Artículos de revistas sobre el tema "Hydrogen resist"
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Horibe, Hideo, Masashi Yamamoto, Eiji Kusano, Tomokazu Ichikawa y Seiichi Tagawa. "Resist Removal by using Atomic Hydrogen". Journal of Photopolymer Science and Technology 21, n.º 2 (2008): 293–98. http://dx.doi.org/10.2494/photopolymer.21.293.
Texto completoHoribe, H., M. Yamamoto, T. Maruoka, Y. Goto, A. Kono, I. Nishiyama y S. Tagawa. "Ion-implanted resist removal using atomic hydrogen". Thin Solid Films 519, n.º 14 (mayo de 2011): 4578–81. http://dx.doi.org/10.1016/j.tsf.2011.01.287.
Texto completoRommel, Marcus y Jürgen Weis. "Hydrogen silsesquioxane bilayer resists—Combining high resolution electron beam lithography and gentle resist removal". Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena 31, n.º 6 (noviembre de 2013): 06F102. http://dx.doi.org/10.1116/1.4822136.
Texto completoTsubouchi, Kazuo, Kazuya Masu y Keiichi Sasaki. "Area-Selective Aluminum Patterning Using Atomic Hydrogen Resist". Japanese Journal of Applied Physics 32, Part 1, No. 1B (30 de enero de 1993): 278–81. http://dx.doi.org/10.1143/jjap.32.278.
Texto completoManfrinato, Vitor R., Lin Lee Cheong, Huigao Duan, Donald Winston, Henry I. Smith y Karl K. Berggren. "Sub-5keV electron-beam lithography in hydrogen silsesquioxane resist". Microelectronic Engineering 88, n.º 10 (octubre de 2011): 3070–74. http://dx.doi.org/10.1016/j.mee.2011.05.024.
Texto completoWinston, D., B. M. Cord, B. Ming, D. C. Bell, W. F. DiNatale, L. A. Stern, A. E. Vladar et al. "Scanning-helium-ion-beam lithography with hydrogen silsesquioxane resist". Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 27, n.º 6 (2009): 2702. http://dx.doi.org/10.1116/1.3250204.
Texto completoMaruoka, Takeshi, Yousuke Goto, Masashi Yamamoto, Hideo Horibe, Eiji Kusano, Kazuhisa Takao y Seiichi Tagawa. "Relationship between the Thermal Hardening of Ion-Implanted Resist and the Resist Removal Using Atomic Hydrogen". Journal of Photopolymer Science and Technology 22, n.º 3 (2009): 325–28. http://dx.doi.org/10.2494/photopolymer.22.325.
Texto completoRamjaun, T. I., S. W. Ooi, R. Morana y H. K. D. H. Bhadeshia. "Designing steel to resist hydrogen embrittlement: Part 1 – trapping capacity". Materials Science and Technology 34, n.º 14 (13 de julio de 2018): 1737–46. http://dx.doi.org/10.1080/02670836.2018.1475919.
Texto completoOoi, S. W., T. I. Ramjaun, C. Hulme-Smith, R. Morana, M. Drakopoulos y H. K. D. H. Bhadeshia. "Designing steel to resist hydrogen embrittlement Part 2 – precipitate characterisation". Materials Science and Technology 34, n.º 14 (13 de julio de 2018): 1747–58. http://dx.doi.org/10.1080/02670836.2018.1496536.
Texto completoKomori, Takuya, Hui Zhang, Takashi Akahane, Zulfakri bin Mohamad, You Yin y Sumio Hosaka. "Effect of Salty Development on Forming HSQ Resist Nanodot Arrays with a Pitch of 15×15 nm2 by 30-keV Electron Beam Lithography". Key Engineering Materials 534 (enero de 2013): 113–17. http://dx.doi.org/10.4028/www.scientific.net/kem.534.113.
Texto completoWhitfield, Dennis M., Stephen P. Douglas, Ting-Hua Tang, Imre G. Csizmadia, Henrianna Y. S. Pang, Frederick L. Moolten y Jiri J. Krepinsky. "Differential reactivity of carbohydrate hydroxyls in glycosylations. II. The likely role of intramolecular hydrogen bonding on glycosylation reactions. Galactosylation of nucleoside 5′-hydroxyls for the syntheses of novel potential anticancer agents". Canadian Journal of Chemistry 72, n.º 11 (1 de noviembre de 1994): 2225–38. http://dx.doi.org/10.1139/v94-284.
