Artículos de revistas sobre el tema "In-Mold Electronics"
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Beltrão, Mariana, Fernando M. Duarte, Júlio C. Viana y Vitor Paulo. "A review on in‐mold electronics technology". Polymer Engineering & Science 62, n.º 4 (11 de febrero de 2022): 967–90. http://dx.doi.org/10.1002/pen.25918.
Texto completoMadadnia, Behnam, Jan Vanfleteren y Frederick Bossuyt. "Methods to Improve Accuracy of Electronic Component Positioning in Thermoformed Electronics". Micromachines 14, n.º 12 (16 de diciembre de 2023): 2248. http://dx.doi.org/10.3390/mi14122248.
Texto completoSrinivasan, KP y T. Muthuramalingam. "In-depth scrutinization of In- Mold Electronics for Automotive applications". Journal of Physics: Conference Series 1969, n.º 1 (1 de julio de 2021): 012064. http://dx.doi.org/10.1088/1742-6596/1969/1/012064.
Texto completoHoldford, Becky y Roger Stierman. "What “Green” Means: Challenges for Failure Analysis". EDFA Technical Articles 8, n.º 4 (1 de noviembre de 2006): 12–14. http://dx.doi.org/10.31399/asm.edfa.2006-4.p012.
Texto completoMorishige, Koichi. "Special Issue on Dies and Molds". International Journal of Automation Technology 2, n.º 6 (5 de noviembre de 2008): 417. http://dx.doi.org/10.20965/ijat.2008.p0417.
Texto completoRusyana, Mohammad Purwa y Rizky Maulana. "PENGARUH REKONDISI MOLD TYPE-2186 TERHADAP PENINGKATAN PRODUKTIVITAS DAN KUALITAS HASIL PRODUKSI". Jurnal Permadi: Perancangan, Manufaktur, Material dan Energi 3, n.º 1 (29 de enero de 2021): 54–62. http://dx.doi.org/10.52005/permadi.v3i1.47.
Texto completoAnzai, Masahiro. "Special Issue on Die and Mold Technology". International Journal of Automation Technology 4, n.º 5 (5 de septiembre de 2010): 414. http://dx.doi.org/10.20965/ijat.2010.p0414.
Texto completoChen, Feng Jun, Shao Hui Yin, Jian Wu Yu, Ke Jun Zhu y Yu Wang. "Ultra-Precision Fabrication of Small-Size Aspherical Glass Lens Mold". Key Engineering Materials 487 (julio de 2011): 29–33. http://dx.doi.org/10.4028/www.scientific.net/kem.487.29.
Texto completoZhang, Sam, Xianting Zeng, Zhenggui Tang y Ming Jen Tan. "EXPLORING THE ANTISTICKING PROPERTIES OF SOLID LUBRICANT THIN FILMS IN TRANSFER MOLDING". International Journal of Modern Physics B 16, n.º 06n07 (20 de marzo de 2002): 1080–85. http://dx.doi.org/10.1142/s0217979202010890.
Texto completoHwang, Chul Jin, Y. B. Ko, Hyung Pil Park, S. T. Chung y Byung Ohk Rhee. "Development of Dental Scaler Tip Mold with Powder Injection Molding Process". Materials Science Forum 534-536 (enero de 2007): 345–48. http://dx.doi.org/10.4028/www.scientific.net/msf.534-536.345.
Texto completoZhao, Zhong Li, Hai Peng Yu, Da Ming Wu, Ying Liu, Xiu Ting Zheng, Jian Zhuang y Peng Sheng Jing. "Research on the Key Technology in Ultra-Precision Machining of Optical Micro V-Groove Mold Roller". Advanced Materials Research 712-715 (junio de 2013): 1563–67. http://dx.doi.org/10.4028/www.scientific.net/amr.712-715.1563.
Texto completoSulong, Abu Bakar, Gan Tek Keong y Jaafar Sahari. "Effects of Molding Parameters and Addition of Fillers on Gate Chip Off Formation during the Degating Process in Transfer Molding". Key Engineering Materials 447-448 (septiembre de 2010): 790–94. http://dx.doi.org/10.4028/www.scientific.net/kem.447-448.790.
Texto completoShearer, Catherine. "Transient Liquid Phase Sintering Pastes in Heterogeneous Integration". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2017, DPC (1 de enero de 2017): 1–26. http://dx.doi.org/10.4071/2017dpc-wp1_presentation5.
