the microstructure, X-ray diffraction, and electron probe X-ray microanalysis to characterize the intermetallic compounds (IMCs) at the interface. Therefore, the growth behavior of IMCs is discussed through kinetics. To know the influence of solder joints during thermal processes, shear tests were carried out. In a 50In-50Bi/Cu system, an interfacial IMC, Cu11In9, was formed at 120 °C. In addition, the IMC thickness increased with reflow time. The interfacial IMC separated into two layers during 30-minutes reflow. The upper part was Cu11(In,Bi)9 which contained more Bi than the lower part of IMC. The growth mechanism of Cu11In9 in this system at 120 °C was diffusion-controlled by kinetics. In the In/Cu liquid state reaction, the interfacial IMCs are Cu11In9 and CuIn2, and the growth rate of Cu11In9 in the 50In-50Bi/Cu system was slow during 40 °C, 60 °C, and 70 °C aging processes. The thickness of the interfacial IMCs apparently increased when the aging temperature rose to 80 °C. As a result of the In/Cu solid-state reaction, CuIn2 existed as a low-temperature metastable phase under 50 °C. Moreover, CuIn2 tended to transform into Cu11In9 above 70 °C. For 50In-50Bi/Cu shear tests, the shear strength of solder joints increased with the aging time at various temperatures. In addition, the cases of brittle fracture decreased after aging. In conclusion, long-term aging could improve the mechanical properties of the 50In-50Bi/Cu system in this experiment.
50
Chen, Chieh Fu y 陳玠甫. "The interfacial reaction of Co/Solid-state Sn-3.5Ag Pb-free solder". Thesis, 2016. http://ndltd.ncl.edu.tw/handle/17076111075967518693.
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碩士國立清華大學
工程與系統科學系
104
Under bump metallization(UBM) is an important issue in packaging industry, because it directly effects the reliability and the life time of solder joint. To overcome the failure of solder joints by Ni3P in the Ni-P UBM, the Co-bases UBM becomes the substitute of the Ni-P UBM, because of the well diffusion-barrier capability, better reliability and acceptable solderability. On the other hand, the Sn-3.5Ag solder is the one of the replacement for lead-solder. Because the Sn-3.5Ag solder has the better elastic modulus and the lower coefficient of thermal expansion. The addition of Ag in solder can decrease the growth rate of intermetallic compounds (IMCs). For these reasons, the Sn-3.5Ag solder becomes the prefer options in packaging industry. In this study, we systematically investigated the solid-state interfacial reaction between the Sn-3.5Ag and the Co substrate through different aging time at temperature of 150℃, 170℃ and 190℃, respectively. Based on the results from XRD and EDX, CoSn3 , Ag3Sn and CoSn4 IMCs are formed in this system. The CoSn3 IMC layer grows thicker with longer reaction time and higher temperature. The kinetic analysis shows that the formation of CoSn3 is mainly control by the interfacial reaction in the beginning. When the thickness of CoSn3 over the critical region, the mechanism changed to diffusion control. The activation energy of CoSn3 is calculated to be 122.47kJ/mole. The diffusivity of Co and Sn in the IMC at 190℃ is 1.60*10-13 cm2/s and 2.11*10-12 cm2/s, respectively. The result of ball push test shows that the shear strength of solder joint decreased after solid-state aging. Most of the solder joints are the ductile fracture. Only 3 of the long-time solid-state aging solder joints showed both ductile fracture and brittle fracture. The coarsening of holes is the main reason to form the brittle fracture.