Texto completoNagai, Tatsuo, Haruyoshi Yamakawa, Minoru Uchida, Toru Otsu, Norihito Ikemiya y Hiroshi Morita. "Study on Resist Removal Using Electrolyzed Sulfuric Acid Solution in Comparison with SPM". Solid State Phenomena 187 (abril de 2012): 109–12. http://dx.doi.org/10.4028/www.scientific.net/ssp.187.109.
Texto completoNamatsu, H., T. Yamaguchi, M. Nagase, K. Yamazaki y K. Kurihara. "Nano-patterning of a hydrogen silsesquioxane resist with reduced linewidth fluctuations". Microelectronic Engineering 41-42 (marzo de 1998): 331–34. http://dx.doi.org/10.1016/s0167-9317(98)00076-8.
Texto completoPascher, Nikola, Szymon Hennel, Susanne Mueller y Andreas Fuhrer. "Tunnel barrier design in donor nanostructures defined by hydrogen-resist lithography". New Journal of Physics 18, n.º 8 (28 de julio de 2016): 083001. http://dx.doi.org/10.1088/1367-2630/18/8/083001.
Texto completoJin, Niu, Sookyung Choi, Liang Wang, Guang Chen, DongHyun Kim, Vipan Kumar y Ilesanmi Adesida. "Nanometer-scale gaps in hydrogen silsesquioxane resist for T-gate fabrication". Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 25, n.º 6 (2007): 2081. http://dx.doi.org/10.1116/1.2798734.
Texto completoMitsui, Toshiyuki, Eric Hill y Eric Ganz. "Nanolithography by selective chemical vapor deposition with an atomic hydrogen resist". Journal of Applied Physics 85, n.º 1 (enero de 1999): 522–24. http://dx.doi.org/10.1063/1.369483.
Texto completoSaleem, Muhammad Rizwan. "Hydrogen silsesquioxane resist stamp for replication of nanophotonic components in polymers". Journal of Micro/Nanolithography, MEMS, and MOEMS 11, n.º 1 (2 de marzo de 2012): 013007. http://dx.doi.org/10.1117/1.jmm.11.1.013007.
Texto completoDinh, Cong Que, Akihiro Oshima y Seiichi Tagawa. "Depth Dependence of Time Delay Effect on Hydrogen Silsesquioxane (HSQ) Resist Layers". Journal of Photopolymer Science and Technology 25, n.º 1 (2012): 121–24. http://dx.doi.org/10.2494/photopolymer.25.121.
Texto completoGeorgiev, Y. M., W. Henschel, A. Fuchs y H. Kurz. "Surface roughness of hydrogen silsesquioxane as a negative tone electron beam resist". Vacuum 77, n.º 2 (enero de 2005): 117–23. http://dx.doi.org/10.1016/j.vacuum.2004.07.080.
Texto completoMatsubara, Yasushi, Jun Taniguchi y Iwao Miyamoto. "Fabrication of Three-Dimensional Hydrogen Silsesquioxane Resist Structure using Electron Beam Lithography". Japanese Journal of Applied Physics 45, n.º 6B (20 de junio de 2006): 5538–41. http://dx.doi.org/10.1143/jjap.45.5538.
Texto completoYang, Fan, David K. Taggart y Reginald M. Penner. "Fast, Sensitive Hydrogen Gas Detection Using Single Palladium Nanowires That Resist Fracture". Nano Letters 9, n.º 5 (13 de mayo de 2009): 2177–82. http://dx.doi.org/10.1021/nl9008474.
Texto completoVila-Comamala, Joan, Sergey Gorelick, Vitaliy A. Guzenko y Christian David. "3D Nanostructuring of hydrogen silsesquioxane resist by 100 keV electron beam lithography". Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena 29, n.º 6 (noviembre de 2011): 06F301. http://dx.doi.org/10.1116/1.3629811.
Texto completoMasu, Kazuya. "Atomic hydrogen resist process with electron beam lithography for selective Al patterning". Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 12, n.º 6 (noviembre de 1994): 3270. http://dx.doi.org/10.1116/1.587610.
Texto completoKato, T., J. Kamijo, T. Nakamura, C. Ohata, S. Katsumoto y J. Haruyama. "Spin phase protection in interference of electron spin waves in lightly hydrogenated graphene". RSC Advances 6, n.º 72 (2016): 67586–91. http://dx.doi.org/10.1039/c6ra11648e.
Texto completoYamasaki, S. y H. K. D. H. Bhadeshia. "M 4 C 3 precipitation in Fe–C–Mo–V steels and relationship to hydrogen trapping". Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences 462, n.º 2072 (8 de marzo de 2006): 2315–30. http://dx.doi.org/10.1098/rspa.2006.1688.