Texto completoLiu, Xiangyang, Derek Li, Hiroshi Fukutani, Paul Trudeau, LoleÏ Khoun, Olga Mozenson, Kathleen L. Sampson et al. "UV‐Sinterable Silver Oxalate‐Based Molecular Inks and Their Application for In‐Mold Electronics". Advanced Electronic Materials 7, n.º 9 (18 de julio de 2021): 2100194. http://dx.doi.org/10.1002/aelm.202100194.
Texto completoAnzai, Masahiro. "Special Issue on Die and Mold Technology". International Journal of Automation Technology 6, n.º 4 (5 de julio de 2012): 521. http://dx.doi.org/10.20965/ijat.2012.p0521.
Texto completoHubmann, Martin, Behnam Madadnia, Jonas Groten, Martin Pletz, Jan Vanfleteren, Barbara Stadlober, Frederick Bossuyt, Jatinder Kaur y Thomas Lucyshyn. "Process Optimization of Injection Overmolding Structural Electronics with Regard to Film Distortion". Polymers 14, n.º 23 (22 de noviembre de 2022): 5060. http://dx.doi.org/10.3390/polym14235060.
Texto completoUllah, Misbah, Nicolò Maria Ippolito, Loredana Spera y Francesco Vegliò. "Treatment of wastewater produced during the hydrometallurgical extraction of silver from in-mold structural electronics". Case Studies in Chemical and Environmental Engineering 10 (diciembre de 2024): 100916. http://dx.doi.org/10.1016/j.cscee.2024.100916.
Texto completoHopmann, Christian, Kirsten Bobzin, Tobias Brögelmann, Christian Schäfer, Maximilian Schöngart, Malte Röbig y Mona Naderi. "Improved molding of micro structures using PVD-coated mold inserts". Journal of Polymer Engineering 36, n.º 6 (1 de agosto de 2016): 575–82. http://dx.doi.org/10.1515/polyeng-2015-0270.
Texto completoGong, Yao, Kyoung Je Cha y Jang Min Park. "Deformation characteristics and resistance distribution in thermoforming of printed electrical circuits for in-mold electronics application". International Journal of Advanced Manufacturing Technology 108, n.º 3 (mayo de 2020): 749–58. http://dx.doi.org/10.1007/s00170-020-05377-9.
Texto completoGoto, Hiroshi. "Overview on Nanoimprint Technology - Process, Tools, Applications and Technical Issues for Industrialization". Key Engineering Materials 345-346 (agosto de 2007): 1073–77. http://dx.doi.org/10.4028/www.scientific.net/kem.345-346.1073.
Texto completoPark, Keon Joo, Chae Won Kim, Min Jae Sung, Jiyoul Lee y Young Tea Chun. "Semiconducting Polymer Nanowires with Highly Aligned Molecules for Polymer Field Effect Transistors". Electronics 11, n.º 4 (18 de febrero de 2022): 648. http://dx.doi.org/10.3390/electronics11040648.
Texto completoKhaliq, Amin, Muhammad Ahmad Kamran y Myung Yung Jeong. "Nanoimprint Mold Consisting of an Adhesive Lap Joint between a Nanopatterned Metal Sleeve and a Carbon Composite Roll". Nanomaterials 13, n.º 10 (20 de mayo de 2023): 1685. http://dx.doi.org/10.3390/nano13101685.
Texto completoSyed-Khaja, Aarief y Jörg Franke. "Design and Solder Process Optimization in MID Technology for High Power Applications". Advanced Materials Research 1038 (septiembre de 2014): 107–12. http://dx.doi.org/10.4028/www.scientific.net/amr.1038.107.
Texto completoLiu, Hang, Yan Xu, Kai Leung Yung y Chun Lei Kang. "The Interface Behavior of Micro Overmolding". Advanced Materials Research 591-593 (noviembre de 2012): 896–99. http://dx.doi.org/10.4028/www.scientific.net/amr.591-593.896.
Texto completoLee, Sang Yoon, Seong Hyun Jang, Hyun Kyung Lee, Jong Sun Kim, SangKug Lee, Ho Jun Song, Jae Woong Jung, Eui Sang Yoo y Jun Choi. "The development and investigation of highly stretchable conductive inks for 3-dimensional printed in-mold electronics". Organic Electronics 85 (octubre de 2020): 105881. http://dx.doi.org/10.1016/j.orgel.2020.105881.