Texto completoYang, Joel K. W., Bryan Cord, Huigao Duan, Karl K. Berggren, Joseph Klingfus, Sung-Wook Nam, Ki-Bum Kim y Michael J. Rooks. "Understanding of hydrogen silsesquioxane electron resist for sub-5-nm-half-pitch lithography". Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 27, n.º 6 (2009): 2622. http://dx.doi.org/10.1116/1.3253652.
Texto completoSidorkin, Vadim, Emile van der Drift y Huub Salemink. "Influence of hydrogen silsesquioxane resist exposure temperature on ultrahigh resolution electron beam lithography". Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 26, n.º 6 (noviembre de 2008): 2049–53. http://dx.doi.org/10.1116/1.2987965.
Texto completovan Delft, Falco C. M. J. M., Jos P. Weterings, Anja K. van Langen-Suurling y Hans Romijn. "Hydrogen silsesquioxane/novolak bilayer resist for high aspect ratio nanoscale electron-beam lithography". Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 18, n.º 6 (2000): 3419. http://dx.doi.org/10.1116/1.1319682.
Texto completoJunarsa, Ivan, Mark P. Stoykovich, Paul F. Nealey, Yuansheng Ma, Franco Cerrina y Harun H. Solak. "Hydrogen silsesquioxane as a high resolution negative-tone resist for extreme ultraviolet lithography". Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 23, n.º 1 (2005): 138. http://dx.doi.org/10.1116/1.1849213.
Texto completoYoshimura, Toshiyuki, Akira Ishikawa, Hiroshi Okamoto, Hiroshi Miyazaki, Akemi Sawada, Takuma Tanimoto y Shinji Okazaki. "Direct delineation of fine metallic patterns through hydrogen reduction of inorganic resist HPA". Microelectronic Engineering 13, n.º 1-4 (marzo de 1991): 97–100. http://dx.doi.org/10.1016/0167-9317(91)90056-j.
Texto completovan Kan, J. A., A. A. Bettiol y F. Watt. "Hydrogen silsesquioxane a next generation resist for proton beam writing at the 20nm level". Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms 260, n.º 1 (julio de 2007): 396–99. http://dx.doi.org/10.1016/j.nimb.2007.02.051.
Texto completoJamieson, Andrew. "Low-voltage electron beam lithography resist processes: top surface imaging and hydrogen silisesquioxane bilayer". Journal of Micro/Nanolithography, MEMS, and MOEMS 3, n.º 3 (1 de julio de 2004): 442. http://dx.doi.org/10.1117/1.1758268.
Texto completoShen, Jiashi, Ferhat Aydinoglu, Mohammad Soltani y Bo Cui. "E-beam lithography using dry powder resist of hydrogen silsesquioxane having long shelf life". Journal of Vacuum Science & Technology B 37, n.º 2 (marzo de 2019): 021601. http://dx.doi.org/10.1116/1.5079657.
Texto completoWestly, Daron A., Donald M. Tennant, Yukinori Aida, Hirofumi Ohki y Takashi Ohkubo. "Improved time dependent performance of hydrogen silsesquioxane resist using a spin on top coat". Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena 29, n.º 6 (noviembre de 2011): 06FJ02. http://dx.doi.org/10.1116/1.3660788.
Texto completoLee, Hyo-Sung, Jung-Sub Wi, Sung-Wook Nam, Hyun-Mi Kim y Ki-Bum Kim. "Two-step resist-development process of hydrogen silsesquioxane for high-density electron-beam nanopatterning". Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 27, n.º 1 (2009): 188. http://dx.doi.org/10.1116/1.3049482.
Texto completoYoshimura, Toshiyuki, Akira Ishikawa, Hiroshi Okamoto, Hiroshi Miyazaki, Akemi Sawada, Takuma Tanimoto y Shinji Okazaki. "Direct delineation of fine metallic patterns through hydrogen reduction of the inorganic resist HPA". Microelectronic Engineering 14, n.º 3-4 (septiembre de 1991): 149–58. http://dx.doi.org/10.1016/0167-9317(91)90001-t.
Texto completoYin, You, Taichi Itagawa y Sumio Hosaka. "Electron Beam Lithography for Fabrication of Nanophase-Change Memory". Applied Mechanics and Materials 481 (diciembre de 2013): 30–35. http://dx.doi.org/10.4028/www.scientific.net/amm.481.30.
Texto completoSolard, Jeanne, Mahmoud Chakaroun y Azzedine Boudrioua. "Optimal design and fabrication of ITO photonic crystal using e-beam patterned hydrogen silsesquioxane resist". Journal of Vacuum Science & Technology B 38, n.º 2 (marzo de 2020): 022802. http://dx.doi.org/10.1116/1.5142533.
Texto completoMitsui, Toshiyuki, Rob Curtis y Eric Ganz. "Selective nanoscale growth of titanium on the Si(001) surface using an atomic hydrogen resist". Journal of Applied Physics 86, n.º 3 (agosto de 1999): 1676–79. http://dx.doi.org/10.1063/1.370946.
Texto completoChoi, Sookyung, Minjun Yan, Ilesanmi Adesida, Keng H. Hsu y Nicholas X. Fang. "Ultradense gold nanostructures fabricated using hydrogen silsesquioxane resist and applications for surface-enhanced Raman spectroscopy". Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 27, n.º 6 (2009): 2640. http://dx.doi.org/10.1116/1.3253610.
Texto completoKüpper, Daniel, David Küpper, Thorsten Wahlbrink, Wolfgang Henschel, Jens Bolten, Max C. Lemme, Yordan M. Georgiev y Heinrich Kurz. "Impact of supercritical CO[sub 2] drying on roughness of hydrogen silsesquioxane e-beam resist". Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 24, n.º 2 (2006): 570. http://dx.doi.org/10.1116/1.2167990.
Texto completoClark, Nathaniel, Amy Vanderslice, Robert Grove y Robert R. Krchnavek. "Time-dependent exposure dose of hydrogen silsesquioxane when used as a negative electron-beam resist". Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 24, n.º 6 (2006): 3073. http://dx.doi.org/10.1116/1.2366697.
Texto completoLoong, W. A. y M. S. Yen. "Enhanced oxygen plasma stripping of P+-implanted negative resist by hydrogen plasma pretreatment: temperature effects". Electronics Letters 27, n.º 12 (1991): 1079. http://dx.doi.org/10.1049/el:19910670.
Texto completoWang, Fei, Jinsheng Liang, Haifeng Liu, Xinhui Duan, Qingguo Tang y Huimin Liu. "Preparation and Performance of Inorganic Heat Insulation Panel Based on Sepiolite Nanofibers". Journal of Nanomaterials 2014 (2014): 1–7. http://dx.doi.org/10.1155/2014/876967.
Texto completoTu, Bo, Yantao Bao, Ming Tang, Qian Zhu, Xiaopeng Lu, Hui Wang, Tianyun Hou, Ying Zhao, Ping Zhang y Wei-Guo Zhu. "TIP60 recruits SUV39H1 to chromatin to maintain heterochromatin genome stability and resist hydrogen peroxide-induced cytotoxicity". Genome Instability & Disease 1, n.º 6 (noviembre de 2020): 339–55. http://dx.doi.org/10.1007/s42764-020-00025-8.
Texto completoYan, M., J. Lee, B. Ofuonye, S. Choi, J. H. Jang y I. Adesida. "Effects of salty-developer temperature on electron-beam-exposed hydrogen silsesquioxane resist for ultradense pattern transfer". Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena 28, n.º 6 (noviembre de 2010): C6S23—C6S27. http://dx.doi.org/10.1116/1.3504497.
Texto completoGnan, M., S. Thoms, D. S. Macintyre, R. M. De La Rue y M. Sorel. "Fabrication of low-loss photonic wires in silicon-on-insulator using hydrogen silsesquioxane electron-beam resist". Electronics Letters 44, n.º 2 (2008): 115. http://dx.doi.org/10.1049/el:20082985.
Texto completoChoi, Sookyung, Niu Jin, Vipan Kumar, Ilesanmi Adesida y Mark Shannon. "Effects of developer temperature on electron-beam-exposed hydrogen silsesquioxane resist for ultradense silicon nanowire fabrication". Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 25, n.º 6 (2007): 2085. http://dx.doi.org/10.1116/1.2794315.
Texto completoCrane, E., A. Kölker, T. Z. Stock, N. Stavrias, K. Saeedi, M. A. W. van Loon, B. N. Murdin y N. J. Curson. "Hydrogen resist lithography and electron beam lithography for fabricating silicon targets for studying donor orbital states". Journal of Physics: Conference Series 1079 (agosto de 2018): 012010. http://dx.doi.org/10.1088/1742-6596/1079/1/012010.
Texto completoHenschel, W., Y. M. Georgiev y H. Kurz. "Study of a high contrast process for hydrogen silsesquioxane as a negative tone electron beam resist". Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 21, n.º 5 (2003): 2018. http://dx.doi.org/10.1116/1.1603284.
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