Texto completoZhan, Yujie, Liangui Deng, Wei Dai, Yongxue Qiu, Shicheng Sun, Dizhi Sun, Bowen Hu y Jianguo Guan. "Fabrication of Large-Area Nanostructures Using Cross-Nanoimprint Strategy". Nanomaterials 14, n.º 12 (8 de junio de 2024): 998. http://dx.doi.org/10.3390/nano14120998.
Texto completoChen, Yanyan, Shengfei Zhang, Shunchang Hu, Yangjing Zhao, Guojun Zhang, Yang Cao y Wuyi Ming. "Study of Heat Transfer Strategy of Metal Heating/Conduction Plates for Energy Efficiency of Large-Sized Automotive Glass Molding Process". Metals 13, n.º 7 (30 de junio de 2023): 1218. http://dx.doi.org/10.3390/met13071218.
Texto completoArafat Bagoes Setyawan, Muhammad Khaerudin y Siti Setiawati. "Perancangan Aplikasi Enkripsi dan Dekripsi Gambar Cetak Biru Pada PT. Patco Elektronik Teknologi Menggunakan Algoritma RSA Berbasis Android". NUANSA INFORMATIKA 18, n.º 2 (20 de julio de 2024): 19–25. http://dx.doi.org/10.25134/ilkom.v18i2.145.
Texto completoNodin, Muhamad Nor y Mohd Sallehuddin Yusof. "A Preliminary Study of PDMS Stamp towards Flexography Printing Technique: An Overview". Advanced Materials Research 844 (noviembre de 2013): 201–4. http://dx.doi.org/10.4028/www.scientific.net/amr.844.201.
Texto completoPanneerselvam, Vivekanandan y Faiz Mohd Turan. "Optimization of Process Parameters of Injection Moldings for Plastic Pallets Manufacturing Industry". Journal of Modern Manufacturing Systems and Technology 2 (26 de marzo de 2019): 75–83. http://dx.doi.org/10.15282/jmmst.v2i1.1802.
Texto completoLombard, Ph, T. Gerges, J. Y. Charmeau, B. Allard y M. Cabrera. "Procédé plastronique Electronique Structurelle Surmoulée (ESS, IME – In Mold Electronics) dans un projet de mise en œuvre pratique". J3eA 21 (2022): 1012. http://dx.doi.org/10.1051/j3ea/20221012.
Texto completoPham, Tuan Nghia. "Cooling channel design for improving quality of injection plastic product". TẠP CHÍ KHOA HỌC TRƯỜNG ĐẠI HỌC QUỐC TẾ HỒNG BÀNG 4 (24 de junio de 2023): 101–8. http://dx.doi.org/10.59294/hiujs.vol.4.2023.392.
Texto completoFurusawa, Takeshi, Naomi Kawamura, Toshiki Furutani y Takashi Kariya. "Control of Package Warpage by Package Substrate Design for Low Profile Package-on-Package Structure". International Symposium on Microelectronics 2012, n.º 1 (1 de enero de 2012): 000491–96. http://dx.doi.org/10.4071/isom-2012-tp65.
Texto completoUnno, Noriyuki y Tapio Mäkelä. "Thermal Nanoimprint Lithography—A Review of the Process, Mold Fabrication, and Material". Nanomaterials 13, n.º 14 (8 de julio de 2023): 2031. http://dx.doi.org/10.3390/nano13142031.
Texto completoHuda, Miftakul. "ANALISIS PERBAIKAN KUALITAS INJECTION PART DENGAN PENDEKATAN LEAN SIX SIGMA". EKOMABIS: Jurnal Ekonomi Manajemen Bisnis 1, n.º 01 (21 de enero de 2020): 79–90. http://dx.doi.org/10.37366/ekomabis.v1i01.7.
Texto completoBasir, Al, Norhamidi Muhamad, Mohammad Fadhli Izuddin Mohd Nor, Muhammad Mohamed y Nashrah Hani Jamadon. "Moldability and Solvent Debinding of Hydroxyapatite Micro-Part Processed through Micro-Powder Injection Molding". Jurnal Kejuruteraan 36, n.º 2 (30 de marzo de 2024): 399–405. http://dx.doi.org/10.17576/jkukm-2024-36(2)-01.
Texto completoLombard, Ph, H. Cauchy-Clerc, B. Allard y M. Cabrera. "Etude de cas en plastronique IME – Alliance de la plasturgie et de l’électronique pour le packaging de systèmes 3D". J3eA 23 (2024): 1003. http://dx.doi.org/10.1051/j3ea/20241003.
Texto completoJin, Weikan, Zhiheng Yu, Guohong Hu, Hui Zhang, Fengli Huang y Jinmei Gu. "Effects of Three-Dimensional Circular Truncated Cone Microstructures on the Performance of Flexible Pressure Sensors". Materials 15, n.º 13 (5 de julio de 2022): 4708. http://dx.doi.org/10.3390/ma15134708.
Texto completoTSAI, HUNG-YIN y CHIA-JEN TING. "LOW COST FABRICATION OF SUB-WAVELENGTH STRUCTURES ON LARGE-AREA POLYMER SHEET BY UV CURING AND NANO-IMPRINTING PROCESSES". Surface Review and Letters 17, n.º 03 (junio de 2010): 345–51. http://dx.doi.org/10.1142/s0218625x10013977.
Texto completoRen, Dayang, Changzhong Wu, Qiuqi Sun, Shengqiang Wang, Jiaxin Tian y Chengyu Wang. "Principle, application and development trend of dry ice cleaning hub fixture". E3S Web of Conferences 385 (2023): 04023. http://dx.doi.org/10.1051/e3sconf/202338504023.
Texto completoYan, Honghao, Jun Zhou, Chengyun Wang, Huaqiang Gong, Wu Liu, Weihong Cen, Guixin Yuan y Yu Long. "3D printing of dual cross-linked hydrogel for fingerprint-like iontronic pressure sensor". Smart Materials and Structures 31, n.º 1 (25 de noviembre de 2021): 015019. http://dx.doi.org/10.1088/1361-665x/ac383c.
Texto completoWang, Xuelin, Yi Ren y Jing Liu. "Liquid Metal Enabled Electrobiology: A New Frontier to Tackle Disease Challenges". Micromachines 9, n.º 7 (21 de julio de 2018): 360. http://dx.doi.org/10.3390/mi9070360.
Texto completoNagato, Keisuke, Yuki Yajima y Masayuki Nakao. "Laser-Assisted Thermal Imprinting of Microlens Arrays—Effects of Pressing Pressure and Pattern Size". Materials 12, n.º 4 (25 de febrero de 2019): 675. http://dx.doi.org/10.3390/ma12040675.
Texto completoOta, Hiroki. "(Invited) Fabriations and Applications Using Liquid Metal Towards Stretchable Electronics". ECS Meeting Abstracts MA2023-02, n.º 34 (22 de diciembre de 2023): 1672. http://dx.doi.org/10.1149/ma2023-02341672mtgabs.
Texto completoChang, Hanjui, Yue Sun, Shuzhou Lu y Yuntao Lan. "Enhancing Brain–Computer Interfaces through Kriging-Based Fusion of Sparse Regression Partial Differential Equations to Counter Injection Molding View of Node Displacement Effects". Polymers 16, n.º 17 (3 de septiembre de 2024): 2507. http://dx.doi.org/10.3390/polym16172507.
Texto completoDelplanque, Emilie, Antoine Aymard, Davy Dalmas y Julien Scheibert. "Solving curing-protocol-dependent shape errors in PDMS replication". Journal of Micromechanics and Microengineering 32, n.º 4 (9 de marzo de 2022): 045006. http://dx.doi.org/10.1088/1361-6439/ac56ea.
Texto completoMadhavan, R. "High Performance Conductive Composites and E-skins with Large-scale Manufacturing for Wearable Electronic Sensor Systems". Journal of Modern Nanotechnology 4 (21 de noviembre de 2024): 5. http://dx.doi.org/10.53964/jmn.2024005.
Texto completoTokita, Masao. "Progress of Spark Plasma Sintering (SPS) Method, Systems, Ceramics Applications and Industrialization". Ceramics 4, n.º 2 (25 de abril de 2021): 160–98. http://dx.doi.org/10.3390/ceramics4020014.
Texto completoChen, Chang Cheng y Bo Heng Wu. "Numerical Investigation on Mini Internal Gear Forging Process". Key Engineering Materials 725 (diciembre de 2016): 560–65. http://dx.doi.org/10.4028/www.scientific.net/kem.725.560.
Texto completoSun, Chang Fu, Na Jun Wang y Jian Guang Li. "Research on CNC Grinding Program of Overall End Milling Cutter". Key Engineering Materials 579-580 (septiembre de 2013): 122–27. http://dx.doi.org/10.4028/www.scientific.net/kem.579-580.122.
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